CN114466876A - Thermosetting resin composition, molded body, and lamp reflector - Google Patents
Thermosetting resin composition, molded body, and lamp reflector Download PDFInfo
- Publication number
- CN114466876A CN114466876A CN202080069017.6A CN202080069017A CN114466876A CN 114466876 A CN114466876 A CN 114466876A CN 202080069017 A CN202080069017 A CN 202080069017A CN 114466876 A CN114466876 A CN 114466876A
- Authority
- CN
- China
- Prior art keywords
- mass
- parts
- resin composition
- thermosetting resin
- unsaturated polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 107
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 107
- 229920006337 unsaturated polyester resin Polymers 0.000 claims abstract description 60
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 57
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 150000007519 polyprotic acids Polymers 0.000 claims description 23
- 239000000945 filler Substances 0.000 claims description 21
- 239000002562 thickening agent Substances 0.000 claims description 20
- -1 alkylene glycol Chemical compound 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000004793 Polystyrene Substances 0.000 claims description 10
- 229920002223 polystyrene Polymers 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 6
- 239000006082 mold release agent Substances 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 239000002174 Styrene-butadiene Substances 0.000 claims 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims 1
- 239000011115 styrene butadiene Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 abstract description 33
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 29
- 238000000034 method Methods 0.000 description 26
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000178 monomer Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229920006395 saturated elastomer Polymers 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 150000008064 anhydrides Chemical class 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000005886 esterification reaction Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 230000002787 reinforcement Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 5
- 239000000920 calcium hydroxide Substances 0.000 description 5
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 230000032050 esterification Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000005056 polyisocyanate Substances 0.000 description 5
- 229920001228 polyisocyanate Polymers 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004412 Bulk moulding compound Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 3
- 239000008116 calcium stearate Substances 0.000 description 3
- 235000013539 calcium stearate Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OQBLGYCUQGDOOR-UHFFFAOYSA-L 1,3,2$l^{2}-dioxastannolane-4,5-dione Chemical compound O=C1O[Sn]OC1=O OQBLGYCUQGDOOR-UHFFFAOYSA-L 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical group OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- KFIRODWJCYBBHY-UHFFFAOYSA-N 3-nitrophthalic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1C(O)=O KFIRODWJCYBBHY-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical group CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- XRPZVNIXPWZPCA-UHFFFAOYSA-N ethenyl acetate;styrene Chemical compound CC(=O)OC=C.C=CC1=CC=CC=C1 XRPZVNIXPWZPCA-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical group CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical group OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical group CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/37—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/10—Mirrors with curved faces
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2351/08—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2425/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2425/02—Homopolymers or copolymers of hydrocarbons
- C08J2425/04—Homopolymers or copolymers of styrene
- C08J2425/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention provides a thermosetting resin composition which has good fluidity, moldability and releasability from a mold during molding, and which can form a cured product which is not easily cracked even when the cured product is formed into a shape having a wall thickness uneven portion and has excellent fogging properties. A thermosetting resin composition comprising (A) an unsaturated polyester resin, (B) an ethylenically unsaturated compound, and (C) a low shrinkage agent, wherein the unsaturated polyester resin (A) has a weight average molecular weight of 5,000 to 15,000, and contains (B) 55 to 80 parts by mass of the ethylenically unsaturated compound (B) and (C) 40 to 75 parts by mass of the low shrinkage agent (C) per 100 parts by mass of the unsaturated polyester resin (A).
Description
Technical Field
The present disclosure relates to a thermosetting resin composition, a molded body including a cured product thereof, and a lamp reflector (lamp reflector) including the molded body.
Background
Conventionally, lamps used for automobile headlamps and the like have been provided with a lamp reflector including a molded body containing a cured product of a thermosetting resin composition. Examples of the thermosetting resin composition used as a material for a lamp reflector include BMC (Bulk Molding Compound) containing an unsaturated polyester resin, a low shrinkage agent, a filler, and glass fibers as main components. The BMC was excellent in dimensional accuracy, mechanical strength and heat resistance of the cured product. Therefore, lamp reflectors comprising molded articles of cured products containing BMC are widely used in OA (office automation) equipment, general electric and mechanical parts, heavy electric parts, automobile parts, and the like.
Examples of thermosetting resin compositions used as materials for lamp reflectors include those described in patent documents 1 and 2.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2013-216879
Patent document 2: international publication No. 2006/095414
Disclosure of Invention
Problems to be solved by the invention
In general, a thermosetting resin composition used as a material for a lamp reflector contains a mold release agent in order to ensure releasability from a mold at the time of molding. However, if the content of the release agent in the thermosetting resin composition is increased in order to obtain sufficient releasability, fogging in a molded article including a cured product of the thermosetting resin composition is deteriorated.
As a method for reducing the content of the release agent in the thermosetting resin composition while ensuring releasability from a mold at the time of molding, a method of adding a thickener to the thermosetting resin composition can be mentioned. However, if a thickener is added to a thermosetting resin composition to improve mold releasability, the flowability of the thermosetting resin composition decreases and moldability deteriorates. Therefore, the conventional thermosetting resin composition is not a thermosetting resin composition which is excellent in fluidity and releasability from a mold at the time of molding and which can obtain a cured product having excellent fogging property.
As a method for improving the fluidity of the thermosetting resin composition, it is conceivable to increase the amount of the monomer contained in the thermosetting resin composition, but there is a concern that the fogging property in the cured product may be deteriorated due to the residual monomer.
In addition, as a method for improving the fluidity of the thermosetting resin composition, it is conceivable to reduce the low shrinkage agent contained in the thermosetting resin composition, but the molding shrinkage rate becomes large, and cracks are likely to occur in a complicated shape having a wall thickness unevenness portion (uneven portion) such as a lamp reflector.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a thermosetting resin composition which is excellent in flowability, moldability, and releasability from a mold at the time of molding, and which can form a cured product which is less likely to cause cracking even in a shape having a wall thickness unevenness and has excellent fogging properties.
Further, the present invention has an object to provide a molded article comprising a cured product of the thermosetting resin composition, and a lamp reflector comprising the molded article.
Means for solving the problems
The present disclosure includes the following schemes [1] to [10 ].
[1]
A thermosetting resin composition characterized by comprising (A) an unsaturated polyester resin, (B) an ethylenically unsaturated compound, and (C) a low shrinkage agent,
the unsaturated polyester resin (A) has a weight average molecular weight of 5,000 to 15,000,
the unsaturated polyester resin (A) contains 55 to 80 parts by mass of the ethylenically unsaturated compound (B) and 40 to 75 parts by mass of the low shrinkage agent (C) per 100 parts by mass of the unsaturated polyester resin (A).
[2]
The thermosetting resin composition according to [1], which comprises 58 to 75 parts by mass of the ethylenically unsaturated compound (B) per 100 parts by mass of the unsaturated polyester resin (A).
[3]
The thermosetting resin composition according to [1] or [2], which comprises 55 to 65 parts by mass of the low shrinkage agent (C) per 100 parts by mass of the unsaturated polyester resin (A).
[4]
The thermosetting resin composition according to any one of [1] to [3], wherein the unsaturated polyester resin (A) is a polycondensate of an unsaturated polybasic acid and a (poly) alkylene glycol.
[5]
The thermosetting resin composition according to any one of [1] to [4], wherein the low shrinkage agent (C) is at least 1 selected from the group consisting of polystyrene and styrene-butadiene rubber.
[6]
The thermosetting resin composition according to any one of [1] to [5], which further contains (D) a curing agent.
[7]
The thermosetting resin composition according to [6], which further comprises (E) a mold release agent, (F) a filler, (G) a thickener and (H) a fiber-reinforcing material.
[8]
The thermosetting resin composition according to [7], which comprises, per 100 parts by mass of the unsaturated polyester resin (A):
55 to 80 parts by mass of the ethylenically unsaturated compound (B),
40 to 75 parts by mass of the low shrinkage agent (C),
3 to 10 parts by mass of the curing agent (D),
3 to 10 parts by mass of the release agent (E),
300 to 1000 parts by mass of the filler (F),
0.1 to 5 parts by mass of the thickener (G), and
80 to 240 parts by mass of the fiber reinforcement (H).
[9]
A molded article comprising a cured product of the thermosetting resin composition according to any one of [1] to [8 ].
[10]
A lamp reflector comprising the molded article of [9], an undercoat layer formed on the molded article, and a metal reflective layer formed on the undercoat layer.
ADVANTAGEOUS EFFECTS OF INVENTION
The thermosetting resin composition of the present disclosure has good flowability, moldability, and releasability from a mold during molding, and can provide a cured product that is not easily cracked even when formed into a shape having a wall thickness unevenness, and has excellent fogging properties.
The molded article of the present disclosure contains a cured product of the thermosetting resin composition of the present disclosure. Therefore, the coating composition has excellent fogging properties, and is suppressed in the occurrence of cracks even in the shape having uneven wall thickness portions. In addition, the thermosetting resin composition of the present disclosure is excellent in flowability, moldability, and releasability from a mold at the time of molding, and therefore, the molded article of the present disclosure is excellent in productivity.
The thermosetting resin composition and the molded body of the present disclosure are suitable as a material for a lamp reflector.
Drawings
Fig. 1 is a schematic sectional view showing a lamp having a lamp reflector according to an embodiment.
FIG. 2 is an explanatory view of the shape of a molded article used for evaluation of cracks in uneven wall thickness.
Fig. 3 is an explanatory view of a cross-sectional shape of a flow path of a spiral flow mold used in a spiral flow test (spiral flow test).
Detailed Description
The thermosetting resin composition, the molded article, and the lamp reflector of the present disclosure will be described in detail below. The present invention is not limited to the embodiments described below.
In the present disclosure, the term "ethylenically unsaturated bond" refers to a double bond formed between carbon atoms other than the carbon atoms forming the aromatic ring, and the term "ethylenically unsaturated compound" refers to a compound having an ethylenically unsaturated bond.
In the present disclosure, "(meth) acrylate" means acrylate or methacrylate.
< thermosetting resin composition >
One embodiment of the thermosetting resin composition comprises (A) an unsaturated polyester resin, (B) an ethylenically unsaturated compound, and (C) a low shrinkage agent. The thermosetting resin composition may further contain at least 1 selected from (D) a curing agent, (E) a release agent, (F) a filler, (G) a thickener, and (H) a fiber reinforcing material. Hereinafter, each component contained in the thermosetting resin composition will be described.
[ (A) unsaturated polyester resin ]
(A) The unsaturated polyester resin is not particularly limited as long as it is obtained by polycondensing a polyhydric alcohol with an unsaturated polybasic acid, and if necessary, with a saturated polybasic acid. The unsaturated polybasic acid is a polybasic acid having an ethylenically unsaturated bond, and the saturated polybasic acid is a polybasic acid having no ethylenically unsaturated bond. (A) The unsaturated polyester resin may be used alone, or 2 or more kinds may be used in combination. In addition, when the resin composition is referred to as "unsaturated polyester resin", the resin composition may contain an ethylenically unsaturated compound (reactive diluent) such as a styrene monomer in addition to the unsaturated polyester as a polymer.
The polyol is not particularly limited as long as it is a compound having 2 or more hydroxyl groups. Examples of the polyhydric alcohol include (poly) alkylene glycols such as ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, and dipropylene glycol; alkanediols such as butanediol, pentanediol, hexanediol, 2-methyl-1, 3-propanediol, and 2, 2-dimethyl-1, 3-propanediol; alicyclic structure-containing diols such as cyclohexane-1, 4-dimethanol and hydrogenated bisphenol A; aromatic ring-containing diols such as bisphenol a, ethylene oxide adducts of bisphenol a, and propylene oxide adducts of bisphenol a; 3-membered alcohol such as glycerol. It is noted that in the present disclosure, ethylene glycol and propylene glycol are not alkanediols, but are classified as alkylene glycols. Among them, from the viewpoint of fluidity as a thermosetting resin composition, heat resistance as a cured product and mechanical strength, 2-membered alcohols are preferable, and (poly) alkylene glycols, alkanediols, diols containing an alicyclic structure, and diols containing an aromatic ring are more preferable, and (poly) alkylene glycols are even more preferable. The (poly) alkylene glycol preferably has an alkylene group having 2 to 3 carbon atoms. As the polyhydric alcohol, specifically, (poly) propylene glycol, 2-dimethyl-1, 3-propane diol, hydrogenated bisphenol a and bisphenol a are preferable, and propylene glycol is more preferable. The polyhydric alcohols may be used alone or in combination of 2 or more.
The unsaturated polybasic acid is not particularly limited as long as it is a polybasic acid having an ethylenically unsaturated bond and having 2 or more carboxyl groups or an anhydride thereof. Examples of the unsaturated polybasic acid include polybasic acids such as maleic acid, fumaric acid, citraconic acid, itaconic acid, and chloromaleic acid, and anhydrides thereof. Among them, from the viewpoint of fluidity as a thermosetting resin composition, heat resistance as a cured product and mechanical strength, aliphatic dicarboxylic acids and their anhydrides are preferable, and maleic acid, fumaric acid and their anhydrides are more preferable. The unsaturated polybasic acids may be used alone or in combination of 2 or more.
The saturated polybasic acid is not particularly limited as long as it is a polybasic acid having not an ethylenically unsaturated bond and having 2 or more carboxyl groups or an anhydride thereof. Examples of the saturated polybasic acid include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, nitrophthalic acid, halophthalic anhydride, oxalic acid, malonic acid, azelaic acid, glutaric acid, hexahydrophthalic anhydride, and the like. Among them, dicarboxylic acids and their anhydrides are preferable from the viewpoint of heat resistance and mechanical strength of a cured product and resin fluidity at the time of molding, and phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, and adipic acid are more preferable, and phthalic anhydride and isophthalic acid are still more preferable. The saturated polybasic acids may be used alone or in combination of 2 or more.
(A) The unsaturated polyester resin can be produced by polycondensing the above raw materials by a known method. (A) The conditions for producing the unsaturated polyester resin can be appropriately set depending on the kind and the amount of the raw material used.
(A) The unsaturated polyester resin can be produced, for example, by subjecting the above raw materials to an esterification reaction in an inert gas stream such as nitrogen gas at 140 to 230 ℃ under normal pressure, under pressure or under reduced pressure. When the raw materials are subjected to esterification reaction, an esterification catalyst may be used as necessary. Specific examples of the esterification catalyst include known esterification catalysts such as manganese acetate, dibutyltin oxide, stannous oxalate, zinc acetate, and cobalt acetate. These esterification catalysts may be used alone, or 2 or more of them may be used in combination.
(A) The unsaturated polyester resin has a weight average molecular weight of 5,000 to 15,000. Preferably 5,500 to 10,000, more preferably 6,000 to 8,000. If the weight average molecular weight of the unsaturated polyester resin (A) is less than 5,000, the flowability of the thermosetting resin composition is too high and moldability is lowered. When the weight average molecular weight of the unsaturated polyester resin (A) is more than 15,000, the thermosetting resin composition becomes highly viscous and the flowability is lowered, or the compounding ratio of the ethylenically unsaturated compound (B) needs to be increased and the fogging property of the cured product is deteriorated. The "weight average molecular weight" in the present disclosure refers to a value determined by measuring at room temperature (23 ℃) using a standard polystyrene calibration curve under the following conditions using Gel Permeation Chromatography (GPC).
The device comprises the following steps: shodex (registered trademark) GPC-101 manufactured by Showa Denko K.K
Column: showa Denko K.K. LF-804
Column temperature: 40 deg.C
Sample preparation: (A) 0.2% by mass tetrahydrofuran solution of unsaturated polyester resin
Flow rate: 1 mL/min
Eluent: tetrahydrofuran (THF)
A detector: RI-71S
(A) The unsaturated polyester resin preferably has an unsaturation degree of 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100 mol%. If the degree of unsaturation is in the above range, the moldability of the thermosetting resin composition is further improved. (A) The degree of unsaturation of the unsaturated polyester resin can be calculated from the following formula using the number of moles of the unsaturated polybasic acid and the saturated polybasic acid used as raw materials.
Unsaturation (mole%) } × 100 { (the number of moles of unsaturated polybasic acid × the number of ethylenically unsaturated bonds per 1 molecule of unsaturated polybasic acid)/(the number of moles of unsaturated polybasic acid + the number of moles of saturated polybasic acid) }
[ (B) olefinically unsaturated Compounds ]
The ethylenically unsaturated compound (B) is not particularly limited as long as it has an ethylenically unsaturated bond copolymerizable with the unsaturated polyester resin (a).
Examples of the ethylenically unsaturated compound (B) include aromatic monomers such as styrene, vinyltoluene, α -methylstyrene and divinylbenzene; acrylic monomers such as alkyl (meth) acrylates such as methyl (meth) acrylate, hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, polyoxyalkylene di (meth) acrylates such as triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, and the like; allyl monomers such as triallyl isocyanurate and diallyl phthalate; and oligomers obtained by combining a plurality of the above monomers.
Among the above-mentioned compounds, the ethylenically unsaturated compound (B) is preferably an aromatic monomer and an acrylic monomer, more preferably styrene and an alkyl (meth) acrylate, and still more preferably styrene, from the viewpoint of reactivity with the unsaturated polyester resin (a). The ethylenically unsaturated compound (B) may be used alone or in combination of 2 or more.
(B) The content of the ethylenically unsaturated compound is 55 to 80 parts by mass, preferably 58 to 75 parts by mass, and more preferably 60 to 72 parts by mass, based on 100 parts by mass of the unsaturated polyester resin (A). If the content of the ethylenically unsaturated compound (B) is less than 55 parts by mass, the viscosity of the thermosetting resin composition cannot be sufficiently reduced and the flowability is lowered. When the content of the ethylenically unsaturated compound (B) is more than 80 parts by mass, the fogging property of the cured product is deteriorated.
[ (C) Low shrinkage agent ]
The low shrinkage agent (C) is not particularly limited, and any known in the art of the present invention can be used. Among them, thermoplastic resins are preferably used. Examples of the thermoplastic resin that can be used as the low shrinkage agent (C) include polystyrene, polyethylene, polymethyl methacrylate, polyvinyl acetate, saturated polyester, styrene-butadiene rubber, polycaprolactone, and the like. Among the thermoplastic resins, polystyrene, polyvinyl acetate, saturated polyester, and styrene-butadiene rubber are preferable, polystyrene and styrene-butadiene rubber are more preferable, and polystyrene is further preferable from the viewpoint of low shrinkage. These (C) low shrinkage agents may be used alone or in combination of 2 or more.
(C) The content of the low shrinkage agent is 40 to 75 parts by mass, preferably 50 to 70 parts by mass, and more preferably 55 to 65 parts by mass, based on 100 parts by mass of the unsaturated polyester resin (A). If the content of the (C) low shrinkage agent is less than 40 parts by mass, the curing shrinkage during molding cannot be sufficiently suppressed, and the cured product may be cracked, thereby deteriorating the moldability of the thermosetting resin composition. If the content of the (C) low shrinkage agent is more than 75 parts by mass, the flowability of the thermosetting resin composition is lowered, or the strength of the cured product is adversely affected.
[ (D) curing agent ]
As the curing agent (D), a peroxide is preferably used. Examples of the peroxide that can be used as the curing agent (D) include diacyl peroxides, peroxyesters, hydrogen peroxide, dialkyl peroxides, ketone peroxides, peroxyketals, alkyl peresters, and percarbonates. Specific examples thereof include t-butyl peroxy-2-ethylhexanoate, benzoyl peroxide, 1-di-t-butylperoxy-3, 3, 5-trimethylcyclohexane, t-butylperoxyisopropyl carbonate, t-butyl peroxybenzoate, dicumyl peroxide, and di-t-butyl peroxide. These curing agents (D) may be used alone or in combination of 2 or more. These curing agents are appropriately selected depending on the molding conditions of the thermosetting resin composition and the like.
(D) The content of the curing agent is preferably 3 to 10 parts by mass, more preferably 4 to 8 parts by mass, and still more preferably 5 to 7 parts by mass, per 100 parts by mass of the unsaturated polyester resin (A). If the content of the (D) curing agent is 3 parts by mass or more, the curing reaction by the (D) curing agent proceeds sufficiently. When the content of the curing agent (D) is 10 parts by mass or less, the storage stability of the thermosetting resin composition is good.
[ (E) Release agent ]
Examples of the release agent (E) include fatty acids having 10 to 30 carbon atoms and salts thereof, silicone oils, and synthetic waxes. Among them, a fatty acid having 10 to 30 carbon atoms, a salt thereof or an amide thereof is preferably used because of excellent compatibility with the unsaturated polyester resin (A). Specific examples thereof include stearic acid, oleic acid, zinc stearate, calcium stearate, aluminum stearate, magnesium stearate, stearic acid amide, oleic acid amide, and the like. These (E) releasing agents may be used alone, or 2 or more kinds may be used in combination.
(E) The content of the release agent is preferably 3 to 10 parts by mass, more preferably 4 to 8 parts by mass, and still more preferably 5 to 7 parts by mass, per 100 parts by mass of the unsaturated polyester resin (A). When the content of the (E) release agent is 3 parts by mass or more, the releasability of the cured product is good. When the content of the release agent (E) is 10 parts by mass or less, the release agent component adheres little to the mold, and the thermosetting resin is excellent in productivity.
[ (F) Filler Material ]
The filler (F) is not particularly limited, and any organic or inorganic filler can be used. The substance having a fibrous shape is not classified into (F) a filler. Among them, inorganic filler is preferably used. (F) The filler can be appropriately selected according to necessary functions such as a function of adjusting the viscosity of the thermosetting resin composition to a viscosity suitable for handling and a function of improving the moldability of the thermosetting resin composition.
As the inorganic filler, for example, aluminum hydroxide, barium sulfate, talc, kaolin, calcium sulfate, calcium carbonate, silica, alumina, mica, gypsum, clay, and the like can be used. Among these inorganic fillers, calcium carbonate, aluminum hydroxide and talc are preferable because they are inexpensive, and calcium carbonate and aluminum hydroxide are more preferable. Here, a component that conforms to the definition of both (F) the filler material and (G) the thickener is treated as the (G) thickener. These fillers (F) may be used alone or in combination of 2 or more.
The median particle diameter of the filler (F) is preferably 1 to 100. mu.m, more preferably 1 to 60 μm, and still more preferably 1 to 50 μm, from the viewpoint of the viscosity of the thermosetting resin composition. If the median particle diameter of the filler (F) is 1 μm or more, aggregation of the filler (F) can be suppressed. If the median particle diameter of the filler (F) is 100 μm or less, the increase in viscosity of the thermosetting resin composition can be suppressed, and hence the moldability is good.
In the present disclosure, the "median particle diameter" refers to a particle diameter that is 50% cumulative in a volume-based particle diameter distribution obtained by a laser diffraction/scattering method.
(F) The shape of the filler is not particularly limited, and may be spherical or flat. From the viewpoint of suppressing an increase in viscosity of the thermosetting resin composition, a spherical shape having a small specific surface area is preferable. By suppressing the increase in viscosity of the thermosetting resin to ensure fluidity, the thermosetting resin composition can be easily filled into a mold in a molding step.
From the viewpoint of moldability of the thermosetting resin composition, the content of the filler (F) is preferably 300 parts by mass or more, more preferably 500 parts by mass or more, and still more preferably 700 parts by mass or more, per 100 parts by mass of the unsaturated polyester resin (a). From the viewpoint of moldability of the thermosetting resin composition, the content of the filler (F) is preferably 1000 parts by mass or less, more preferably 950 parts by mass or less, and still more preferably 900 parts by mass or less, per 100 parts by mass of the unsaturated polyester resin (a).
[ (G) thickener ]
As the (G) thickener, a compound exhibiting a thickening effect can be used. Examples of the thickener (G) include metal compounds and isocyanate compounds. Examples of the metal compound include hydroxides and oxides of alkali metals or alkaline earth metals. Examples of the hydroxide and oxide of an alkali metal or alkaline earth metal include magnesium hydroxide, magnesium oxide, calcium hydroxide, and calcium oxide. Examples of the isocyanate compound include aromatic polyisocyanates such as tolylene diisocyanate and 4, 4' -diphenylmethane diisocyanate; alicyclic polyisocyanates such as isophorone diisocyanate and cyclohexane diisocyanate; aromatic aliphatic polyisocyanates such as xylylene diisocyanate; aliphatic polyisocyanates such as 1, 6-hexamethylene diisocyanate; allophanate bodies, biuret bodies, and trimers of the above polyisocyanates; and monoisocyanates such as phenyl isocyanate and isocyanatoethyl methacrylate.
As the thickener (G), in order to obtain the effect of suppressing oxidation of the thermosetting resin composition and suppressing the releasability improving effect by the reaction between the mold surface and the thermosetting resin composition, at least 1 selected from calcium hydroxide, magnesium hydroxide and magnesium oxide is preferably used among the metal compounds, and calcium hydroxide is more preferably used. The thickener (G) may be the above-mentioned compound alone or 2 or more kinds thereof may be used in combination.
(G) The content of the thickener is preferably 0.1 to 5 parts by mass, more preferably 0.5 to 2 parts by mass, and still more preferably 0.8 to 1.2 parts by mass, per 100 parts by mass of the unsaturated polyester resin (A). When the content of the thickener (G) is 0.1 part by mass or more, the thickening effect and the mold release property improving effect by the thickener (G) can be obtained. If the content of the (G) thickener is 5 parts by mass or less, deterioration of moldability due to a decrease in fluidity can be suppressed.
[ (H) fiber-reinforced Material ]
The fiber reinforcement (H) is not particularly limited, and those known in the art of the present invention can be used. Examples of the (H) fibrous reinforcing material include various organic fibers and inorganic fibers such as glass fibers, pulp fibers, polyethylene terephthalate fibers, vinylon fibers, carbon fibers, aramid fibers, and wollastonite. Among these (H) fiber reinforcements, glass fibers are preferable, and glass chopped strands (チョップドストランドガラス) having a fiber length of about 3 to 25mm are more preferable. The above-mentioned (H) fiber-reinforced material may be used alone, or 2 or more kinds may be used in combination.
(H) The content of the fiber reinforcement is preferably 80 to 240 parts by mass, and more preferably 120 to 200 parts by mass, based on 100 parts by mass of the unsaturated polyester resin (A). When the content of the (H) fiber-reinforced material is 80 parts by mass or more, a cured product having more excellent mechanical properties can be obtained. When the content of the (H) fibrous reinforcing material is 240 parts by mass or less, the (H) fibrous reinforcing material is easily uniformly dispersed in the thermosetting resin composition, and a more homogeneous cured product can be obtained.
[ other ingredients ]
The thermosetting resin composition may contain, in addition to the above components, components known in the art of the present invention such as pigments, if necessary, within a range not impairing the effects of the present invention.
< method for producing thermosetting resin composition >
The thermosetting resin composition can be produced by a method generally performed in the technical field of the present invention. Specifically, for example, the thermosetting resin composition can be produced by a method of kneading each component as a raw material of the thermosetting resin composition using a kneader or the like. The conditions such as the order of addition of the components and the kneading time in kneading are not particularly limited, and may be appropriately determined depending on the content of the components.
< shaped body >
The molded article of an embodiment includes a cured product of the thermosetting resin composition. The molded article can be produced by molding the thermosetting resin composition into a predetermined shape and curing the molded article.
The method for molding and curing the thermosetting resin composition is not particularly limited, and a method generally performed in the technical field of the present invention can be used. Specifically, as a molding method of the thermosetting resin composition, compression molding, transfer molding, injection molding, and the like can be used, and injection molding is preferably used. The conditions for molding and curing of the thermosetting resin composition may be determined according to the molding method, the components of the thermosetting resin composition, the shape of the molded article, and the like.
The molded article of an embodiment includes a cured product of the thermosetting resin composition. Therefore, the molded body has excellent fogging properties, and even if the molded body has a shape having uneven wall thickness, the occurrence of cracks is suppressed. Further, the thermosetting resin composition is excellent in flowability, moldability, and releasability from a mold at the time of molding, and therefore, the molded article is excellent in productivity.
The thermosetting resin composition and the molded body of the present disclosure are suitable as a material for a lamp reflector. The applications of the thermosetting resin composition and the molded article of the present disclosure are not limited to lamp reflectors.
< Lamp Reflector and Lamp >
Next, a lamp reflector and a lamp according to an embodiment will be described in detail with reference to the drawings.
Fig. 1 is a schematic sectional view showing a lamp including a lamp reflector according to an embodiment. The lamp shown in fig. 1 is used as a vehicle headlamp such as an automobile. The lamp shown in fig. 1 includes a lamp reflector, a light source 4 provided at a predetermined position of the lamp reflector, and a lens 5 provided at an opening of the lamp reflector.
The lamp reflector of the lamp shown in fig. 1 comprises a shaped body 1, an undercoat layer 2 formed on the shaped body 1, and a metal reflective layer 3 formed on the undercoat layer 2. The molded body 1 is a base material of a lamp reflector and contains a cured product of a thermosetting resin composition.
The undercoat layer 2 improves the adhesion between the molded body 1 and the metal reflective layer 3. The primer layer 2 is a coating film obtained by applying a primer to the molded body 1 and curing the primer. The primer used for forming the primer layer 2 is not particularly limited, and for example, a primer composition known in the art of the present invention may be used.
As the primer, for example, a resin composition containing an Ultraviolet (UV) curable resin or a thermosetting resin, or the like can be used.
Examples of the UV curable resin and the thermosetting resin contained in the primer include acrylic resins and the like. Examples of the acrylic resin contained in the primer include acrylic resins obtained by homopolymerizing or copolymerizing polyfunctional monomers such as pentaerythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol pentaacrylate.
The primer may contain not only an acrylic resin but also other resins such as a polyester resin. Examples of the polyester resin contained in the primer include unsaturated polyester resins, vinyl-modified polyester resins, phenol-modified polyester resins, fat-and-oil-modified polyester resins, and silicone-modified polyester resins.
The primer may contain a curing agent, a solvent, and the like in addition to the resin.
The thickness of the undercoat layer 2 can be appropriately set according to the material of each of the molded body 1, the undercoat layer 2, and the metal reflective layer 3, the size of the lamp reflector, and the like. For example, the thickness of the primer layer 2 may be 10 to 50 μm.
The metal reflective layer 3 reflects light from the light source 4 of the lamp shown in fig. 1. The metal reflective layer 3 is not particularly limited, and any known material in the technical field of the present invention can be used. Examples of the metal reflective layer 3 include those formed of aluminum, silver, zinc, and an alloy mainly composed of silver and zinc.
The thickness of the metal reflective layer 3 may be appropriately set according to the size of the lamp reflector, and the like. For example, the thickness of the metal reflective layer 3 may be
The light source 4 and the lens 5 of the lamp shown in fig. 1 are not particularly limited, and those known in the art of the present invention can be used.
The lamp shown in fig. 1 can be manufactured, for example, by the following method.
First, a molded body 1 of a lamp reflector is produced by molding a thermosetting resin composition into a predetermined shape and curing the composition.
Next, the molded body 1 is subjected to a removal treatment of the release agent as necessary. Examples of the removal treatment of the release agent to be performed on the molded article 1 include a cleaning treatment, a heat treatment, and a flame treatment.
Next, a primer is applied to the molded body 1 and cured to form a primer layer 2. The method for applying the primer to the molded body 1 is not particularly limited, and a known method such as an air spray method or an airless spray method can be used. The method for curing the primer is not particularly limited, and may be appropriately selected depending on the components of the primer, etc.
Next, the metal reflective layer 3 is formed on the undercoat layer 2. The method for forming the metal reflective layer 3 on the undercoat layer 2 is not particularly limited, and a known method such as a vacuum deposition method can be used.
Through the above process, the lamp reflector of the lamp shown in fig. 1 can be obtained.
Next, the light source 4 and the lens 5 are mounted at predetermined positions of the lamp reflector. The method for mounting the light source 4 and the lens 5 is not particularly limited, and a known method can be used.
Through the above procedure, the lamp shown in fig. 1 was obtained.
In the lamp reflector provided in the lamp shown in fig. 1, the molded body 1 contains a cured product of the thermosetting resin composition of the present disclosure. Since the fogging property of the molded body 1 is good, the lamp reflector has excellent fogging property. In the lamp reflector, since the occurrence of cracks in the molded body 1 is suppressed, even if the molded body 1 has a complicated shape having uneven wall thickness portions, a good yield can be obtained.
Examples
The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
The following shows an example of synthesizing the unsaturated polyester resin (A).
[ Synthesis example 1]
In a 4-neck flask equipped with a thermometer, a stirrer, a nitrogen gas inlet and a reflux condenser, the ratio of 100: maleic anhydride and propylene glycol were added in a molar ratio of 100, and the temperature was raised to 210 ℃ while heating and stirring under a nitrogen stream, and esterification was carried out by the procedure of the conventional method to obtain unsaturated polyester resin a 1. Next, 0.015 parts by mass of hydroquinone was added to 100 parts by mass of the reactant, and after cooling to 160 ℃, styrene monomer was further added to obtain a styrene solution containing 170% by mass of unsaturated polyester resin a. The weight average molecular weight (Mw) of the unsaturated polyester resin a1 was measured under the above conditions, and was 6,000.
[ Synthesis example 2]
And (3) adding 80: 20: a styrene solution containing unsaturated polyester resin a2 was obtained in the same manner as in example 1, except that maleic anhydride, phthalic anhydride and propylene glycol were added in a molar ratio of 100. The weight average molecular weight (Mw) of the unsaturated polyester resin a2 was measured under the above conditions, and was found to be 7,000.
Comparative Synthesis example 3
A styrene solution containing unsaturated polyester resin a3 was obtained in the same manner as in example 1, except that the reaction temperature was set to 220 ℃. The weight average molecular weight (Mw) of the unsaturated polyester resin a3 was measured under the above conditions and found to be 20,000.
[ comparative Synthesis example 4]
A styrene solution containing unsaturated polyester resin a4 was obtained in the same manner as in example 1, except that the reaction temperature was set to 230 ℃. The weight average molecular weight (Mw) of the unsaturated polyester resin a4 was measured under the above conditions, and the result was 30,000.
(C) The following substances were used for the components (A) to (B).
(C) Low shrinkage agent:
c1: polystyrene MS-200 (Water accumulation chemical products of the product of the company, the product of the society)
C2: styrene-butadiene rubber T-411G (manufactured by Asahi Kasei Co., Ltd.)
(D) Curing agent: tert-butyl peroxy-2-ethylhexanoate パーブチル O (manufactured by Nichioil Co., Ltd.)
(E) Releasing agent: calcium stearate (manufactured by Nizhi oil Co., Ltd.)
(F) Filling materials: calcium carbonate ソフトン 1200 (Beibei powdered Industrial Co., Ltd., average particle diameter 1.8 μm)
(G) Thickening agent: calcium hydroxide (キシダ chemical company)
(H) Fiber reinforced material: glass chopped strands ECS09B-173 (manufactured by Rido textile Co., Ltd., fiber length 9mm)
[ example 1]
The styrene solution of the unsaturated polyester resin a1 obtained in synthesis example 1 was further added with styrene monomer so that the components (a) and (B) were in the proportions shown in table 1, and kneaded using a twin-wrist kneader. Next, パーブチル O6 was added as a curing agent (D) in an amount of 100 parts by mass of the component (a) and kneaded for 1 minute. To the resulting kneaded mixture were added 56 parts by mass of polystyrene as a low shrinkage agent (C), 6 parts by mass of calcium stearate as a mold release agent (E), 800 parts by mass of calcium carbonate as a filler (F), and 1 part by mass of calcium hydroxide as a thickener (G), and the mixture was kneaded for 35 minutes. Subsequently, 161 parts by mass of glass chopped strands as (H) fiber reinforcements were added and kneaded for 8 minutes. The thermosetting resin composition is obtained by the above steps.
Examples 2 to 9 and comparative examples 1 to 7
Thermosetting resin compositions of examples 2 to 9 and comparative examples 1 to 7 were obtained in the same manner as in example 1 except that the proportions of the components were changed to the proportions shown in Table 1.
[ evaluation of various physical Properties ]
Using the thermosetting resin compositions of examples 1 to 9 and comparative examples 1 to 7, various physical properties were evaluated by the following methods. The evaluation results are shown in table 1.
1. Amount of styrene
The content (mass%) of styrene in the thermosetting resin composition is described as the amount of styrene.
2. Atomization test
Transfer molding was carried out at a molding temperature of 150 ℃ under an injection pressure of 20MPa for a molding time of 1 minute to produce a transfer molded article (phi 117mm, thickness 3 mm). A40 mm square sample was cut out from the transfer molded body and put into a glass dish, and the mouth of the glass dish was completely sealed by capping with aluminum foil and rubber. Next, a glass dish was placed on a hot plate set at 180 ℃ with the aluminum foil facing downward, and heating was performed for 12 hours. The haze values of the glass plate before and after the heat treatment were measured by a haze meter (ヘイズガード II, manufactured by Toyo Seiki Seisaku-sho Ltd.), and the difference in haze values (Δ haze value) between before and after the heat treatment was obtained. The case where the Δ haze value is 1 or less is determined as "good", and the case where the Δ haze value exceeds 1 is determined as "bad".
3. Molding shrinkage ratio
A molded article obtained as a cured product of the thermosetting resin composition was compression-molded at a molding temperature of 150 ℃ under a molding pressure of 10MPa for a molding time of 3 minutes by using a compression molding machine (manufactured by テクノマルシチ K) to obtain a disk-shaped test piece having a diameter of 90mm and a thickness of 11mm, the test piece being defined by JIS K-69115.7. The molding shrinkage was calculated according to JIS K-69115.7 for the obtained test specimens.
4. Cracks at uneven wall thickness
A molded article as a cured product of the thermosetting resin composition was injection-molded at a molding temperature of 160 ℃ and an injection pressure of 60MPa for a molding time of 1 minute by using a mold, to obtain a test piece having a maximum width of 50mm and a length of 150 mm.
As shown in FIG. 2, the obtained test piece had uneven wall thickness portions each consisting of a region having a width of 30mm, a length of 20mm and a thickness of 2mm and a region having a width of 50mm, a length of 130mm and a thickness of 7 mm. By visually observing the uneven wall thickness portion of the test body, the case where no cracks were generated on the surface was evaluated as good, and the case where cracks were generated on the surface was evaluated as bad.
5. Spiral flow (fluidity)
A spiral flow mold having a flow path cross-sectional shape 6 shown in fig. 3, which is a right-left symmetrical trapezoid (upper base a is 6mm, lower base b is 8mm, and height h is 2mm (both are inner diameters)) was attached to a 70t transfer molding machine. A spiral flow test of the thermosetting resin composition was carried out under conditions of a raw material loading of 50g, a molding temperature of 140 ℃ and a molding pressure of 10MPa, and a flow length (spiral flow value) was measured. The obtained spiral flow value was used as an index of fluidity, and a case of exceeding 30cm was judged as "good", and a case of 30cm or less was judged as "poor".
[ tables 1-1]
[ tables 1-2]
As shown in Table 1, the thermosetting resin compositions of examples 1 to 9 were excellent in fogging property and evaluation of cracks at uneven wall thickness was excellent. The thermosetting resin compositions of examples 1 to 9 had a spiral flow value of 34cm or more, sufficient fluidity, small molding shrinkage and excellent moldability.
On the other hand, as shown in table 1, the thermosetting resin compositions of comparative examples 1 and 2 having a small content of (C) a low shrinkage agent had large molding shrinkage rates and cracks were generated in uneven wall thickness portions. (C) The thermosetting resin composition of comparative example 4 containing a large amount of the low shrinkage agent had a small spiral flow value and insufficient fluidity.
The thermosetting resin compositions of comparative examples 3 and 6 using the unsaturated polyester resin (a) (resin A3 and resin a4) having a large weight average molecular weight had a small spiral flow value and insufficient fluidity.
Comparative example 5, in which the fluidity was improved by increasing the amount of styrene, was insufficient in the fogging property as compared with comparative example 3.
Comparative example 7, in which the amount of styrene was reduced as compared with example 9, had a small spiral flow value and insufficient fluidity.
Industrial applicability
The present disclosure provides a thermosetting resin composition that has good flowability, moldability, and releasability from a mold during molding, and that can form a cured product that is not easily cracked even when formed into a shape having a wall thickness unevenness, and that has excellent fogging properties. Further, according to the present disclosure, a molded body having excellent fogging properties and in which generation of cracks is suppressed even in a shape having a wall thickness unevenness is provided. The thermosetting resin composition and the molded article can be widely used for OA equipment, general electric and mechanical parts, heavy electric parts, automobile parts, and the like, and are particularly suitable as a material for a lamp reflector.
Description of the symbols
1 shaped body
2 priming coat
3 metal reflective layer
4 light source
5 lens
6 the cross-sectional shape of the flow path of the spiral flow mold.
Claims (10)
1. A thermosetting resin composition characterized by comprising (A) an unsaturated polyester resin, (B) an ethylenically unsaturated compound, and (C) a low shrinkage agent,
the weight average molecular weight of the unsaturated polyester resin (A) is 5,000-15,000,
the resin composition contains 55-80 parts by mass of the ethylenic unsaturated compound (B) and 40-75 parts by mass of the low shrinkage agent (C) per 100 parts by mass of the unsaturated polyester resin (A).
2. The thermosetting resin composition according to claim 1, wherein the ethylenically unsaturated compound (B) is contained in an amount of 58 to 75 parts by mass based on 100 parts by mass of the unsaturated polyester resin (A).
3. The thermosetting resin composition according to claim 1 or 2, wherein the (C) low shrinkage agent is contained in an amount of 55 to 65 parts by mass based on 100 parts by mass of the (A) unsaturated polyester resin.
4. The thermosetting resin composition claimed in any one of claims 1 to 3, wherein the (A) unsaturated polyester resin is a polycondensate of an unsaturated polybasic acid and a (poly) alkylene glycol.
5. The thermosetting resin composition according to any one of claims 1 to 4, wherein the (C) low shrinkage agent is at least 1 selected from the group consisting of polystyrene and styrene-butadiene-based rubbers.
6. The thermosetting resin composition according to any one of claims 1 to 5, further comprising (D) a curing agent.
7. The thermosetting resin composition according to claim 6, further comprising (E) a mold release agent, (F) a filler, (G) a thickener, and (H) a fiber reinforcing material.
8. The thermosetting resin composition according to claim 7, comprising, per 100 parts by mass of the (A) unsaturated polyester resin:
55 to 80 parts by mass of the ethylenically unsaturated compound (B),
40-75 parts by mass of the low shrinkage agent (C),
3-10 parts by mass of a curing agent (D),
3 to 10 parts by mass of the (E) mold release agent,
300-1000 parts by mass of the filler (F),
0.1 to 5 parts by mass of the thickener (G), and
and 80-240 parts by mass of the (H) fiber reinforced material.
9. A molded article comprising a cured product of the thermosetting resin composition according to any one of claims 1 to 8.
10. A lamp reflector comprising the molded body of claim 9, a primer layer formed on the molded body, and a metal reflective layer formed on the primer layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019182249 | 2019-10-02 | ||
| JP2019-182249 | 2019-10-02 | ||
| PCT/JP2020/030821 WO2021065217A1 (en) | 2019-10-02 | 2020-08-13 | Thermally curable resin composition, molded object, and lamp reflector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114466876A true CN114466876A (en) | 2022-05-10 |
Family
ID=75338178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080069017.6A Pending CN114466876A (en) | 2019-10-02 | 2020-08-13 | Thermosetting resin composition, molded body, and lamp reflector |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021065217A1 (en) |
| CN (1) | CN114466876A (en) |
| WO (1) | WO2021065217A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120233A (en) * | 2003-10-16 | 2005-05-12 | Showa Highpolymer Co Ltd | Thermoplastic block copolymer and unsaturated polyester resin composition, and molded product |
| JP2007262247A (en) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Works Ltd | Thermosetting resin composition, method for producing the same and thermosetting resin molded article |
| CN101654548A (en) * | 2008-08-21 | 2010-02-24 | 昭和高分子株式会社 | Unsaturated polyester resin composition for lamp reflector and its molding product, and a lamp reflector |
| CN104334595A (en) * | 2012-05-28 | 2015-02-04 | 昭和电工株式会社 | Unsaturated polyester resin composition, molded article thereof, and lamp reflector |
| WO2016035516A1 (en) * | 2014-09-04 | 2016-03-10 | 昭和電工株式会社 | Unsaturated polyester resin composition, lamp reflector and method for producing same |
| JP2018090695A (en) * | 2016-12-02 | 2018-06-14 | 昭和電工株式会社 | Arc resistant bmc |
| CN110105736A (en) * | 2018-02-01 | 2019-08-09 | Dic株式会社 | Hot curing resin composition, tubular molding compound and its formed products |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3907333B2 (en) * | 1999-01-12 | 2007-04-18 | ジャパンコンポジット株式会社 | Method for molding unsaturated polyester resin composition |
| JP2011162748A (en) * | 2010-02-15 | 2011-08-25 | Showa Denko Kk | Bulk molding compound, lamp reflector and method for producing the same |
| JP6998537B2 (en) * | 2015-09-28 | 2022-01-18 | パナソニックＩｐマネジメント株式会社 | Molding materials for light reflectors, light reflectors and light emitting devices |
| JP6510471B2 (en) * | 2016-09-06 | 2019-05-08 | ジャパンコンポジット株式会社 | Unsaturated polyester resin composition for molding material, molding material containing the same and molded article |
| JP6889540B2 (en) * | 2016-10-24 | 2021-06-18 | ジャパンコンポジット株式会社 | Unsaturated polyester resin composition for artificial marble, molding materials and molded products containing it |
| CN110382560A (en) * | 2017-03-03 | 2019-10-25 | 日本优必佳株式会社 | Electrical/electronic part crystallinity radical-polymerizable composition uses the electrical/electronic part formed body of the composition and the manufacturing method of the electrical/electronic part formed body |
| JP7152271B2 (en) * | 2018-11-13 | 2022-10-12 | 昭和電工株式会社 | Thermosetting resin composition, motor provided with member made of cured product thereof, and method for manufacturing motor |
| JP7186602B2 (en) * | 2018-12-25 | 2022-12-09 | 昭和電工株式会社 | Thermosetting resin composition, molding and lamp reflector |
-
2020
- 2020-08-13 CN CN202080069017.6A patent/CN114466876A/en active Pending
- 2020-08-13 JP JP2021550400A patent/JPWO2021065217A1/ja active Pending
- 2020-08-13 WO PCT/JP2020/030821 patent/WO2021065217A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120233A (en) * | 2003-10-16 | 2005-05-12 | Showa Highpolymer Co Ltd | Thermoplastic block copolymer and unsaturated polyester resin composition, and molded product |
| JP2007262247A (en) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Works Ltd | Thermosetting resin composition, method for producing the same and thermosetting resin molded article |
| CN101654548A (en) * | 2008-08-21 | 2010-02-24 | 昭和高分子株式会社 | Unsaturated polyester resin composition for lamp reflector and its molding product, and a lamp reflector |
| CN104334595A (en) * | 2012-05-28 | 2015-02-04 | 昭和电工株式会社 | Unsaturated polyester resin composition, molded article thereof, and lamp reflector |
| WO2016035516A1 (en) * | 2014-09-04 | 2016-03-10 | 昭和電工株式会社 | Unsaturated polyester resin composition, lamp reflector and method for producing same |
| JP2018090695A (en) * | 2016-12-02 | 2018-06-14 | 昭和電工株式会社 | Arc resistant bmc |
| CN110105736A (en) * | 2018-02-01 | 2019-08-09 | Dic株式会社 | Hot curing resin composition, tubular molding compound and its formed products |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021065217A1 (en) | 2021-04-08 |
| WO2021065217A1 (en) | 2021-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4598822B2 (en) | Unsaturated polyester resin composition for lamp reflector and molded product thereof | |
| JP5308737B2 (en) | Unsaturated polyester resin composition for lamp reflector and molded product thereof, and lamp reflector | |
| JP6022561B2 (en) | Unsaturated polyester resin composition and molded article thereof, and lamp reflector | |
| JP4673298B2 (en) | Low specific gravity unsaturated polyester resin composition for lamp reflector and molded product thereof | |
| JP6590342B2 (en) | Unsaturated polyester resin composition, lamp reflector and method for producing the same | |
| WO2013018360A1 (en) | Thermoplastic resin composition for reflective material, reflective plate, and light-emitting diode element | |
| JP6140484B2 (en) | Unsaturated polyester resin composition for lamp reflector and molded product thereof, and lamp reflector | |
| US20030083420A1 (en) | Unsaturated polyester resin composition, cured unsaturated polyester resin and lamp reflecting mirror base | |
| CN111201280A (en) | Unsaturated polyester resin composition, molded article containing cured product thereof, and lamp reflector containing the molded article | |
| CN114466876A (en) | Thermosetting resin composition, molded body, and lamp reflector | |
| CN111378265A (en) | Thermosetting resin composition, molded body, and lamp reflector | |
| JP2011162748A (en) | Bulk molding compound, lamp reflector and method for producing the same | |
| JP5919071B2 (en) | Thermoplastic resin for reflector and reflector | |
| WO2018012205A1 (en) | Radically curable resin composition and cured product of same | |
| CN116745330A (en) | Unsaturated polyester resin composition and molded article | |
| JP6782739B2 (en) | A thermosetting resin composition for encapsulating an in-vehicle electronic control unit substrate, an in-vehicle electronic control unit substrate encapsulant using the composition, and a method for manufacturing the encapsulant. | |
| CN114746456A (en) | Thermosetting resin composition | |
| JP2024066883A (en) | Thermosetting resin composition and molded article | |
| CN104334595B (en) | Unsaturated polyester resin compositions and article shaped thereof and lamp reflector | |
| JP2024066880A (en) | Thermosetting resin composition and molded article | |
| CN114616261A (en) | Thermosetting resin composition and electrical/electronic component comprising cured product thereof | |
| JP2021095525A (en) | Thermosetting resin composition, cured product thereof, and artificial marble | |
| JP2020015777A (en) | Crystalline radical polymerizable composition for encapsulating onboard harness terminal, onboard harness terminal encapsulated body using the composition, and manufacturing method of the encapsulated body | |
| JPH10265662A (en) | Resin composition for cured product of low thermal expansion and composite using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Tokyo, Japan Applicant after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Applicant before: Showa electrical materials Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230518 Address after: Tokyo, Japan Applicant after: Showa electrical materials Co.,Ltd. Address before: Tokyo, Japan Applicant before: SHOWA DENKO Kabushiki Kaisha |
|
| TA01 | Transfer of patent application right |