CN110105736A - Hot curing resin composition, tubular molding compound and its formed products - Google Patents
Hot curing resin composition, tubular molding compound and its formed products Download PDFInfo
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- CN110105736A CN110105736A CN201910103669.6A CN201910103669A CN110105736A CN 110105736 A CN110105736 A CN 110105736A CN 201910103669 A CN201910103669 A CN 201910103669A CN 110105736 A CN110105736 A CN 110105736A
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- curing resin
- resin composition
- methyl
- hot curing
- acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/52—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
- C08G63/54—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation the acids or hydroxy compounds containing carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/66—Polyesters containing oxygen in the form of ether groups
- C08G63/668—Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/672—Dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The present invention provides a kind of hot curing resin composition, tubular molding compound and its formed products, for the hot curing resin composition, the mixing of material is excellent, shrinking percentage when being configured to formed products is low, and can obtain heat absorption start temperature it is low and with excellent anti-flammability formed products.The present invention uses a kind of anabolic resin combination of heat, it is characterized in that, it contains: the anabolic resin (A) of heat, polymerizable monomer (B), the inorganic filler (C) comprising sodium bicarbonate and organic peroxide (D).
Description
Technical field
The present invention relates to hot curing resin composition, tubular molding compound and its formed products.
Background technique
Shrinking agent, inhibitor, solidification are added in the heat-curing resins such as unsaturated polyester resin, vinylester resin
Agent, packing material, release agent, strengthening material etc. and hot curing resin composition obtained by being kneaded using kneading machine is had
The advantages that electrical insulating property, heat resistance, anti-flammability, high rigidity, dimensional stability, therefore be widely used in and the phases such as household electrical appliances, automobile
In the encapsulation (sealing material) of the electronic component of pass.Among above-mentioned hot curing resin composition, the bulk molding of bulk is made
Expect (Bulk Molding Compound；Hereinafter referred to as " BMC ".) being capable of molding by extrusion, transfer moudling, injection mold
It is moulded into the manufacturing process such as shape and formed products is made.
In recent years, the high output (densification) of electronic component, miniaturization (lightweight) constantly promote, therefore become in inside
The problems such as must being easy the worry for the sprawling that accumulation is a large amount of hot, after there is fire or fire to occur.
Wherein, as the method for assigning anti-flammability to hot curing resin composition, it is known to add the nothings such as aluminium hydroxide
The technology of machine filler is (referring for example to patent document 1.).However, there is heat absorption start temperature height in these formed products, in low-temperature region
In the insufficient problem of heat absorptivity.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-313785 bulletin
Summary of the invention
Problem to be solved by the invention
The problem to be solved by the invention is to provide a kind of hot curing resin composition, tubular molding compound and its formings
Product, for the hot curing resin composition, the mixing of material is excellent, and shrinking percentage when being configured to formed products is low,
And can obtain heat absorption start temperature it is low and with excellent anti-flammability formed products.
The means used to solve the problem
The inventors of the present invention have made intensive studies to solve the above-mentioned problems, as a result, it has been found that: containing heat-curing resin,
The hot curing resin composition of polymerizable monomer, the inorganic filler comprising sodium bicarbonate and organic peroxide can obtain
The formed products low and with excellent anti-flammability to heat absorption start temperature, so as to complete the present invention.
That is, the present invention provides a kind of hot curing resin composition, which is characterized in that it contains: heat-curing resin
(A), polymerizable monomer (B), the inorganic filler (C) comprising sodium bicarbonate and organic peroxide (D).
Invention effect
It is low and with excellent anti-flammability that hot curing resin composition of the invention can obtain heat absorption start temperature
Formed products, therefore in the supporting mass of electronic component used in can be used for household electrical appliances, automobile etc., sealing material.
Specific embodiment
Hot curing resin composition of the invention contains: heat-curing resin (A), polymerizable monomer (B) include carbonic acid
The inorganic filler (C) of hydrogen sodium and organic peroxide (D).
As above-mentioned heat-curing resin (A), unsaturated polyester resin, vinylester resin, polyurethane acroleic acid can be enumerated
Ester resin, epoxy resin etc., from the high circulation of forming, resin viscosity is low, can be filled and reality based on the height of functional filler
It sets out in terms of the multifunction of existing formed products, preferably unsaturated polyester resin, vinylester resin.It should be noted that this
A little heat-curing resins (A) can be used alone, and can also be used in combination of two or more.
As above-mentioned polymerizable monomer (B), such as styrene, α-methylstyrene, chlorostyrene, dichloro-benzenes second can be enumerated
Alkene, divinylbenzene, t-butyl styrene, vinyltoluene, vinyl acetate, diaryl phthalates, cyanurate three
Aryl ester, monomer with (methyl) acryloyl group etc..These polymerizable monomers can be used a kind, can also be used in combination of two or more.
As the above-mentioned monomer with (methyl) acryloyl group, such as (methyl) methyl acrylate, (methyl) third can be enumerated
Olefin(e) acid ethyl ester, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) propylene
Sour 2- ethylhexyl, (methyl) lauryl acrylate, (methyl) cyclohexyl acrylate, (methyl) benzyl acrylate, (methyl)
Stearyl acrylate, (methyl) tridecyl acrylate, (methyl) acrylic acid 2- hydroxy methacrylate, two ring penta of (methyl) acrylic acid
Alkenyl oxygroup ethyl ester, ethylene glycol single methyl ether (methyl) acrylate, ethylene glycol monomethyl ether (methyl) acrylate, ethylene glycol
Single-butyl ether (methyl) acrylate, ethylene glycol mono hexyl ether (methyl) acrylate, ethylene glycol single 2-ethyl hexyl ether (first
Base) acrylate, diethylene glycol monomethyl ether (methyl) acrylate, diethylene glycol monoethyl ether (methyl) acrylate, two
Ethylene glycol monobutyl ether (methyl) acrylate, diethylene glycol monohexyl ether (methyl) acrylate, diethylene glycol single 2-ethyl
Hexyl ether (methyl) acrylate, (methyl) phenoxyethyl acrylate, (methyl) acrylic acid phenoxy-propyl, ethylene glycol two
(methyl) acrylate, diethylene glycol two (methyl) acrylate, triethylene glycol two (methyl) acrylate, tetraethylene glycol two
(methyl) acrylate, polyethylene glycol two (methyl) acrylate, propylene glycol two (methyl) acrylate, two (first of dipropylene glycol
Base) acrylate, tripropylene glycol two (methyl) acrylate, polypropylene glycol two (methyl) acrylate, two (first of neopentyl glycol
Base) acrylate, two (methyl) acrylate of polytetramethylene glycol, 1,3-BDO two (methyl) acrylate, 1,6-
Bis- ((methyl) the acryloxy) -2- third of hexylene glycol two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, 1,3-
Bis- (4- (methyl) acryloxy ethoxy phenyl) propane of alcohol, 2,2-, bis- (4- (methyl) the acryloxy diethoxies of 2,2-
Bis- (4- (methyl) acryloxypolyethoxyphenyl) propane of phenyl propane, 2,2-, tetraethylene glycol two (methyl) acrylic acid
Ester, ethylene-oxide-modified two (methyl) acrylate of bisphenol-A, isocyanuric acid ethylene-oxide-modified two (methyl) acrylic acid
Ester, pentaerythrite two (methyl) acrylate monostearate etc..
It should be noted that in the present invention, " (methyl) acrylic acid " refer to both acrylic acid and methacrylic acid or
One, " (methyl) acrylate " refer to both acrylate and methacrylate or one, " (methyl) acryloyl group "
Refer to both acryloyl group and methylacryloyl or one.
In hot curing resin composition of the invention, above-mentioned heat-curing resin (A) and above-mentioned polymerizable monomer (B)
Mass ratio [(A)/(B)] be preferably 90/10~30/70 range, more preferably 80/20~40/60 range, further preferably
For 70/30~50/50 range.
In addition, in hot curing resin composition of the invention, from can reduce shrinking percentage aspect, as except upper
The resin component other than heat-curing resin (A) and above-mentioned polymerizable monomer (B) is stated, preferably comprises thermoplastic resin, more preferably
Contain saturated polyester resin.
The content of above-mentioned thermoplastic resin in resin component be preferably 5~40 mass % range, more preferably 10~
The range of 30 mass %.
For above-mentioned inorganic filler (C), it is low from available heat absorption start temperature and with excellent anti-flammability at
It sets out in terms of shape product, it is important that include sodium bicarbonate.
As the above-mentioned inorganic filler (C) in addition to sodium bicarbonate, can enumerate for example aluminium hydroxide, calcium carbonate, magnesium carbonate,
Magnesia, aluminium oxide etc..
For the content of the sodium bicarbonate in above-mentioned inorganic filler (C), from further increasing hot curing resin composition
Mixing and formed products heat absorptivity in terms of set out, the preferably range of 20~80 mass %, more preferable 25~75 mass %
Range.
In addition, in hot curing resin composition of the invention, as the content of above-mentioned inorganic filler (C), relative to
100 mass parts of resin component of above-mentioned heat-curing resin (A) and above-mentioned polymerizable monomer (B) as an essential component, preferably
The range of the range of 100~500 mass parts, more preferable 200~400 mass parts.
Above-mentioned organic peroxide (D) is used as curing agent in hot curing resin composition of the invention.As above-mentioned
Organic peroxide (D) can enumerate such as diacyl peroxide system organic peroxide, peroxyester system organic peroxy
Object, dialkyl peroxide system organic peroxide, ketone peroxide system organic peroxide, peroxy ketal system organic peroxy
Object, percarbonate system organic peroxide etc..
The use level of above-mentioned organic peroxide (D) is relative to above-mentioned heat-curing resin (A) and above-mentioned polymerism list
100 mass parts of resin component of body (B) as an essential component, the preferably range of 0.1~10 mass parts, more preferably 0.5~3
The range of mass parts.
In hot curing resin composition of the invention, other than mentioned component (A)~(D), the present invention is not being damaged
Effect in the range of, polymerization inhibitor, curing accelerator, lower shrinkage agent, release agent, reinforcing material, pigment, resistance can also be cooperated
Fire agent, colorant, defoaming agent etc..
As above-mentioned polymerization inhibitor, such as methyl hydroquinone, hydroquinone, hydroquinone monomethyl ether, Isosorbide-5-Nitrae-can be enumerated
Naphthoquinones, 1,4-benzoquinone, to toluene hydroquinone (p-Toluhydroquinone), p-tert-butyl catechol, 2,6- tert-butyl -4- methylbenzene
Phenol etc..Cooperate use level when polymerization inhibitor in heat-curing resin of the invention in hot curing resin composition of the invention
It is preferably the range of 10~1500ppm in composition.
Above-mentioned lower shrinkage agent is matched for inhibiting the contraction after the solidification of hot curing resin composition of the invention
It closes.As above-mentioned lower shrinkage agent, the resin particle such as acrylic resin, polystyrene can be enumerated.
Above-mentioned release agent is for easy after hot curing resin composition of the invention is formed using mold
In the substance for being removed from the molds resulting formed products.As above-mentioned release agent, such as unsaturated fatty acid amide system can be enumerated
Release agent, polyethylene wax system release agent, metallic soap system release agent, silicone release agent, fluorine system releasing agent etc..In addition, as upper
Metallic soap system release agent is stated, such as zinc laurate, calcium laurate, zinc stearate, calcium stearate, aluminum stearate, tristearin can be enumerated
Sour magnesium, Zinc tetradecanoate, montanic acid calcium, montanic acid zinc, montanic acid aluminium, behenic acid calcium, behenic acid magnesium, behenic acid zinc etc..
As above-mentioned reinforcing material, such as glass fibre, vinylon fiber, phenol fibre, carbon fiber, polyester fiber can be enumerated
Equal fibrous materials.Among these, from the viewpoint of obtaining easiness, preferred glass fibre.The glass fibre can be used
Any one of short glass fiber, milled glass fibre, roving glass fibers etc..
Hot curing resin composition of the invention can be by carrying out the kneading machines such as above-mentioned each components utilising kneader
It is kneaded and manufactures.In addition, be combined into adjusting to match in a manner of making resulting resin combination become bulk, so as to
Tubular molding compound (BMC) is made.
By the way that BMC is made in hot curing resin composition of the invention, so as to utilize extrusion molding, transfer modling
The manufacturing process such as method, injection molding forming are easily made formed products.
Embodiment
Hereinafter, further illustrating the present invention by embodiment.
(Production Example 1: the manufacture of unsaturated polyester (UP))
The third two are added in the reaction vessel for having thermometer, blender, inactive gas introducing port and cocurrent flow cooler
540 mass parts of alcohol, 280 mass parts of M-phthalic acid, 510 mass parts of maleic anhydride, 220 DEG C are warming up in nitrogen atmosphere, makes it
Reaction 7 hours, carries out being cooled to 170 DEG C when solid component acid value reaches 25, then adds 0.13 mass parts of hydroquinone, obtains
Unsaturated polyester (UP).
(Production Example 2: the manufacture of saturated polyester)
Diethyl is added in the reaction vessel for having thermometer, blender, inactive gas introducing port and reflux cooler
320 mass parts of glycol, 270 mass parts of dipropylene glycol, 410 mass parts of M-phthalic acid, 380 mass parts of adipic acid, in nitrogen atmosphere
In be warming up to 230 DEG C, make its react 8 hours, carry out being cooled to 170 DEG C when solid component acid value reaches 7, then add to benzene two
0.14 mass parts of phenol, obtain saturated polyester.
(embodiment 1: the preparation of hot curing resin composition (1))
By 20 mass parts of saturated polyester obtained in 46 mass parts of unsaturated polyester (UP), Production Example 2 obtained in Production Example 1,
34 mass parts of styrene, sodium bicarbonate (Tokuyama Corp's system；60 μm of industrial grade, average grain diameter) 105 mass parts, calcium carbonate
(Dong dusting Industrial Co., Ltd system " NS#100 "；2.1 μm of average grain diameter) 110 mass parts, aluminium hydroxide (Showa electrician's strain formula
Commercial firm's system " Higilite HC-32 "；8 μm of average grain diameter) 120 mass parts, release agent (zinc stearate；Sakai chemical industry strain formula meeting
Society's system " SZ-2000 ") 6 mass parts and curing agent (organic peroxide；Japan Oil Co's system " PERCURE HO ") 1.5 matter
It measures part to be kneaded 8 minutes using kneader, reinforcing material (glass fibre/chopped strand is then added；Chongqing world composite material has
It limits corporation " ECS404-6 "；The long 6mm of fiber) 49.5 mass parts, and then be kneaded 6 minutes, thus obtain heat-curing resin group
It closes object (1).
(embodiment 2~7)
In addition to being changed to carry out similarly to Example 1 with other than being combined into shown in table 1, obtain heat-curing resin
Composition (2)~(7).
(comparative example 1~3)
In addition to being changed to carry out similarly to Example 1 with other than being combined into shown in table 2, obtain heat-curing resin
Composition (R1)~(R3).
Using hot curing resin composition (1)~(7) obtained in above-described embodiment 1~7 and comparative example 1~3 and
(R1)~(R3), carries out following evaluations respectively.
[evaluation of mixing]
The appearance for visually observing resulting hot curing resin composition evaluates mixing according to following benchmark.
◎: becoming bulk, and the dispersity of reinforcing material is excellent.
Zero: becoming bulk, the dispersity of reinforcing material is good.
×: the dispersity of non-Cheng Tuanzhuan, reinforcing material are bad.
[measurement of shaping shrinkage rate]
Extrusion molding is carried out under conditions of 120 DEG C of forming temperature, forming pressure 10MPa, forming the dwell time 180 seconds,
The shrink disc as measurement test film is made, shaping shrinkage rate is calculated according to JIS K6911.
[measurement of heat absorption start temperature and caloric receptivity]
Extrusion molding is carried out under conditions of 120 DEG C of forming temperature, forming pressure 10MPa, forming the dwell time 180 seconds,
300mm × 300mm × thickness 3mm plate is made, test sample is processed according to JIS K7122, utilizes differential scanning amount
Heat meter (TA INSTRUMENTS corporation " DSC Q-100 ", heating rate: 10 DEG C/min, nitrogen atmosphere) starts to measure heat absorption
Caloric receptivity within the scope of temperature and 100~180 DEG C.
[measurement of oxygen index (OI)]
Extrusion molding is carried out under conditions of 120 DEG C of forming temperature, forming pressure 10MPa, forming the dwell time 180 seconds,
300mm × 300mm × thickness 3mm plate is made, measurement test film (length: 130mm, width is cut out according to JIS K7201
Degree: 6.5mm, thickness: 3mm), measure oxygen index (OI).
By the composition of the hot curing resin composition of above-mentioned preparation and evaluation result is shown in table 1 and table 2.
[table 1]
[table 2]
Confirmed: the mixing of the hot curing resin composition of the invention of Examples 1 to 7 is excellent, receipts when forming
Shrinkage is low, in addition, the heat absorption start temperature of resulting formed products is low, excellent in flame retardance.
On the other hand, it is thus identified that: the forming of example, that is, comparative example 1~3 without containing sodium bicarbonate as an essential component
The heat absorption start temperature of product is high.
Claims (4)
1. a kind of hot curing resin composition, which is characterized in that it contains: heat-curing resin (A), polymerizable monomer (B),
Inorganic filler (C) and organic peroxide (D) comprising sodium bicarbonate.
2. hot curing resin composition according to claim 1, wherein relative to the heat-curing resin (A)
And 100 mass parts of resin component of the polymerizable monomer (B) as an essential component, the content of the sodium bicarbonate are 50 mass
Part~500 mass parts.
3. a kind of tubular molding compound, which is characterized in that it is formed by hot curing resin composition of any of claims 1 or 2.
4. a kind of formed products are using obtained by tubular molding compound as claimed in claim 3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018016422A JP7172049B2 (en) | 2018-02-01 | 2018-02-01 | Thermosetting resin composition, bulk molding compound and its molded product |
| JP2018-016422 | 2018-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110105736A true CN110105736A (en) | 2019-08-09 |
Family
ID=67483960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910103669.6A Pending CN110105736A (en) | 2018-02-01 | 2019-02-01 | Hot curing resin composition, tubular molding compound and its formed products |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7172049B2 (en) |
| CN (1) | CN110105736A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466876A (en) * | 2019-10-02 | 2022-05-10 | 昭和电工株式会社 | Thermosetting resin composition, molded body, and lamp reflector |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7400268B2 (en) * | 2019-08-28 | 2023-12-19 | 株式会社レゾナック | Unsaturated polyester resin composition and cured product thereof |
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| JPS4856759A (en) * | 1971-11-20 | 1973-08-09 | ||
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| JPH1095909A (en) * | 1996-09-25 | 1998-04-14 | Sekisui Chem Co Ltd | Unsaturated polyester resin composition and production of unsaturated polyester resin molded article |
| CN103987747A (en) * | 2011-12-14 | 2014-08-13 | 昭和电工株式会社 | Unsaturated polyester resin composition and encapsulated motor |
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| JP2997385B2 (en) * | 1993-12-08 | 2000-01-11 | 株式会社白石中央研究所 | Manufacturing method of lightweight polyester resin powder |
| JP2002036435A (en) * | 2000-07-27 | 2002-02-05 | Sekisui Chem Co Ltd | Laminated molded object and method for manufacturing the same |
| US9447944B2 (en) * | 2012-05-28 | 2016-09-20 | Showa Denko K.K. | Unsaturated polyester resin composition, molded article thereof, and lamp reflector |
| KR102012306B1 (en) * | 2012-06-04 | 2019-08-20 | 니혼 유피카 가부시키가이샤 | Crystalline unsaturated polyester resin composition for led reflector, granular material comprising said composition, led reflector produced by molding said granular material, surface-mount-type light-emitting device, and lighting device and image display device each equipped with said light-emitting device |
| JP5153952B1 (en) * | 2012-06-04 | 2013-02-27 | 日本ユピカ株式会社 | Crystalline unsaturated polyester resin composition for LED reflector, granule comprising the composition, and LED reflector obtained by molding the granule |
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2018
- 2018-02-01 JP JP2018016422A patent/JP7172049B2/en active Active
-
2019
- 2019-02-01 CN CN201910103669.6A patent/CN110105736A/en active Pending
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| JPS4844383A (en) * | 1971-10-08 | 1973-06-26 | ||
| JPS4856759A (en) * | 1971-11-20 | 1973-08-09 | ||
| US4692427A (en) * | 1986-11-25 | 1987-09-08 | Witco Corporation | Dispersions and the preparation of foamed resins therefrom |
| JPH1095909A (en) * | 1996-09-25 | 1998-04-14 | Sekisui Chem Co Ltd | Unsaturated polyester resin composition and production of unsaturated polyester resin molded article |
| CN103987747A (en) * | 2011-12-14 | 2014-08-13 | 昭和电工株式会社 | Unsaturated polyester resin composition and encapsulated motor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466876A (en) * | 2019-10-02 | 2022-05-10 | 昭和电工株式会社 | Thermosetting resin composition, molded body, and lamp reflector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019131736A (en) | 2019-08-08 |
| JP7172049B2 (en) | 2022-11-16 |
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