CN114420655B - Multi-level integrated circuit composite substrate chip - Google Patents
Multi-level integrated circuit composite substrate chip Download PDFInfo
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- CN114420655B CN114420655B CN202210059139.8A CN202210059139A CN114420655B CN 114420655 B CN114420655 B CN 114420655B CN 202210059139 A CN202210059139 A CN 202210059139A CN 114420655 B CN114420655 B CN 114420655B
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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Abstract
The invention provides a multi-level integrated circuit composite substrate chip, comprising: the circuit comprises an integrated circuit module, a heat dissipation module, a circuit dredging module and a stabilizing device; the heat gives off the module and inlays and dredge between the module in integrated circuit module and circuit, and securing device connects on the module is dredged to the circuit, and the integrated circuit module is used for arranging integrated circuit, and the module is dredged to the circuit is used for dredging and the overall arrangement to external conductor in the integrated circuit, and the heat gives off the module and is used for dredging the heat that the module produced to integrated circuit module and circuit and evacuating, and securing device is used for carrying out the outrigger. The invention provides a multi-level integrated circuit composite substrate chip which can better dissipate heat, reduce the influence on the stability of an integrated circuit, avoid the damage to the integrated circuit caused by overhigh temperature and prolong the service life of the integrated circuit.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a multi-level integrated circuit composite substrate chip.
Background
At present, in the prior art, an integrated circuit composite substrate chip is generally of a compression integrated structure, which not only has poor heat dissipation performance and can seriously affect the stability of an integrated circuit due to heat generation, but also can cause damage to the integrated circuit due to overhigh temperature, so that the invention provides a multi-level integrated circuit composite substrate chip which can better dissipate heat, reduce the influence on the stability of the integrated circuit, avoid the damage to the integrated circuit due to overhigh temperature and prolong the service life of the integrated circuit.
Disclosure of Invention
The present invention is directed to a multi-level integrated circuit composite substrate chip to solve the above-mentioned problems.
In order to achieve the purpose, the invention provides the following technical scheme: a multi-level integrated circuit composite substrate chip, comprising: the circuit comprises an integrated circuit module, a heat dissipation module, a circuit dredging module and a stabilizing device; the heat dissipation module is embedded between the integrated circuit module and the circuit dredging module, the stabilizing device is connected to the circuit dredging module, the integrated circuit module is used for arranging an integrated circuit, the circuit dredging module is used for dredging and distributing external wires in the integrated circuit, the heat dissipation module is used for evacuating heat generated by the integrated circuit module and the circuit dredging module, and the stabilizing device is used for stably supporting.
Further, the heat dissipation module includes: a heat dissipation frame and a heat absorption grid; the heat absorption grids are arranged inside the heat dissipation frame, a plurality of heat dissipation ports are arranged on the heat dissipation frame, and the heat absorption grids are penetrated through by the heat dissipation ports.
Further, the line grooming module includes: a dredging base plate, a fixing part and a separating clamp; the fixing part is used for fixing the external lead on the dredging substrate, and adopts a nearby fixing principle when the external lead is dredged, and adopts the separation clamp to the crossing position of the external lead when the external lead has to cross.
Furthermore, the heat absorption grids are equal in size and uniform in distribution, the heat absorption grids are made by compressing activated carbon, and when the external lead penetrates through the heat absorption grids, the heat absorption grids reserve a channel for the external lead, and the channel is matched with the outer diameter of the cross section of the external lead.
Further, the integrated circuit module includes: the external interface is used for establishing connection between the integrated circuit and an external electronic device and realizing information interaction between the external electronic device and the integrated circuit; the integrated circuit includes a plurality of stacked levels of integrated circuits separated by dielectric material.
Furthermore, the integrated circuit is also connected with a program control unit, and the program control unit comprises a control small unit, an identification small unit, a reading small unit and a storage small unit; the reading small unit is connected with the identification small unit and the storage small unit, the identification small unit is also connected with the control small unit, the reading small unit is directly connected with a control program, then the control program is transmitted to the identification small unit, the identification small unit identifies the control program to obtain a program identification result, then the control small unit performs control execution according to the program identification result to realize the execution of the program, the control program is stored in the storage small unit when the reading small unit is directly connected with the control program, and the control program stored in the storage small unit is called to perform identification and control execution when the reading small unit is not directly connected with the control small unit.
Furthermore, the storage cell stores a plurality of control programs, when the control programs in the storage cell are deleted, the reading cell is connected with an upper computer device, the upper computer device firstly sends a target deletion signal to the reading cell, and the reading cell calls the target control programs from the storage cell according to the target deletion signal to delete the target control programs.
Further, the external interface includes: a signal transceiving terminal, the signal transceiving terminal comprising: the first processing circuit processes an output signal through the phase shifter to obtain an output processing signal, and then the output processing signal is subjected to power amplification processing and then is output by the signal transceiving unit; the second processing line performs signal processing on the received signal when the signal transceiver unit receives the signal, and the signal processing includes: the first processing circuit and the second processing circuit are distributed in parallel when in distribution, and the first processing circuit and the second processing circuit are respectively arranged in a mode of hierarchical first connection.
Further, the stabilizing device comprises: the fixing frame fixes the circuit dredging module when the stabilizing device is used for stable supporting, and then the height of the fixing frame is adjusted according to the supporting feet; wherein the support foot comprises: the height adjustment of the supporting legs is achieved, firstly, a target height is obtained, then the length of the telescopic shaft is adjusted according to the target height, after the telescopic shaft reaches the target height, the telescopic shaft is locked in height through the locking structure, and then the adsorption chassis is adsorbed to a target position to be installed and fixed.
Furthermore, the number of the supporting legs is four, the supporting legs are connected with the fixed frame in a sliding mode, rotating parts are further arranged on the supporting legs, the supporting legs are arranged on the fixed frame in a moving mode to enable different positions of the fixed frame to be supported, and when the supporting legs are supported at different positions, the supporting legs and the telescopic shafts are used for adjusting the fixed angle of the multi-layer integrated circuit composite substrate chip.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a multi-level integrated circuit composite substrate chip according to the present invention;
FIG. 2 is a schematic diagram of a heat dissipation module in a schematic structural view of a multi-level integrated circuit composite substrate chip according to the present invention;
FIG. 3 is a schematic diagram of a line thinning module in a structural schematic diagram of a multi-level integrated circuit composite substrate chip according to the present invention;
FIG. 4 is a schematic diagram of an integrated circuit module in a structural schematic diagram of a multi-level integrated circuit composite substrate chip according to the present invention;
fig. 5 is a schematic diagram of a program control unit connected to an integrated circuit module in a structural schematic diagram of a multi-level integrated circuit composite substrate chip according to the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it should be understood that they are presented herein only to illustrate and explain the present invention and not to limit the present invention.
As shown in fig. 1, an embodiment of the present invention provides a multi-level integrated circuit composite substrate chip, including: the circuit comprises an integrated circuit module, a heat dissipation module, a circuit dredging module and a stabilizing device; the heat dissipation module is embedded between the integrated circuit module and the circuit dredging module, the stabilizing device is connected to the circuit dredging module, the integrated circuit module is used for arranging an integrated circuit, the circuit dredging module is used for dredging and distributing external wires in the integrated circuit, the heat dissipation module is used for evacuating heat generated by the integrated circuit module and the circuit dredging module, and the stabilizing device is used for stably supporting.
The above technical scheme provides a multi-level integrated circuit composite substrate chip, including: the integrated circuit module, the heat gives off the module, module and securing device are dredged to the circuit, wherein the heat gives off the module and inlays between integrated circuit module and the module is dredged to the circuit, securing device installs on the module is dredged to the circuit, to the compound base plate chip of multilevel integrated circuit, integrated circuit arranges integrated circuit in the integrated circuit module, electronic components in the integrated circuit are connecting through the wire, these wires are dredged and the overall arrangement in the module is dredged to the circuit, and the heat gives off the module and inlays between integrated circuit module and the module is dredged to the circuit, the heat that produces is dredged to integrated circuit module and circuit in the compound base plate chip use of multilevel integrated circuit in-process, reduce the temperature of integrated circuit module and circuit and the module is dredged to the circuit, and securing device is connected on the module is dredged to the circuit, support the compound base plate chip of multilevel integrated circuit when installing the compound base plate chip of integrated circuit, make the compound base plate chip of multilevel integrated circuit keep stable.
Above-mentioned technical scheme dredges the module through the circuit and makes the wire distribute better, avoid the wire alternately chaotic, and can also reduce the wire and gather and lead to the circuit to produce higher resistance, reduce the circuit heat production simultaneously, it is timely sparse to the heat that integrated circuit module and circuit dredged the module production to dredge through the heat gives off the module, avoid the integrated circuit module to be in the high temperature to cause the damage to the electronic components in the circuit, the service life of integrated circuit is prolonged, can also reduce the influence of temperature to electronic components, the stability of integrated circuit is improved, furthermore, can play the supporting role to the compound base plate chip of multilayer level integrated circuit through securing device, make the compound base plate chip of multilayer level integrated circuit stable fixed, avoid removing the use that influences the compound base plate chip of multilayer level integrated circuit.
As shown in fig. 2, in an embodiment provided by the present invention, the heat dissipation module includes: a heat dissipation frame and a heat absorption grid; the heat absorption grids are arranged inside the heat dissipation frame, a plurality of heat dissipation ports are arranged on the heat dissipation frame, and the heat absorption grids are penetrated through by the heat dissipation ports.
The heat among the above-mentioned technical scheme gives off the module and includes heat dissipation frame and heat absorption check, and the heat absorption check sets up inside heat dissipation frame moreover, and the external wire of connecting the integrated circuit module passes the heat absorption check and dredges and the overall arrangement in the module is dredged to the circuit to be equipped with a plurality of thermovents on the heat dissipation frame, and the thermovent sees through the heat absorption check and runs through each other.
Above-mentioned technical scheme plays protection and fixed action to the heat absorption check through heat dissipation frame, avoids the heat to give off the module and takes place deformation, can dispel the heat through being equipped with a plurality of thermovents on the heat dissipation frame through a plurality of exports, can have better connectivity through the thermovent sees through the heat absorption check and runs through each other to can in time drop the temperature, effectively improve the radiating efficiency.
As shown in fig. 3, in an embodiment provided by the present invention, the line grooming module includes: a dredging base plate, a fixing part and a separating clamp; the fixing part is used for fixing the external lead on the dredging substrate, and adopts a nearby fixing principle when the external lead is dredged, and adopts the separation clamp to the crossing position of the external lead when the external lead has to cross.
Above-mentioned technical scheme is equipped with in the module is dredged to the circuit and dredges the base plate, fixed part and separation clamp, dredge and the overall arrangement to external conductor on dredging the base plate, fix external conductor at dredging basic through fixed part, and external conductor takes near fixed principle when fixing, it is basic to dredge through fixed part is fixed to dredging in the position nearby, and external conductor's length will be suitable, avoid unnecessary external conductor to pile up the gathering, and when external conductor has to produce alternately, adopt the separation clamp to keep apart in external conductor crossing position.
Above-mentioned technical scheme makes external conductor can the overall arrangement better through dredging the base plate, and make external conductor avoid making a round trip to rock after reasonable overall arrangement through fixed part, through taking fixed principle nearby to external conductor fixing can reduce external conductor's length, reduce the unnecessary gathering of piling up of external conductor, and then reduce wire resistance, avoid the circuit to produce unnecessary heat and cause the intensification, keep apart through adopting the partition clamp in external conductor cross position simultaneously and avoid the wire alternately to produce the connection.
In one embodiment provided by the invention, the heat absorption grids are equal in size and uniform in distribution, the heat absorption grids are made by compressing activated carbon, and when the external lead passes through the heat absorption grids, the heat absorption grids leave channels for the external lead, and the channels are matched with the outer diameter of the cross section of the external lead.
The heat absorption grids in the technical scheme are the same in size and are uniformly distributed in the heat dissipation frame, the heat absorption grids are made by compressing activated carbon, when the external lead passes through the heat absorption grids, channels are reserved at corresponding positions of the heat absorption grids, and the size of each channel is matched with the thickness of the external lead.
Above-mentioned technical scheme is equal through the size of heat absorption check, it has better permeability to distribute evenly to enable the heat to give off the module, and then improve the radiating efficiency, and adopt the active carbon compression to make the heat absorption check have higher heat absorptivity, can in time shift and spread the heat that the module produced is dredged to the heat giving off module and circuit, effectively reduce the temperature, avoid the heat to give off the module and the circuit is dredged the module high temperature and is caused the damage to integrated circuit, the life-span of integrated circuit is prolonged, in addition can avoid external conductor to detour through the size of passageway and external conductor's thickness degree adaptation and cause the wasting of resources, and can also play the set effect to the wire, avoid the wire to rock.
As shown in fig. 4, in one embodiment of the present invention, the integrated circuit module includes: the external interface is used for establishing connection between the integrated circuit and an external electronic device and realizing information interaction between the external electronic device and the integrated circuit; the integrated circuit includes a plurality of stacked levels of integrated circuits separated by dielectric material.
The integrated circuit module in the technical scheme comprises an integrated circuit and an external interface, wherein the external interface is connected with the integrated circuit and is used for connecting an external electronic device, when the external interface is connected with the external electronic device, information transmission and interaction between the integrated circuit and the external electronic device are realized, a plurality of integrated circuit layers are arranged in the integrated circuit, and the integrated circuit layers are separated through dielectric materials.
Above-mentioned technical scheme realizes being connected of integrated circuit and outside electron device through external interface for integrated circuit uses and plays a role, and integrated circuit can effectively reduce integrated circuit's volume through a plurality of integrated circuit layers moreover, still has light in weight, lead-out wire and welding point are few, longe-lived, the reliability is high, the advantage of good performance simultaneously.
As shown in fig. 5, in an embodiment provided by the present invention, the integrated circuit is further connected to a program control unit, where the program control unit includes a control small unit, an identification small unit, a reading small unit, and a storage small unit; the reading small unit is connected with the identification small unit and the storage small unit, the identification small unit is further connected with the control small unit, the reading small unit is directly connected with a control program and then transmits the control program to the identification small unit, the identification small unit identifies the control program to obtain a program identification result, then the control small unit performs control execution according to the program identification result to realize the execution of the program, the control program is stored in the storage small unit when the reading small unit is directly connected with the control program, and the control program stored in the storage small unit is called to perform identification and control execution when the reading small unit is not directly connected with the control small unit.
The integrated circuit in the above technical solution is further connected to a program control unit, and the program control unit is used to implement a program control circuit for the integrated circuit, and the program control unit includes: the control small unit is connected with the integrated circuit in a hierarchical mode, the other end of the control small unit is connected with the identification small unit, the identification small unit is further connected to the reading small unit, the reading small unit is further connected with the storage small unit, when the program control unit is used for programming the control circuit for the integrated circuit, the reading small unit is directly connected with a control program and then transmits the connected control program to the identification small unit, the identification small unit identifies the control program to obtain a program identification result, then the control small unit controls and executes according to the program identification result to realize the execution of the program, when the control program is connected to the reading small unit, the control program can be stored in the storage small unit, when the reading small unit is not directly connected with the control program, the control program in the storage unit can be read, and then the identification small unit is identified.
According to the technical scheme, the multi-level integrated circuit composite substrate chip has a programming control function through the program control unit, so that the selection control of the integrated circuit can be realized through the control program, the functions of the multi-level integrated circuit composite substrate chip are enriched, the control program can be stored through the small storage unit, the control can be realized by calling the control program stored in the small storage unit when the small reading unit is not directly connected with the control program, and convenience is provided for program control.
In an embodiment provided by the present invention, the storage cell stores a plurality of control programs, and when the control programs in the storage cell are deleted, the reading cell is connected to an upper computer device, the upper computer device first sends a target deletion signal to the reading cell, and the reading cell retrieves the target control programs from the storage cell according to the target deletion signal for deletion.
The storage cell in the above technical solution can store a plurality of control programs, the control programs are different from each other, when the control programs stored in the storage cell are deleted, the upper computer device is connected to the reading cell, and then the upper computer device sends a target deletion signal to the reading cell, so that the reading cell calls the target control programs in the storage cell according to the target deletion signal, and the upper computer device deletes the target control programs.
According to the technical scheme, the control program in the small storage unit is deleted by connecting the small storage unit with the upper computer device, so that the problem that too many control programs stored in the small storage unit influence the efficiency and accuracy of calling the control program in the small storage unit by the small storage unit is avoided, the problem that too much control programs cannot be stored in a new control program by the small storage unit can be avoided, and the available space of the small storage unit is increased.
In one embodiment, the external interface includes: a signal transceiving terminal, said signal transceiving terminal comprising: the first processing circuit processes an output signal through a phase shifter to obtain an output processing signal, and then the output processing signal is subjected to power amplification processing and then is output by the signal transceiving unit; when the signal transceiving unit receives a signal, the second processing line performs signal processing on the received signal, where the signal processing includes: the first processing circuit and the second processing circuit are distributed in parallel when in distribution, and the first processing circuit and the second processing circuit are respectively arranged in a mode of hierarchical first connection.
The external interface in the above technical scheme includes: a signal transceiving terminal, the signal transceiving terminal comprising: the first processing circuit processes the output signal through the phase shifter to obtain an output processing signal, and then the output processing signal is subjected to power amplification processing and then is output by the signal transceiving unit; when the signal transceiving unit receives the signal, the second processing line performs signal processing on the received signal, and the signal processing includes: the first processing line and the second processing line are distributed in parallel when being distributed, and the first processing line and the second processing line are respectively distributed in a mode of hierarchical first-order connection.
According to the technical scheme, the received signals are accurately processed in the integrated circuit through the external interface, errors after the signals processed by the integrated cable are output are small, the output signals are processed through the first processing line, the influence of loss of the output signals on the signals is reduced, the accuracy of the output signals is improved, the received signals are processed through the second processing line, the received signals can be compensated, the errors of the received signals are reduced, the received signals can be adjusted, the situation that electronic components in the integrated circuit are damaged due to fluctuation of the received signals is avoided, the stability of the integrated circuit is improved, in addition, the first processing line and the second processing line adopt parallel distribution when being distributed, and the first processing line and the second processing line respectively adopt layered first connection to effectively reduce the size of occupied space, the size of a multi-level integrated circuit composite substrate chip is reduced, and the structure can be more compact.
In one embodiment, the present invention provides that the stabilizing device comprises: the fixing frame fixes the circuit dredging module when the stabilizing device is used for stably supporting, and then the height of the fixing frame is adjusted according to the supporting feet; wherein the support foot comprises: the height adjustment of the supporting legs is achieved, firstly, a target height is obtained, then the length of the telescopic shaft is adjusted according to the target height, after the telescopic shaft reaches the target height, the telescopic shaft is locked in height through the locking structure, and then the adsorption chassis is adsorbed to a target position to be installed and fixed.
The fixing device in the above technical scheme includes: the fixing frame fixes the circuit dredging module when the stabilizing device stably supports, and the fixing frame can be adjusted according to the size of the circuit dredging module and then adjusts the height of the supporting foot; among the support legs are: adsorb chassis, telescopic shaft and locking structure, when carrying out altitude mixture control to the supporting legs, will acquire the target height earlier, then go the length of adjustment telescopic shaft according to the target height again, when the length of adjustment telescopic shaft, carry out the high locking to the telescopic shaft after the telescopic shaft reaches the target height through locking structure for the height and the target height of telescopic shaft are unanimous, then will adsorb the chassis and adsorb the target location and install fixedly again.
Wherein, the adsorptivity of adsorbing the chassis can be adjusted, when adjusting to the adsorptivity of adsorbing the chassis, at first estimate through following formula:
in the formula, M represents the integral mass of the integrated circuit module, the heat dissipation module and the line dredging module, M represents the mass of the stabilizing device, g represents the gravity acceleration, r represents the radius of the adsorption chassis, n represents the number of the adsorption chassis, w represents the safety coefficient, theta represents the included angle between the telescopic shaft and the vertical direction, alpha represents a coefficient parameter, the value range here is 0.63-0.95, R represents the estimated data, and pi represents the circumferential rate;
then judging through the following formula;
g is an estimated data judgment value, C represents atmospheric pressure, and p represents pressure in the adsorption chassis;
and under the condition that the estimated data judgment value G is smaller than a preset value, performing vacuum treatment on the adsorption chassis through a vacuum generator to reduce air in the adsorption chassis, wherein the preset value is usually 0.05.
Above-mentioned technical scheme can carry out size adjustment according to the adaptation circumstances through fixed frame thereby make fixed frame can dredge the big or small adaptation of module with the circuit better, thereby can dredge the circuit better and live the module, and can fix multilayer level integrated circuit composite substrate chip firmly when installing multilayer level integrated circuit composite substrate chip through adsorbing the chassis in the supporting legs, avoid making a round trip to rock the normal use that influences multilayer level integrated circuit composite substrate chip, and can fix to the length that stretches out and draws back through the locking structure, it makes multilayer level integrated circuit composite substrate chip take place to remove to avoid the telescopic shaft to stretch out and draw back at will, the stability of multilayer level integrated circuit composite substrate chip has been improved. Thereby carry out the adsorbability adjustment to the absorption chassis through vacuum generator in addition and make the adsorbed more firm of many grades of integrated circuit composite substrate chip, when adjusting the adsorbability of absorption chassis, reconcile the data of estimating through the parameter coefficient, thereby reduce the difference of estimating the condition and actual conditions, and through all taking into account the integrated circuit module, the heat gives off the whole quality of module and circuit persuasion module and the quality of securing device, avoid neglecting the influence of fixing device itself, the accuracy of estimating the data has been improved.
In an embodiment of the invention, the number of the supporting legs is four, the supporting legs are slidably connected with the fixed frame, the supporting legs are further provided with a rotating part, the supporting legs are moved on the fixed frame to support different positions of the fixed frame, and when the supporting legs are supported at different positions, the rotating part and the telescopic shaft are used for adjusting the fixed angle of the multi-layer integrated circuit composite substrate chip.
The figure of the supporting legs among the above-mentioned technical scheme is four, and supporting legs and fixed frame sliding connection, and still be equipped with rotary part on the supporting legs, make to support the different positions of fixed frame through removing the supporting legs on fixed frame, and when different positions supported, slide on fixed frame through the supporting legs and make many grades of integrated circuit composite substrate chip reach stable equilibrium state, then carry out angle adjustment to many grades of integrated circuit composite substrate chip through rotary part, make many grades of integrated circuit composite substrate chip present suitable inclination.
According to the technical scheme, the four supporting points can be found through the number of the supporting legs, different supporting heights can be set for the four supporting points according to actual conditions, the multi-level integrated circuit composite substrate chip is kept stable, different angles can be presented according to the installation position of the multi-level integrated circuit composite substrate chip through the rotating component, the supporting legs and the fixed frame in a sliding connection mode, and therefore the multi-level integrated circuit composite substrate chip is more suitable and stable to install.
It will be appreciated by those skilled in the art that the first and second aspects of the invention are merely referred to in different stages of application.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (6)
1. A multi-level integrated circuit composite substrate chip, comprising: the device comprises an integrated circuit module, a heat dissipation module, a circuit dredging module and a stabilizing device; the heat dissipation module is embedded between the integrated circuit module and the line dredging module, the stabilizing device is connected to the line dredging module, the integrated circuit module is used for arranging an integrated circuit, the line dredging module is used for dredging and distributing external wires in the integrated circuit, the heat dissipation module is used for evacuating heat generated by the integrated circuit module and the circuit dredging module, and the stabilizing device is used for stably supporting;
wherein the integrated circuit module comprises: the external interface is used for establishing connection between the integrated circuit and an external electronic device and realizing information interaction between the external electronic device and the integrated circuit; the integrated circuit comprises a plurality of stacked integrated circuit levels, and the integrated circuit levels are separated by dielectric materials;
the integrated circuit is also connected with a program control unit, and the program control unit comprises a control small unit, an identification small unit, a reading small unit and a storage small unit; the reading small unit is connected with the identification small unit and the storage small unit, the identification small unit is also connected with the control small unit, the reading small unit is directly connected with a control program, then the control program is transmitted to the identification small unit, the identification small unit identifies the control program to obtain a program identification result, then the control small unit performs control execution according to the program identification result to realize the execution of the program, and when the reading small unit is directly connected with the control program, the control program is also stored in the storage small unit;
the small storage unit stores a plurality of control programs, when the control programs in the small storage unit are deleted, the small reading unit is connected with an upper computer device, the upper computer device firstly sends a target deletion signal to the small reading unit, and the small reading unit calls the target control programs from the small storage unit according to the target deletion signal to delete the target control programs;
the stabilizing device comprises: the fixing frame fixes the circuit dredging module when the stabilizing device is used for stably supporting, and then the height of the fixing frame is adjusted according to the supporting feet; wherein the support foot comprises: the support foot height adjustment, at first acquire target height, then according to target height adjustment the length of telescopic shaft after the telescopic shaft reaches target height through the locking structure to the telescopic shaft carries out the high locking, then will adsorb the chassis and adsorb the target location and install fixedly, wherein, the adsorptivity of adsorbing the chassis can be adjusted, when adjusting to the adsorptivity of adsorbing the chassis, at first predict through following formula:
in the formula, M represents the integral mass of the integrated circuit module, the heat dissipation module and the line dredging module, M represents the mass of the stabilizing device, g represents the gravity acceleration, r represents the radius of the adsorption chassis, n represents the number of the adsorption chassis, w represents the safety coefficient, theta represents the included angle between the telescopic shaft and the vertical direction, alpha represents a coefficient parameter, the value range here is 0.63-0.95, R represents the estimated data, and pi represents the circumferential rate;
then judging through the following formula;
g is an estimated data judgment value, C represents atmospheric pressure, and p represents pressure in the adsorption chassis;
and under the condition that the estimated data judgment value G is smaller than the preset value, carrying out vacuum treatment on the adsorption chassis through a vacuum generator, and reducing air in the adsorption chassis.
2. The multi-level integrated circuit composite substrate chip of claim 1, wherein the heat dissipation module comprises: a heat dissipation frame and a heat absorption grid; the heat absorption grids are arranged inside the heat dissipation frame, a plurality of radiating ports are formed in the heat dissipation frame, and the radiating ports penetrate through the heat absorption grids.
3. The multi-level integrated circuit composite substrate chip of claim 1, wherein the line grooming module comprises: the dredging base plate, the fixing part and the separating clip; the fixing part is used for fixing the external lead on the dredging substrate, and adopts a nearby fixing principle when the external lead is dredged, and adopts the separation clamp to the crossing position of the external lead when the external lead has to cross.
4. The multi-level integrated circuit composite substrate chip as claimed in claim 2, wherein the heat-absorbing cells are of equal size and uniform distribution, and are made by compressing activated carbon, and when the external wires pass through the heat-absorbing cells, the heat-absorbing cells leave channels for the external wires, and the channels are adapted to the outer diameter of the cross section of the external wires.
5. The multi-level integrated circuit composite substrate chip of claim 1, wherein the external interface comprises: a signal transceiving terminal, said signal transceiving terminal comprising: the first processing circuit processes an output signal through a phase shifter to obtain an output processing signal, and then the output processing signal is subjected to power amplification processing and then is output by the signal transceiving unit; the second processing line performs signal processing on the received signal when the signal transceiver unit receives the signal, and the signal processing includes: the first processing circuit and the second processing circuit are distributed in parallel when in distribution, and the first processing circuit and the second processing circuit are respectively arranged in a mode of hierarchical first connection.
6. The multilevel integrated circuit composite substrate chip according to claim 1, wherein the number of the supporting legs is four, the supporting legs are slidably connected to the fixed frame, and a rotating member is further provided on the supporting legs, the supporting legs are moved on the fixed frame to support different positions of the fixed frame, and when the supporting legs are supported at different positions, the multilevel integrated circuit composite substrate chip is fixedly angularly adjusted by the rotating member and the telescopic shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JPH08278893A (en) * | 1995-04-04 | 1996-10-22 | Canon Inc | Information equipment and controlling method therefor |
| CN203377233U (en) * | 2013-08-06 | 2014-01-01 | 上海能辉电力科技有限公司 | Low-latitude adjustable inclination-angle photovoltaic fixing support |
| CN110187197A (en) * | 2019-04-11 | 2019-08-30 | 东南大学 | A kind of additional phase noise automatic measurement mechanism |
| CN211320085U (en) * | 2020-03-16 | 2020-08-21 | 深圳市芯汇群微电子技术有限公司 | Anti-interference integrated circuit device |
| CN214043630U (en) * | 2021-02-01 | 2021-08-24 | 江苏国睿微电子有限公司 | Multi-level integrated circuit composite substrate chip |
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| CN104052515A (en) * | 2014-05-13 | 2014-09-17 | 成都雷电微力科技有限公司 | High-integrity TR radio frequency module |
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| JPH08278893A (en) * | 1995-04-04 | 1996-10-22 | Canon Inc | Information equipment and controlling method therefor |
| CN203377233U (en) * | 2013-08-06 | 2014-01-01 | 上海能辉电力科技有限公司 | Low-latitude adjustable inclination-angle photovoltaic fixing support |
| CN110187197A (en) * | 2019-04-11 | 2019-08-30 | 东南大学 | A kind of additional phase noise automatic measurement mechanism |
| CN211320085U (en) * | 2020-03-16 | 2020-08-21 | 深圳市芯汇群微电子技术有限公司 | Anti-interference integrated circuit device |
| CN214043630U (en) * | 2021-02-01 | 2021-08-24 | 江苏国睿微电子有限公司 | Multi-level integrated circuit composite substrate chip |
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