CN114453284A - Silicon wafer sorting machine - Google Patents
Silicon wafer sorting machine Download PDFInfo
- Publication number
- CN114453284A CN114453284A CN202011244903.6A CN202011244903A CN114453284A CN 114453284 A CN114453284 A CN 114453284A CN 202011244903 A CN202011244903 A CN 202011244903A CN 114453284 A CN114453284 A CN 114453284A
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- Prior art keywords
- silicon wafer
- particles
- sorter
- sorting machine
- total number
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000002245 particle Substances 0.000 claims abstract description 68
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 239000000428 dust Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 34
- 239000008187 granular material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C7/00—Sorting by hand only e.g. of mail
- B07C7/04—Apparatus or accessories for hand picking
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/10—Devices for withdrawing samples in the liquid or fluent state
- G01N1/14—Suction devices, e.g. pumps; Ejector devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/10—Investigating individual particles
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Hydrology & Water Resources (AREA)
- Dispersion Chemistry (AREA)
- Sampling And Sample Adjustment (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention relates to a silicon wafer sorting machine, comprising: the separator comprises a separator body, wherein a discharge hole is formed in the separator body; the bearing platform is used for bearing the silicon wafer box, and the bearing surface of the bearing platform is positioned at the discharge port; the particle detection structure is arranged in the sorting machine body and is used for detecting parameters of particles in the internal environment of the sorting machine body, and the parameters comprise the total number of the particles in the internal environment of the sorting machine; and the alarm structure is used for giving an alarm when the parameter of the particle does not meet the preset condition.
Description
Technical Field
The invention relates to the technical field of silicon wafer product manufacturing, in particular to a silicon wafer sorting machine.
Background
In order to ensure the product quality, the quantity of particles on the surface of the silicon wafer needs to be strictly controlled, the silicon wafer needs to be sorted before the silicon wafer is delivered, in the sorting process, due to the pressure difference between the inside of the sorting machine and the external environment, the air inside the sorting machine is easily led into a silicon wafer box for containing the silicon wafer, and if the content of the particles in the internal environment of the sorting machine exceeds a normal value, the silicon wafer in the silicon wafer box is polluted. However, the existing sorting machine only simply completes the sorting process of the silicon wafer, and does not have the function of detecting the content of the particle-loaded object in the internal environment of the sorting machine in real time, once the content of the particles in the internal environment of the sorting machine exceeds a normal value, the particles are introduced in the loading process of the silicon wafer, and the number of the particles on the surface of the silicon wafer is increased and exceeds the standard.
Disclosure of Invention
In order to solve the technical problem, the invention provides a silicon wafer sorting machine which avoids the pollution of particles in the internal environment of the sorting machine on silicon wafers.
In order to achieve the purpose, the embodiment of the invention adopts the technical scheme that: a silicon wafer sorter comprising:
the separator comprises a separator body, wherein a discharge hole is formed in the separator body;
the bearing platform is used for bearing the silicon wafer box, the bearing surface of the bearing platform is positioned at the discharge port, and the bearing surface and one side edge of the discharge port are positioned on the same horizontal plane;
the particle detection structure is arranged in the sorting machine body and is used for detecting parameters of particles in the internal environment of the sorting machine body, and the parameters comprise the total number of the particles in the internal environment of the sorting machine;
and the alarm structure is used for giving an alarm when the parameter of the particle does not meet the preset condition.
Optionally, the preset condition includes that the total number of particles in the internal environment of the sorter body is smaller than a first preset value.
Optionally, the parameter of the particles further includes a total number of first particles included in an internal environment of the sorting machine and having a size larger than a second preset value, and the preset condition includes that the total number of the first particles in the internal environment of the sorting machine body is smaller than a third preset value.
Optionally, the method further includes: the particle detection device comprises an air guide pipe and an air pump, wherein the air guide pipe is arranged on the inner wall of the separator body and surrounds the discharge port, a plurality of through holes are formed in the air guide pipe, one ends of the through holes are communicated with the inside of the separator body, the other ends of the through holes are connected with the air pump, and the particle detection structure is arranged between the through holes and the air pump.
Optionally, the particle detection structure includes a dust particle counter and a display instrument panel connected to the dust particle counter, and the display instrument panel is disposed on an outer side wall of the separator.
Optionally, the alarm structure includes an indicator light disposed on an outer sidewall of the sorter.
The invention has the beneficial effects that: through the setting of particle detection structure, can obtain the parameter of the granule in the sorter body internal environment, when the parameter of the granule in the sorter body internal environment does not satisfy the preset condition, stop the loading of silicon chip to avoid the pollution of the granule in the sorter body internal environment to the silicon chip.
Drawings
FIG. 1 is a schematic view showing a state where particles enter a silicon wafer cassette in the related art;
FIG. 2 is a schematic view showing the structure of a silicon wafer sorter according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, a thick arrow in fig. 1 indicates a path of the particles 100 entering the silicon wafer cassette, a thin arrow in the sorter indicates a wind direction of the ion wind in the sorter, and when the silicon wafer is loaded, the particles 100 in the external environment enter the sorter from a discharge port of the sorter, and the particles in the sorter enter the silicon wafer cassette from the discharge port, thereby contaminating the silicon wafer.
As shown in fig. 2, the present embodiment provides a silicon wafer sorter, including:
the separator comprises a separator body 1, wherein a discharge hole is formed in the separator body 1;
the bearing platform 2 is used for bearing the silicon wafer box 7, the bearing surface of the bearing platform 2 is positioned at the discharge port, and the bearing surface and one side edge of the discharge port are positioned on the same horizontal plane;
the particle detection structure is arranged in the sorting machine body 1 and is used for detecting parameters of particles in the internal environment of the sorting machine body 1, and the parameters comprise the total number of the particles in the internal environment of the sorting machine;
and the alarm structure is used for giving an alarm when the parameter of the particle does not meet the preset condition.
Through the setting of particle detection structure, can obtain the parameter of the granule in the 1 internal environment of sorter body, when the parameter of the granule in the 1 internal environment of sorter body does not satisfy the default condition, stop the loading of silicon chip to avoid the pollution of the granule in the 1 internal environment of sorter body to the silicon chip.
In the present embodiment, for example, the preset condition includes that the total number of particles in the environment inside the sorter body 1 is smaller than a first preset value.
The first preset value may be set according to actual needs, for example, the first preset value may be 50-100ea (one), in a specific embodiment, the first preset value may be 60, when the total number of particles in the internal environment of the sorter body 1 exceeds the first preset value, the silicon wafer stops being discharged from the discharge port, and the silicon wafer stops being loaded in the silicon wafer box 7, so that contamination of the silicon wafer caused by the excessive particles in the internal environment of the sorter body 1 is avoided.
In this embodiment, the parameter of the particles further includes a total number of the first particles with a size larger than a second preset value, which are included in the internal environment of the sorting machine, and the preset condition includes that the total number of the first particles in the internal environment of the sorting machine body 1 is smaller than a third preset value.
The large-sized particles are more likely to cause damage to the silicon wafer, in some embodiments, only the statistics of the large particles are performed to improve the efficiency, when the total number of the first particles in the internal environment of the sorter body 1 is greater than a third preset value, the discharging of the silicon wafer is stopped, so as to avoid the contamination of the silicon wafer caused by the excessive particles in the internal environment of the sorter body 1, and the statistics of all the particles in the internal environment of the sorter body 1 is not needed, so that the efficiency is improved, the second preset value and the third preset value can be set according to actual needs, for example, the second preset value is 900nm to 1200nm, the third preset value can be 4 to 8, in an embodiment, the second preset value is 1000nm, and the third preset value is 5, when the number of the first particles with the size greater than 1000nm is greater than 5, stopping discharging the silicon wafer and giving an alarm.
In this embodiment, for example, the silicon wafer sorting machine further includes: the particle detection device comprises an air guide pipe 3 and an air suction pump 4, wherein the air guide pipe 3 is arranged on the inner wall of the separator body 1 and surrounds the discharge port, a plurality of through holes are formed in the air guide pipe 3 along the extending direction of the air guide pipe, one end of each through hole is communicated with the inside of the separator body 1, the other end of each through hole is connected with the air suction pump 4, and a particle detection structure is arranged between each through hole and the air suction pump 4.
And sucking the gas in the internal environment of the separator body 1 into the particle detection structure through a suction pump 4, so that the particle detection structure can detect the parameters of the particles in the internal environment of the separator body 1.
In the present embodiment, the Particle detecting structure includes a dust Particle counter (APC), and a display panel 5 connected to the dust Particle counter, wherein the display panel 5 is disposed on an outer sidewall of the sorting machine.
The display instrument panel 5 is convenient for the staff to visually obtain the parameters of the particles in the internal environment of the sorting machine body 1, so that the silicon wafer loading is controlled conveniently.
In the embodiment, the alarm structure comprises an indicator light 6 arranged on the outer side wall of the sorting machine.
The alarm structure may also include an audible alarm or a voice prompt, and is not limited to the setting of the above-mentioned light alarm manner.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A silicon wafer sorter, comprising:
the separator comprises a separator body, wherein a discharge hole is formed in the separator body;
the bearing platform is used for bearing the silicon wafer box, the bearing surface of the bearing platform is positioned at the discharge port, and the bearing surface and one side edge of the discharge port are positioned on the same horizontal plane;
the particle detection structure is arranged in the sorting machine body and is used for detecting parameters of particles in the internal environment of the sorting machine body, and the parameters comprise the total number of all the particles in the internal environment of the sorting machine;
and the alarm structure is used for giving an alarm when the parameter of the particle does not meet the preset condition.
2. The silicon wafer sorter of claim 1 wherein the predetermined condition comprises a total number of particles in an environment inside the sorter body being less than a first predetermined value.
3. The silicon wafer sorter of claim 1 wherein the parameters of the particles further include a total number of first particles contained in the environment internal to the sorter having a size greater than a second predetermined value, the predetermined conditions including the total number of first particles in the environment internal to the sorter body being less than a third predetermined value.
4. The silicon wafer sorter of claim 1 further comprising: the particle detection device comprises an air guide pipe and an air pump, wherein the air guide pipe is arranged on the inner wall of the separator body and surrounds the discharge port, a plurality of through holes are formed in the air guide pipe, one ends of the through holes are communicated with the inside of the separator body, the other ends of the through holes are connected with the air pump, and the particle detection structure is arranged between the through holes and the air pump.
5. The silicon wafer sorter of claim 1 wherein the particle detection structure comprises a dust particle counter and a display dashboard coupled to the dust particle counter, the display dashboard disposed on an exterior sidewall of the sorter.
6. The silicon wafer handler of claim 1, wherein the alarm structure comprises an indicator light disposed on an outer sidewall of the handler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011244903.6A CN114453284A (en) | 2020-11-10 | 2020-11-10 | Silicon wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011244903.6A CN114453284A (en) | 2020-11-10 | 2020-11-10 | Silicon wafer sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114453284A true CN114453284A (en) | 2022-05-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011244903.6A Pending CN114453284A (en) | 2020-11-10 | 2020-11-10 | Silicon wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114453284A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989534A (en) * | 2009-08-06 | 2011-03-23 | 中芯国际集成电路制造(上海)有限公司 | Particle automatic control method and system thereof |
| CN105431294A (en) * | 2013-06-10 | 2016-03-23 | 科迪华公司 | Low-particle gas enclosure systems and methods |
| US20180156727A1 (en) * | 2016-12-02 | 2018-06-07 | Applied Materials, Inc. | Advanced in-situ particle detection system for semiconductor substrate processing systems |
| CN109075095A (en) * | 2016-05-23 | 2018-12-21 | 应用材料公司 | Particle detections for processing substrate |
| CN210775144U (en) * | 2019-09-30 | 2020-06-16 | 合肥晶合集成电路有限公司 | Semiconductor detection machine |
-
2020
- 2020-11-10 CN CN202011244903.6A patent/CN114453284A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989534A (en) * | 2009-08-06 | 2011-03-23 | 中芯国际集成电路制造(上海)有限公司 | Particle automatic control method and system thereof |
| CN105431294A (en) * | 2013-06-10 | 2016-03-23 | 科迪华公司 | Low-particle gas enclosure systems and methods |
| CN109075095A (en) * | 2016-05-23 | 2018-12-21 | 应用材料公司 | Particle detections for processing substrate |
| US20180156727A1 (en) * | 2016-12-02 | 2018-06-07 | Applied Materials, Inc. | Advanced in-situ particle detection system for semiconductor substrate processing systems |
| CN210775144U (en) * | 2019-09-30 | 2020-06-16 | 合肥晶合集成电路有限公司 | Semiconductor detection machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220701 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |