CN114447026A

CN114447026A - Method for manufacturing organic image sensor

Info

Publication number: CN114447026A
Application number: CN202210132366.9A
Authority: CN
Inventors: 胡军; 谢芯瑀; 高启仁; 陈伟岸
Original assignee: Jyflex Technology Co ltd
Current assignee: Jyflex Technology Co ltd
Priority date: 2022-02-14
Filing date: 2022-02-14
Publication date: 2022-05-06

Abstract

The invention discloses a manufacturing method of an organic image sensor, belonging to the technical field of manufacturing of organic image sensors.A logic circuit is manufactured on a flexible substrate to form an OTFT module; manufacturing organic light emitting diodes on the flexible transparent bottom plate to form an OPD module; bonding a mechanical light emitting diode of the OPD module with a logic circuit of the OTFT module to form an organic image sensor; the organic image sensor is divided into an OTFT module and an OPD module which are separately manufactured, and then the OTFT baseplate and the OPD module are attached, so that the number of stacked layers of manufactured processes on the same substrate is reduced, and the superposition rise of the product reject ratio is reduced, thereby improving the product yield and reducing the production cost; the OTFT module and the OPD module are produced simultaneously, so that the production time of products can be reduced, the cost is reduced, and the productivity is improved; the flexible material is used for roll-to-roll production, so that the production cost is saved, and the production efficiency is improved; except for the metal electrode manufacturing process, organic low-temperature materials are adopted, so that the production energy consumption is reduced.

Description

Method for manufacturing organic image sensor

Technical Field

The invention belongs to the technical field of manufacturing of organic image sensors, and relates to a manufacturing method of an organic image sensor.

Background

An image sensor is a device for converting an optical image into an electrical signal, and is widely used in the fields of digital still cameras, cellular phones, monitoring cameras, medical care, automobiles, and the like. Due to the increasing demands for higher resolution, lower power consumption, increased dynamic range, etc., device architectures of image sensors have been continuously and rapidly developed. In the conventional manufacturing process, the image sensor starts to be stacked layer by layer from the bottom plate logic circuit, so that a complete production period of a product can pass through about ten yellow light manufacturing processes, the production period is long, the reject ratio of each layer is overlapped, the qualification rate of a final product can be seriously influenced, the cost is increased, and the ultraviolet radiation and the temperature of the rear manufacturing process of the bottom plate logic circuit can cause the electrical damage of logic circuit elements, so that the performance of the logic circuit elements is degraded or unstable.

Disclosure of Invention

The invention aims to: the method for manufacturing the organic image sensor solves the problems that the image sensor starts to be stacked layer by layer from a bottom plate logic circuit, the production period is long, the reject ratio is overlapped to influence the qualification rate of a final product, and the electric damage of a logic circuit element is caused by ultraviolet radiation and temperature of a post-processing procedure of the bottom plate logic circuit.

The technical scheme adopted by the invention is as follows:

an organic image sensor manufacturing method, comprising the steps of:

manufacturing a logic circuit on a flexible substrate to form an OTFT module;

manufacturing organic light emitting diodes on the flexible transparent bottom plate to form an OPD module;

and (3) attaching the organic light emitting diode of the OPD module with the logic circuit of the OTFT module to form the organic image sensor.

Further, the manufacturing of the logic circuit on the flexible substrate to form the OTFT module includes the following steps:

completing the manufacture procedure of a first layer of metal electrode on the flexible substrate, wherein the first layer of metal electrode comprises a source electrode and a drain electrode;

completing an active layer process on the first metal electrode;

performing an insulating layer process to remove the opening on the drain electrode and cover the whole surface;

after the insulating layer is processed, the gate electrode processing is finished;

performing a gate insulation layer process to remove the opening on the drain and cover the whole surface;

and after the gate insulating layer is finished, a pixel electrode layer is manufactured, and the pixel electrode layer is communicated with the drain electrode through the opening.

Further, the first layer of metal electrode adopts sputter metal, the thickness of first layer of metal electrode is 0.1 ~ 1 um.

Furthermore, the active layer is made of silicon or organic semiconductor materials, and the thickness of the active layer is 20-100 nm.

Further, the thickness of the gate insulating layer is greater than the thickness of the insulating layer.

Further, the thickness of insulating layer is 0.1 ~ 1 um.

Further, the method for manufacturing the organic light emitting diode on the flexible transparent bottom plate to form the OPD module comprises the following steps:

coating a transparent metal electrode layer on the flexible transparent bottom plate;

coating an OPD functional layer on the metal electrode;

coating a binder material on the OPD functional layer to form an adhesive layer;

and coating a protective film after the adhesive layer is coated.

Further, the flexible transparent bottom plate is PET or PI.

Furthermore, the transparent metal electrode layer is made of nano metal materials or PEDOT (polymer ethylene terephthalate) PSS.

Further, the adhesive material is OCA glue.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

according to the invention, the organic image sensor is divided into the OTFT module and the OPD module to be separately processed, then the OTFT baseplate and the OPD module are attached, the whole production flow of the product is completed, the number of stacked layers of the processes on the same substrate is reduced, and the superposition rise of the reject ratio of the product is reduced, so that the yield of the product is improved, and the production cost is reduced; the OTFT module and the OPD module are produced simultaneously, so that the production time of products can be reduced, the production beat is promoted, the cost is reduced and the productivity is improved; the flexible material is used for roll-to-roll production, so that the production cost is saved, and the production efficiency is improved; except for the metal electrode manufacturing process, organic low-temperature materials are adopted, so that the production energy consumption is reduced, and the cost is saved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other relevant drawings can be obtained according to the drawings without inventive effort, wherein:

FIG. 1 is a schematic structural view of the present invention;

the labels in the figure are: 10-flexible substrate, 20-flexible transparent bottom plate, 30-transparent metal electrode layer, 40-OPD functional layer, 50-adhesive layer, 60-source electrode, 70-drain electrode, 80-source layer, 90-insulating layer, 100-gate electrode, 110-gate insulating layer and 120-pixel electrode layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating embodiments of the invention, are given by way of illustration only, not by way of limitation, i.e., the embodiments described are intended as a selection of the best mode contemplated for carrying out the invention, not as a full mode. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Examples

As shown in fig. 1, the method for manufacturing an organic image sensor according to the present invention includes the following steps:

manufacturing a logic circuit on the flexible substrate 10 to form an OTFT module;

the OTFT module is manufactured by the following specific steps:

completing the manufacturing process of a first layer of metal electrodes on the flexible substrate 10, wherein the first layer of metal electrodes comprise a source electrode 60 and a drain electrode 70;

in practice, the flexible transparent substrate 20 is cleaned using a roll-to-roll apparatus before the first metal electrode layer is formed. The sputtering process parameters are determined according to different equipment. The process flows of photoresist coating, exposure, development, metal etching, film stripping and the like in the patterning yellow light process are set according to the material equipment used in the process and are not described in a unified way.

Completing the active layer 80 process on the first metal electrode;

in practice, the process parameters are set according to different organic materials, such as coating pressure, coating speed, coating thickness, and the like.

Performing an insulating layer 90 process to remove the opening on the drain 70 and cover the whole surface;

in practice, the insulating layer 90 is used to isolate the leakage between the electrodes, and the process parameters are set according to the equipment and materials.

After the insulating layer 90 is processed, the gate electrode 100 is processed;

in practice, the gate electrode 100 is fabricated in the same process as the first metal electrode.

Performing a gate insulation layer 110 process to cover the entire surface except the opening on the drain 70;

in practice, the gate insulation layer 110 is fabricated in accordance with the process of the insulation layer 90.

After the gate insulating layer 110 is formed, a pixel electrode layer 120 is formed, and the pixel electrode layer 120 is connected to the drain electrode 70 through the opening.

Preferably, the first layer of metal electrode is made of metal by a sputtering machine, and the thickness of the first layer of metal electrode is 0.1-1 um.

Preferably, the active layer 80 is silicon or an organic semiconductor material, and the thickness of the active layer 80 is 20 to 100 nm.

Wherein the thickness of the gate insulating layer 110 is greater than the thickness of the insulating layer 90.

In addition, the thickness of insulating layer 90 is 0.1 ~ 1 um.

Manufacturing organic light emitting diodes on the flexible transparent bottom plate 20 to form an OPD module;

the specific steps for manufacturing the OPD module are as follows:

coating a transparent metal electrode layer 30 on the flexible transparent bottom plate 20;

in practice, the flexible transparent substrate 20 is cleaned using a roll-to-roll apparatus prior to coating the transparent metal electrode layer 30.

Coating an OPD functional layer 40 on the metal electrode;

coating an adhesive material on the OPD functional layer 40 to form an adhesive layer 50;

after the adhesive layer 50 is coated, a protective film is applied.

Preferably, the flexible transparent substrate 20 is PET or PI.

Preferably, the transparent metal electrode layer 30 is made of nano-metal material or PEDOT PSS.

Preferably, the binder material is OCA glue.

In summary, the organic image sensor is divided into the OTFT module and the OPD module to be separately processed, and then the OTFT baseplate and the OPD module are attached, so that the whole production flow of the product is completed, the number of stacked layers of the processes on the same substrate is reduced, and the superposition rise of the reject ratio of the product is reduced, thereby improving the yield of the product and reducing the production cost; the OTFT module and the OPD module are produced simultaneously, so that the production time of products can be reduced, the production beat is promoted, the cost is reduced and the productivity is improved; the flexible material is used for roll-to-roll production, so that the production cost is saved, and the production efficiency is improved; except for the metal electrode manufacturing process, organic low-temperature materials are adopted, so that the production energy consumption is reduced, and the cost is saved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents and improvements made by those skilled in the art within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A method of fabricating an organic image sensor, comprising: the method comprises the following steps:

manufacturing a logic circuit on a flexible substrate to form an OTFT module;

2. The method of claim 1, wherein: the method for manufacturing the logic circuit on the flexible substrate to form the OTFT module comprises the following steps:

completing an active layer process on the first metal electrode;

performing a gate insulation layer process to remove the opening on the drain electrode and cover the whole surface;

3. The method of claim 2, wherein: the first layer metal electrode adopts sputter metal, the thickness of first layer metal electrode is 0.1 ~ 1 um.

4. The method of claim 2, wherein: the active layer is made of silicon or organic semiconductor materials, and the thickness of the active layer is 20-100 nm.

5. The method of claim 2, wherein: the thickness of the gate insulating layer is greater than the thickness of the insulating layer.

6. A method of fabricating an organic image sensor according to claim 1, 2 or 5, wherein: the thickness of insulating layer is 0.1 ~ 1 um.

7. The method of claim 1, wherein: the method for manufacturing the organic light emitting diode on the flexible transparent bottom plate to form the OPD module comprises the following steps:

coating an OPD functional layer on the metal electrode;

and coating a protective film after the adhesive layer is coated.

8. The method of claim 7, wherein: the flexible transparent bottom plate is PET or PI.

9. The method of claim 7, wherein: the transparent metal electrode layer is made of nano metal materials or PEDOT (Poly ethylene glycol Ether-ethylene glycol ether ketone) PSS.

10. The method of claim 7, wherein: the binder material is OCA glue.