CN114434305A - Polishing equipment and polishing method for polycrystalline film coating of diamond drawing die - Google Patents
Polishing equipment and polishing method for polycrystalline film coating of diamond drawing die Download PDFInfo
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- CN114434305A CN114434305A CN202210370678.3A CN202210370678A CN114434305A CN 114434305 A CN114434305 A CN 114434305A CN 202210370678 A CN202210370678 A CN 202210370678A CN 114434305 A CN114434305 A CN 114434305A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a polishing device for a polycrystalline film coating of a diamond drawing die, which is used for uniformly polishing an irregular curved surface of the polycrystalline film coating of the diamond drawing die and comprises a workbench, a clamping device for clamping the diamond drawing die and a polishing device which is adjustable relative to the feeding direction of the diamond drawing die, is flexibly attached to the polycrystalline film coating and is used for polishing the polycrystalline film coating; the polycrystalline film coating device is characterized by also comprising a diamond micro powder mixed solution sprayed on the surface of the polycrystalline film coating, and a mixed material conveying device for mixing and conveying the diamond micro powder mixed solution. The invention can automatically and uniformly polish the polycrystalline film coating of the diamond drawing die, particularly the irregular curved surface of the polycrystalline film coating, and has the advantages of high processing precision, high processing efficiency and better use effect. The invention also relates to a polishing method of the polycrystalline film coating of the diamond drawing die.
Description
Technical Field
The invention relates to the technical field of polishing of diamond drawing dies, in particular to polishing equipment for a polycrystalline thin film coating of a diamond drawing die, and further relates to a polishing method for the polycrystalline thin film coating of the diamond drawing die.
Background
Along with the development of drawing processing towards the direction of precision, high speed, low consumption and high production efficiency, the quality requirement on a drawing die for drawing processing is higher and higher, the traditional hard alloy die can not meet the requirements of customers, people tend to a diamond polycrystalline die and a diamond coating die with better effect, the diamond polycrystalline die has better wear resistance than the hard alloy die, but the maximum aperture size of the diamond polycrystalline die can only reach about 40mm, so that great use restriction exists, the technology for depositing a diamond film coating by a chemical vapor deposition method is mature day by day, the aperture of an inner hole of the diamond drawing die of the diamond film coating can reach several millimeters to several hundred millimeters, and the diamond film coating has strong wear resistance, extremely low friction coefficient and long service life, and is accepted by wide users.
The surface of a film coating deposited by a chemical vapor deposition method of the diamond drawing die is rough, the film coating cannot be directly used for drawing a wire pipe, the film coating needs to be polished to meet the use requirement, in the prior art, manual polishing is mostly adopted, the hardness of the film coating is high, the processing force of a manual polishing mode is uneven, the processing precision is low, the processing efficiency is low, and particularly, the processing time is very long for the diamond drawing die with a large shape, and the working strength is not manually bearable.
Disclosure of Invention
In order to solve the problems, the invention provides polishing equipment for a polycrystalline film coating of a diamond drawing die, which can automatically and uniformly polish the polycrystalline film coating of the diamond drawing die, particularly the irregular curved surface of the polycrystalline film coating, and has the advantages of high processing precision, high processing efficiency and better use effect.
The technical scheme adopted by the invention is as follows: a polishing device for a polycrystalline film coating of a diamond drawing die is used for uniformly polishing an irregular curved surface of the polycrystalline film coating of the diamond drawing die, and comprises a workbench, a clamping device and a polishing device, wherein the clamping device is arranged on the workbench and is used for clamping the diamond drawing die, the polishing device is adjustable relative to the feeding direction of the diamond drawing die, flexibly adheres to the polycrystalline film coating and is used for polishing the polycrystalline film coating, and the polycrystalline film coating is formed on the surface of an inner hole of the diamond drawing die; the polishing device also comprises a diamond micro powder mixed solution sprayed on the surface of the polycrystalline film coating in the polishing process, and a mixed material conveying device for mixing and conveying the diamond micro powder mixed solution.
Through clamping device's setting, can realize the centre gripping to diamond drawing die, through adjustable for diamond drawing die direction of feed, and the flexibility is laminated in polycrystalline film coating, with the setting of burnishing device who carries out polishing treatment to polycrystalline film coating, can make burnishing device remain the laminating throughout to the irregular curved surface of polycrystalline film coating of diamond drawing die in polishing process, and realize even polishing, and through the polishing process, spray in the spraying of the mixed liquid of diamond miropowder on polycrystalline film coating surface, can overcome polycrystalline film coating hardness height, difficult processing and easily influence burnishing device life scheduling problem, setting through compounding conveyor, can cross the mixed liquid preparation and the transport that realize the mixed liquid of diamond miropowder.
As a further limitation to the above technical solution, the polishing apparatus includes a linear module, and a guide rail assembly mounted on the linear module via a first mounting plate, the guide rail assembly being arranged perpendicular to the linear module; the polishing device also comprises a distance adjuster which can drive the third mounting plate to move relative to the second mounting plate so as to adjust the distance between the third mounting plate and the second mounting plate, and a flexible force applying device which is detachably connected between the second mounting plate and the third mounting plate.
The arrangement of the linear module and the guide rail assembly can realize the position adjustment of the polishing assembly relative to the clamped diamond mold; the flexible force applicator can apply a flexible force to the polishing assembly, so that the polishing assembly is always attached to the polycrystalline film coating; the flexible force applicator is provided with the distance adjuster, so that the force value of the flexible force can be adjusted, the application is convenient, and the flexible force applicator can be applied to wider occasions.
As a further limitation to the above technical solution, the polishing assembly includes a low-speed electric spindle mounted on the second mounting plate, and a grinding head assembly connected to the low-speed electric spindle, the grinding head assembly includes a grinding rod rotatably connected to the low-speed electric spindle, and a grinding head integrally formed on the grinding rod, and an outer surface of the grinding head is disposed in a spherical-like manner.
As a further limitation to the above technical solution, the flexible force applying device includes a cylindrical spring, and a tension sensor having one end connected to the cylindrical spring, the other end of the cylindrical spring is detachably connected to the second mounting plate, the other end of the tension sensor is detachably connected to the third mounting plate, the distance adjuster includes a lead screw supporting seat and a fixed seat respectively mounted on the first mounting plate, a lead screw nut mounted on the third mounting plate, a lead screw having one end sequentially passing through the lead screw supporting seat and the lead screw nut and connected to the fixed seat, and a hand wheel connected to the other end of the lead screw.
As a further limitation to the above technical solution, the mixing and conveying device includes a mixing cup, and a stirrer for stirring and mixing two materials of diamond fine powder and water or two materials of diamond fine powder and oil added into the mixing cup; the mixing cup is characterized by also comprising a peristaltic pump for conveying the mixed diamond micro powder liquid in the mixing cup and a conveying pipe communicated with the peristaltic pump.
The stirrer is preferably a magnetic stirrer, so that the materials can be uniformly mixed, and the two materials added into the mixing cup can be diamond fine powder and water in a certain proportion or diamond fine powder and oil in a certain proportion.
As a further limitation to the above technical solution, the clamping device includes a mounting seat mounted on the workbench, and a supporting plate mounted on the mounting seat; still including install in proper order in the reduction gear of backup pad one end and with the motor that reduction gear transmission is connected, and the outer lane with the slewing bearing that the backup pad is connected, slewing bearing's inner circle is connected with the chuck via the connecting plate, diamond drawing die centre gripping in on the chuck.
The clamping device is arranged into the structure, so that the structure is simple, the operation is convenient, the size of the chuck is selectable, the clamping device is suitable for diamond drawing dies with different sizes, and particularly, the clamping range of the clamping device is 65 mm-205 mm.
As a further limitation to the above technical solution, a groove sensor is mounted on the first mounting plate to limit the sliding of the second mounting plate along the guide rail assembly, and the polishing assembly is aligned with the center of the diamond drawing die.
The setting of cell type sensor can be spacing along the Y of guide rail set spare to sliding the second mounting panel, and then makes polishing subassembly can aim at diamond drawing die utensil.
As a further limitation to the above technical solution, the polishing device further includes an angle-adjustable grinding and dressing device for grinding and dressing the polishing device, the grinding and dressing device includes a high-speed motorized spindle mounted on the worktable via a bracket, and a grinding and dressing head rotatably connected to the high-speed motorized spindle, an arc-shaped groove is formed in the worktable, one end of the bracket is fixed to the worktable, and the other end of the bracket is slidably disposed in the arc-shaped groove.
The grinding finishing device is arranged, so that grinding after the polishing device is abraded can be facilitated, the arc-shaped groove is formed in the workbench, one end of the support is fixed on the workbench, the other end of the support is slidably arranged in the arc-shaped groove, the position of the grinding finishing head can be adjusted, and different parts of the polishing device can be conveniently ground. The radian diameter of the arc-shaped groove is 100mm, so that the grinding and trimming head is adjustable within the range of +/-10 degrees.
The invention also provides a polishing method of the polycrystalline film coating of the diamond drawing die, which is used for uniformly polishing the irregular curved surface of the polycrystalline film coating of the diamond drawing die by using the polishing equipment of the polycrystalline film coating of the diamond drawing die and comprises the following steps:
a. clamping the diamond drawing die on the clamping device;
b. adjusting the feeding direction of the polishing device relative to the diamond drawing die until the polishing device reaches a working position;
c. setting parameters;
c1, applying a flexible force to the polishing device to enable the polishing device to be flexibly attached to the irregular curved surface of the polycrystalline film coating;
c2, adjusting the rotating speed parameter of the clamping device and the motion parameter of the polishing device;
d. preparing diamond micro powder mixed liquid and conveying the mixed liquid to the surface of an inner hole of a diamond drawing die;
d1, adding two materials of diamond fine powder and water in a certain proportion or adding two materials of diamond fine powder and oil in a certain proportion into the mixing and conveying device, or adding two materials of diamond fine powder and water in a certain proportion and then adding two materials of diamond fine powder and oil in a certain proportion, and stirring the materials into a diamond micro powder mixed solution through the mixing and conveying device;
d2, conveying the mixed diamond micro powder mixed solution to the surface of an inner hole of the diamond drawing die, and keeping the continuous stirring of the mixed material conveying device in the process;
e. performing circumferential and longitudinal polishing on the surface of the inner hole of the diamond drawing die, randomly selecting a plurality of symmetrical positions in a polishing working area during the duration time t1, and detecting the surface roughness Ra value by using a surface roughness profile measuring instrument;
f. c, timely adjusting parameters in the step c according to the Ra value of the surface roughness detected by the surface roughness profile measuring instrument, repeating the step b, the step d1, the step d2 and the step e until a plurality of symmetrical positions are randomly selected in the polishing working area, and detecting that the Ra value of the surface roughness is smaller than 0.06 mu m by using the surface roughness profile measuring instrument;
g. and resetting the polishing equipment.
As a further limitation to the above-described technical solution,
in the step c1, the flexible force is adjustable within the range of 5-7N;
in the step c2, the rotating speed of the clamping device is adjustable within 30-90 r/min, the rotating speed of a main shaft of the polishing device is adjustable within 50-75 Hz, and the forward and backward speed of the polishing device is adjustable within 5-30 mm/s;
in step d1, the ratio of diamond fines to water is 1: 4, the ratio of the diamond fine powder to the oil is 1: 2;
in step d2, the stirrer for continuously stirring by the mixing and conveying device is a magnetic stirrer;
in the step e, the duration t1 is 3-18 h, and 6 symmetrical positions are randomly selected according to the irregular curved surface characteristic of the polycrystalline thin film coating.
By using the polishing equipment for the polycrystalline film coating of the diamond drawing die and combining the polishing method, the irregular curved surface of the polycrystalline film coating of the diamond drawing die can be automatically and uniformly polished, the processing precision is high, and the processing efficiency is high.
Drawings
FIG. 1 is a schematic view of an assembly structure of a polishing apparatus for a polycrystalline thin film coating of a diamond drawing die according to the present invention;
FIG. 2 is a schematic view of another angle assembly structure of the polishing apparatus for a polycrystalline thin film coating of a diamond drawing die according to the present invention;
FIG. 3 is a schematic view of the assembly structure of the clamping device of the present invention;
FIG. 4 is a schematic view of another angle assembly structure of the clamping device of the present invention;
FIG. 5 is a schematic view showing an assembled structure of the polishing apparatus of the present invention;
FIG. 6 is a schematic view of another angular mounting configuration of the polishing apparatus of the present invention;
FIG. 7 is a schematic view of an assembling structure of the distance adjuster of the present invention;
FIG. 8 is a schematic view of the assembly of the grinding and dressing apparatus of the present invention;
FIG. 9 is a schematic view of a workbench according to the present invention.
In the figure:
1-workbench, 11-arc-shaped groove, 2-clamping device, 21-mounting seat, 22-supporting plate, 23-reducer, 24-motor, 25-chuck, 26-rotary bearing, 27-connecting plate, 3-polishing device, 31-linear module, 32-first mounting plate, 33-guide rail component, 34-slide block, 351-low-speed electric spindle, 352-grinding rod, 353-grinding head, 36-second mounting plate, 37-third mounting plate, 371-connecting piece, 38-distance adjuster, 381-lead screw supporting seat, 382-fixing seat, 383-lead screw nut, 384-lead screw, 385-hand wheel, 391-cylindrical spring, 392-tension sensor, 4-mixing conveying device, 41-mixing cup, 42-stirrer, 43-peristaltic pump, 5-grinding and trimming device, 51-bracket, 52-high-speed electric spindle, 53-grinding and trimming head, 6-groove type sensor, 7-metal contact piece and 8-diamond drawing die.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
Example one
The polishing equipment for the polycrystalline film coating of the diamond drawing die is used for uniformly polishing the irregular curved surface of the polycrystalline film coating of the diamond drawing die 8, and specifically, the irregular curved surface of the polycrystalline film coating sequentially comprises an inlet area curved surface, a lubricating area curved surface, a compression area curved surface, a sizing area curved surface and an outlet area curved surface. As shown in fig. 1 and fig. 2, the polishing apparatus includes a worktable 1, a clamping device 2 mounted on the worktable 1 for clamping a diamond drawing die 8, and a polishing device 3 which is adjustable relative to the feeding direction of the diamond drawing die 8 and flexibly attached to a polycrystalline thin film coating formed on the inner hole surface of the diamond drawing die 8 for polishing the polycrystalline thin film coating; the polishing device also comprises a diamond micro powder mixed solution sprayed on the surface of the polycrystalline film coating in the polishing process, and a mixed material conveying device 4 for mixing and conveying the diamond micro powder mixed solution.
Different from the polishing of self-supporting thick film or plane coating, because of there are many and the hole surface of size to be factors such as irregular curved surface in the hole surface of diamond drawing die 8, lead to the polishing that is used for hole longitudinal surface at present mostly manual operation, and polycrystalline film coating hardness is superhard, and manual operation intensity is very big, and the diamond drawing die polycrystalline film coating polishing equipment of this embodiment just can solve the problem that exists among the prior art, and realizes the automatic polishing of polycrystalline film coating.
Through clamping device 2's setting, can realize the centre gripping to diamond drawing die 8, through adjustable for diamond drawing die 8 direction of feed, and the flexibility is laminated in polycrystalline film coating, with the setting of polishing device 3 who carries out polishing treatment to polycrystalline film coating, can make polishing device 3 keep laminating throughout to the irregular curved surface of polycrystalline film coating of diamond drawing die 8 in the polishing process, and realize even polishing, and through the polishing process, spray in the spraying of the mixed liquid of diamond miropowder on polycrystalline film coating surface, can overcome polycrystalline film coating hardness height, difficult processing and easily influence polishing device 3 life scheduling problem, through compounding conveyor 4's setting, can cross the mixed liquid preparation and the transport that realize the mixed liquid of diamond miropowder.
As shown in fig. 5 in conjunction with fig. 6, the polishing apparatus 3 includes a linear module 31, a guide rail assembly 33 mounted on the linear module 31 via a first mounting plate 32, the guide rail assembly 33 being arranged perpendicular to the linear module 31, a polishing assembly slidably mounted on the guide rail assembly 33 via a second mounting plate 36, a third mounting plate 37 slidably mounted on the guide rail assembly 33 adjacent to the second mounting plate 36, a distance adjuster 38 for adjusting a distance between the third mounting plate 37 and the second mounting plate 36 by moving the third mounting plate 37 relative to the second mounting plate 36, and a flexible force applicator detachably connected between the second mounting plate 36 and the third mounting plate 37.
The arrangement of the linear module 31 and the guide rail assembly 33 can realize the position adjustment of the polishing assembly relative to the clamped diamond mold; the flexible force applicator can apply a flexible force to the polishing assembly, so that the polishing assembly is always attached to the polycrystalline film coating; the provision of the flexible force applicator in combination with the distance adjuster 38 allows the magnitude of the force of the flexible force to be adjusted to make it convenient to use and suitable for a wider range of applications.
Specifically, as shown in fig. 9, a mounting groove for a mounting base plate of the polishing apparatus 3 is formed on the table 1, and the linear module 31 is mounted on the mounting base plate, in this embodiment, the linear module 31 has a model of DK175-CL10-S250mm-F0-G3, because the length of the first mounting plate 32 and the number of components mounted thereon are large, the linear module 31 and the first mounting plate 32 are mounted via an intermediate plate for easy mounting, the size of the intermediate plate is smaller than that of the first mounting plate 32, and the guide rail assembly 33 is mounted on the first mounting plate 32, in this embodiment, the guide rail assembly 33 includes two parallel guide rails, specifically, for easy guiding and processing, each guide rail includes a guide rail seat mounted on the first mounting plate 32 and a cylindrical guide post integrally formed on the guide rail seat, and for easy sliding of the second mounting plate 36 and the third mounting plate 37 on the guide rail, the sliders 34 are mounted at the bottoms of the second mounting plate 36 and the third mounting plate 37, specifically, two sliders 34 are respectively mounted at two sides of the bottom of the second mounting plate 36, one slider 34 is respectively mounted at two sides of the bottom of the third mounting plate 37, and a guide groove adapted to the guide post is formed in each slider 34.
To better form the limit, so that the Y-feed of the polishing assembly is aligned with the center of the diamond mold, as shown in fig. 2 and fig. 6, a groove sensor 6 is installed on the first mounting plate 32 to limit the sliding of the second mounting plate 36 along the guide rail assembly 33 to the limit position, and the polishing assembly is aligned with the center of the diamond drawing mold 8, specifically, a metal contact 7 is installed at the bottom of the second mounting plate 36, and after the metal contact 7 enters the groove sensor 6, the Y-feed of the polishing assembly is stopped.
As shown in fig. 5 in combination with fig. 6, the polishing assembly includes a low-speed electric spindle 351 mounted on the second mounting plate 36, and a grinding head assembly connected to the low-speed electric spindle 351, the grinding head assembly includes a grinding rod 352 rotatably connected to the low-speed electric spindle 351, and a grinding head 353 integrally formed on the grinding rod 352, the outer surface of the grinding head 353 is disposed in a spherical-like manner, and the outer surface of the grinding head 353 is disposed in a spherical-like manner, so that the surface of the polycrystalline thin film coating can be better polished.
As shown in fig. 5, the flexible force applicator includes a cylindrical spring 391, and a tension sensor 392 having one end connected to the cylindrical spring 391, the other end of the cylindrical spring 391 is detachably connected to the second mounting plate 36, the other end of the tension sensor 392 is detachably connected to the third mounting plate 37, specifically, a positioning screw is mounted on the second mounting plate 36, a positioning plate is mounted on the third mounting plate 37, specifically, the positioning plate is L-shaped, one end of the tension sensor 392 is fixed to the positioning plate, the two ends of the cylindrical spring 391 are respectively connected to the other ends of the positioning screw and the tension sensor 392, the distance between the second mounting plate 36 and the third mounting plate 37 is adjusted by the distance adjuster 38, and then a reasonable flexible force value is applied by the flexible force applicator, so that the grinding wheel 353 is always attached to the surface of the polycrystalline thin film with a constant force within a certain range, thereby realizing the uniform polishing of the polycrystalline film coating surface. Repeated experiments infer that the larger the flexible force is, the higher the polishing efficiency is, but obvious grinding traces can be generated on the surface of the polycrystalline thin film coating, and the larger the flexible force is, the faster the grinding head 353 is consumed; and the compliance is less, can not play the polishing effect again, so for obtaining suitable polishing efficiency and machining precision, in this embodiment, the compliance is adjustable for 5~7N size to be adapted to irregular curved surface, and the diamond drawing die 8 of not unidimensional.
As shown in fig. 5 and fig. 7, the distance adjuster 38 includes a screw rod support 381 and a fixed seat 382 respectively mounted on the first mounting plate 32, and a screw rod nut 383 mounted on the third mounting plate 37, and further includes a screw rod 384 one end of which passes through the screw rod support 381 and the screw rod nut 383 in sequence and is connected to the fixed seat 382, and a hand wheel 385 connected to the other end of the screw rod 384, and by rotating the hand wheel 385, the screw rod is driven to rotate, and further the screw rod nut 383 and the third mounting plate 37 are driven to move on the guide rail in the Y direction, so as to achieve the distance adjustment between the third mounting plate 37 and the second mounting plate 36.
As shown in fig. 1, the mixing and conveying device 4 includes a mixing cup 41, a stirrer 42 for stirring and mixing two materials of diamond fine powder and water or two materials of diamond fine powder and oil added into the mixing cup 41, a peristaltic pump 43 for conveying a mixed solution of diamond fine powder mixed in the mixing cup 41, and a conveying pipe (not shown in the figure) communicating with the peristaltic pump 43, in this embodiment, the two materials are diamond fine powder and water in a certain ratio, or diamond fine powder and oil in a certain ratio, specifically, in this embodiment, the ratio of diamond fine powder to water is 1: 4, the ratio of the diamond fine powder to the oil is 1: 2. in order to achieve sufficient mixing, the stirrer 42 is preferably a magnetic stirrer 42, and the delivery tube is a metal hose, one end of the delivery tube is connected to the peristaltic pump 43, and the other end is located above the polycrystalline thin film coating.
As shown in fig. 3 to 4 in conjunction with fig. 1, the clamping device 2 includes a mounting base 21 mounted on the table 1, and a support plate 22 mounted on the mounting base 21; the diamond drawing die further comprises a speed reducer 23, a motor 24 and a rotary bearing 26, wherein the speed reducer 23 and the motor 24 are sequentially arranged at one end of the supporting plate 22, the motor is in transmission connection with the speed reducer 23, the outer ring of the rotary bearing 26 is connected with the supporting plate 22, the inner ring of the rotary bearing 26 is connected with a chuck 25 through a connecting plate 27, and the diamond drawing die 8 is clamped on the chuck 25.
Specifically, as shown in fig. 1 and fig. 9, a mounting groove of the mounting seat 21 is formed in the workbench 1, the mounting seat 21 is mounted on the mounting groove, the clamping device 2 is provided with a structure including the mounting seat 21, a supporting plate 22, a motor 24, a speed reducer 23, a chuck 25, a rotary bearing 26 and a connecting plate 27, so that the structure is simple, the operation is convenient, the size of the chuck 25 is selectable, the clamping device is suitable for diamond drawing dies 8 of different sizes, and particularly, the clamping range of the clamping device 2 is 65 mm-205 mm.
Along with the accumulation of polishing operation time, the grinding head 353 can be worn to different degrees, so as to facilitate the grinding and trimming of the grinding head 353, as shown in fig. 1 and fig. 8, the diamond drawing die polycrystalline film coating polishing apparatus further comprises a grinding and trimming device 5 for grinding and trimming the polishing device 3, wherein the grinding and trimming device 5 is adjustable in angle, specifically, the grinding and trimming device 5 comprises a high-speed motorized spindle 52 mounted on the workbench 1 through a bracket 51, and a grinding and trimming head 53 rotatably connected to the high-speed motorized spindle 52, as shown in fig. 8, an arc-shaped groove 11 is formed in the workbench 1, one end of the bracket 51 is fixed on the workbench 1, and the other end of the bracket 51 is slidably arranged in the arc-shaped groove 11.
Grinding finishing device 5's setting can be convenient for to the grinding after the burnishing device 3 processing wearing and tearing, and through having seted up arc wall 11 on workstation 1, on workstation 1 was fixed in to the one end of support 51, in arc wall 11 was located in the other end cunning of support 51, the position of adjustable grinding finishing head 53, and be convenient for carry out the grinding to burnishing device 3 different positions. In this embodiment, the arc diameter of the arc-shaped slot 11 is 100mm, and the grinding and trimming head 53 is adjustable within a range of ± 10 °.
As shown in fig. 1 in conjunction with fig. 5, when the grinding head 353 is required to be ground and dressed, the second mounting plate 36 and the third mounting plate 37 are fixed by connecting a detachable connector 371 between the second mounting plate 36 and the third mounting plate 37, and after grinding and dressing, the connector 371 is removed.
Example two
The invention also provides a polishing method of the diamond drawing die polycrystalline film coating, which is used for uniformly polishing the irregular curved surface of the diamond drawing die polycrystalline film coating by using the polishing equipment of the diamond drawing die polycrystalline film coating in the first embodiment and comprises the following steps:
a. clamping the diamond drawing die 8 on the clamping device 2;
b. adjusting the feeding direction of the polishing device 3 relative to the diamond drawing die 8 until the polishing device 3 reaches the working position;
c. setting parameters;
c1, applying a flexible force to the polishing device 3 to ensure that the polishing device keeps flexible fit with the irregular curved surface of the polycrystalline film coating;
c2, adjusting the rotating speed parameter of the clamping device 2 and the motion parameter of the polishing device 3;
d. preparing diamond micro powder mixed liquid and conveying the mixed liquid to the surface of an inner hole of a diamond drawing die;
d1, adding two materials of diamond fine powder and water in a certain proportion or adding two materials of diamond fine powder and oil in a certain proportion into the mixing and conveying device 4, or adding two materials of diamond fine powder and water in a certain proportion and then adding two materials of diamond fine powder and oil in a certain proportion, and stirring the materials into a diamond micro powder mixed solution through the mixing and conveying device;
d2, conveying the mixed diamond micro powder mixed solution to the surface of the inner hole of the diamond drawing die 8, and keeping the continuous stirring of the mixed material conveying device 4 in the process;
e. performing circumferential and longitudinal polishing on the surface of an inner hole of the diamond drawing die 8, randomly selecting a plurality of symmetrical positions in a polishing working area during the duration time t1, and detecting the surface roughness Ra value by using a surface roughness profile measuring instrument;
f. c, timely adjusting all parameters in the step c according to the Ra value of the surface roughness detected by the surface roughness profile measuring instrument, and selectively repeating the step b, the step d1, the step d2 and the step e until a plurality of symmetrical positions are randomly selected in the polishing working area, wherein the Ra value of the surface roughness detected by the surface roughness profile measuring instrument is less than 0.06 mu m;
g. polishing equipment reset
Specifically, the polishing method in this embodiment is full-automatic polishing, an operation panel is provided on the polishing apparatus, and a PLC controller is provided in the table 1, and the model of the PLC controller in this embodiment is taida AS 228T-a.
In step a, the diamond mold is clamped on the chuck 25 of the clamping device 2, so that the diamond mold is suitable for diamond drawing molds 8 with different sizes, the operable range is wider, the size of the chuck 25 can be selected, and particularly, the clamping range of the clamping device 2 is 65 mm-205 mm.
In step b, the Y-direction feeding direction of the grinding head 353 of the polishing device 3 is adjusted until the metal contact 7 in the first embodiment enters the groove sensor 6, a signal is transmitted to the PLC controller, the polishing assembly stops the Y-direction feeding, and then the X-direction feeding direction of the grinding head 353 of the polishing device 3 is adjusted by the linear module 31 to the initial processing position of the metal drawing die, specifically, the initial processing position is the entrance area curved surface.
In step c1, the flexible force is adjustable in size of 5-7N.
The larger the flexible force is, the higher the polishing efficiency is, but obvious grinding traces can be generated on the surface of the polycrystalline film coating, and the larger the flexible force is, the faster the loss of the grinding head 353 is; and the flexibility is less, can not play the polishing effect again, so for obtaining suitable polishing efficiency and machining precision, through repeated contrast test, in this embodiment, the flexibility is 5~7N adjustable in size to be adapted to irregular curved surface, and the diamond drawing die 8 of different sizes.
In step c2, the rotation speed of the clamping device 2 is adjustable within a range of 30 to 90r/min, the rotation speed of the spindle of the polishing device 3 is adjustable within a range of 50 to 75Hz, and the forward and backward speed of the polishing device 3 is adjustable within a range of 5 to 30 mm/s. In this embodiment, the rotation speed of the clamping device 2 is preferably 60 to 70r/min, and the forward/backward speed of the polishing device 3 is 5 to 10 mm/s.
In step d1, the ratio of diamond fines to water is 1: 4, the ratio of the diamond fine powder to the oil is 1: 2.
in step d1, 1: 4, adding two materials of diamond fine powder and water or directly adding 1: 2, adding 1: 4, adding two materials of diamond fine powder and water after processing for t1 time, wherein the weight ratio of the diamond fine powder to the water is 1: 2, preferably adding 1: 4, adding 1: 2, in the embodiment, the time to be processed is specifically 1-2 hours.
In step d2, the stirrer 42 that the mixing and conveying device 4 continuously stirs is a magnetic stirrer 42.
In the step e, the duration t1 is 3-18 h, and 6 symmetrical positions are randomly selected according to the irregular curved surface characteristic of the polycrystalline film coating.
According to the invention, a large number of different parameters are allocated, the flexible force is within the range of 5-7N, the rotating speed of the main shaft is within the range of 50-75 Hz, the faster the rotating speed of the clamping device 2 is within the relative range, the slower the linear module 31 advances within the relative range, the better the polishing effect is, and the following data are realized:
the above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention by equally replacing or changing the technical idea of the present invention within the technical scope of the present invention.
Claims (10)
1. The utility model provides a diamond drawing die polycrystal film coating polishing equipment for diamond drawing die's the even polishing of the irregular curved surface of polycrystal film coating, includes the workstation, its characterized in that: the polishing device is arranged on the workbench and used for clamping the diamond drawing die, and the polishing device is adjustable relative to the feeding direction of the diamond drawing die, flexibly attached to the polycrystalline thin film coating and used for polishing the polycrystalline thin film coating, wherein the polycrystalline thin film coating is formed on the surface of an inner hole of the diamond drawing die; the polishing device also comprises a diamond micro-powder mixed solution sprayed on the surface of the polycrystalline film coating in the polishing process, and a mixing and conveying device for mixing and conveying the diamond micro-powder mixed solution.
2. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 1, wherein: the polishing device comprises a linear module and a guide rail assembly arranged on the linear module through a first mounting plate, wherein the guide rail assembly is arranged perpendicular to the linear module; the polishing device also comprises a distance adjuster which can drive the third mounting plate to move relative to the second mounting plate so as to adjust the distance between the third mounting plate and the second mounting plate, and a flexible force applying device which is detachably connected between the second mounting plate and the third mounting plate.
3. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 2, wherein: polishing subassembly including install in low-speed electricity main shaft on the second mounting panel, and connect in the last bistrique subassembly of low-speed electricity main shaft, bistrique subassembly including rotate connect in the last grinding pin of low-speed electricity main shaft, and integrated into one piece in bistrique on the grinding pin, the surface quasi-spherical surface of bistrique sets up.
4. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 2, wherein: the flexible force applying device comprises a cylindrical spring and a tension sensor, one end of the tension sensor is connected with the cylindrical spring, the other end of the cylindrical spring is detachably connected with the second mounting plate, the other end of the tension sensor is detachably connected with the third mounting plate, the distance adjuster comprises a lead screw supporting seat and a fixing seat which are respectively installed on the first mounting plate, a lead screw nut which is installed on the third mounting plate and a hand wheel, one end of the lead screw nut is sequentially connected with a lead screw connected with the fixing seat, and one end of the lead screw nut is sequentially connected with the lead screw supporting seat.
5. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 1, wherein: the mixing and conveying device comprises a mixing cup and a stirrer for stirring and mixing two materials of diamond fine powder and water or two materials of diamond fine powder and oil added into the mixing cup; the mixing cup is characterized by also comprising a peristaltic pump for conveying the mixed diamond micro powder liquid in the mixing cup and a conveying pipe communicated with the peristaltic pump.
6. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 1, wherein: the clamping device comprises a mounting seat mounted on the workbench and a supporting plate mounted on the mounting seat; still including install in proper order in the reduction gear of backup pad one end and with the motor that reduction gear transmission is connected, and the outer lane with the slewing bearing that the backup pad is connected, slewing bearing's inner circle is connected with the chuck via the connecting plate, diamond drawing die centre gripping in on the chuck.
7. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 2, wherein: and a groove sensor is arranged on the first mounting plate so as to limit the sliding of the second mounting plate along the guide rail assembly and align the polishing assembly to the center of the diamond drawing die.
8. The diamond draw tool polycrystalline thin film coating polishing apparatus of claim 1, wherein: the polishing device comprises a high-speed motorized spindle and a grinding and trimming head, the high-speed motorized spindle is mounted on the workbench through a support, the grinding and trimming head is rotatably connected to the high-speed motorized spindle, an arc-shaped groove is formed in the workbench, one end of the support is fixed on the workbench, and the other end of the support is slidably arranged in the arc-shaped groove.
9. A polishing method of a polycrystalline film coating of a diamond drawing die is characterized by comprising the following steps: use of the diamond draw die polycrystalline thin film coating polishing apparatus of any one of claims 1 to 8 to uniformly polish an irregular curved surface of a diamond draw die polycrystalline thin film coating, comprising the steps of:
a. clamping the diamond drawing die on the clamping device;
b. adjusting the feeding direction of the polishing device relative to the diamond drawing die until the polishing device reaches a working position;
c. setting parameters;
c1, applying a flexible force to the polishing device to enable the polishing device to be flexibly attached to the irregular curved surface of the polycrystalline film coating;
c2, adjusting the rotating speed parameter of the clamping device and the motion parameter of the polishing device;
d. preparing diamond micro powder mixed liquid and conveying the mixed liquid to the surface of an inner hole of a diamond drawing die;
d1, adding two materials of diamond fine powder and water in a certain proportion or adding two materials of diamond fine powder and oil in a certain proportion into the mixing and conveying device, or adding two materials of diamond fine powder and water in a certain proportion and then adding two materials of diamond fine powder and oil in a certain proportion, and stirring the materials into a diamond micro powder mixed solution through the mixing and conveying device;
d2, conveying the mixed diamond micro powder mixed solution to the surface of an inner hole of the diamond drawing die, and keeping the continuous stirring of the mixed material conveying device in the process;
e. performing circumferential and longitudinal polishing on the surface of the inner hole of the diamond drawing die, randomly selecting a plurality of symmetrical positions in a polishing working area during the duration time t1, and detecting the surface roughness Ra value by using a surface roughness profile measuring instrument;
f. c, timely adjusting parameters in the step c according to the Ra value of the surface roughness detected by the surface roughness profile measuring instrument, repeating the step b, the step d1, the step d2 and the step e until a plurality of symmetrical positions are randomly selected in the polishing working area, and detecting that the Ra value of the surface roughness is smaller than 0.06 mu m by using the surface roughness profile measuring instrument;
g. and resetting the polishing equipment.
10. The diamond draw tool polycrystalline film coating polishing method of claim 9, wherein:
in the step c1, the flexible force is adjustable within the range of 5-7N;
in the step c2, the rotating speed of the clamping device is adjustable within 30-90 r/min, the rotating speed of a main shaft of the polishing device is adjustable within 50-75 Hz, and the forward and backward speed of the polishing device is adjustable within 5-30 mm/s;
in step d1, the ratio of diamond fines to water is 1: 4, the ratio of the diamond fine powder to the oil is 1: 2;
in step d2, the stirrer for continuously stirring by the mixing and conveying device is a magnetic stirrer;
in the step e, the duration t1 is 3-18 h, and 6 symmetrical positions are randomly selected according to the irregular curved surface characteristic of the polycrystalline thin film coating.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210370678.3A CN114434305A (en) | 2022-04-11 | 2022-04-11 | Polishing equipment and polishing method for polycrystalline film coating of diamond drawing die |
| CN202221906275.8U CN217728317U (en) | 2022-04-11 | 2022-07-22 | Diamond drawing die polycrystalline film coating polishing equipment |
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| CN202210370678.3A CN114434305A (en) | 2022-04-11 | 2022-04-11 | Polishing equipment and polishing method for polycrystalline film coating of diamond drawing die |
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| CN202221906275.8U Active CN217728317U (en) | 2022-04-11 | 2022-07-22 | Diamond drawing die polycrystalline film coating polishing equipment |
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