CN109656396B - Touch structure, manufacturing method and touch device - Google Patents
Touch structure, manufacturing method and touch device Download PDFInfo
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- CN109656396B CN109656396B CN201710946800.6A CN201710946800A CN109656396B CN 109656396 B CN109656396 B CN 109656396B CN 201710946800 A CN201710946800 A CN 201710946800A CN 109656396 B CN109656396 B CN 109656396B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention discloses a touch structure, a manufacturing method and a touch device, wherein the touch structure comprises: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer and a second TP layer which are isolated from each other to form a capacitor structure; the first TP layer is embedded in the packaging layer, and the second TP layer is embedded in the packaging layer or embedded on the surface of the packaging layer facing the packaging layer. Or, the touch structure includes: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer embedded in the packaging layer or embedded in the outer surface of the packaging layer facing the packaging layer; the packaging layer comprises a second TP layer which is embedded in the packaging layer; the first TP layer and the second TP layer are mutually isolated to form a capacitor structure. In the touch structure, compare in prior art, saved TP layer thickness, pasted the gluey material thickness on TP layer to reduce the whole thickness of touch structure, improved the flexibility of touch structure.
Description
Technical Field
The invention relates to the technical field of electronic information, in particular to a touch structure, a manufacturing method and a touch device.
Background
In a display device, a display device often appears together with a touch structure, and taking an Organic Light-Emitting Diode (OLED) as an example, the display device has become a novel display device having the most potential in recent years with advantages of all solid state, self-luminescence, no need of a backlight source, low driving voltage, high efficiency, realization of ultra-thin and flexible display, and the like. A flexible OLED display device in the prior art is generally manufactured by laminating a plurality of flexible thin films to each other, and fig. 1 is a schematic structural view of a conventional flexible OLED display device, as shown in fig. 1, the flexible OLED display device is structurally composed of a plurality of flexible thin films, including: a cover plate, a Touch Panel (TP), a Polarizer (POL), a flexible Film Encapsulation (TFE), and a flexible substrate carrying OLED devices.
However, for the existing flexible devices such as the flexible OLED display device, since the substrate is made of a flexible material, it is easily subjected to bending deformation during the operation process, and the display device with a longer service life often has problems such as cracks (crack) or peeling (peeling), which seriously affects the operation performance and the service life of the device.
Disclosure of Invention
The invention provides a touch structure, a manufacturing method and a device, which are used for improving the flexibility of a flexible device.
An embodiment of the present invention provides a touch structure, including: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode;
the packaging layer comprises a first TP layer and a second TP layer which are isolated from each other to form a capacitor structure; the first TP layer is embedded in the packaging layer, and the second TP layer is embedded in the packaging layer or embedded on the surface of the packaging layer facing the packaging layer.
Optionally, the encapsulation layer includes N sub-encapsulation layers; the N sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping mode; n is greater than or equal to 2;
the first TP layer is located at an interface of two adjacent sub-encapsulation layers.
Optionally, the first TP layer is located at the first interface;
the second TP layer is located at a second interface, and at least one of the adjacent sub-packaging layers forming the second interface is different from the adjacent sub-packaging layer forming the first interface.
Optionally, the first TP layer and the second TP layer are made of silver nanowire films.
An embodiment of the present invention provides a touch structure, including: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode;
the packaging layer comprises a first TP layer embedded in the packaging layer or embedded in the outer surface of the packaging layer facing the packaging layer;
the packaging layer comprises a second TP layer, and the second TP layer is embedded in the packaging layer;
the first TP layer and the second TP layer are isolated from each other to form a capacitor structure.
Optionally, the encapsulation layer includes N sub-encapsulation layers; the N sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping mode; n is greater than or equal to 2;
the first TP layer is located at an interface of two adjacent sub-encapsulation layers.
The embodiment of the invention provides a touch structure manufacturing method, which comprises the following steps:
preparing a first packaging layer in the substrate to a first preset thickness;
preparing a first TP layer on the surface of the first packaging layer;
continuously preparing a second packaging layer on the first TP layer to a second preset thickness;
growing a second TP layer on the surface of the second packaging layer to form a packaging layer, or continuing to grow a third packaging layer to a third preset thickness after growing the second TP layer on the surface of the second packaging layer to form the packaging layer;
and preparing a packaging layer on the surface of the packaging layer.
Optionally, the first preset thickness is the total thickness of n sub-packaging layers, and the n sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping manner; n is greater than 1;
preparing a first TP layer on the surface of the first packaging layer, wherein the first TP layer comprises the following steps:
preparing the first TP layer on the surface of the nth sub-packaging layer;
and preparing an n +1 layer of sub-packaging layer on the surface of the first TP layer.
Optionally, the (n + 1) th sub-encapsulation layer is an organic layer;
preparing the first TP layer on the surface of the nth layer of sub-packaging layer, wherein the preparation method comprises the following steps:
preparing the first TP layer on the surface of the temporary substrate;
preparing an organic layer on the surface of the first TP layer;
peeling the first TP layer and the organic layer from the temporary substrate;
and attaching one surface of the organic layer, which is far away from the first TP layer, to the surface of the nth sub-packaging layer.
Optionally, preparing an organic layer on the surface of the first TP layer, including:
preparing an organic layer on the surface of the first TP layer to a preset stripping thickness, wherein the preset stripping thickness is smaller than the thickness of the n +1 th sub-packaging layer;
before the surface of the organic layer far away from the first TP layer is attached to the surface of the nth sub-packaging layer, the method further comprises the following steps:
and growing an organic layer on the surface of the nth layer of sub-packaging layer to a preset bonding thickness, wherein the sum of the preset stripping thickness and the preset bonding thickness is equal to the thickness of the (n + 1) th layer of sub-packaging layer.
An embodiment of the present invention provides a touch device, including any one of the touch structures described above.
In summary, embodiments of the present invention provide a touch structure, a manufacturing method and a touch device, in which the touch structure includes: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer and a second TP layer which are isolated from each other to form a capacitor structure; the first TP layer is embedded in the packaging layer, and the second TP layer is embedded in the packaging layer or embedded on the surface of the packaging layer facing the packaging layer. Or, the touch structure includes: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer embedded in the packaging layer or embedded in the outer surface of the packaging layer facing the packaging layer; the packaging layer comprises a second TP layer which is embedded in the packaging layer; the first TP layer and the second TP layer are mutually isolated to form a capacitor structure. In the touch structure, two TP layers are embedded in the packaging layer or the surface of the packaging layer or embedded in the packaging layer, and compared with the prior art, the thickness of the TP layer and the thickness of a glue material for sticking the TP layer are saved, so that the overall thickness of the touch structure is reduced, and the flexibility of the touch structure is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a conventional flexible OLED display device;
fig. 2 is a schematic side-cut view of a touch structure according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a pattern of a first TP layer and a second TP layer according to an embodiment of the present invention;
fig. 4 is a schematic diagram of another pattern of a first TP layer and a second TP layer provided in an embodiment of the present invention;
fig. 5 is a schematic side-cut view of a touch structure according to an embodiment of the present invention;
fig. 6 is a schematic side-cut view of a touch structure according to an embodiment of the present invention;
fig. 7 is a schematic side-cut view of a touch structure according to an embodiment of the present invention;
fig. 8 is a schematic flow chart of a method for manufacturing a touch structure according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 2 is a schematic side-cut view of a touch structure according to an embodiment of the present invention, as shown in fig. 2, the touch structure includes: a substrate 1, a packaging layer 2 and a packaging layer 3 which are arranged in a stacked manner; the packaging layer 2 comprises a first TP layer 41 and a second TP layer 42 which are isolated from each other to form a capacitor structure; the first TP layer 41 is embedded inside the package layer 2, and the second TP layer 42 is embedded inside the package layer 2. In a specific implementation, the substrate 1 may be a flexible substrate. The packaging layer 3 may include a structure of a cover plate, POL, BOCA, etc. non-encapsulation layer and TP layer as shown in fig. 1, but the embodiment of the present invention is not limited thereto.
In the touch structure, the first TP layer 41 and the second TP layer 42 are both patterned TP layer structures, and form a capacitive structure therebetween, so as to implement capacitive touch sensing, where one layer provides ordinate information of touch information, the other layer provides abscissa information of touch information, and the two layers cooperate with each other to implement positioning of touch. Fig. 3 is a schematic diagram of patterns of a first TP layer and a second TP layer according to an embodiment of the present invention, as shown in fig. 3, the first TP layer 41 is a vertical pattern, the second TP layer 42 is a horizontal pattern, in the touch structure, the first TP layer 41 and the second TP layer 42 are partially overlapped to form a capacitance structure, and the first TP layer 41 and the second TP layer 42 sense touch information through a change of capacitance charges, so as to provide horizontal coordinate information and vertical coordinate information of the touch information, respectively. It should be understood that the first TP layer 41 may also be in a longitudinal pattern, and the second TP layer 42 may also be in a transverse pattern, which is not limited by the embodiment of the present invention. In addition, the pattern of the first TP layer 41 and the second TP layer 42 can also be as shown in fig. 4, fig. 4 is a schematic diagram of another pattern of the first TP layer and the second TP layer provided by the embodiment of the present invention, in fig. 4, the first TP layer 41 is a pattern formed by prismatic transverse connections, and the second TP layer 42 is a pattern formed by prismatic longitudinal connections. In the touch structure, the prismatic connection points of the first TP layer 41 and the second TP layer 42 are overlapped to form a capacitive structure, and the first TP layer 41 and the second TP layer 42 sense touch information through a change of a capacitive charge, thereby providing abscissa information and ordinate information of the touch information, respectively.
It should be appreciated that in particular implementations of the touch structure, the first TP layer and the second TP layer need not both be embedded within the encapsulation layer, wherein one of the embedded encapsulation layer surfaces still enables a reduction in the thickness of the touch structure. Fig. 5 is a schematic side-cut view of a touch structure according to an embodiment of the present invention, where the touch structure shown in fig. 5 includes: a substrate 1, a packaging layer 2 and a packaging layer 3 which are arranged in a stacked manner; the packaging layer 2 comprises a first TP layer 41 and a second TP layer 42 which are isolated from each other to form a capacitor structure; the first TP layer 41 is embedded inside the encapsulation layer 2, and the second TP layer 42 is embedded on the surface of the encapsulation layer 2 facing the package layer 3.
In the touch structure shown in fig. 1 and 5, the first TP layer is embedded in the encapsulation layer, and the second TP layer is embedded in the interior or on the surface of the encapsulation layer, which saves the thickness of the TP layer and the thickness of the adhesive material for adhering the TP layer compared with the existing touch structure, thereby reducing the overall thickness of the touch structure and improving the flexibility of the touch structure.
Because the flexible device has higher flexibility requirement on the packaging structure, most of the existing flexible devices are multi-layer packaging structures, and the embodiment of the invention also provides an implementation mode of the packaging structure suitable for multi-layer packaging. Optionally, the encapsulation layer includes N sub-encapsulation layers; the N sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping mode; n is greater than or equal to 2; the first TP layer is located at the interface of two adjacent sub-encapsulation layers. Fig. 6 is a schematic side-cut view of a touch structure according to an embodiment of the present invention, and as shown in fig. 6, the encapsulation layer 2 includes a sub-encapsulation layer 21, a sub-encapsulation layer 22, and a sub-encapsulation layer 23, where the sub-encapsulation layer 21 and the sub-encapsulation layer 23 are inorganic layers, and the sub-encapsulation layer 22 is an organic layer. The first TP layer 41 is located at the interface of the sub-encapsulation layer 22 and the sub-encapsulation layer 23. The first TP layer 41 is fabricated at the interface of two adjacent sub-package layers instead of inside the sub-package layers, so that the influence of the first TP layer 41 on the sub-package layer package effect can be reduced, and the growth of the package layer is easier. Of course, as shown in fig. 6, when the second TP layer 42 is also embedded inside the encapsulation layer and the encapsulation layer has a plurality of sub-encapsulation layers, the second TP layer may also be located at the interface of two adjacent sub-encapsulation layers, and the second TP layer 42 is grown at the interface of the sub-encapsulation layer 21 and the sub-encapsulation layer 22 in fig. 6.
When the packaging layer is of a multilayer structure and the first TP layer and the second TP layer are embedded inside the packaging layer, the first TP layer and the second TP layer are both positioned at the interface of two adjacent sub-packaging layers. Optionally, the first TP layer is located at the first interface; the second TP layer is located at the second interface, and at least one of the adjacent sub-encapsulation layers constituting the second interface is different from the adjacent sub-encapsulation layer constituting the first interface. That is, the first TP layer and the second TP layer are located at different sub-interfaces. This is because, when the first TP layer and the second TP layer are located on the same sub-interface, an insulating medium needs to be grown between the first TP layer and the second TP layer to prevent the first TP layer and the second TP layer from being short-circuited, which undoubtedly increases the difficulty of manufacturing the TP layers, and the reliability of the finally obtained touch device cannot be guaranteed.
Optionally, the first TP layer and the second TP layer are made of silver nanowire films. The silver nanowire film has excellent photoelectric properties, the sheet resistance of the silver nanowire film is still lower than 50 omega/sq when the transmittance is higher than 90%, and compared with the traditional conductive glass Tin-doped Indium Oxide (ITO), the silver nanowire film has higher ductility and flexibility and is one of the most promising materials of the flexible touch technology.
Based on the same technical concept, the embodiment of the invention also provides another touch structure. Fig. 7 is a schematic side-cut view of a touch structure according to an embodiment of the present invention, as shown in fig. 7, the touch structure includes: a substrate 1, a packaging layer 2 and a packaging layer 3 which are arranged in a stacked manner; the packaging layer 2 comprises a first TP layer 41, the first TP layer 41 is embedded inside the packaging layer 2 or embedded on the outer surface of the packaging layer 2 facing the packaging layer 3; the packaging layer 3 comprises a second TP layer 42, and the second TP layer 42 is embedded in the packaging layer 3; the first TP layer 41 and the second TP layer 42 are isolated from each other to form a capacitor structure. In embodiments of the present invention, the packaging layer 3 may comprise one or more of a lidding sheet, POL, BOCA, etc., and the second TP layer may be embedded in or between any of these layers.
In the touch structure provided by the embodiment of the invention, the first TP layer 41 and the second TP layer 42 are respectively embedded in the encapsulation layer 2 and the packaging layer 3, and compared with the existing touch structure, the thickness of the TP layer and the thickness of the adhesive material for adhering the TP layer are omitted, so that the overall thickness of the touch structure is reduced, and the flexibility of the touch structure is improved.
Of course, the second TP layer may be embedded in the substrate 1 without affecting the touch effect, and such a case should also be included in the embodiment of the present invention.
The encapsulation layers of the touch structure shown in fig. 7 include N sub-encapsulation layers for the same reason as in the previous embodiment, the N sub-encapsulation layers being organic and inorganic layers that are grown to overlap; n is greater than or equal to 2; the first TP layer is located at the interface of two adjacent sub-encapsulation layers.
In summary, an embodiment of the present invention provides a touch structure, including: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer and a second TP layer which are isolated from each other to form a capacitor structure; the first TP layer is embedded in the packaging layer, and the second TP layer is embedded in the packaging layer or embedded on the surface of the packaging layer facing the packaging layer. An embodiment of the present invention further provides a touch structure, including: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises a first TP layer embedded in the packaging layer or embedded in the outer surface of the packaging layer facing the packaging layer; the packaging layer comprises a second TP layer which is embedded in the packaging layer; the first TP layer and the second TP layer are mutually isolated to form a capacitor structure. In the touch structure, two TP layers are embedded in the packaging layer or the surface of the packaging layer or embedded in the packaging layer, and compared with the prior art, the thickness of the TP layer and the thickness of a glue material for sticking the TP layer are saved, so that the overall thickness of the touch structure is reduced, and the flexibility of the touch structure is improved.
Based on the same technical concept, the embodiment of the invention also provides a touch structure manufacturing method, and the method can manufacture the touch structure provided by any one of the embodiments. Fig. 8 is a schematic flow chart of a method for manufacturing a touch structure according to an embodiment of the present invention, as shown in fig. 8, including the following steps:
s801: a first packaging layer is prepared in the substrate to a first preset thickness.
S802: and preparing a first TP layer on the surface of the first packaging layer.
S803: and continuously preparing a second packaging layer on the first TP layer to a second preset thickness.
S804: and growing a second TP layer on the surface of the second packaging layer to form the packaging layer, or continuing to grow a third packaging layer to a third preset thickness after growing the second TP layer on the surface of the second packaging layer to form the packaging layer.
S805: and preparing a packaging layer on the surface of the packaging layer.
In S801, a first predetermined thickness is related to a position relationship between the TP layer and the encapsulation layer, and taking the touch structure shown in fig. 5 as an example, when the touch structure is manufactured, the first predetermined thickness is a thickness of the encapsulation layer between the first TP layer 41 and the substrate 1, and the first encapsulation layer is an encapsulation layer between the first TP layer 41 and the substrate 1. It should be understood that in the embodiment of the manufacturing method of the present invention, the TP layer manufactured first is the first TP layer, and the TP layer manufactured later is the second TP layer, and it should be understood that the distinction between the first TP layer and the second TP layer is only for simplifying the description of the manufacturing method, and such a definition does not exist in the embodiment of the touch structure.
In S802, an embodiment of the present invention provides an implementation manner in a case that an encapsulation layer is a multi-layer encapsulation structure. Optionally, the first preset thickness is the total thickness of n sub-packaging layers, and the n sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping manner; n is greater than 1; preparing a first TP layer on the surface of the first packaging layer, specifically, preparing the first TP layer on the surface of the nth sub-packaging layer; and after the first TP layer is prepared, continuously preparing the (n + 1) th sub-packaging layer on the surface of the first TP layer. Alternatively, the first TP layer may be prepared on the surface of the nth sub-encapsulation layer by a variety of methods such as inkjet printing, screen printing, mask-assisted spray coating or spin coating, self-assembly (contact printing, stencil method, Langmuir-Blodgett, LB) method, evaporation-induced method, and the like. After the preparation of the first TP layer is completed, whether to continue growing the (n + 1) th sub-encapsulation layer can be determined according to the structure of the target encapsulation layer.
Optionally, when the n +1 th sub-encapsulation layer is an organic layer, that is, the nth sub-encapsulation layer is an inorganic layer, an embodiment of the present invention further provides a method for growing a first TP layer on the surface of the inorganic sub-encapsulation layer, where the method mainly includes the following steps:
the method comprises the following steps: and preparing a first TP layer on the surface of the temporary substrate.
Step two: and preparing an organic layer on the surface of the first TP layer.
Step three: the first TP layer and the organic layer are peeled off from the temporary substrate.
Step four: and attaching one surface of the organic layer, which is far away from the first TP layer, to the surface of the nth sub-packaging layer.
In the first step, the temporary substrate may be a substrate such as a silicon wafer, glass, or Polyethylene terephthalate (PET), and the first TP layer is prepared on the surface of the temporary substrate by inkjet printing, screen printing, mask-assisted spray coating or spin coating, self-assembly (contact printing, stencil, LB, evaporation induction), or the like.
The first TP layer prepared by the method provided by the embodiment of the invention can have a good combination effect with the organic layer, so that the first TP layer is more stable in the packaging layer and has better flexibility.
Optionally, in the second step, the thickness of the organic layer prepared on the surface of the first TP layer is a preset stripping thickness, and the preset stripping thickness is smaller than the thickness of the n +1 th sub-encapsulation layer. Before the attaching is performed in the fourth step, the method further comprises: and growing an organic layer on the surface of the n-1 th sub-packaging layer to a preset bonding thickness, wherein the sum of the preset stripping thickness and the preset bonding thickness is equal to the thickness of the nth sub-packaging layer. As is well known, in most cases, the growth is firmer than the structure obtained by bonding, and the bonding effect between the same materials is better than the bonding effect between different materials, in the embodiment of the present invention, the n +1 th sub-package layer is divided into two parts to grow, so that the part growing on the surface of the n th sub-package layer can be firmly combined with the n th sub-package layer, and the two bonded parts are both organic materials of the n +1 th sub-package layer, and the bonding effect is better than the effect of directly bonding the n +1 th sub-package layer to the surface of the n th sub-package layer.
It should be understood that, in the embodiment of the present invention, only the first TP layer is taken as an example to describe the method for fabricating the TP layer in the encapsulation layer, and for the structure in which the second TP layer is also embedded in the encapsulation layer, the embodiment of the present invention is also applicable to the fabrication of the second TP layer, and the detailed description of the embodiment of the present invention is omitted here.
Based on the same technical concept, an embodiment of the present invention further provides a touch device with a touch function, where the touch device includes the touch structure provided in any of the above embodiments, and the touch function is implemented by the touch structure provided in any of the above embodiments.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A touch structure, comprising: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode; the packaging layer comprises N layers of sub-packaging layers; the N sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping mode; n is greater than or equal to 2;
the packaging layer comprises a first TP layer and a second TP layer which are isolated from each other to form a capacitor structure; the first TP layer is internally embedded in the organic layer inside the packaging layer and is positioned at the interface of two adjacent sub-packaging layers; the second TP layer is embedded in the inorganic layer inside the packaging layer or embedded in the surface of the packaging layer facing the packaging layer.
2. The structure of claim 1, wherein when the second TP layer is embedded in an inorganic layer inside the encapsulation layer, the first TP layer is located at a first interface;
the second TP layer is located at a second interface, and at least one of the adjacent sub-packaging layers forming the second interface is different from the adjacent sub-packaging layer forming the first interface.
3. The structure of any one of claims 1-2, wherein the first TP layer and the second TP layer are of a silver nanowire thin film material.
4. A touch structure, comprising: the packaging structure comprises a substrate, a packaging layer and a packaging layer which are arranged in a stacked mode;
the packaging layer comprises a first TP layer embedded on the outer surface of the packaging layer facing the packaging layer;
the packaging layer comprises a second TP layer, and the second TP layer is embedded in the packaging layer or the substrate;
the first TP layer and the second TP layer are isolated from each other to form a capacitor structure.
5. The structure of claim 4, wherein the encapsulation layer comprises N sub-encapsulation layers; the N sub-packaging layers are organic layers and inorganic layers which are grown in an overlapping mode; n is greater than or equal to 2;
the first TP layer is located at an interface of two adjacent sub-encapsulation layers.
6. A touch device comprising a touch structure according to any of claims 1 to 3 or comprising a touch structure according to any of claims 4 or 5.
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| CN109656396A (en) | 2019-04-19 |
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