CN114434040A - Dissimilar material interconnected zinc alloy mixed solder powder and connecting method - Google Patents
Dissimilar material interconnected zinc alloy mixed solder powder and connecting method Download PDFInfo
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- CN114434040A CN114434040A CN202110052123.XA CN202110052123A CN114434040A CN 114434040 A CN114434040 A CN 114434040A CN 202110052123 A CN202110052123 A CN 202110052123A CN 114434040 A CN114434040 A CN 114434040A
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- 239000000843 powder Substances 0.000 title claims abstract description 109
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 78
- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 52
- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000003466 welding Methods 0.000 claims abstract description 88
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 229910007570 Zn-Al Inorganic materials 0.000 claims abstract description 5
- 229910017518 Cu Zn Inorganic materials 0.000 claims abstract description 4
- 229910017752 Cu-Zn Inorganic materials 0.000 claims abstract description 4
- 229910017943 Cu—Zn Inorganic materials 0.000 claims abstract description 4
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 21
- 239000010953 base metal Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 abstract description 36
- 229910000969 tin-silver-copper Inorganic materials 0.000 abstract description 36
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 30
- 230000004907 flux Effects 0.000 abstract description 8
- 239000011701 zinc Substances 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 5
- 239000011812 mixed powder Substances 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 39
- 229910052759 nickel Inorganic materials 0.000 description 22
- 238000002604 ultrasonography Methods 0.000 description 21
- 239000010949 copper Substances 0.000 description 18
- 239000002131 composite material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Abstract
The invention relates to a dissimilar material interconnected zinc alloy mixed solder powder and a connecting method thereof, wherein the Zn alloy mixed solder powder is prepared by mixing Zn-Al alloy, Cu-Zn alloy, pure Ni powder and tin-silver-copper or tin-silver-copper and tin-copper mixed solder powder according to a certain proportion. The prepared Zn alloy solder powder is prepared by uniformly mixing 20-60 wt% of Zn alloy mixed powder, 0.05-10 wt% of pure Ni powder and tin-silver-copper or tin-silver-copper and tin-copper mixed solder powder at room temperature. The alloy solder powder of the invention has simple manufacture and low material cost, and can effectively avoid the corrosion caused by the oxidation of Zn in the solder powder and the residue of the soldering flux and the defect of air holes caused by welding. By adopting double ultrasonic auxiliary welding, the heating energy can be saved, the welding time is shorter, the welding efficiency is higher, the application range is wide, and the welding device is particularly suitable for connecting different materials and materials difficult to weld.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a dissimilar material interconnected zinc alloy mixed solder powder and a connecting method.
Background
Cu, Al and their alloys have good electric and heat conducting properties, and are widely used in the industries of power electronics, refrigeration and the like, such as heat exchangers, cables and the like. However, Al resources are relatively rich and Cu resources are deficient in China. Although Al is slightly inferior to Cu in electric conduction and heat conduction performance, the density of Al is lower than that of Cu, and the corrosion resistance is better, so that the Cu/Al composite structure formed by combining the advantages of the Al and the Cu can not only realize light weight of products, but also save resources and reduce material cost.
Meanwhile, with the increasing use of aluminum alloy and composite materials thereof in electronic packaging and the urgent need of people to avoid direct brazing of metals such as nickel plating and silver, aluminum is increasingly required to replace copper, and the realization of high-quality interconnection of aluminum and copper is urgent.
In the prior patent CN109759741A, the brazing powder is composed of tin copper powder or tin-silver copper powder, or the powder of tin copper powder and tin-silver copper powder mixed, and is uniformly mixed with any one, or any two, or any three, or any four, or five of nickel powder, cobalt powder, copper powder, tin powder and titanium powder of active nano particles with the diameter of 1-1000nm according to the mass ratio of no more than 20%. The method adopts an ultrasonic auxiliary brazing method, promotes the solder or the nano particles to have metallurgical reaction with the parent metal through the oscillation heat generation of an ultrasonic generating device, and realizes the low-temperature interconnection of the lead-free solder in a full solid phase or a semi-solid state. In the prior patent, CN111151914A relates to an antioxidant Zn-based solder paste and a preparation method thereof, wherein the antioxidant Zn-based solder paste is a composite solder paste finally formed by mixing Zn-Al solder powder and a soldering flux, and then mixing the mixture with a binder and an antioxidant.
The characteristics of the above examples include that the composite solder containing nanoparticles is not uniformly mixed and easily oxidized, the kinds of particles are too many, the size of the weld is difficult to control accurately, the Zn-based solder paste is not easy to preserve for a long time under the flux, the halogen remains in the flux, and the welding may have defects such as air holes at the welded joint. Therefore, a mixed solder powder of a dissimilar material interconnected zinc alloy and a connecting method are proposed to solve the above problems.
Disclosure of Invention
The invention provides a dissimilar material interconnected zinc alloy mixed solder powder and a connecting method aiming at the defects of the prior art. The alloy solder powder used by the method is simple to manufacture and low in material cost, and can effectively avoid corrosion caused by Zn oxidation and flux residue in the solder powder and air hole defects caused by welding.
In order to achieve the purpose, the invention provides the following technical scheme:
the mixed Zn alloy solder powder is prepared by uniformly mixing 20-60 wt% of mixed Zn alloy powder, 0.05-10 wt% of pure Ni powder and mixed solder powder of Sn-Ag-Cu or Sn-Ag-Cu and Sn-Cu at room temperature.
The method is further technically characterized in that:
(1) the Zn-Al alloy comprises Zn96Al4, Zn98Al2, Zn85Al15 and the like, and the grain diameter thereof is 1-50 mu m; the Cu-Zn alloy includes Cu80Zn20, Cu50Zn50, Cu60Zn40, etc., and its grain size is 1 μm-50 μm.
(1) The Zn alloy mixed powder is one, two, three, four, five or six of Zn96Al4, Zn98Al2, Zn85Al15, Cu80Zn20, Cu50Zn50 and Cu60Zn40 which are mixed in any proportion.
(3) The purity of the pure Ni powder is more than 97 percent, and the particle diameter is 0.005-50 mu m.
(4) The tin-silver-copper or tin-copper or the mixed solder powder of the tin-silver-copper and the tin-copper, wherein the tin-silver-copper solder powder is Sn0.3Ag0.7Cu, and the tin-copper solder powder is Sn-0.7Cu, and the particle size of the tin-silver-copper or the mixed solder powder is 0.2 mu m-50 mu m.
A method for connecting dissimilar material interconnection zinc alloy mixed solder powder is characterized by comprising the following steps:
(1) and (3) polishing the base material to be welded by using abrasive paper with different meshes, and polishing by using a polishing agent after polishing. After treatment, the parent metal is sequentially put into acetone solution, hydrochloric acid solution, NaOH solution and alcohol for cleaning for a period of time, and the parent metal is taken out and cleaned by the alcohol for standby.
(2) Putting a part of base material into a clamp, then putting Zn alloy solder powder, dripping a few points of alcohol by using a rubber head dropper to compact the solder, simultaneously preventing moisture from entering the solder powder, and then putting the other part of base material onto the powder.
(3) And (3) placing the clamp on a heating table, turning on the double-ultrasonic wave for a period of time after the temperature reaches the temperature to be welded, closing the clamp, and taking down the welded base metal after the clamp is cooled to room temperature.
The method is further technically characterized in that:
the ultrasonic generator is a longitudinal ultrasonic generator, the frequency of the ultrasonic generator a is set to be 15-20KHz, the power is set to be 300W-2000W, the frequency of the ultrasonic generator b is set to be 15-20KHz, the power is set to be 300W-2000W, and double ultrasonic is placed at 0-180 degrees; the ultrasonic wave a assists the welding time for 1-30s, the ultrasonic wave b assists the welding time for 3-30s, the welding time is 120-300s, and the set temperature of the heating table is room temperature-200 ℃.
Compared with the prior art, the invention is used for the mixed welding flux powder of the zinc alloy for the interconnection of the dissimilar materials and the connecting method, and has the following beneficial effects:
1. the Zn alloy mixed solder powder and the connection method used in the invention can avoid the flux, thereby avoiding the welding defects such as corrosion caused by the residual flux, air holes caused by welding and the like.
2. Compared with the traditional pure Zn or Zn alloy soldering paste and other welding bodies, the Zn alloy mixed solder powder used by the invention effectively reduces the oxidation and corrosion of zinc by adopting Zn alloy powder particles, has the advantage of long-time storage, and simultaneously has lower comprehensive price.
3. The invention adopts double-ultrasonic auxiliary welding, loads weak ultrasonic on the side of the easy-to-weld material, attaches strong ultrasonic on the side of the difficult-to-weld material, reduces the welding temperature by more than 30 ℃ compared with soft soldering, can save heating energy, and has shorter welding time, higher welding efficiency and wide application range.
4. The solder powder used by the invention is added with Ni particles, which not only can enhance the weldability of the solder and improve the connection strength, but also can inhibit the excessive growth of the IMC of the welding joint and improve the service reliability of the joint.
Drawings
FIG. 1 is a schematic view of an apparatus according to embodiment 1;
FIG. 2 is a schematic view of an apparatus according to embodiment 2;
FIG. 3 is a schematic view of an apparatus according to embodiment 3;
FIG. 4 is a schematic view of the apparatus of practical example 4 and practical example 5;
FIG. 5 is a schematic view of the apparatus of embodiment 6, embodiment 8 and embodiment 9;
FIG. 6 is a schematic view of the apparatus of practical example 7 and practical example 10.
Detailed Description
The present invention will be described in detail below with reference to the following detailed description and the accompanying drawings.
The special material interconnected zinc alloy mixed solder powder is prepared by uniformly mixing 20-60 wt% of Zn alloy mixed powder, 0.05-10 wt% of pure Ni powder and tin-silver-copper or tin-silver-copper and tin-copper mixed solder powder at room temperature.
The method is further technically characterized in that:
(1) the Zn-Al alloy comprises Zn96Al4, Zn98Al2, Zn85Al15 and the like, and the grain diameter thereof is 1-50 mu m; the Cu-Zn alloy includes Cu80Zn20, Cu50Zn50, Cu60Zn40, etc., and its grain size is 1 μm-50 μm.
(1) The Zn alloy mixed powder is one, two, three, four, five or six of Zn96Al4, Zn98Al2, Zn85Al15, Cu80Zn20, Cu50Zn50 and Cu60Zn40 which are mixed in any proportion.
(3) The purity of the pure Ni powder is more than 97 percent, and the particle size is 0.005-50 mu m.
(4) The tin-silver-copper or tin-copper or the mixed solder powder of the tin-silver-copper and the tin-copper, wherein the tin-silver-copper solder powder is Sn0.3Ag0.7Cu, and the tin-copper solder powder is Sn-0.7Cu, and the particle size of the tin-silver-copper or the mixed solder powder is 0.2 mu m-50 mu m.
A method for connecting dissimilar material interconnection zinc alloy mixed solder powder is characterized by comprising the following steps:
(1) and (3) polishing the base material to be welded by using abrasive paper with different meshes, and polishing by using a polishing agent after polishing. After treatment, the parent metal is sequentially put into acetone solution, hydrochloric acid solution, NaOH solution and alcohol for cleaning for a period of time, and the parent metal is taken out and cleaned by the alcohol for standby.
(2) Putting a part of base material into a clamp, then putting Zn alloy solder powder, dripping a few points of alcohol by using a rubber head dropper to compact the solder, simultaneously preventing moisture from entering the solder powder, and then putting the other part of base material onto the powder.
(3) And (3) placing the clamp on a heating table, turning on the double-ultrasonic wave for a period of time after the temperature reaches the temperature to be welded, closing the clamp, and taking down the welded base metal after the clamp is cooled to room temperature.
The method is further technically characterized in that:
the ultrasonic generator is a longitudinal ultrasonic generator, the frequency of the ultrasonic generator a is set to be 15-20KHz, the power is set to be 300W-2000W, the frequency of the ultrasonic generator b is set to be 15-20KHz, the power is set to be 300W-2000W, and double ultrasonic is placed at 0-180 degrees; the ultrasonic wave a assists the welding time for 1-30s, the ultrasonic wave b assists the welding time for 3-30s, the welding time for 120-300s, and the set temperature of the heating table is room temperature-200 ℃.
Detailed description of the preferred embodiment 1
The Zn alloy solder powder comprises the following components in percentage by weight:
60％Zn96Al4+5％Ni+35％SAC0307；
60％Zn98Al2+5％Ni+35％SAC0307；
60％Zn85Al15+5％Ni+35％SAC0307；
60％Cu80Zn20+5％Ni+35％SAC0307；
60％Cu50Zn50+5％Ni+35％SAC0307；
60％Cu60Zn40+5％Ni+35％SAC0307；
60％Zn96Al4+5％Ni+35％Sn-0.7Cu；
60％Zn98Al2+5％Ni+35％Sn-0.7Cu；
60％Zn85Al15+5％Ni+35％Sn-0.7Cu；
60％Cu80Zn20+5％Ni+35％Sn-0.7Cu；
60％Cu50Zn50+5％Ni+35％Sn-0.7Cu；
60% Cu60Zn40+ 5% Ni + 35% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 20KHz, the power of the ultrasonic generator a is set to be 300W, the frequency of an ultrasonic generator b is set to be 20KHz, the power of the ultrasonic generator b is set to be 300W, the double ultrasound placement is mutually set to be 0 ℃ as shown in figure 1, the ultrasonic a assists in welding time for 5s, the ultrasonic b assists in welding time for 5s, the welding time for 300s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Specific example 2
The Zn alloy solder powder comprises the following components in percentage by weight:
50％Zn96Al4+10％Ni+40％SAC0307；
50％Zn98Al2+10％Ni+40％SAC0307；
50％Zn85Al15+10％Ni+40％SAC0307；
50％Cu80Zn20+10％Ni+40％SAC0307；
50％Cu50Zn50+10％Ni+40％SAC0307；
50％Cu60Zn40+10％Ni+40％SAC0307；
50％Zn96Al4+10％Ni+40％Sn-0.7Cu；
50％Zn98Al2+10％Ni+40％Sn-0.7Cu；
50％Zn85Al15+10％Ni+40％Sn-0.7Cu；
50％Cu80Zn20+10％Ni+40％Sn-0.7Cu；
50％Cu50Zn50+10％Ni+40％Sn-0.7Cu；
50% Cu60Zn40+ 10% Ni + 40% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 19KHz, the power of the ultrasonic generator a is set to be 400W, the frequency of an ultrasonic generator b is set to be 19KHz, the power of the ultrasonic generator b is set to be 400W, the double ultrasound is placed at 60 ℃ each as shown in figure 2, the ultrasonic a assists in welding time of 10s, the ultrasonic b assists in welding time of 10s, the welding time of 270s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Specific example 3
The Zn alloy solder powder comprises the following components in percentage by weight:
40％Zn96Al4+10％Ni+50％SAC0307；
40％Zn98Al2+10％Ni+50％SAC0307；
40％Zn85Al15+10％Ni+50％SAC0307；
40％Cu80Zn20+10％Ni+50％SAC0307；
40％Cu50Zn50+10％Ni+50％SAC0307；
40％Cu60Zn40+10％Ni+50％SAC0307；
40％Zn96Al4+10％Ni+50％Sn-0.7Cu；
40％Zn98Al2+10％Ni+50％Sn-0.7Cu；
40％Zn85Al15+10％Ni+50％Sn-0.7Cu；
40％Cu80Zn20+10％Ni+50％Sn-0.7Cu；
40％Cu50Zn50+10％Ni+50％Sn-0.7Cu；
40% Cu60Zn40+ 10% Ni + 50% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 18KHz, the power of the ultrasonic generator a is set to be 500W, the frequency of an ultrasonic generator b is set to be 18KHz, the power of the ultrasonic generator b is set to be 500W, the double ultrasound is placed at 90 degrees as shown in figure 3, the ultrasonic a assists in welding for 15s, the ultrasonic b assists in welding for 15s, and the welding for 240s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Specific example 4
The Zn alloy solder powder comprises the following components in percentage by weight:
40％Zn96Al4+20％Zn98Al2+0.5％Ni+19.75％SAC0307 +19.75％Sn-0.7Cu；
40％Zn96Al4+20％Zn85Al15+0.5％Ni+19.75％SAC0307 +19.75％Sn-0.7Cu；
40％Zn98Al2+20％Zn85Al15+0.5％Ni+19.75％SAC0307 +19.75％Sn-0.7Cu；
40％Cu80Zn20+20％Cu50Zn50+0.5％Ni+19.75％SAC0307 +19.75％Sn-0.7Cu；
40％Cu80Zn20+20％Cu60Zn40+0.5％Ni+19.75％SAC0307 +19.75％Sn-0.7Cu；
25％Cu50Zn50+25％Cu60Zn40+0.5％Ni+24.5％SAC0307 +25％Sn-0.7Cu；
25％Zn96Al4+25％Cu80Zn20+0.5％Ni+24.5％SAC0307 +25％Sn-0.7Cu；
25％Zn96Al4+25％Cu50Zn50+0.5％Ni+24.5％SAC0307 +25％Sn-0.7Cu；
25％Zn96Al4+25％Cu60Zn40+0.5％Ni+24.5％SAC0307 +25％Sn-0.7Cu；
25％Zn98Al2+25％Cu80Zn20+0.5％Ni+24.5％SAC0307 +25％Sn-0.7Cu；
10％Zn98Al2+30％Cu50Zn50+10％Ni+25％SAC0307 +25％Sn-0.7Cu；
10％Zn98Al2+30％Cu60Zn40+10％Ni+25％SAC0307 +25％Sn-0.7Cu；
10％Zn85Al15+30％Cu80Zn20+10％Ni+25％SAC0307 +25％Sn-0.7Cu；
10％Zn85Al15+30％Cu50Zn50+10％Ni+25％SAC0307 +25％Sn-0.7Cu；
10% Zn85Al15+ 30% Cu60Zn40+ 10% Ni + 25% SAC0307+ 25% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 19KHz, the power of the ultrasonic generator a is set to be 600W, the frequency of an ultrasonic generator b is set to be 19KHz, the power of the ultrasonic generator b is set to be 600W, the double ultrasound is placed at 90 degrees as shown in figure 4, the ultrasonic a assists in welding for 20s, the ultrasonic b assists in welding for 20s, the welding for 210s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Specific example 5
The Zn alloy solder powder comprises the following components in percentage by weight:
20％Zn96Al4+20％Zn98Al2+20％Zn85Al15+10％Ni +15％SAC0307+15％Sn-0.7Cu；
20％Zn96Al4+20％Cu80Zn20+20％Cu50Zn50+10％Ni +15％SAC0307+15％Sn-0.7Cu；
20％Zn96Al4+20％Cu50Zn50+20％Cu60Zn40+10％Ni +15％SAC0307+15％Sn-0.7Cu；
20％Zn96Al4+20％Zn85Al15+20％Cu80Zn20+10％Ni +15％SAC0307+15％Sn-0.7Cu；
10％Zn98Al2+10％Zn85Al15+30％Cu80Zn20+5％Ni +25％SAC0307+20％Sn-0.7Cu；
10％Zn98Al2+10％Cu80Zn20+30％Cu50Zn50+5％Ni +25％SAC0307+20％Sn-0.7Cu；
10％Zn98Al2+10％Cu50Zn50+30％Cu60Zn40+5％Ni +25％SAC0307+20％Sn-0.7Cu；
10％Zn98Al2+10％Zn85Al15+30％Cu60Zn40+5％Ni +25％SAC0307+20％Sn-0.7Cu；
20％Zn85Al15+10％Cu80Zn20+10％Cu50Zn50+10％Ni +30％SAC0307+20％Sn-0.7Cu；
20％Zn85Al15+10％Cu50Zn50+10％Cu60Zn40+10％Ni +30％SAC0307+20％Sn-0.7Cu；
20％Zn85Al15+10％Cu80Zn20+10％Cu60Zn40+10％Ni +30％SAC0307+20％Sn-0.7Cu；
20% Zn85Al15+ 10% Zn98Al2+ 10% Cu50Zn50+ 10% Ni + 30% SAC0307+ 20% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of the particle diameters of Zn alloy powder is 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar material interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (3) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 200 ℃ of the temperature to be welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 20KHz, the power is set to be 700W, the frequency of an ultrasonic generator b is set to be 20KHz, the power is set to be 700W, the double ultrasound is placed at 90 degrees as shown in figure 4, the ultrasonic a assists in welding for 25s, the ultrasonic b assists in welding for 25s, the welding for 180s, and the welded base metal is taken down after the double ultrasound is cooled to the room temperature.
Specific example 6
The Zn alloy solder powder comprises the following components in percentage by weight:
15％Zn96Al4+15％Zn98Al2+15％Zn85Al15+15％Cu80Zn20 +10％Ni+15％SAC0307+15％Sn-0.7Cu；
15％Zn96Al4+15％Zn98Al2+15％Zn85Al15+15％Cu50Zn50 +10％Ni+15％SAC0307+15％Sn-0.7Cu；
15％Zn96Al4+15％Zn98Al2+15％Zn85Al15+15％Cu60Zn40 +10％Ni+15％SAC0307+15％Sn-0.7Cu；
15％Zn98Al2+15％Zn85Al15+10％Cu80Zn20+10％Cu50Zn50 +5％Ni+25％SAC0307+20％Sn-0.7Cu；
15％Zn98Al2+15％Zn85Al15+10％Cu80Zn20+10％Cu60Zn40 +5％Ni+25％SAC0307+20％Sn-0.7Cu；
15％Zn98Al2+15％Zn85Al15+10％Cu50Zn50+10％Cu60Zn40 +5％Ni+25％SAC0307+20％Sn-0.7Cu；
10％Zn85Al15+10％Cu80Zn20+10％Cu50Zn50+10％Cu60Zn40 +10％Ni+25％SAC0307+25％Sn-0.7Cu；
10％Zn85Al15+10％Zn96Al4+10％Cu80Zn20+10％Cu50Zn50 +10％Ni+25％SAC0307+25％Sn-0.7Cu；
10% Zn85Al15+ 10% Zn96Al4+ 10% Cu80Zn20+ 10% Cu60Zn40+ 10% Ni + 25% SAC0307+ 25% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar material interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (3) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to be welded, wherein the ultrasonic generator is a longitudinal ultrasonic generator, the ultrasonic generator is continuously vibrated by ultrasonic, the frequency of the ultrasonic generator a is set to be 15KHz, the power of the ultrasonic generator a is set to be 800W, the frequency of the ultrasonic generator b is set to be 15KHz, the power of the ultrasonic generator b is set to be 800W, the double ultrasound is placed at 120 ℃ as shown in figure 5, the ultrasonic a assists in welding for 30s, the ultrasonic b assists in welding for 30s, the welding time is 150s, and the welded base metal is taken down after the welded base metal is cooled to room temperature.
Specific example 7
The Zn alloy solder powder comprises the following components in percentage by weight:
12％Zn96Al4+12％Zn98Al2+12％Zn85Al15+12％Cu80Zn20 +12％Cu50Zn50+10％Ni+15％SAC0307+15％Sn-0.7Cu；
12％Zn96Al4+12％Zn98Al2+12％Zn85Al15+12％Cu80Zn20 +12％Cu60Zn40+10％Ni+15％SAC0307+15％Sn-0.7Cu；
12％Zn96Al4+12％Zn98Al2+12％Zn85Al15+12％Cu50Zn50 +12％Cu60Zn40+10％Ni+15％SAC0307+15％Sn-0.7Cu；
12％Zn96Al4+12％Zn98Al2+12％Cu80Zn20+12％Cu50Zn50 +12％Cu60Zn40+10％Ni+15％SAC0307+15％Sn-0.7Cu；
12％Zn96Al4+12％Zn85Al15+12％Cu80Zn20+12％Cu50Zn50 +12％Cu60Zn40+10％Ni+15％SAC0307+15％Sn-0.7Cu；
12% Zn98Al2+ 12% Zn85Al15+ 12% Cu80Zn20+ 12% Cu50Zn50+ 12% Cu60Zn40+ 10% Ni + 15% SAC0307+ 15% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to be welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 16KHz, the power is set to be 1000W, the frequency of an ultrasonic generator b is set to be 16KHz, the power is set to be 1000W, the double ultrasound is placed at 180 ℃ as shown in figure 6, the ultrasonic a assists in welding for 1s, the ultrasonic b assists in welding for 3s, and the welding for 120s, and taking down the welded base metal after the welding is cooled to room temperature.
Specific example 8
The Zn alloy solder powder comprises the following components in percentage by weight:
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu80Zn20 +8％Cu50Zn50+10％Ni+25％SAC0307+25％Sn-0.7Cu；
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu80Zn20 +8％Cu60Zn40+10％Ni+25％SAC0307+25％Sn-0.7Cu；
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu50Zn50 +8％Cu60Zn40+10％Ni+25％SAC0307+25％Sn-0.7Cu；
8％Zn96Al4+8％Zn98Al2+8％Cu80Zn20+8％Cu50Zn50 +8％Cu60Zn40+10％Ni+25％SAC0307+25％Sn-0.7Cu；
8％Zn96Al4+8％Zn85Al15+8％Cu80Zn20+8％Cu50Zn50 +8％Cu60Zn40+10％Ni+25％SAC0307+25％Sn-0.7Cu；
8% Zn98Al2+ 8% Zn85Al15+ 8% Cu80Zn20+ 8% Cu50Zn50+ 8% Cu60Zn40+ 10% Ni + 25% SAC0307+ 25% Sn-0.7 Cu; is prepared by one of the following steps.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the particle diameter of the tin-silver-copper or tin-silver-copper and tin-copper mixed solder powder is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 15KHz, the power of the ultrasonic generator a is set to be 1300W, the frequency of an ultrasonic generator b is set to be 15KHz, the power of the ultrasonic generator b is set to be 1300W, the double ultrasound is placed at 120 ℃ as shown in figure 5, the ultrasonic a assists in welding for 15s, the ultrasonic b assists in welding for 15s, and the welding for 60s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Specific example 9
The Zn alloy solder powder comprises the following components in percentage by weight:
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu80Zn20 +10％Cu50Zn50+5％Ni+20％SAC0307+25％Sn-0.7Cu；
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu80Zn20 +10％Cu60Zn40+5％Ni+20％SAC0307+25％Sn-0.7Cu；
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu50Zn50 +10％Cu60Zn40+5％Ni+20％SAC0307+25％Sn-0.7Cu；
10％Zn96Al4+10％Zn98Al2+10％Cu80Zn20+10％Cu50Zn50 +10％Cu60Zn40+5％Ni+20％SAC0307+25％Sn-0.7Cu；
10％Zn96Al4+10％Zn85Al15+10％Cu80Zn20+10％Cu50Zn50 +10％Cu60Zn40+5％Ni+20％SAC0307+25％Sn-0.7Cu；
10% Zn98Al2+ 10% Zn85Al15+ 10% Cu80Zn20+ 10% Cu50Zn50+ 10% Cu60Zn40+ 5% Ni + 20% SAC0307+ 25% Sn-0.7 Cu; is prepared by one of the following steps.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 180 ℃ to-be-welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 20KHz, the power of the ultrasonic generator a is set to be 1600W, the frequency of an ultrasonic generator b is set to be 20KHz, the power of the ultrasonic generator b is set to be 1600W, the double ultrasound is placed at 120 ℃ as shown in figure 5, the ultrasonic a assists in welding time for 20s, the ultrasonic b assists in welding time for 20s, the welding time for 30s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Detailed description of example 10
The Zn alloy solder powder comprises the following components in percentage by weight:
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu80Zn20 +10％Cu50Zn50+10％Cu60Zn40+10％Ni+30％SAC0307；
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu80Zn20 +8％Cu50Zn50+8％Cu60Zn40+7％Ni+45％SAC0307；
7％Zn96Al4+7％Zn98Al2+7％Zn85Al15+7％Cu80Zn20 +7％Cu50Zn50+7％Cu60Zn40+8％Ni+50％SAC0307；
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu80Zn20 +10％Cu50Zn50+10％Cu60Zn40+5％Ni+35％Sn-0.7Cu；
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu80Zn20 +8％Cu50Zn50+8％Cu60Zn40+7％Ni+45％Sn-0.7Cu；
7％Zn96Al4+7％Zn98Al2+7％Zn85Al15+7％Cu80Zn20 +7％Cu50Zn50+7％Cu60Zn40+8％Ni+50％Sn-0.7Cu；
10％Zn96Al4+10％Zn98Al2+10％Zn85Al15+10％Cu80Zn20 +10％Cu50Zn50+10％Cu60Zn40+5％Ni+20％SAC0307+15％Sn- 0.7Cu；
8％Zn96Al4+8％Zn98Al2+8％Zn85Al15+8％Cu80Zn20 +8％Cu50Zn50+8％Cu60Zn40+7％Ni+20％SAC0307+25％Sn-0.7Cu；
7% Zn96Al4+ 7% Zn98Al2+ 7% Zn85Al15+ 7% Cu80Zn20+ 7% Cu50Zn50+ 7% Cu60Zn40+ 8% Ni + 25% SAC0307+ 25% Sn-0.7 Cu; one of them.
The grain diameter of each alloy is as follows: one of Zn alloy powder with particle size of 1 μm, 10 μm, 25 μm and 45 μm; the grain diameter of the pure Ni powder is one of 0.08 mu m, 1 mu m, 10 mu m, 25 mu m and 45 mu m; the grain diameter of the tin-silver-copper or tin-copper or the mixed solder powder of tin-silver-copper and tin-copper is one of 0.2 μm, 1 μm, 10 μm, 25 μm and 45 μm.
The welding process for the dissimilar metal interconnection is characterized by comprising the following steps of:
after the strip welding parent metal is processed, the strip welding parent metal is placed into a clamp. And (2) placing the fixture on a heating table, starting double ultrasound after the temperature reaches 200 ℃ of the temperature to be welded, wherein the ultrasonic generating device is a longitudinal ultrasonic generator, the ultrasonic generating device is continuous ultrasonic vibration, the frequency of an ultrasonic generator a is set to be 15KHz, the power of the ultrasonic generator a is set to be 2000W, the frequency of an ultrasonic generator b is set to be 15KHz, the power of the ultrasonic generator b is set to be 2000W, the double ultrasound is placed at 180 degrees, as shown in figure 6, the ultrasonic a assists in welding for 30s, the ultrasonic b assists in welding for 30s, the welding for 12s, and the welded base metal is taken down after the temperature is cooled to room temperature.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the technical solutions, and although the present invention has been described in detail by referring to the preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of the present invention can be made without departing from the spirit and scope of the technical solutions, and all the modifications and equivalent substitutions should be covered by the claims of the present invention.
Claims (7)
1. The mixed Zn alloy solder powder is prepared by uniformly mixing 20-60 wt% of mixed Zn alloy powder, 0.05-10 wt% of pure Ni powder and mixed solder powder of Sn-Ag-Cu or Sn-Ag-Cu and Sn-Cu at room temperature.
2. The hetero-material interconnection zinc alloy hybrid solder powder as set forth in claim 1, wherein the Zn-Al alloy includes Zn96Al4, Zn98Al2, Zn85Al15, etc., and has a particle diameter of 1 μm to 50 μm; the Cu-Zn alloy includes Cu80Zn20, Cu50Zn50, Cu60Zn40, etc., and its grain size is 1 μm-50 μm.
3. The hetero-material interconnected zinc alloy hybrid solder powder as claimed in claim 1, wherein the Zn alloy hybrid powder is one, two, three, four, five, or six of Zn96Al4, Zn98Al2, Zn85Al15, Cu80Zn20, Cu50Zn50, and Cu60Zn40 mixed in any ratio.
4. The hetero-material interconnected zinc alloy solder powder as claimed in claim 1, wherein the purity of the pure Ni powder is more than 97%, and the particle diameter thereof is 0.005 μm to 50 μm.
5. A mixed solder powder of a dissimilar metal interconnection zinc alloy as claimed in claim 1, a mixed solder powder of Sn-Ag-Cu or Sn-Ag-Cu and Sn-Cu, the Sn-Ag-Cu solder powder being Sn0.3Ag0.7Cu, and the Sn-Cu solder powder being Sn-0.7Cu, having a particle size of 0.2 μm to 50 μm.
6. The welding method is characterized by comprising the following steps:
(1) and (3) polishing the base material to be welded by using abrasive paper with different meshes, and polishing by using a polishing agent after polishing. After treatment, the parent metal is sequentially put into acetone solution, hydrochloric acid solution, NaOH solution and alcohol for cleaning for a period of time, and the parent metal is taken out and cleaned by the alcohol for standby.
(2) Putting a part of base material into a clamp, then putting Zn alloy solder powder, dripping a few points of alcohol by using a rubber head dropper to compact the solder, simultaneously preventing moisture from entering the solder powder, and then putting the other part of base material onto the powder.
(3) And (3) placing the clamp on a heating table, turning on the double-ultrasonic wave for a period of time after the temperature reaches the temperature to be welded, closing the clamp, and taking down the welded base metal after the clamp is cooled to room temperature.
7. The ultrasonic generator of claim 6 is a longitudinal ultrasonic generator, the ultrasonic generator is a continuous ultrasonic vibration ultrasonic generator a, the frequency of the ultrasonic generator a is set to be 15-20KHz, the power of the ultrasonic generator a is set to be 300W-2000W, the frequency of the ultrasonic generator b is set to be 15-20KHz, the power of the ultrasonic generator b is set to be 300W-2000W, and the double ultrasonic arrangement is 0-180 degrees; the ultrasonic wave a assists the welding time for 1-30s, the ultrasonic wave b assists the welding time for 3-30s, the welding time is 120-300s, and the set temperature of the heating table is room temperature-200 ℃.
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