CN104124300A - Solar cell backplane and solar cell module - Google Patents
Solar cell backplane and solar cell module Download PDFInfo
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- CN104124300A CN104124300A CN201310149072.8A CN201310149072A CN104124300A CN 104124300 A CN104124300 A CN 104124300A CN 201310149072 A CN201310149072 A CN 201310149072A CN 104124300 A CN104124300 A CN 104124300A
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- cell backboard
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- 239000004744 fabric Substances 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 94
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- -1 polyethylene Polymers 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 10
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 9
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 9
- 239000000565 sealant Substances 0.000 claims description 9
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 8
- 239000004917 carbon fiber Substances 0.000 claims description 8
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920006231 aramid fiber Polymers 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 238000009954 braiding Methods 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 229920001897 terpolymer Polymers 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 2
- 239000004760 aramid Substances 0.000 claims description 2
- 229920003235 aromatic polyamide Polymers 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 230000008018 melting Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- 238000003851 corona treatment Methods 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 229920002620 polyvinyl fluoride Polymers 0.000 description 7
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N Methyl ethyl ketone Natural products CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000001467 acupuncture Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention provides a solar cell backplane which comprises an enhancement layer, a matrix layer and a bonding layer which are successively stacked. The enhancement layer is a composite material which is formed by fabrics and a polymer. The invention also provides a solar cell module containing the backplane. The solar cell backplane provided by the invention has good strength.
Description
Technical field
The invention belongs to technical field of solar batteries, relate in particular to a kind of solar cell backboard and a kind of solar module.
Background technology
Solar cell is directly light energy conversion to be become to the device of electric energy by photoelectric effect.It is a kind of novel power supply, has permanent, spatter property and the large advantage of flexibility three, and its market prospects are wide.Solar energy power generating can occupy the important seat of world energy sources consumption in the near future, not only wants Substitute For Partial conventional energy resource, and will become the main body of world energy supplies.
Solar module is a laminated construction normally: mainly comprise the layers such as backboard, sealant layer, cell piece, sealant layer and photic zone, lamination forms successively.Wherein, the Main Function of solar cell backboard is the overall mechanical strength that improves solar module, can prevent that in addition water vapor permeable from, in sealant layer, affecting the useful life of cell piece.Characteristics such as so solar cell backboard must have insulation (resistance to electrical breakdown), ageing-resistant, weather affects and corrosion-resistant.
At present, existing technology solar cell backboard is mainly produced by multilayer film thermoforming way.Take the most frequently used TPT as example, and it is that independently film is hot-forming by the bonding of glue with three layers of polyvinyl fluoride/PETG/polyvinyl fluorides (being PVF/PET/PVF).But because the general surface of fluoropolymer can be low, while adopting between PVF and PET hot-press gluing, glue formula is required harsh, and easily cause film bonding strength between layers inadequate, easily cause between layers bubble residual simultaneously, in applying for a long time, gas, salt fog, some pollutants can permeate to centre and corrode along the edge of film, thereby cause thin layer because glue aging causes peeling off between layer and layer, cause solar cell weather, the decline of UV resistant and insulating properties, thereby affect the life-span of solar cell, the bearing of polymeric substrate is poor simultaneously, under the mal-conditions such as dust storm the impact resistance of whole assembly a little less than.
Summary of the invention
The present invention, for solving the technical problem of the intensity difference of solar cell backboard in prior art, provides solar cell backboard and solar module that a kind of intensity is good.
The invention provides a kind of solar cell backboard, comprise the enhancement layer, base layer and the tack coat that stack gradually, described enhancement layer is composite material, and described composite material is that fabric and polymer form.
The present invention also provides a kind of solar module, described solar module comprises backboard, sealant layer, cell piece, sealant layer and the photic zone stacking gradually, described backboard is solar cell backboard of the present invention, and the tack coat of described solar cell backboard contacts with sealant layer.
Enhancement layer in solar cell backboard of the present invention, enhancement layer is made by fabric and polymer composites, and backboard intensity is high, and bond strength between layers is high.
Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of solar cell backboard, comprise the enhancement layer, base layer and the tack coat that stack gradually, described enhancement layer is composite material, and described composite material is that fabric and polymer form.
The mass content of Fiber In Composite Material fabric and polymer has no particular limits, and can adjust voluntarily according to the thickness of enhancement layer and characteristic.
Fabric is with the enhancing skeleton of one deck or multilayer form, and in polymer, dipping forms composite material.Fabric can provide high mechanical strength, makes the backboard can resistance to dust storm, shock-resistant.
Preferably, described fabric is three-dimensional framework structure.Three-dimensional framework structure refers to that the arrangement of fortifying fibre can form the three-dimensional structure of mutual winding by modes such as braiding, acupunctures, replaces common fiber tiling or the braiding structure of two dimension.This structure provides the resin making in fiber and composite material more easily to bond, and needs when multilayer laminated, and interlayer adhesion force is more excellent.
Preferably, between described base layer and enhancement layer, base layer and tack coat, there is adhesive layer.
Preferably, described base layer and the enhancement layer structure that is formed in one.Hot melt adhesive between described base layer and tack coat.
Preferably, at least one braiding in carbon fiber, aramid fiber, glass fibre and polyethylene fibre of described fabric forms;
Preferably, described polymer be epoxylite, at least one in unsaturated polyester esters resin, phenolic resinoid, polyimide based resin and cyanate resin.
Preferably, described base layer is at least one in PETG layer (PET), polybutylene terephthalate (PBT) layer (PBT), aramid layer (PA), polyimide layer (PI), polyphenylene oxide layer (PPO) and Merlon (PC) layer.
Preferably, described tack coat is the rete of at least one formation in polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-octene copolymer, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate methyl terpolymer and polyvinyl butyral resin.In tack coat, can add the auxiliary agents such as crosslinking agent, ultra-violet absorber, effectively protect basis material, it is bonding that this layer can select binding agent and base layer to carry out, but preferred and base layer heat pressure adhesive.The temperature of heat pressure adhesive is 60-300 ℃, and preferably 100-180 ℃, can select laminating machine or roll-in to carry out bonding, preferably with the laminating machine of vacuum extractor.
Preferably, the thickness of described enhancement layer is 30um-1000um; The thickness of base layer is 50um-800um; The thickness of adhesive linkage is 50um-1000um.More preferably, the thickness of described enhancement layer is 100um-400um; The thickness of base layer is 100um-400um; The thickness of adhesive linkage is 100um-500um.
Enhancement layer of the present invention is obtained by polymer solution impregnation of fibers fabric, the stacked rear heat-pressure curing of the enhancement layer of gained and base layer another side, and when polymer solution solidifies, enhancement layer resin solidification forms firmly bonding with base layer simultaneously.Under optimum state, tack coat, base layer and enhancement layer heat simultaneously, cure under pressure.
Applying specific embodiment is below described in further detail the present invention.
Embodiment 1
(1) at the EVA(of 100 weight portions ethylene-vinyl acetate copolymer) resin (Korea S Samsung synthetic chemistry Co., Ltd product, model is E032A) in add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of EVA resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 200 μ m.
(2) 100 parts of HLK102-3 vinyl ester resins (Changzhou Hua Like new material Co., Ltd) and 2 parts of methyl ethyl ketone peroxides, 2 parts of cobalt octoate liquid are stirred.The carbon fibre fabric (carbon fiber is base cloth warp thread weft yarn, and aramid fiber is hook loop yarn) that flies fiber material Science and Technology Ltd. without Sion is flooded in this solution, obtain the enhancement layer that thickness is 100um.
(3) side of enhancement layer is protected by release liners; PET film (the Jiangsu Yuxing Film Science and Technology Co., Ltd of opposite side and 250um; CY11; two sides corona treatment) stacked; PET film opposite side is put into laminating machine together with the adhesive linkage of gained in (1), 100 ℃, vacuumizes 3min; lamination 10min, obtains described backboard S1.
Embodiment 2
(1) at the EMMA(of 100 weight portions ethylene-methyl methacrylate methyl terpolymer) resin (Sumitomo Chemical Co., Ltd, model WK301) in, add EVA resin (the Korea S Samsung synthetic chemistry Co., Ltd product of 30 weight portions, model is E032A), the titanium dioxide of 10 parts (R960 of E.I.Du Pont Company) fully mixes and is heated to the abundant melting of EVA resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 150 μ m.
(2) 100 parts of HLK-197 Bisphenol a unsaturated polyester resins (Changzhou Hua Like new material Co., Ltd) and 2 parts of methyl ethyl ketone peroxides, 2 parts of cobalt octoate liquid are stirred.The carbon fibre fabric (carbon fiber is base cloth warp thread weft yarn, and aramid fiber is hook loop yarn) that flies fiber material Science and Technology Ltd. without Sion is flooded in this solution, obtain the enhancement layer that thickness is 120um.
(3) enhancement layer one side is protected by release liners, and the PBT film of opposite side and 130um (SABIC FR1, two-sided corona treatment) is stacked; PBT film opposite side is put into laminating machine together with the adhesive linkage of gained in (1), 120 ℃, vacuumizes 3min; lamination 8min, obtains described backboard S2.
Embodiment 3
(1) at the PE(of 100 weight portions Sinopec, model 2420H) in, add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 300 μ m.
(2) 100 parts of phenol-formaldehyde resin modifieds and 140 parts of acetone are carried out to stirring and dissolving.The carbon fibre fabric (carbon fiber is base cloth warp thread weft yarn, and aramid fiber is hook loop yarn) that flies fiber material Science and Technology Ltd. without Sion is flooded in this solution, obtain the enhancement layer that thickness is 400um.
(3) enhancement layer two-layer laminate; one side is protected by release liners; PET film (the Jiangsu Yuxing Film Science and Technology Co., Ltd of opposite side and 400um; CY11, two sides corona treatment) stacked, PET film opposite side is put into laminating machine with together with the adhesive linkage of gained in (1); 135 ℃; vacuumize 3min, lamination 10min, obtains described backboard S3.
Embodiment 4
(1) at the PP(of the 100 weight portions Korea S Samsung synthetic chemistry RF401 of Co., Ltd) in add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 50 μ m.
(2) by 100 parts of polyimide resins, (Qinyang Tianyi Chemical Co., Ltd. TY005-1) adds 20 parts of acetone and stirs.Common carbon fibers fabric is flooded in this solution, obtain the enhancement layer that thickness is 30um.
(3) enhancement layer two-layer laminate, a side is protected by release liners, (the self-control of the PI film of opposite side and 50um; two-sided corona treatment) stacked, PI film opposite side is put into laminating machine, 180 ℃ together with the adhesive linkage of gained in (1); vacuumize 3min, lamination 10min, obtains described backboard S4.
Embodiment 5
(1) in polyvinyl butyral resin (the Changchun petrochemistry company of 100 weight portions, model B-1776) in, add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 1000 μ m.
(2) by 100 parts of modified cyanic acid ester resins and 150 parts of acetone mix and blends.Common carbon fibers fabric is flooded in this solution, obtain the enhancement layer that thickness is 100um.
(3) enhancement layer two-layer laminate, a side is protected by release liners, (the self-control of the PC film of opposite side and 800um; two-sided corona treatment) stacked, PC film opposite side is put into laminating machine, 140 ℃ together with the adhesive linkage of gained in (1); vacuumize 3min, lamination 10min, obtains described backboard S5.
Embodiment 6
(1) in polyvinyl butyral resin (the Changchun petrochemistry company of 90 weight portions, model B-1776) in, add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the adhesive linkage that thickness is 1000 μ m.
(2) by 100 parts of modified cyanic acid ester resins and 120 parts of acetone mix and blends.Common carbon fibers fabric is flooded in this solution, obtain the enhancement layer that thickness is 100um, by gained enhancement layer two superimposed, 140 ℃ of baking and curing.
(3) 100 parts of mylar (GK682 spins in Japan) are dissolved in 200 parts of ethyl acetate, add 60 parts of curing agent (TKA-100), stir and obtain glue.
(4) the PC film of 800um (self-control, two-sided corona treatment) both sides are coated with respectively to the glue of gained in (3), obtain the glue-line that 40um is thick; Glue-line is dried 10min at 80 ℃, then both sides respectively with (1) in the film of gained and (2) enhancement layer of gained carry out bondingly, obtain described backboard S6.
Comparative example 1
(1) at the EVA of 90 weight portions resin (Korea S Samsung synthetic chemistry Co., Ltd product, model is E032A) in add the silicon dioxide of 7 weight portions, the BTA of 2 weight portions is that (company produces ultraviolet absorber by Ciba, model UV329), fully mix and be heated to the abundant melting of EVA resin, insulation melting 2 minutes, then adopt T die head extruder extrusion molding, thereby obtain the rete that thickness is 200 μ m.
(2) Jiangsu Yuxing Film Science and Technology Co., Ltd, CY11, two sides corona treatment.At both sides coating polyurethane adhesive, both sides are bonding respectively at rete and the PVF film (Tedlar of E.I.Du Pont Company) of gained in (1), obtain backboard CS1.
Method of testing and result
1, strength test
Use universal testing machine to carry out bending strength test to gained backboard, the results are shown in Table 1.
2, adhesion strength
According to peel strength between peel strength and base layer and enhancement layer between GB/T 2790 test base layers and tack coat.The results are shown in Table 1.
Table 1
。
As can be seen from Table 1, the backboard of gained of the present invention has good mechanical strength, suitablely under more severe dust storm condition, use, simultaneously, use the fabric of three-dimensional structure, the thickness of composite fibre layer can be superposeed arbitrarily, the backboard of varying strength is provided, and good adhesive property between retaining layer.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (13)
1. a solar cell backboard, is characterized in that, comprises the enhancement layer, base layer and the tack coat that stack gradually, and described enhancement layer is composite material, and described composite material is that fabric and polymer form.
2. solar cell backboard according to claim 1, is characterized in that, described fabric is three-dimensional framework structure.
3. solar cell backboard according to claim 1, is characterized in that, between described base layer and enhancement layer, has adhesive layer.
4. solar cell backboard according to claim 1, is characterized in that, between described base layer and tack coat, has adhesive layer.
5. solar cell backboard according to claim 1, is characterized in that, described base layer and the enhancement layer structure that is formed in one.
6. solar cell backboard according to claim 1, is characterized in that, hot melt adhesive between described base layer and tack coat.
7. solar cell backboard according to claim 1, is characterized in that, at least one braiding in carbon fiber, aramid fiber, glass fibre and polyethylene fibre of described fabric forms.
8. solar cell backboard according to claim 1, is characterized in that, described polymer be epoxylite, at least one in unsaturated polyester esters resin, phenolic resinoid, polyimide based resin and cyanate resin.
9. solar cell backboard according to claim 1, it is characterized in that, described base layer is at least one in PETG layer, polybutylene terephthalate (PBT) layer, aramid layer, polyimide layer, polyphenylene oxide layer and layer of polycarbonate.
10. solar cell backboard according to claim 1, it is characterized in that, described tack coat is the rete of at least one formation in polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-octene copolymer, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate methyl terpolymer and polyvinyl butyral resin.
11. solar cell backboards according to claim 1, is characterized in that, the thickness of described enhancement layer is 30um-1000um; The thickness of base layer is 50um-800um; The thickness of adhesive linkage is 50um-1000um.
12. solar cell backboards according to claim 11, is characterized in that, the thickness of described enhancement layer is 100um-400um; The thickness of base layer is 100um-400um; The thickness of adhesive linkage is 100um-500um.
13. 1 kinds of solar modules, described solar module comprises backboard, sealant layer, cell piece, sealant layer and the photic zone stacking gradually, it is characterized in that, described backboard is the solar cell backboard described in any one in claim 1-12, and the tack coat of described solar cell backboard contacts with sealant layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310149072.8A CN104124300A (en) | 2013-04-26 | 2013-04-26 | Solar cell backplane and solar cell module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310149072.8A CN104124300A (en) | 2013-04-26 | 2013-04-26 | Solar cell backplane and solar cell module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104124300A true CN104124300A (en) | 2014-10-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310149072.8A Pending CN104124300A (en) | 2013-04-26 | 2013-04-26 | Solar cell backplane and solar cell module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104124300A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104518042A (en) * | 2014-12-17 | 2015-04-15 | 无锡德鑫太阳能电力有限公司 | Solar cell backboard |
| CN105185852A (en) * | 2015-09-29 | 2015-12-23 | 中国电子科技集团公司第四十八研究所 | Flexible solar cell module employing aramid support and preparation technology of flexible solar cell module |
| CN106283677A (en) * | 2016-08-18 | 2017-01-04 | 老虎粉末涂料制造（太仓）有限公司 | Photovoltaic module encapsulating material and the preparation method of this encapsulating material |
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| CN113921634A (en) * | 2021-10-09 | 2022-01-11 | 苏州福斯特光伏材料有限公司 | Photovoltaic packaging sheet and photovoltaic module |
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