CN214477351U - Film tearing machine with vacuum chuck self-cleaning mechanism - Google Patents
Film tearing machine with vacuum chuck self-cleaning mechanism Download PDFInfo
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- CN214477351U CN214477351U CN202120644395.4U CN202120644395U CN214477351U CN 214477351 U CN214477351 U CN 214477351U CN 202120644395 U CN202120644395 U CN 202120644395U CN 214477351 U CN214477351 U CN 214477351U
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Abstract
The utility model relates to a tear film machine with vacuum chuck self-cleaning mechanism, including antistatic table surface and be located the vacuum chuck on the antistatic table surface, vacuum chuck's level is surveyed and is equipped with clean mechanism, and clean structure includes the gas blow pipe, and the one end of gas blow pipe is equipped with the inlet port, and the inside airflow channel that is equipped with of gas blow pipe, a plurality of ventholes are just seted up to one side of vacuum chuck to the gas blow pipe, and the inlet port passes through admission line and connects outside high-purity nitrogen gas source, and the direction of giving vent to anger of venthole is towards the vacuum chuck surface. The utility model discloses vacuum chuck one side at the dyestripping machine has set up self-cleaning device, and the gas blow pipe through can blowing high-purity nitrogen gas blows to vacuum chuck and blows cleanly, can realize through PLC control that the wafer is opened the automatic clean function of blowing after being removed, and whole journey need not artifical manual processing, need not to shut down, has improved dyestripping operating efficiency, has also reduced the loss of wafer.
Description
Technical Field
The utility model relates to a semiconductor production facility, concretely relates to tear film machine with vacuum chuck self-cleaning mechanism.
Background
Wafers are silicon wafers used in semiconductor integrated circuit fabrication, and in order to prevent breakage during transportation of the wafers, the wafers are usually subjected to a film-sticking process, which is removed in a subsequent manufacturing process. The film tearing equipment adopted at present is a film tearing machine, an operation table top of the film tearing machine is an anti-static table top, a vacuum chuck is arranged on the anti-static table top, and a wafer is placed on the vacuum chuck to be adsorbed and fixed when the film is torn. Through the repeated operation of tearing the membrane, originally remaining tiny particle after grinding on the wafer can be attached to vacuum chuck gradually, in case the particulate matter that adheres to on the vacuum chuck increases, not only can block up the gas pocket on the vacuum chuck and influence the adsorption affinity, still can cause the wafer to appear the crackle and arouse the fragmentation rate increase, consequently need in time carry out cleaning to vacuum chuck. Present tear membrane machine equipment generally does not set up the clean mechanism of vacuum chuck, needs artifical regular shut down clean maintenance, shuts down the frequency statistics when according to normal operation, just needs to shut down clean once about 4 hours, shuts down about 6 times every day, adopts artifical clean mode can cause the outage rate to increase at present, seriously influences production efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a tear film machine with vacuum chuck self-cleaning mechanism can blow to vacuum chuck automatically and clean, avoids vacuum chuck surface to adhere to small particulate matter, specifically adopts following technical scheme to realize:
the utility model provides a tear film machine with vacuum chuck automatically cleaning mechanism, includes the antistatic table face and is located the vacuum chuck on the antistatic table face, vacuum chuck's level is surveyed and is equipped with clean mechanism, clean structure includes the gas blow pipe, and the one end of gas blow pipe is equipped with the inlet port, and the inside airflow channel that is equipped with of gas blow pipe, the gas blow pipe just offers a plurality of ventholes to one side of vacuum chuck, and the inlet port passes through admission line and connects outside high-purity nitrogen gas source, and the direction of giving vent to anger of venthole is towards the vacuum chuck surface.
Furthermore, the air outlets are distributed along the air blowing pipe at intervals horizontally, and the distribution length of the air outlets is greater than the diameter of the vacuum chuck.
Further, the diameter of the vacuum chuck is 200mm, the distribution length of the air outlet holes is 220mm, the aperture size of the air outlet holes is 1mm, the distance between the air outlet holes is 2mm, and the length of the air blowing pipe is 230 mm.
Further, the bottom of the air blowing pipe is provided with an air pipe fixing plate, and the air blowing pipe is fixed on the air pipe fixing plate.
Furthermore, an electromagnetic valve is installed on the air inlet pipeline, a sensor used for detecting whether the wafer is removed or not is arranged at the position of the vacuum chuck, the sensor feeds back a signal to the microprocessor after detecting that the wafer placed on the vacuum chuck is removed, and the microprocessor sends an opening signal to the electromagnetic valve and blows air to the vacuum chuck from the air outlet.
Further, the sensor adopts an infrared sensor or a pressure sensor.
The utility model discloses vacuum chuck one side at the dyestripping machine has set up self-cleaning device, and the gas blow pipe through can blowing high-purity nitrogen gas blows to vacuum chuck and blows cleanly, can realize through PLC control that the wafer is opened the automatic clean function of blowing after being removed, and whole journey need not artifical manual processing, need not to shut down, has improved dyestripping operating efficiency, has also reduced the loss of wafer.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of a vacuum suction cup self-cleaning mechanism of the film tearing machine of the present invention;
fig. 2 is the utility model discloses tear film machine vacuum chuck self-cleaning mechanism side structure schematic diagram.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
The embodiment discloses a tear film machine with vacuum chuck self-cleaning mechanism, as shown in fig. 1 and fig. 2, this tear film machine's tear film mechanism mainly includes antistatic table face 1 and is located the vacuum chuck 2 on antistatic table face 1, and vacuum chuck 2 is used for the fixed wafer of vacuum adsorption to be convenient for tear the membrane operation. In order to realize automatic cleaning and maintenance of the vacuum chuck 2, the present embodiment is provided with a cleaning mechanism on the horizontal side of the vacuum chuck 2. This clean structure is including being located gas blow pipe 3 on upper portion and being used for fixed gas blow pipe 3's trachea fixed plate 4, and gas blow pipe 3 can adopt the screw to fix with trachea fixed plate 4, and the gas blow pipe sets up a plurality of ventholes 5 towards one side of vacuum chuck 2 along the equidistance of horizontal direction, and the inside of gas blow pipe 3 forms airflow channel, and inlet port 6 is seted up to one side of gas blow pipe 3, and inlet port 6 passes through the outside high-purity nitrogen source of admission line connection. In order to ensure better full-coverage blowing cleaning effect on the vacuum chuck 2, the whole length of the horizontally distributed air outlet holes 5 is larger than the diameter of the vacuum chuck 2, taking the vacuum chuck 2 with the diameter of 200mm as an example, the distribution length of the air outlet holes 5 is recommended to be 220mm, the aperture size of the air outlet holes 5 is recommended to be 1mm, the distance between every two adjacent air outlet holes 5 is recommended to be 2mm, and the length of the blowing pipe 3 is recommended to be 230 mm. According to the setting height of the prior anti-static table board 1, in order to ensure that the air outlet 5 is opposite to the surface of the vacuum chuck 2 to blow air after the air blowing pipe 3 is installed, the bottom surface of the anti-static table board 1 is taken as a reference surface, and the height of the air blowing pipe 3 is set to be about 6.25 mm. High-purity nitrogen is used as a gas source for blowing cleaning, so as to avoid influencing the surface of the wafer.
Considering the control requirement that the air blowing pipe 3 can automatically blow air to clean after the wafer is removed from the vacuum chuck 2 every time, the whole process can be automatically controlled by adopting a PLC, that is, a solenoid valve (not shown) is installed on a gas inlet pipe connected with high-purity nitrogen gas, a sensor for detecting whether a wafer is removed is provided at the vacuum chuck 2, there are many sensors capable of realizing such function detection, like infrared sensor and pressure sensor etc. all can, in case the sensor detects that place the wafer on vacuum chuck 2 and remove the back and give microprocessor with the signal feedback, send opening signal to the solenoid valve by microprocessor, high-purity nitrogen gas blows to vacuum chuck 2 from venthole 5 and cleans, cleans maintenance to vacuum chuck 2 immediately after every wafer dyestripping, has avoided the residual influence of particulate matter, and whole clean maintenance need not to shut down and manual intervention.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a tear film machine with vacuum chuck automatically cleaning mechanism, includes the anti-static mesa and is located the vacuum chuck on the anti-static mesa, its characterized in that: vacuum chuck's level is surveyed and is equipped with clean mechanism, clean structure includes the gas blow pipe, and the one end of gas blow pipe is equipped with the inlet port, and the inside air current passageway that is equipped with of gas blow pipe, the gas blow pipe just offers a plurality of ventholes to one side of vacuum chuck, and the inlet port passes through the outside high-purity nitrogen gas source of admission line connection, and the direction of giving vent to anger of venthole is towards the vacuum chuck surface.
2. The film tearing machine provided with the vacuum sucker self-cleaning mechanism as claimed in claim 1, wherein: the air outlet holes are distributed along the air blowing pipe at intervals horizontally, and the distribution length of the air outlet holes is larger than the diameter of the vacuum chuck.
3. The film tearing machine with the vacuum sucker self-cleaning mechanism as claimed in claim 2, wherein: the diameter of the vacuum chuck is 200mm, the distribution length of the air outlet holes is 220mm, the aperture size of the air outlet holes is 1mm, the distance between the air outlet holes is 2mm, and the length of the air blowing pipe is 230 mm.
4. The film tearing machine provided with the vacuum sucker self-cleaning mechanism as claimed in claim 1, wherein: and the bottom of the air blowing pipe is provided with an air pipe fixing plate, and the air blowing pipe is fixed on the air pipe fixing plate.
5. The film tearing machine provided with the vacuum sucker self-cleaning mechanism as claimed in claim 1, wherein: the air inlet pipeline is provided with an electromagnetic valve, the vacuum chuck is provided with a sensor for detecting whether the wafer is removed, the sensor feeds back a signal to the microprocessor after detecting that the wafer placed on the vacuum chuck is removed, and the microprocessor sends an opening signal to the electromagnetic valve and blows air to the vacuum chuck from the air outlet.
6. The film tearing machine provided with the vacuum sucker self-cleaning mechanism as claimed in claim 5, wherein: the sensor adopts an infrared sensor or a pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120644395.4U CN214477351U (en) | 2021-03-30 | 2021-03-30 | Film tearing machine with vacuum chuck self-cleaning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120644395.4U CN214477351U (en) | 2021-03-30 | 2021-03-30 | Film tearing machine with vacuum chuck self-cleaning mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN214477351U true CN214477351U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120644395.4U Active CN214477351U (en) | 2021-03-30 | 2021-03-30 | Film tearing machine with vacuum chuck self-cleaning mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115416948A (en) * | 2022-09-02 | 2022-12-02 | 淮安杰鼎唐科技有限公司 | Self-cleaning film tearing machine |
| CN118372540A (en) * | 2024-06-24 | 2024-07-23 | 中电科风华信息装备股份有限公司 | Flexible product rubberizing notacoria separator and FOF bonding machine |
-
2021
- 2021-03-30 CN CN202120644395.4U patent/CN214477351U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115416948A (en) * | 2022-09-02 | 2022-12-02 | 淮安杰鼎唐科技有限公司 | Self-cleaning film tearing machine |
| CN118372540A (en) * | 2024-06-24 | 2024-07-23 | 中电科风华信息装备股份有限公司 | Flexible product rubberizing notacoria separator and FOF bonding machine |
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