CN114437643A - Novel light photovoltaic module packaging plate - Google Patents

Novel light photovoltaic module packaging plate Download PDF

Info

Publication number
CN114437643A
CN114437643A CN202111663362.5A CN202111663362A CN114437643A CN 114437643 A CN114437643 A CN 114437643A CN 202111663362 A CN202111663362 A CN 202111663362A CN 114437643 A CN114437643 A CN 114437643A
Authority
CN
China
Prior art keywords
parts
layer
photovoltaic module
module packaging
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111663362.5A
Other languages
Chinese (zh)
Inventor
王同心
何张才
叶雪峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Hongdao New Material Co ltd
Original Assignee
Suzhou Hongdao New Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Hongdao New Material Co ltd filed Critical Suzhou Hongdao New Material Co ltd
Priority to CN202111663362.5A priority Critical patent/CN114437643A/en
Publication of CN114437643A publication Critical patent/CN114437643A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a novel light photovoltaic module packaging plate which sequentially comprises an air surface layer, an adhesive layer, a base material layer and a glue film binding layer from outside to inside, wherein the base material layer comprises the following components in parts by weight: 50-99 parts of matrix resin, 0.1-50 parts of reinforcing filler, 0.1-3 parts of hydrolysis resistance agent, 0.1-3 parts of ultraviolet absorbent, 0.1-3 parts of light stabilizer and 0.1-35 parts of other auxiliary agents, wherein the matrix resin is selected from any one or a mixture of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, polybutylene terephthalate, cyclic polyolefin, cycloolefin polymer, polypropylene, nylon and polyethylene; the reinforcing filler is selected from any one or a mixture of more of metal fibers, carbon fibers, plastic fibers and glass fibers. The invention has the advantages of light weight, high weather resistance, high strength, good impact resistance and high reliability.

Description

Novel light photovoltaic module packaging plate
Technical Field
The invention belongs to the technical field of photovoltaic power generation assembly sealing, and particularly relates to a high-molecular polymer photovoltaic panel packaging light assembly.
Background
Since the double-carbon target is provided, distributed photovoltaic power generation is developed rapidly, compared with centralized power generation, a distributed scene is more complex, the traditional module packaging scheme mostly adopts glass or a combination of glass and a high polymer material, the weight of the traditional module packaging scheme is usually 20-30 Kg, and the weight of auxiliary components such as a bracket is more than 30Kg, so that the use of distributed photovoltaics (especially BAPV and BIPV) is very limited, for example, some old color steel roofs have certain potential safety hazards and are inconvenient to install if the installation weight is too large.
At present, in order to solve the existing technical problems, the conventional technology generally replaces the upper and lower outer layer structures of the photovoltaic module with the photovoltaic back sheet made of high polymer materials. And present polymer photovoltaic backplate material adopts PET or polyolefin as the substrate (mostly 4 or 5 layer structures) more, but brings the backplate intensity inadequately thereupon, and weatherability subalternation problem, therefore can only compensate the not enough of backplate intensity through increasing the number of piles, increases to 9 layers or more by original 4~5 layer structures. Due to the increase of the number of structural layers, the production process of the back plate is complicated, the weight of the back plate is increased, the production cost of the back plate is improved, and the matching performance of equipment is poor.
Disclosure of Invention
Aiming at the problems and defects in the prior art, the invention provides a novel light photovoltaic module packaging plate which has the advantages of light weight, high weather resistance, high strength, good impact resistance and high reliability.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a novel light photovoltaic module encapsulates board, includes air surface course, adhesive linkage, substrate layer and glued membrane anchor coat from outer to interior in proper order, wherein:
the base material layer material is prepared by mixing the following components in parts by weight and then carrying out extrusion molding, solution tape casting molding or calendaring molding:
50-99 parts of matrix resin
0.1-50 parts of reinforcing filler
0.1-3 parts of hydrolysis resistant agent
0.1-3 parts of ultraviolet absorbent
0.1-3 parts of light stabilizer
0.1 to 35 portions of other additives
Wherein the matrix resin is selected from one or more of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, polybutylene terephthalate, cyclic polyolefin, cyclic olefin polymer, polypropylene, nylon and polyethylene; the reinforcing filler is selected from any one or a mixture of more of metal fibers, carbon fibers, plastic fibers and glass fibers.
Preferably, the other auxiliary agent comprises at least one of hydrolysis resistance agent, tackifier, acid absorbent, heat stabilizer, antioxidant, filler and colorant. The hydrolysis resisting agent is any one or a mixture of more of polycarbodiimide, epoxy polymer, carbodiimide, bis (2, 6-diisopropylphenyl) carbodiimide, dicyclohexylcarbodiimide and diisopropylcarbodiimide.
Preferably, the ultraviolet absorber is selected from any one or a mixture of at least two of o-hydroxybenzophenones, benzotriazoles, salicylates, triazines and substituted acrylonitriles.
Preferably, the light stabilizer is selected from any one of light-shielding agents, quenchers, radical scavengers, hydroperoxide decomposers, or a mixture of at least two thereof.
Preferably, the air surface layer material is prepared by mixing fluorine-containing resin and other auxiliary agents and then performing extrusion molding, solution casting molding or calendaring molding, wherein the fluorine-containing resin is one or a mixture of two of vinylidene fluoride, ethylene-tetrafluoroethylene copolymer, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, vinyl fluoride, polytetrafluoroethylene or ethylene-chlorotrifluoroethylene copolymer.
Preferably, the air surface layer material also contains an ultraviolet absorber and a light stabilizer.
Preferably, the adhesive layer is prepared by mixing an adhesive material with the ultraviolet absorber, the light stabilizer and the other auxiliary agents and then performing extrusion molding, solution casting molding or calendaring molding.
Preferably, the bonding material is any one of polyurethane, polymethyl methacrylate, polyhydroxyethyl methacrylate, ethylene-vinyl alcohol copolymer, ethylene-methacrylic acid copolymer, ethyl methacrylate copolymer, glycidyl methacrylate grafted polyolefin elastomer, glycidyl methacrylate grafted polyethylene, maleic anhydride grafted polyolefin elastomer, maleic anhydride grafted polyethylene or a mixture of at least two of them.
Preferably, the thickness of the air surface layer is 15-80 μm, and preferably 20-30 μm; the thickness of the substrate layer is 10-1000 microns, preferably 50-400 microns; the thickness of the bonding layer is 6-20 mu m.
Preferably, the adhesive film bonding layer is selected from a coating, a hot melt adhesive or other bonding materials, and plays a role in assisting bonding.
Preferably, the air surface layer and the base material layer are respectively subjected to extrusion molding, solution tape casting or calendaring molding to prepare the film layer, the prepared air surface layer and the prepared base material layer are combined together through an adhesive layer, and the adhesive film combining layer is formed on the other surface of the base material layer in a coating or film spraying mode.
Has the advantages that: compared with the prior art, the invention has the following advantages:
1. the weight is light: the invention adopts the polymer front plate and the polymer rear plate for packaging, and the weight is reduced by more than 70 percent compared with the glass packaging;
2. high weather resistance: the air surface is prepared by selecting fluorine-containing resin which contains carbon-fluorine bonds, and due to the local ionic bond characteristic of the fluorine-containing resin, the fluorine-containing resin is a strongest single bond and relatively short bonds, and has excellent weather resistance in organic chemistry; meanwhile, the ultraviolet absorbent is stably matched with light, so that ultraviolet rays (the blocking rate is more than 98%) can be effectively prevented, internal materials are protected, and the ultraviolet resistance of the material can even reach 1500kWh/m2The above;
3. high strength and good impact resistance: the strength and the impact resistance of the base material are improved through the matching of the matrix resin, the reinforcing filler, the hydrolysis resistance agent, the ultraviolet absorbent, the light stabilizer and other additives;
4. the reliability is high: through the design of each layer of material and the combination of the multiple layers of material through adhesives, the polymer front plate and the polymer rear plate provided by the invention can not generate the defects of cracking, layering, yellowing and the like in the use process.
Drawings
FIG. 1 is a schematic structural view of a novel lightweight photovoltaic module according to the present invention;
fig. 2 is a schematic structural diagram of the novel lightweight photovoltaic module packaging plate according to the present invention.
In the figure, a polymer front plate 1, a glue film 2, a battery piece 3, a glue film 4, a polymer rear plate 5, an air surface layer A, an adhesive layer B, a base material layer C and a glue film bonding layer D.
Detailed Description
The invention is further elucidated with reference to the drawings and the embodiments. It is to be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.
Example 1: polymer front panel
The polymer front plate comprises an air surface (25 mu m, transparent light blue), an adhesive layer (8 mu m), a base material layer (600 mu m) and a glue film bonding surface (5 mu m) from outside to inside in sequence, wherein:
the air bread comprises the following components in parts by weight:
85 parts of fluorine-containing resin
Ultraviolet absorber 0.6 part
Light stabilizer 0.3 part
14.1 parts of other auxiliary agents;
wherein the fluorine-containing resin is polyvinylidene fluoride, the ultraviolet absorbent is UV234, the light stabilizer is UV770, the other auxiliary agents are PMMA (polymethyl methacrylate) 14 parts, acid absorbent 0.05 part and acid absorbent 0.05 part;
wherein the bonding layer comprises the following components in parts by weight:
99.5 parts of binding material
0.2 portion of ultraviolet absorbent
Light stabilizer 0.1 part
Other auxiliary agents; 0.2 part
Wherein the bonding material is polyurethane, the ultraviolet absorbent is UV234, the light stabilizer is UV770, and the other auxiliary agents are 1010;
wherein, by weight, the substrate layer comprises the following components:
93 parts of matrix resin
Reinforcing filler 5 parts
0.5 portion of hydrolysis resistant agent
Ultraviolet absorber 0.6 part
Light stabilizer 0.3 part
Other auxiliary agents; 0.6 part
Wherein the matrix resin is polyethylene terephthalate, the reinforcing filler is glass fiber, the hydrolysis resistance agent is carbodiimide, the ultraviolet absorbent is UV234, the light stabilizer is UV770, and the other auxiliary agents are 1010;
wherein the adhesive film bonding surface is a transparent FEVE coating;
the preparation method comprises the steps of coating the adhesive film bonding surface on the base material layer in a coating mode, then coating the adhesive layer on the base material layer, and then compounding the adhesive layer with the air surface to obtain the polymer rear plate.
Example 2: polymer back plate
As a polymer rear plate, from outside to inside, an air surface (25 μm, opaque white), an adhesive layer (8 μm), a base material layer (600 μm), and a glue film bonding surface (5 μm) were provided in this order, wherein:
the air bread comprises the following components in parts by weight:
75 parts of fluorine-containing resin
Ultraviolet absorber 0.6 part
Light stabilizer 0.3 part
24.1 parts of other auxiliary agents;
wherein the fluorine-containing resin is polyvinylidene fluoride, the ultraviolet absorbent is UV234, the light stabilizer is UV770, the other auxiliary agents are PMMA (polymethyl methacrylate) 14 parts, titanium dioxide 10 parts, acid absorbent 0.05 part and 1010.05 part;
wherein the bonding layer comprises the following components in parts by weight:
99.5 parts of binding material
0.2 portion of ultraviolet absorbent
Light stabilizer 0.1 part
Other auxiliary agents; 0.2 part
Wherein the bonding material is polyurethane, the ultraviolet absorbent is UV234, the light stabilizer is UV770, and the other auxiliary agents are 1010;
wherein, by weight, the substrate layer comprises the following components:
83 parts of matrix resin
Reinforcing filler 5 parts
0.5 portion of hydrolysis resistant agent
0.6 part of ultraviolet absorber
Light stabilizer 0.3 part
Other auxiliary agents; 10.6 parts
Wherein the matrix resin is polyethylene terephthalate, the reinforcing filler is glass fiber, the hydrolysis resistance agent is carbodiimide, the ultraviolet absorbent is UV234, the light stabilizer is UV770, and the other auxiliary agents are 10 parts of titanium dioxide and 0.6 part of 1010;
wherein the adhesive film bonding surface is a white FEVE coating;
the preparation method comprises the steps of coating the adhesive film bonding surface on the base material layer in a coating mode, then coating the adhesive layer on the base material layer, and then compounding the adhesive layer with the air surface to obtain the polymer rear plate.

Claims (10)

1. The utility model provides a novel light photovoltaic module packaging board which characterized in that: include air surface course, adhesive linkage, substrate layer and glued membrane anchor coat from outside to interior in proper order, wherein:
the base material layer material is prepared by mixing the following components in parts by weight and then carrying out extrusion molding, solution tape casting molding or calendaring molding:
50-99 parts of matrix resin
0.1-50 parts of reinforcing filler
0.1-3 parts of hydrolysis resistant agent
0.1-3 parts of ultraviolet absorbent
0.1-3 parts of light stabilizer
0.1 to 35 portions of other auxiliary agents
Wherein the matrix resin is selected from one or more of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, polybutylene terephthalate, cyclic polyolefin, cycloolefin polymer, polypropylene, nylon and polyethylene; the reinforcing filler is selected from any one or a mixture of more of metal fibers, carbon fibers, plastic fibers and glass fibers.
2. The novel lightweight photovoltaic module package panel of claim 1, wherein: the other auxiliary agents comprise at least one of hydrolysis resistance agent, tackifier, acid absorbent, heat stabilizer, antioxidant, filler and colorant;
the hydrolysis resisting agent is any one or a mixture of more of polycarbodiimide, epoxy polymer, carbodiimide, bis (2, 6-diisopropylphenyl) carbodiimide, dicyclohexylcarbodiimide and diisopropylcarbodiimide.
3. The novel lightweight photovoltaic module packaging sheet of claim 1, wherein: the ultraviolet absorbent is selected from any one or a mixture of at least two of o-hydroxybenzophenone, benzotriazole, salicylate, triazine and substituted acrylonitrile.
4. The novel lightweight photovoltaic module packaging sheet of claim 1, wherein: the light stabilizer is selected from any one or a mixture of at least two of light shielding agents, quenchers, radical trapping agents and hydroperoxide decomposers.
5. The novel lightweight photovoltaic module packaging sheet of claim 1, wherein: the air surface layer material is prepared by mixing fluorine-containing resin and other auxiliary agents and then performing extrusion molding, solution tape casting or calendaring molding, wherein the fluorine-containing resin is any one or a mixture of two of vinylidene fluoride, ethylene-tetrafluoroethylene copolymer, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, vinyl fluoride, polytetrafluoroethylene or ethylene-chlorotrifluoroethylene copolymer.
6. The novel lightweight photovoltaic module packaging sheet of claim 5, wherein: the air surface layer material also contains an ultraviolet absorber and a light stabilizer.
7. The novel lightweight photovoltaic module packaging sheet of claim 5, wherein: the adhesive layer is prepared by mixing an adhesive material with the ultraviolet absorber, the light stabilizer and the other auxiliary agents and then carrying out extrusion molding, solution tape casting or calendaring molding.
8. The novel lightweight photovoltaic module encapsulant sheet in accordance with claim 7, wherein: the bonding material is any one or a mixture of at least two of polyurethane, polymethyl methacrylate, polyhydroxyethyl methacrylate, ethylene-vinyl alcohol copolymer, ethylene-methacrylic acid copolymer, ethyl methacrylate copolymer, glycidyl methacrylate grafted polyolefin elastomer, glycidyl methacrylate grafted polyethylene, maleic anhydride grafted polyolefin elastomer and maleic anhydride grafted polyethylene.
9. The novel lightweight photovoltaic module packaging sheet of claim 1, wherein: the thickness of the air surface layer is 15-80 μm, and preferably 20-30 μm; the thickness of the substrate layer is 10-1000 microns, preferably 50-400 microns; the thickness of the bonding layer is 6-20 mu m; the adhesive film bonding layer is selected from a coating, a hot melt adhesive or other bonding materials, and plays a role in assisting bonding.
10. The novel light photovoltaic module packaging plate as claimed in any one of claims 1 to 9, wherein: the air surface layer and the base material layer are respectively subjected to extrusion molding, solution tape casting molding or calendaring molding to prepare the film layers, the prepared air surface layer and the prepared base material layer are combined together through the adhesive layer, and the adhesive film combining layer is formed on the other surface of the base material layer in a coating or film spraying mode.
CN202111663362.5A 2021-12-31 2021-12-31 Novel light photovoltaic module packaging plate Pending CN114437643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111663362.5A CN114437643A (en) 2021-12-31 2021-12-31 Novel light photovoltaic module packaging plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111663362.5A CN114437643A (en) 2021-12-31 2021-12-31 Novel light photovoltaic module packaging plate

Publications (1)

Publication Number Publication Date
CN114437643A true CN114437643A (en) 2022-05-06

Family

ID=81366055

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111663362.5A Pending CN114437643A (en) 2021-12-31 2021-12-31 Novel light photovoltaic module packaging plate

Country Status (1)

Country Link
CN (1) CN114437643A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118085373A (en) * 2024-04-26 2024-05-28 上海品诚晶曜光伏科技有限公司 Thermoplastic flame-retardant hyperboloid PC packaging assembly and preparation method and application thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201224A (en) * 2014-08-20 2014-12-10 杭州福斯特光伏材料股份有限公司 Transparent back plate for solar cell module
CN206401338U (en) * 2016-12-19 2017-08-11 中天光伏材料有限公司 A kind of photovoltaic cell encapsulation integration glued membrane backboard
CN108034377A (en) * 2017-11-16 2018-05-15 明冠新材料股份有限公司 A kind of glued membrane backboard integrated material and its preparation process
CN108400186A (en) * 2018-04-26 2018-08-14 江阴四方游泳康复产业股份有限公司 A kind of SMC monoblock types photovoltaic module, manufacturing method and application
CN108682707A (en) * 2018-06-13 2018-10-19 常州回天新材料有限公司 A kind of solar photovoltaic battery component transparent back panel for generating electricity on two sides
CN109337260A (en) * 2018-11-13 2019-02-15 常州回天新材料有限公司 A kind of transparent polyvinylidene fluoride film and its manufacturing method
CN110181913A (en) * 2019-05-15 2019-08-30 安徽金兑新材料科技有限公司 A kind of low warpage solar cell backboard substrate and preparation method thereof
CN111690335A (en) * 2020-04-29 2020-09-22 乐凯胶片股份有限公司 Transparent back plate for packaging solar cell

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201224A (en) * 2014-08-20 2014-12-10 杭州福斯特光伏材料股份有限公司 Transparent back plate for solar cell module
CN206401338U (en) * 2016-12-19 2017-08-11 中天光伏材料有限公司 A kind of photovoltaic cell encapsulation integration glued membrane backboard
CN108034377A (en) * 2017-11-16 2018-05-15 明冠新材料股份有限公司 A kind of glued membrane backboard integrated material and its preparation process
CN108400186A (en) * 2018-04-26 2018-08-14 江阴四方游泳康复产业股份有限公司 A kind of SMC monoblock types photovoltaic module, manufacturing method and application
CN108682707A (en) * 2018-06-13 2018-10-19 常州回天新材料有限公司 A kind of solar photovoltaic battery component transparent back panel for generating electricity on two sides
CN109337260A (en) * 2018-11-13 2019-02-15 常州回天新材料有限公司 A kind of transparent polyvinylidene fluoride film and its manufacturing method
CN110181913A (en) * 2019-05-15 2019-08-30 安徽金兑新材料科技有限公司 A kind of low warpage solar cell backboard substrate and preparation method thereof
CN111690335A (en) * 2020-04-29 2020-09-22 乐凯胶片股份有限公司 Transparent back plate for packaging solar cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118085373A (en) * 2024-04-26 2024-05-28 上海品诚晶曜光伏科技有限公司 Thermoplastic flame-retardant hyperboloid PC packaging assembly and preparation method and application thereof

Similar Documents

Publication Publication Date Title
KR101780925B1 (en) Photovoltaic modules having a polyvinylidene fluoride backsheet
CN108682707B (en) Transparent back plate of solar photovoltaic cell module for double-sided power generation
CN108565307B (en) Packaging material for photovoltaic module
CN108198884B (en) Damp-heat resistant solar cell back plate and manufacturing method thereof
WO2010038875A1 (en) Solar cell back surface protective film, and solar cell module provided with same
CN108242473B (en) Color photovoltaic module and preparation method thereof
CN103052505A (en) Multilayer films containing a fluorinated copolymer resin layer and an encapsulant layer
CN101615635B (en) Heat resistance-treated back board of solar cell
US20140109956A1 (en) High Performance Backsheet for Photovoltaic Applications and Method for Manufacturing the Same
WO2017140002A1 (en) Resin-based composite thin-film material and preparation method therefor, and solar cell module
CN111303790A (en) Glue film and back plate integrated packaging material and processing technology thereof
CN106244032A (en) A kind of EVA adhesive film used for solar batteries and preparation method thereof
CN114437643A (en) Novel light photovoltaic module packaging plate
JP2001326374A (en) Solar battery module
CN104124300A (en) Solar cell backplane and solar cell module
CN103730531B (en) A kind of humidity-resisting solar cell backplate without adhesive and manufacture method thereof
CN103722840A (en) Humidity-resisting solar cell backplate without adhesive and manufacturing method thereof
US10665742B2 (en) Co-extruded backsheet for solar cell modules
EP3164891B1 (en) Mono-backsheet for solar cell modules
CN218827176U (en) Back plate and photovoltaic module
CN218939702U (en) Back sheet for photovoltaic module and photovoltaic module
CN116144284B (en) Raw material package, integrated adhesive film backboard, preparation method of integrated adhesive film backboard and photovoltaic module
CN110323296A (en) A kind of photovoltaic shoe plate
JP6660037B2 (en) Solar cell module
CN115663048A (en) Back plate for photovoltaic module and application thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20220506