CN114449780A - Novel Mini LED printed circuit board processing method - Google Patents
Novel Mini LED printed circuit board processing method Download PDFInfo
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- CN114449780A CN114449780A CN202210171137.8A CN202210171137A CN114449780A CN 114449780 A CN114449780 A CN 114449780A CN 202210171137 A CN202210171137 A CN 202210171137A CN 114449780 A CN114449780 A CN 114449780A
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- 238000003672 processing method Methods 0.000 title claims abstract description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 107
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000012360 testing method Methods 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 6
- 238000009832 plasma treatment Methods 0.000 claims description 6
- 239000013039 cover film Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 241000883990 Flabellum Species 0.000 claims description 3
- 230000003749 cleanliness Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000007888 film coating Substances 0.000 description 11
- 238000009501 film coating Methods 0.000 description 11
- 238000007789 sealing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011049 pearl Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000013478 data encryption standard Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- -1 drilling Substances 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a processing method of a novel Mini LED printed circuit board, which relates to the technical field of printed circuit board manufacturing, and is realized through novel processing equipment, wherein the novel processing equipment comprises a conveyor belt, the right side of the top of the conveyor belt is provided with a vacuum pressurizing device, the left side of the top of the conveyor belt is provided with a driving mechanism, the rear side of the driving mechanism is provided with a power mechanism in a transmission manner, the driving mechanism is provided with a multidirectional cleaning mechanism in a transmission manner, the exhaust end of the vacuum pressurizing device is connected with the air inlet end of the power mechanism, and the exhaust end of the power mechanism is connected with the multidirectional cleaning mechanism. The invention can effectively clean the substrate before film covering, does not need to carry out AOI test again after film covering is finished, and does not need to arrange an additional air source and a driving source, thereby avoiding greatly improving the equipment cost, simplifying the production steps, improving the production efficiency and being suitable for industrial production.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a processing method of a novel Mini LED printed circuit board.
Background
Along with the development and breakthrough of LED chips and packaging technology thereof, LED dot spacing is realizing the minification, the resolution ratio and the display effect of an LED screen are greatly improved, from monochromatic LED to full-color LED, booth apart from LED, Micro LED, Mini LED upgrades, Mini LED technology is also called sub-millimeter light emitting diode, it means with dozens of LED lamp pearls of traditional LCD display screen side backlight, change into thousands, tens of thousands or even more straight following formula backlight lamp pearls, through the intensive distribution of a large number of lamp pearls, regional dimming in the small range has been realized, thereby can realize higher luminance uniformity and color contrast in the less distance of mixing light.
At present, the traditional manufacturing process of the printed circuit board for the Mini LED comprises the steps of cutting materials, drilling, copper deposition, electroplating, resin hole plugging, baking, plate grinding, inner layer wet film exposure, DES (data encryption standard), AOI (single light source), solder resist printing, solder resist exposure, solder resist development, baking, character screen printing, surface treatment, CNC (computer numerical control) molding, testing, FQC (flexible quality control) and packaging and warehousing.
The invention patent of patent application publication No. CN 109862687B discloses a Mini LED flexible printed circuit board and a manufacturing method thereof, wherein the circuit board comprises a white base material layer, a pad array is distributed on one surface of the white base material layer, a signal line is arranged on the other surface of the white base material layer, a grid layer formed by copper wires in a criss-cross mode is arranged in the area outside the signal line, and copper blocks are arranged on the grid layer corresponding to the pads. The back of pad array is provided with the net that is formed by copper line vertically and horizontally staggered, and corresponds at the back of pad array and be provided with real copper billet, has guaranteed the roughness of face and the stability of whole board harmomegathus to guarantee the preparation precision of pad, the production yield is high, has prevented anti-welding off normal and follow-up welding off normal, through adopting white substrate, has improved the reflectivity of flexible circuit board. The manufacturing method simplifies the production and test processes of the Mini LED flexible printed circuit board, improves the production efficiency and yield and reduces the cost.
However, the above process still has some disadvantages after practical use by those skilled in the art, and obviously, because the circuit board is not cleaned before the cover film is attached, the circuit board needs to be subjected to a second AOI test after the cover film is attached, which increases the equipment cost, also increases the time cost, and reduces the production efficiency of the circuit board.
In view of the above situation, a person skilled in the art thinks of arranging a cleaning mechanism before the laminating station to clean the circuit board, but because the surface of the circuit board has a large number of copper blocks, the cleaning is difficult, the dead angle position at the edge of the copper block is difficult to clean, and meanwhile, an additional driving source and an air source are required to be arranged, so that the equipment cost is greatly increased.
Therefore, it is necessary to invent a new method for processing a Mini LED pcb to solve the above problems.
Disclosure of Invention
The invention aims to provide a novel method for processing a Mini LED printed circuit board so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a processing method of novel Mini LED printed circuit board, processing method is realized through novel processing equipment, novel processing equipment includes the conveyer belt, conveyer belt top right side is provided with vacuum pressure equipment and conveyer belt top left side is provided with actuating mechanism, the transmission is provided with power unit and actuating mechanism and goes up the clean mechanism of transmission and be provided with multidirectional, the exhaust end of vacuum pressure equipment is connected with power unit's inlet end, power unit's exhaust end is connected with the clean mechanism of multidirectional, the fixed trigger mechanism that is provided with in actuating mechanism right side, trigger mechanism drives the push rod in the clean mechanism of multidirectional when the clean mechanism of multidirectional removes, makes its horizontal slip.
Preferably, the driving mechanism comprises a first side plate, a second side plate, a guide rod and a reciprocating screw rod.
Preferably, the second side plate is located at the front side of the first side plate, the guide rod is fixedly arranged between the first side plate and the second side plate and located at the right side between the first side plate and the second side plate, the reciprocating screw rod is located at the left side between the first side plate and the second side plate, and two ends of the reciprocating screw rod penetrate through the first side plate and the second side plate respectively and are connected with the first side plate and the second side plate in a rotating mode through bearings.
Preferably, the power mechanism comprises a sealing shell, fan blades, a partition plate, branch pipes, an air inlet pipe and an air outlet pipe.
Preferably, the sealing shell is fixedly arranged at the rear side of the first side plate, the fan blades are arranged inside the sealing shell and fixedly arranged at the rear end of the reciprocating screw rod, the partition plate is fixedly arranged inside the sealing shell, the branch pipes are arranged in a plurality of and a plurality of positions, the branch pipes uniformly penetrate through the partition plate along the direction perpendicular to the paper surface, the air inlet pipe is fixedly arranged at the rear side of the sealing shell in a penetrating manner, the end part of the air inlet pipe is fixedly connected with the exhaust end of vacuum pressurization equipment, and the exhaust pipe is fixedly arranged at the front side of the sealing shell in a penetrating manner.
Preferably, the multidirectional cleaning mechanism comprises a cleaning plate, a cleaning cavity, a guide plate, a sliding chute, a sliding rod, a push rod, an end plate and a return spring.
Preferably, the cleaning plate is sleeved outside the guide rod and the reciprocating screw rod, the cleaning plate is in threaded connection with the reciprocating screw rod, the cleaning plate is in sliding connection with the guide rod, the cleaning plate is arranged obliquely backwards, the cleaning cavity is formed in the bottom of the cleaning plate, the exhaust pipe penetrates through the top of the cleaning plate and is communicated with the cleaning cavity, a plurality of guide plates and push rods are arranged, the plurality of guide plates are uniformly arranged at the bottom of the inner side of the cleaning cavity from left to right and are rotatably connected with the cleaning cavity through pin shafts, the sliding groove is formed in the rear side of the inner part of the cleaning cavity, the sliding rod is arranged inside the sliding groove in a sliding manner, two ends of the sliding rod penetrate through the inner wall of the cleaning cavity and extend to the outer side of the cleaning plate, the sliding rod is in sliding connection with the cleaning plate, the plurality of push rods are fixedly arranged at the front side of the sliding rod and are respectively positioned at two sides of the plurality of the guide plates, the end plate is fixedly arranged at the left end of the sliding rod, the reset spring is sleeved outside the sliding rod, and the right end of the reset spring is fixedly connected with the cleaning plate and the left end of the reset spring is fixedly connected with the end plate.
Preferably, the trigger mechanism comprises a mounting plate, a trigger slot and a trigger block.
Preferably, the mounting panel is fixed and is set up on the right side between first curb plate and second curb plate, it is a plurality of all to trigger the groove and trigger the piece and all be provided with a plurality ofly, a plurality of trigger the groove and evenly set up in the mounting panel left side, it is a plurality of trigger the even fixed setting in mounting panel left side of piece, it is a plurality of trigger the groove and the crisscross setting of a plurality of trigger pieces.
Preferably, the processing method specifically comprises the following steps:
s1, cutting, drilling, black hole, vertical continuous electroplating and pattern transfer are carried out on the substrate by adopting a conventional process, then AOI test is carried out, and four-terminal test is carried out after the AOI test is finished;
s2, placing the substrates subjected to four-terminal testing on the left side of the top of a conveyor belt in sequence, continuously conveying the substrates forward by the conveyor belt, enabling a vacuum pressurizing device to be in a working state, continuously sucking air by a vacuum pump in the vacuum pressurizing device, inputting the air into a sealed shell through an air inlet pipe, then blowing the air to fan blades after being divided by a plurality of branch pipes, driving a reciprocating screw rod to rotate by the fan blades, further enabling a cleaning plate to repeatedly move back and forth under the driving of the reciprocating screw rod, and simultaneously enabling redundant air flow to enter a cleaning cavity through an exhaust pipe and then be sprayed out from the bottom of the cleaning cavity under the flow guiding of a guide plate;
s3, when the substrate moves to a cleaning station below the multi-direction cleaning mechanism under the conveying of the conveyor belt, the airflow blown out from the bottom of the cleaning cavity directly blows on the surface to be coated on the top of the substrate, and because the cleaning plate is arranged obliquely backwards, the air blown out from the cleaning cavity blows obliquely forwards, and at the moment, all impurities which are not blocked by the copper blocks on the surface of the substrate are blown down;
s4, in the process that the cleaning plate moves along the guide rod and the reciprocating screw rod, the right end of the sliding rod continuously slides along the trigger grooves and the trigger blocks which are arranged in a staggered mode, and then the push rods are driven to move left and right repeatedly, and in the process that the push rods move left and right, the guide plate continuously swings left and right to guide airflow, so that impurities blocked by the copper blocks are blown to the two sides of the copper blocks and then are blown down by the airflow which moves forwards in an inclined mode;
s5, moving the cleaned substrate to a film coating station between the vacuum pressurization equipment and the driving mechanism along with the transmission of the conveyor belt, finishing film coating at the film coating station, then entering the vacuum pressurization equipment for vacuum pressurization operation under the driving of the conveyor belt, removing a gap between the cover film and the substrate, finishing film coating, and taking down the substrate after film coating;
s6, carrying out chemical cleaning, printing, primary pre-baking, exposure, secondary pre-baking, developing and curing operations on the substrate after the film covering is finished, and further finishing the manufacture of the solder mask layer;
s7, after the solder mask is manufactured, carrying out plasma treatment to improve the cleanliness of the bonding pad;
and S8, carrying out gold immersion surface treatment after plasma treatment, and then carrying out flying probe test.
The invention has the technical effects and advantages that:
the invention is provided with the driving mechanism, the power mechanism, the multidirectional cleaning mechanism and the trigger mechanism, so that before the film covering operation is carried out, air exhausted by the vacuum pressurization equipment can be used as a gas source to drive the power mechanism, the power mechanism drives the multidirectional cleaning mechanism to move through the driving mechanism, meanwhile, redundant gas flow can enter the multidirectional cleaning mechanism and is sprayed out from the bottom of the multidirectional cleaning mechanism, the substrate is cleaned, in addition, under the coordination of the trigger mechanism, the gas flow can be continuously guided when the multidirectional cleaning mechanism moves, and further, a better cleaning effect is realized, compared with the same type device or process in the prior art, the invention can effectively clean the substrate before the film covering, the AOI test is not required to be carried out again after the film covering is finished, meanwhile, an additional air source and a driving source are not required to be arranged, the cost of the equipment is greatly improved, can also simplify the production steps, improve the production efficiency and is suitable for industrial production.
Drawings
Fig. 1 is an overall top view of the present invention.
Fig. 2 is a schematic top view of the driving mechanism of the present invention.
Fig. 3 is a schematic top view of a power mechanism according to the present invention.
Fig. 4 is a front cross-sectional structural schematic view of the multi-directional cleaning mechanism of the present invention.
Fig. 5 is a schematic perspective view of the triggering mechanism of the present invention.
In the figure: 1. a conveyor belt; 2. a vacuum pressurization device; 3. a drive mechanism; 31. a first side plate; 32. a second side plate; 33. a guide rod; 34. a reciprocating screw rod; 4. a power mechanism; 41. sealing the housing; 42. a fan blade; 43. a partition plate; 44. a branch pipe; 45. an air inlet pipe; 46. an exhaust pipe; 5. a multidirectional cleaning mechanism; 51. cleaning the plate; 52. cleaning the cavity; 53. a baffle; 54. a chute; 55. a slide bar; 56. a push rod; 57. an end plate; 58. a return spring; 6. a trigger mechanism; 61. mounting a plate; 62. a trigger slot; 63. and triggering the block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The invention provides a processing method of a novel Mini LED printed circuit board as shown in figures 1-5, the processing method is realized by novel processing equipment which comprises a conveyor belt 1, the right side of the top of the conveyor belt 1 is provided with a vacuum pressurizing device 2, the left side of the top of the conveyor belt 1 is provided with a driving mechanism 3, a power mechanism 4 is arranged at the rear side of the driving mechanism 3 in a transmission way, a multi-directional cleaning mechanism 5 is arranged on the driving mechanism 3 in a transmission way, the exhaust end of the vacuum pressurizing device 2 is connected with the air inlet end of a power mechanism 4, the exhaust end of the power mechanism 4 is connected with a multi-directional cleaning mechanism 5, the right side of the driving mechanism 3 is fixedly provided with a trigger mechanism 6, and when the multi-direction cleaning mechanism 5 moves, the trigger mechanism 6 drives a push rod 56 in the multi-direction cleaning mechanism 5 to slide left and right.
As shown in fig. 2, the driving mechanism 3 includes a first side plate 31, a second side plate 32, a guide bar 33, and a reciprocating screw 34.
More specifically, the second side plate 32 is located on the front side of the first side plate 31, the guide rod 33 is fixedly disposed between the first side plate 31 and the second side plate 32 and located on the right side between the first side plate 31 and the second side plate 32, the reciprocating screw rod 34 is located on the left side between the first side plate 31 and the second side plate 32, and two ends of the reciprocating screw rod respectively penetrate through the first side plate 31 and the second side plate 32 and are rotatably connected with the first side plate 31 and the second side plate 32 through bearings.
As shown in fig. 3, the power mechanism 4 includes a sealed housing 41, fan blades 42, a partition plate 43, a branch pipe 44, an intake pipe 45, and an exhaust pipe 46.
More specifically, sealed casing 41 is fixed to be set up in first curb plate 31 rear side, flabellum 42 is located inside sealed casing 41, and fixed the setting in reciprocal lead screw 34 rear end, division board 43 is fixed to be set up inside sealed casing 41, branch pipe 44 is provided with a plurality ofly, and is a plurality of branch pipe 44 evenly runs through along the direction of perpendicular to paper and sets up on division board 43, intake pipe 45 is fixed to run through and sets up in sealed casing 41 rear side, and its tip and vacuum pressure equipment 2's exhaust end fixed connection, exhaust pipe 46 is fixed to run through and sets up in sealed casing 41 front side to the air current of vacuum pressure equipment 2 output can be through intake pipe 45 input to sealed casing 41 inside, then drives flabellum 42 rotatory after the reposition of redundant personnel of pass through a plurality of branch pipes 44, and unnecessary air current then passes through exhaust pipe 46 and exports.
As shown in fig. 4, the multi-directional cleaning mechanism 5 includes a cleaning plate 51, a cleaning chamber 52, a baffle plate 53, a chute 54, a slide rod 55, a push rod 56, an end plate 57, and a return spring 58.
More specifically, the cleaning plate 51 is sleeved on the outer side of the guide rod 33 and the reciprocating screw rod 34, the cleaning plate 51 is in threaded connection with the reciprocating screw rod 34, the cleaning plate 51 is in sliding connection with the guide rod 33, the cleaning plate 51 is arranged obliquely backwards, the cleaning cavity 52 is arranged at the bottom of the cleaning plate 51, the exhaust pipe 46 penetrates through the top of the cleaning plate 51 and is communicated with the cleaning cavity 52, a plurality of guide plates 53 and push rods 56 are arranged, the guide plates 53 are uniformly arranged at the bottom of the inner side of the cleaning cavity 52 from left to right and are rotatably connected with the cleaning cavity 52 through pin shafts, the sliding groove 54 is arranged at the rear side of the inner part of the cleaning cavity 52, the sliding rod 55 is arranged inside the sliding groove 54 in a sliding manner, two ends of the sliding rod 55 penetrate through the inner wall of the cleaning cavity 52 and extend to the outer side of the cleaning plate 51, the sliding rod 55 is in sliding connection with the cleaning plate 51, and the push rods 56 are fixedly arranged at the front side of the sliding rod 55, and are located a plurality of guide plates 53 both sides respectively, end plate 57 is fixed to be set up in the slide bar 55 left end, reset spring 58 cup joints and sets up in the slide bar 55 outside, and its right-hand member and cleaning plate 51 fixed connection and left end and end plate 57 fixed connection to drive cleaning plate 51 repeated back and forth movement when reciprocating screw 34 is rotatory, exhaust pipe 46 inputs the air current to inside the clean chamber 52 simultaneously, then by the blowout of clean chamber 52 bottom, clean the base plate.
As shown in fig. 5, the trigger mechanism 6 includes a mounting plate 61, a trigger groove 62, and a trigger block 63.
More specifically, mounting panel 61 is fixed to be set up on the right side between first curb plate 31 and second curb plate 32, it all is provided with a plurality ofly, a plurality ofly to trigger groove 62 evenly set up in mounting panel 61 left side, a plurality of trigger block 63 evenly fixed sets up in mounting panel 61 left side, and is a plurality of trigger groove 62 and the crisscross setting of a plurality of trigger block 63 to when cleaning plate 51 removes, slide bar 55 slides along a plurality of 62 inner walls of trigger groove and a plurality of trigger block 63 outer wall slides under cleaning plate 51's drive, and then constantly electronic a plurality of push rods 56 remove about repeatedly, and then leads the air current, makes it blow to the copper billet both sides by the impurity that the copper billet blockked, then is blown down by the forward air current of slope.
Example 2
The processing method specifically comprises the following steps:
s1, cutting, drilling, black hole, vertical continuous electroplating and pattern transfer are carried out on the substrate by adopting a conventional process, then AOI test is carried out, and four-terminal test is carried out after the AOI test is finished;
s2, placing the substrates subjected to four-terminal testing on the left side of the top of a conveyor belt 1 in sequence, continuously conveying the substrates forward by the conveyor belt 1, keeping the vacuum pressurization equipment 2 in a working state, continuously sucking air by a vacuum pump in the vacuum pressurization equipment, inputting the air into a sealed shell 41 through an air inlet pipe 45, then blowing the air to fan blades 42 after being divided by a plurality of branch pipes 44, driving the reciprocating screw rods 34 to rotate by the fan blades 42, further enabling the cleaning plate 51 to repeatedly move back and forth under the driving of the reciprocating screw rods 34, simultaneously enabling redundant air flow to enter the cleaning cavity 52 through an exhaust pipe 46, and then spraying the air flow out of the bottom of the cleaning cavity 52 under the flow guiding of a guide plate 53;
s3, when the substrate moves to the cleaning station below the multi-direction cleaning mechanism 5 under the conveying of the conveyor belt 1, the airflow blown out from the bottom of the cleaning cavity 52 directly blows on the surface to be coated on the top of the substrate, and because the cleaning plate 51 is arranged obliquely backwards, the air blown out from the cleaning cavity 52 is blown obliquely forwards, and at the moment, all impurities which are not blocked by the copper blocks on the surface of the substrate are blown down;
s4, in the process that the cleaning plate 51 moves along the guide rod 33 and the reciprocating screw rod 34, the right end of the sliding rod 55 continuously slides along the trigger grooves 62 and the trigger blocks 63 which are arranged in a staggered mode, so that the push rods 56 are driven to move left and right repeatedly, in the process that the push rods 56 move left and right, the guide plate 53 continuously swings left and right, and further air flow is guided, so that impurities blocked by the copper blocks are blown to the two sides of the copper blocks and then blown down by the obliquely forward air flow;
s5, moving the cleaned substrate to a film coating station between the vacuum pressurization equipment 2 and the driving mechanism 3 along with the transmission of the conveyor belt 1, completing film coating at the film coating station, and then entering the vacuum pressurization equipment 2 to perform vacuum pressurization operation under the driving of the conveyor belt 1, so as to eliminate a gap between the film coating and the substrate, completing film coating, and taking down the substrate after film coating;
s6, carrying out chemical cleaning, printing, primary pre-baking, exposure, secondary pre-baking, developing and curing on the coated substrate to complete the manufacture of the solder mask layer;
s7, after the solder mask is manufactured, carrying out plasma treatment to improve the cleanliness of the bonding pad;
and S8, carrying out gold immersion surface treatment after plasma treatment, and then carrying out flying probe test.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. A processing method of a novel Mini LED printed circuit board is characterized by comprising the following steps: the processing method is realized by novel processing equipment which comprises a conveyor belt (1), the right side of the top of the conveyor belt (1) is provided with a vacuum pressurizing device (2) and the left side of the top of the conveyor belt (1) is provided with a driving mechanism (3), a power mechanism (4) is arranged at the rear side of the driving mechanism (3) in a transmission way, a multidirectional cleaning mechanism (5) is arranged on the driving mechanism (3) in a transmission way, the exhaust end of the vacuum pressurization device (2) is connected with the air inlet end of the power mechanism (4), the exhaust end of the power mechanism (4) is connected with the multidirectional cleaning mechanism (5), a trigger mechanism (6) is fixedly arranged on the right side of the driving mechanism (3), when the trigger mechanism (6) moves in the multi-direction cleaning mechanism (5), a push rod (56) of the multi-directional cleaning mechanism (5) is driven to slide left and right.
2. The processing method of the novel Mini LED printed circuit board as claimed in claim 2, wherein: the driving mechanism (3) comprises a first side plate (31), a second side plate (32), a guide rod (33) and a reciprocating screw rod (34).
3. The processing method of the novel Mini LED printed circuit board as claimed in claim 2, wherein: the second side plate (32) is located on the front side of the first side plate (31), the guide rod (33) is fixedly arranged between the first side plate (31) and the second side plate (32) and located on the right side between the first side plate (31) and the second side plate (32), the reciprocating screw rod (34) is located on the left side between the first side plate (31) and the second side plate (32), and two ends of the reciprocating screw rod penetrate through the first side plate (31) and the second side plate (32) respectively and are connected with the first side plate (31) and the second side plate (32) in a rotating mode through bearings.
4. The processing method of the novel Mini LED printed circuit board as claimed in claim 3, wherein: the power mechanism (4) comprises a sealed shell (41), fan blades (42), a partition plate (43), branch pipes (44), an air inlet pipe (45) and an air outlet pipe (46).
5. The processing method of the novel Mini LED printed circuit board as claimed in claim 4, wherein: sealed casing (41) are fixed to be set up in first curb plate (31) rear side, flabellum (42) are located inside sealed casing (41), and fixed the setting in reciprocal lead screw (34) rear end, division board (43) are fixed to be set up inside sealed casing (41), branch pipe (44) are provided with a plurality ofly, and are a plurality of branch pipe (44) evenly run through along the direction of perpendicular to paper and set up on division board (43), intake pipe (45) are fixed to run through and set up in sealed casing (41) rear side, and the exhaust end fixed connection of its tip and vacuum pressure equipment (2), blast pipe (46) are fixed to run through and set up in sealed casing (41) front side.
6. The processing method of the novel Mini LED printed circuit board as claimed in claim 5, wherein: the multi-directional cleaning mechanism (5) comprises a cleaning plate (51), a cleaning cavity (52), a guide plate (53), a sliding groove (54), a sliding rod (55), a push rod (56), an end plate (57) and a return spring (58).
7. The processing method of the novel Mini LED printed circuit board as claimed in claim 6, wherein: the cleaning plate (51) is sleeved and arranged on the outer side of the guide rod (33) and the reciprocating screw rod (34), the cleaning plate (51) is in threaded connection with the reciprocating screw rod (34), the cleaning plate (51) is in sliding connection with the guide rod (33), the cleaning plate (51) is arranged obliquely backwards, the cleaning cavity (52) is arranged at the bottom of the cleaning plate (51), the exhaust pipe (46) penetrates through the top of the cleaning plate (51) and is communicated with the cleaning cavity (52), the guide plates (53) and the push rod (56) are both provided with a plurality of guide plates (53), the guide plates (53) are uniformly arranged at the bottom of the inner side of the cleaning cavity (52) from left to right and are rotatably connected with the cleaning cavity (52) through pin shafts, the sliding groove (54) is arranged at the inner rear side of the inner part of the cleaning cavity (52), the sliding rod (55) is slidably arranged on the inner side of the sliding groove (54), and the two ends of the sliding rod all penetrate through the inner wall of the cleaning cavity (52) and extend to the outer side of the cleaning plate (51), slide bar (55) and clean board (51) sliding connection, it is a plurality of push rod (56) are all fixed to be set up in slide bar (55) front side, and are located a plurality of guide plates (53) both sides respectively, end plate (57) are fixed to be set up in slide bar (55) left end, reset spring (58) cup joint and set up in the slide bar (55) outside, and its right-hand member and clean board (51) fixed connection and left end and end plate (57) fixed connection.
8. The processing method of the novel Mini LED printed circuit board as claimed in claim 7, wherein: the trigger mechanism (6) comprises a mounting plate (61), a trigger groove (62) and a trigger block (63).
9. The processing method of the novel Mini LED printed circuit board as claimed in claim 8, wherein: mounting panel (61) are fixed to be set up on the right side between first curb plate (31) and second curb plate (32), it all is provided with a plurality ofly, a plurality of to trigger groove (62) and trigger piece (63) evenly set up in mounting panel (61) left side, and is a plurality of trigger piece (63) are evenly fixed to be set up in mounting panel (61) left side, and are a plurality of trigger groove (62) and a plurality of trigger piece (63) crisscross the setting.
10. The processing method of the novel Mini LED printed circuit board as claimed in any one of claims 1 to 9, comprising the following steps:
s1, cutting, drilling, black hole, vertical continuous electroplating and pattern transfer are carried out on the substrate by adopting a conventional process, then AOI test is carried out, and four-terminal test is carried out after the AOI test is finished;
s2, the substrates subjected to four-terminal testing are sequentially placed on the left side of the top of a conveyor belt (1), the conveyor belt (1) continuously conveys the substrates forwards, at the moment, a vacuum pressurizing device (2) is in a working state, a vacuum pump in the vacuum pressurizing device continuously sucks air, the air is input into a sealed shell (41) through an air inlet pipe (45), then the air is blown to fan blades (42) after being divided by a plurality of branch pipes (44), at the moment, the fan blades (42) drive a reciprocating screw rod (34) to rotate, a cleaning plate (51) is driven by the reciprocating screw rod (34) to repeatedly move forwards and backwards, and meanwhile, redundant air flow enters the inside of a cleaning cavity (52) through an exhaust pipe (46) and then is sprayed out from the bottom of the cleaning cavity (52) under the flow guiding of a guide plate (53);
s3, when the substrate moves to a cleaning station below the multi-directional cleaning mechanism (5) under the conveying of the conveyor belt (1), airflow blown out from the bottom of the cleaning cavity (52) directly blows on a surface to be coated on the top of the substrate, and because the cleaning plate (51) is arranged obliquely backwards, air blown out from the cleaning cavity (52) is blown obliquely forwards, and at the moment, all impurities which are not blocked by copper blocks on the surface of the substrate are blown down;
s4, in the process that the cleaning plate (51) moves along the guide rod (33) and the reciprocating screw rod (34), the right end of the sliding rod (55) continuously slides along the trigger grooves (62) and the trigger blocks (63) which are arranged in a staggered mode, so that the push rods (56) are driven to move left and right repeatedly, in the process that the push rods (56) move left and right, the guide plate (53) continuously swings left and right, and air flow is guided, so that impurities blocked by the copper blocks are blown to the two sides of the copper blocks and then blown down by the air flow which inclines forwards;
s5, moving the cleaned substrate to a film laminating station between the vacuum pressurization equipment (2) and the driving mechanism (3) along with the transmission of the conveyor belt (1), finishing film laminating at the film laminating station, and then entering the vacuum pressurization equipment (2) to perform vacuum pressurization operation under the driving of the conveyor belt (1), so that a gap between the cover film and the substrate is eliminated, film laminating is finished, and the substrate after film laminating is finished is taken down;
s6, carrying out chemical cleaning, printing, primary pre-baking, exposure, secondary pre-baking, developing and curing operations on the substrate after the film covering is finished, and further finishing the manufacture of the solder mask layer;
s7, after the solder mask is manufactured, carrying out plasma treatment to improve the cleanliness of the bonding pad;
and S8, carrying out gold immersion surface treatment after plasma treatment, and then carrying out flying probe test.
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| CN202210171137.8A CN114449780B (en) | 2022-02-24 | 2022-02-24 | Processing method of Mini LED printed circuit board |
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| CN202210171137.8A CN114449780B (en) | 2022-02-24 | 2022-02-24 | Processing method of Mini LED printed circuit board |
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| JPH09298136A (en) * | 1996-04-30 | 1997-11-18 | Nissin Electric Co Ltd | Treatment of substrate and device thereof |
| TWM534041U (en) * | 2016-09-09 | 2016-12-21 | Jial De Prec Machines Co Ltd | Non-contact cleansing device |
| CN109862687A (en) * | 2018-12-27 | 2019-06-07 | 深圳市景旺电子股份有限公司 | A kind of Mini LED flexible circuit board and preparation method thereof |
| CN209110353U (en) * | 2018-11-16 | 2019-07-16 | 漳州市鸿源电子工业有限公司 | A kind of mash welder of automated cleaning |
| CN112469206A (en) * | 2019-09-06 | 2021-03-09 | 李园艺 | Auxiliary tool for PCB welding jig and using method thereof |
| CN215089130U (en) * | 2021-07-28 | 2021-12-10 | 深圳市迪奥自动化设备有限公司 | Chip mounter that possesses dustproof function |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298136A (en) * | 1996-04-30 | 1997-11-18 | Nissin Electric Co Ltd | Treatment of substrate and device thereof |
| TWM534041U (en) * | 2016-09-09 | 2016-12-21 | Jial De Prec Machines Co Ltd | Non-contact cleansing device |
| CN209110353U (en) * | 2018-11-16 | 2019-07-16 | 漳州市鸿源电子工业有限公司 | A kind of mash welder of automated cleaning |
| CN109862687A (en) * | 2018-12-27 | 2019-06-07 | 深圳市景旺电子股份有限公司 | A kind of Mini LED flexible circuit board and preparation method thereof |
| CN112469206A (en) * | 2019-09-06 | 2021-03-09 | 李园艺 | Auxiliary tool for PCB welding jig and using method thereof |
| CN215089130U (en) * | 2021-07-28 | 2021-12-10 | 深圳市迪奥自动化设备有限公司 | Chip mounter that possesses dustproof function |
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| CN114449780B (en) | 2024-01-30 |
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