CN202330481U - Special fixture for flying probe testing of high-density interconnection circuit board - Google Patents

Special fixture for flying probe testing of high-density interconnection circuit board Download PDF

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Publication number
CN202330481U
CN202330481U CN 201120473140 CN201120473140U CN202330481U CN 202330481 U CN202330481 U CN 202330481U CN 201120473140 CN201120473140 CN 201120473140 CN 201120473140 U CN201120473140 U CN 201120473140U CN 202330481 U CN202330481 U CN 202330481U
Authority
CN
China
Prior art keywords
circuit board
bottom plate
rotating beam
outer frame
flying probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201120473140
Other languages
Chinese (zh)
Inventor
赵晓丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Printronics Circuit Corp
Original Assignee
Tianjin Printronics Circuit Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Printronics Circuit Corp filed Critical Tianjin Printronics Circuit Corp
Priority to CN 201120473140 priority Critical patent/CN202330481U/en
Application granted granted Critical
Publication of CN202330481U publication Critical patent/CN202330481U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a special fixture for flying probe testing of a high-density interconnection circuit board. The special fixture comprises a bottom plate, a circuit board outer frame and multiple clamping devices, wherein the circuit board outer frame is arranged on the upper surface of the bottom plate, the multiple clamping devices are uniformly arranged on the bottom plate on the outer side of the circuit board outer frame, each clamping device comprises an upright, a rotating beam and a pressing plate, the rotating beam is hinged on the upper end of the upright, the rear end of the rotating beam is provided with a screw rod used for fixing the rotating beam and the upright in a penetrating manner, and the lower ends of the locking screw rods arranged on the front ends of the rotating beams positioned on the same side of the circuit board outer frame are jointly connected with the upper ends of the pressing plates arranged on the same sides with the rotating beams. According to the special fixture, a circuit board is placed in the circuit board outer frame arranged on the bottom plate, and is pressed and fixed through the clamping devices uniformly arranged on the bottom plate on the outer side of the circuit board outer frame, then the bottom plate is clamped in a flying probe tester, when a flying probe touches the bottom plate, the bottom plate upwards supports the circuit board without generating the problem of bending the circuit board due to stress; and elastic cushions arranged on the bottom surfaces of the pressing plates can not abrade the appearance of the circuit board, thus the special fixture is very safe.

Description

High density interconnected circuit plate flying probe unit clamp
Technical field
The utility model belongs to high density interconnected circuit plate manufacturing technology field, especially a kind of high density interconnected circuit plate flying probe unit clamp.
Background technology
The circuit board manufacturing need be tested it after accomplishing, and conventional test methods is to accomplish through needle-bar test machine testing jig, but the manufacturing cost of this testing jig is higher, testing and measuring technology is complicated.People have invented flying probe tester through research for this reason, and it is controlled by predefined program; A plurality of probe contact pads and via hole, thereby the element test of completion circuit board, but in test process; Probe needs to contact firmly with circuit board, and circuit board is had certain impulsive force, impacts the injury that circuit board is caused in order to reduce probe; People have invented probe " soft landing " way of contact, but Ren Ranhui is when producing the less circuit board testing of certain impulsive force, especially thickness; Faults such as sheet, tabs very easily occur falling, cause test normally to accomplish, and increased test period.
The utility model content
The purpose of the utility model is to overcome the deficiency of prior art, and a kind of high density interconnected circuit plate flying probe unit clamp rational in infrastructure, easy to use is provided.
The technical scheme that the utility model is taked is:
A kind of high density interconnected circuit plate flying probe unit clamp; It is characterized in that: comprise base plate, circuit board housing, clamp device; The circuit board housing is installed in the upper surface of base plate; On the base plate in the circuit board housing outside, be uniformly distributed with a plurality of clamp devices are installed, said clamp device comprises column, rotating beam and pressing plate, and the rotating beam hinge is contained in the upper end of column; Install one in the rotating beam rear end and be used for rotating beam and the fixing screw rod of column, the lower end that is positioned at the tie down screw that the rotating beam front end of the same side of circuit board housing adorned connects the upper surface of the pressing plate that homonymy is provided with jointly.
And the lower surface of said pressing plate is equipped with cushion.
The advantage and the good effect of the utility model are:
In the utility model, in the circuit board housing that circuit board is placed on the base plate to be adorned, and clamp device is installed is fixed through being uniformly distributed with on the base plate of the circuit board housing outside; Then base plate is clamped in the flying probe tester; In probe when touching,, the problem of the stressed bending of circuit board can not appear in the base plate support circuit plate that makes progress; And the cushion that install the pressing plate bottom surface can be to the apparent generation wearing and tearing of circuit board, safety very.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Below in conjunction with embodiment, the utility model is further specified, following embodiment is illustrative, is not determinate, can not limit the protection domain of the utility model with following embodiment.
A kind of high density interconnected circuit plate flying probe unit clamp; Shown in Fig. 1~2; The innovation of the utility model is: comprise base plate 10, circuit board housing 4, clamp device, the circuit board housing is installed in the upper surface of base plate, and the space in it is used to place circuit board 5; On the base plate in the circuit board housing outside, be uniformly distributed with a plurality of clamp devices are installed; Said clamp device comprises column 3, rotating beam 2 and pressing plate 6, and rotating beam cuts with scissors the upper end that is contained in column through hinge 8, installs one in the rotating beam rear end and is used for rotating beam and the fixing screw rod 7 of column; The screw rod lower end engages after connecting the made screw of column upper end phase contraposition is fixed rotating beam and column, and the lower end that is positioned at the tie down screw 1 that the rotating beam front end of the same side of circuit board housing adorned connects the upper surface of the pressing plate of homonymy setting jointly.
For fear of the wearing and tearing of pressing plate, cushion 9 is installed in the bottom surface of pressing plate to circuit board surface.
In the present embodiment, on the base plate in each side outside of circuit board housing two covers are installed all and clamp device, installation is more certainly can realize the even clamping to circuit board, but certainly will increase the complicacy of operation, so two covers are for preferred.
When the utility model used, operating personnel at first unscrewed the screw rod and the rotating beam that overturns, and then circuit board are placed in the circuit board housing; Rotating beam again overturns; Tighten screw rod, tie down screw is being tightened, make pressing plate tight, firm being pressed in the circuit board housing of circuit board; At last base plate is clamped in the flying probe tester, starts flying probe tester and accomplish test.When probe was touched, the base plate support circuit plate that makes progress the problem of the stressed bending of circuit board can not occur, and the cushion that install the pressing plate bottom surface can be to the apparent generation wearing and tearing of circuit board, safety very.

Claims (2)

1. high density interconnected circuit plate flying probe unit clamp; It is characterized in that: comprise base plate, circuit board housing, clamp device; The circuit board housing is installed in the upper surface of base plate; On the base plate in the circuit board housing outside, be uniformly distributed with a plurality of clamp devices are installed, said clamp device comprises column, rotating beam and pressing plate, and the rotating beam hinge is contained in the upper end of column; Install one in the rotating beam rear end and be used for rotating beam and the fixing screw rod of column, the lower end that is positioned at the tie down screw that the rotating beam front end of the same side of circuit board housing adorned connects the upper surface of the pressing plate that homonymy is provided with jointly.
2. high density interconnected circuit plate flying probe unit clamp according to claim 1, it is characterized in that: the lower surface of said pressing plate is equipped with cushion.
CN 201120473140 2011-11-24 2011-11-24 Special fixture for flying probe testing of high-density interconnection circuit board Expired - Fee Related CN202330481U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120473140 CN202330481U (en) 2011-11-24 2011-11-24 Special fixture for flying probe testing of high-density interconnection circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120473140 CN202330481U (en) 2011-11-24 2011-11-24 Special fixture for flying probe testing of high-density interconnection circuit board

Publications (1)

Publication Number Publication Date
CN202330481U true CN202330481U (en) 2012-07-11

Family

ID=46442457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201120473140 Expired - Fee Related CN202330481U (en) 2011-11-24 2011-11-24 Special fixture for flying probe testing of high-density interconnection circuit board

Country Status (1)

Country Link
CN (1) CN202330481U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102901904A (en) * 2012-10-16 2013-01-30 上海欣影电力科技发展有限公司 Multifunctional intelligent detection device for circuit board
CN103616534A (en) * 2013-11-27 2014-03-05 深圳市大族激光科技股份有限公司 Vertical type flying probe tester clamp and design method thereof
CN104166023A (en) * 2014-08-29 2014-11-26 苏州市吴中区胥口广博模具加工厂 Tri-axial linkage type large circuit board test fixture
CN104166025A (en) * 2014-08-29 2014-11-26 苏州市吴中区胥口广博模具加工厂 Using method of tri-axial linkage type large circuit board test fixture
CN106124965A (en) * 2016-07-22 2016-11-16 中国船舶重工集团公司第七二四研究所 A kind of radio frequency PCB testing device based on rf probe and rotary joint pedestal
CN106996991A (en) * 2016-08-31 2017-08-01 东风汽车电子有限公司 A kind of automatic inspection jig of automobile combination meter
CN113714957A (en) * 2021-10-09 2021-11-30 南通芯盟测试研究院运营管理有限公司 Deformable probe card clamp suite
CN114473127A (en) * 2022-03-14 2022-05-13 长沙兆兴博拓科技有限公司 Welding and clamping device for high-density flying probe test dense needle seat and circuit board

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102901904A (en) * 2012-10-16 2013-01-30 上海欣影电力科技发展有限公司 Multifunctional intelligent detection device for circuit board
CN102901904B (en) * 2012-10-16 2015-10-07 上海欣影电力科技发展有限公司 A kind of Multifunctional intelligent detection device for circuit board
CN103616534A (en) * 2013-11-27 2014-03-05 深圳市大族激光科技股份有限公司 Vertical type flying probe tester clamp and design method thereof
CN103616534B (en) * 2013-11-27 2016-07-27 大族激光科技产业集团股份有限公司 Vertical flying probe machine clamp and method for designing thereof
CN104166023A (en) * 2014-08-29 2014-11-26 苏州市吴中区胥口广博模具加工厂 Tri-axial linkage type large circuit board test fixture
CN104166025A (en) * 2014-08-29 2014-11-26 苏州市吴中区胥口广博模具加工厂 Using method of tri-axial linkage type large circuit board test fixture
CN106124965A (en) * 2016-07-22 2016-11-16 中国船舶重工集团公司第七二四研究所 A kind of radio frequency PCB testing device based on rf probe and rotary joint pedestal
CN106996991A (en) * 2016-08-31 2017-08-01 东风汽车电子有限公司 A kind of automatic inspection jig of automobile combination meter
CN106996991B (en) * 2016-08-31 2023-03-31 东风汽车电子有限公司 Automatic inspection clamp for automobile combination instrument
CN113714957A (en) * 2021-10-09 2021-11-30 南通芯盟测试研究院运营管理有限公司 Deformable probe card clamp suite
CN113714957B (en) * 2021-10-09 2022-05-17 南通芯盟测试研究院运营管理有限公司 Deformable probe card clamp suite
CN114473127A (en) * 2022-03-14 2022-05-13 长沙兆兴博拓科技有限公司 Welding and clamping device for high-density flying probe test dense needle seat and circuit board
CN114473127B (en) * 2022-03-14 2022-11-11 长沙兆兴博拓科技有限公司 Welding and clamping device for high-density flying probe test dense needle seat and circuit board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120711

Termination date: 20141124

EXPY Termination of patent right or utility model