CN114417781A - PCB wiring crosstalk evaluation method, system, device, equipment and storage medium - Google Patents
PCB wiring crosstalk evaluation method, system, device, equipment and storage medium Download PDFInfo
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Abstract
The application relates to the field of printed circuit board design, and discloses a PCB wiring crosstalk evaluation method, a system, a device, equipment and a storage medium. The modeling simulation workload of an engineer is reduced, the influence of the PCB glass fiber effect and the PCB lamination on the crosstalk value between the wires is comprehensively considered, the quick and accurate assessment on the crosstalk between the PCB wires is realized, the risk that the engineer selects a wiring scheme causing the unconventional crosstalk value in the PCB design process can be greatly reduced, and the wiring area planning can be quickly calculated, so that the product development quality is improved.
Description
Technical Field
The present application relates to the field of printed circuit board design, and in particular, to a method, a system, an apparatus, a device, and a storage medium for evaluating PCB trace crosstalk.
Background
Crosstalk is noise on a line caused by coupling between two signal lines, mutual inductance and mutual capacitance between the signal lines, and a signal is transmitted to a static line (also called victim line) without a signal by a dynamic line (active line) or an aggressor line (aggressor line), which causes a coupling interference problem. In the design of a Printed Circuit Board (PCB) and an integrated Circuit (ic), crosstalk is a troublesome problem, and parameters of a PCB Board layer, a signal line pitch, electrical characteristics of a driving terminal and a receiving terminal, and a line termination method all have certain influence on the crosstalk. In response to the trend of light, thin, small and small electronic products with the pursuit of higher signal transmission quality, the circuit board size is smaller and the wiring density of each layer is greater, especially when the signal transmission speed is continuously increased, the crosstalk problem is more serious, and how to reduce the noise interference becomes an important subject to be faced by the PCB design team.
Generally, a signal integrity engineer defines the routing parameters such as the routing distance according to the design guidelines provided by the chip factory. However, when the design requirements exceed the design guidelines, the signal integrity engineer must perform modeling and simulation to determine whether the crosstalk caused by the trace design affects the high-speed signal within an allowable range. Therefore, in the design process, engineers need to spend a lot of time on modeling simulation, which not only results in large workload of engineers and long product development period, but also has high requirements on the modeling simulation capability of engineers. If the engineer considers the factors incompletely in the simulation process and the simulation model is inaccurate, the simulation result is further inaccurate, wrong guidance is given to the PCB design, and the product development quality is finally influenced.
How to accurately evaluate the crosstalk result caused by the PCB trace design is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a PCB wiring crosstalk evaluation method, a system, a device, equipment and a storage medium, which are used for accurately evaluating a crosstalk result brought by PCB wiring design, reducing the working pressure of PCB engineers, shortening the development cycle of electronic products and improving the quality of the electronic products.
In order to solve the above technical problem, the present application provides a method for evaluating PCB trace crosstalk, including:
receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;
generating a target PCB laminated simulation module based on the laminated information of the target PCB, and generating a target PCB fiberglass cloth simulation module based on the target PCB fiberglass cloth parameters;
combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation model;
carrying out crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;
and outputting the crosstalk simulation result.
Optionally, the method further includes:
establishing a sub-laminated database in advance according to the PCB material electrical characteristic parameters of different PCB plates;
receiving input lamination information of the target PCB lamination, specifically:
receiving input lamination requirements for lamination of the target PCB plate;
the generating of the target PCB lamination simulation module based on the lamination information of the target PCB lamination specifically includes:
selecting a target sub-lamination from the sub-lamination database according to the lamination requirement;
and generating the target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.
Optionally, the generating the target PCB laminated simulation module of the target PCB laminated layer meeting the lamination requirement based on the lamination information of each target sub-laminated layer specifically includes:
when the target sub-lamination only comprises an inner layer PCB structure and an outer layer PCB structure, generating a single-layer target PCB lamination based on lamination information of the inner layer PCB structure and lamination information of the outer layer PCB structure;
when the target sub-laminate includes a multi-layer sub-laminate structure, generating a multi-layer target PCB board laminate based on each of the sub-laminate structures.
Optionally, the target PCB fiberglass cloth parameter is specifically a type of the fiberglass cloth.
Optionally, the target routing parameter specifically includes: the device comprises a signal line broken line angle, a total signal line length, a signal line segment number, a signal line impedance value, a signal frequency point and a signal line interval.
Optionally, before the combining the target PCB board lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameter and building a PCB signal line crosstalk simulation calculation model, the method further includes:
judging whether the routing design corresponding to the target routing parameters is influenced by the PCB glass fiber effect;
if so, the step of building a PCB signal wire crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters is carried out;
and if not, outputting the information that the wiring design is not compliant.
Optionally, the method further includes:
comparing the crosstalk simulation result with an industrial standard crosstalk value corresponding to a signal frequency point in the target wiring parameter to obtain a crosstalk evaluation result;
and outputting the crosstalk evaluation result.
In order to solve the above technical problem, the present application further provides a PCB trace crosstalk evaluation system, including:
the PCB lamination module is used for generating a target PCB lamination simulation module based on the input lamination information of the target PCB lamination;
the PCB glass fiber cloth module is used for generating a target PCB glass fiber cloth simulation module based on the input target PCB glass fiber cloth parameters;
and the crosstalk simulation calculation module is used for combining the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the input target wiring parameters, building a PCB signal wire crosstalk simulation calculation model, performing crosstalk simulation on the PCB signal wire crosstalk simulation calculation model, and obtaining and outputting a crosstalk simulation result.
In order to solve the above technical problem, the present application further provides a PCB routing crosstalk evaluation apparatus, including:
the receiving unit is used for receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;
the first modeling unit is used for generating a target PCB lamination simulation module based on lamination information of the target PCB lamination;
the second modeling unit is used for generating a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;
the third modeling unit is used for building a PCB signal line crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;
the crosstalk simulation unit is used for performing crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;
and the first output unit is used for outputting the crosstalk simulation result.
In order to solve the above technical problem, the present application further provides a PCB routing crosstalk evaluation device, including:
a memory for storing a computer program;
a processor, configured to execute the computer program, wherein the computer program, when executed by the processor, implements the steps of the PCB trace crosstalk evaluation method according to any one of the above-mentioned embodiments.
In order to solve the above technical problem, the present application further provides a storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the PCB trace crosstalk evaluation method are implemented as in any one of the above.
According to the PCB wiring crosstalk evaluation method, the lamination information of the target PCB lamination, the target PCB glass fiber cloth parameter and the target wiring parameter input by a user are received, the target PCB lamination simulation module is generated based on the lamination information of the target PCB lamination, the target PCB glass fiber cloth simulation module is generated based on the target PCB glass fiber cloth parameter, and therefore the target PCB lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter are combined, the PCB signal line crosstalk simulation calculation model is automatically set up, further the PCB signal line crosstalk simulation calculation model is subjected to crosstalk simulation, and a crosstalk simulation result is obtained and output. The modeling simulation workload of an engineer is reduced, the influence of the PCB glass fiber effect and the PCB lamination on the crosstalk value between the wires is comprehensively considered, the quick and accurate assessment on the crosstalk between the PCB wires is realized, the risk that the engineer selects a wiring scheme causing the unconventional crosstalk value in the PCB design process can be greatly reduced, and the wiring area planning can be quickly calculated, so that the product development quality is improved.
The application also provides a PCB wiring crosstalk evaluation system, device, equipment and storage medium, which have the beneficial effects and are not repeated herein.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for evaluating PCB trace crosstalk according to an embodiment of the present disclosure;
fig. 2(a) is a schematic diagram of an inner layer structure of a crosstalk simulation calculation model of a PCB signal line according to an embodiment of the present application;
fig. 2(b) is a schematic diagram of an outer layer structure of a crosstalk simulation calculation model of a PCB signal line according to an embodiment of the present application;
fig. 3 is a schematic plan view of a crosstalk simulation calculation model of a PCB signal line according to an embodiment of the present application;
fig. 4(a) is a schematic diagram of a crosstalk simulation result of a first example PCB signal line provided in the embodiment of the present application;
fig. 4(b) is a schematic diagram of a crosstalk simulation result of a second example PCB signal line provided in the embodiment of the present application;
fig. 4(c) is a schematic diagram of a crosstalk simulation result of a third example PCB signal line provided in the embodiment of the present application;
fig. 4(d) is a schematic diagram of a crosstalk simulation result of a fourth example PCB signal line provided in the embodiment of the present application;
fig. 5 is a schematic diagram illustrating cross talk evaluation of a differential trace according to an embodiment of the present application;
fig. 6 is a schematic view of a trace design according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a PCB trace crosstalk evaluation system according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a PCB trace crosstalk evaluation apparatus according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a PCB trace crosstalk evaluation device according to an embodiment of the present application.
Detailed Description
The core of the application is to provide a method, a system, a device, equipment and a storage medium for evaluating the crosstalk of the PCB wiring, which are used for reducing the working pressure of PCB engineers, shortening the development cycle of electronic products and improving the quality of the electronic products while accurately evaluating the crosstalk result brought by the PCB wiring design.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example one
Fig. 1 is a flowchart of a method for evaluating PCB trace crosstalk according to an embodiment of the present disclosure.
As shown in fig. 1, a method for evaluating PCB trace crosstalk provided in the embodiment of the present application includes:
s101: and receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters.
S102: and generating a target PCB laminated simulation module based on the laminated information of the target PCB, and generating a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters.
S103: and (4) building a PCB signal line crosstalk simulation calculation model by combining the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters.
S104: and carrying out crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result.
S105: and outputting a crosstalk simulation result.
Most of the present PCB substrates are composed of four main components, i.e., Copper Foil (Copper Foil), Reinforcement (Reinforcement), resin (Epoxy), and Fillers (Fillers). The copper foil layer is used for conducting electricity, transmitting signals and dissipating heat. The reinforcing material is used for making the PCB rigid and not easy to deform and preventing the internal circuit contact from being separated due to thermal expansion and cold contraction, and the main material comprises kraft paper, glass fiber paper and glass fiber cloth. The resin is related to basic physical properties such as high and low water absorption rate and heat resistance, and the main materials include epoxy resin, phenolic resin, polyester resin, polyphenylene oxide, hydrocarbon, polytetrafluoroethylene and the like. The filling material is used for enhancing the high temperature resistance when the PCB is welded.
Among the electrical characteristics of PCB materials, the propagation speed of signals and the attenuation of signals in high-speed circuits are two important parameters. The propagation delay of the signal depends on the dielectric constant
The size of (dielectric constant; Dk) and the transmission line structure. Since the propagation time is proportional to the k-root of the dielectric constant, if a substrate material with a low dielectric constant is used, the propagation delay of signals can be reduced, and the coupling capacitance between the wires can be reduced, thereby reducing the crosstalk between the signals. The signal attenuation includes conductor loss and dielectric loss, wherein the conductorLosses include dc resistance loss, ac resistance loss due to skin effects, and loss due to conductor Roughness (roughnesss); dielectric Loss, which is the Loss of a signal in a material, is usually described by Loss finger or df (dispersion factor), and the use of a dielectric material with low Loss can reduce the signal attenuation and improve the signal integrity.
Because the selection of PCB materials and the wiring mode of signal wires are main factors influencing the crosstalk value among the signal wires, the application provides an evaluation system which can automatically execute the establishment of a PCB signal wire crosstalk simulation calculation model and carry out crosstalk simulation, a user is required to provide lamination (also called lamination) information, target PCB glass fiber cloth parameters and target wiring parameters of a target PCB plate lamination which are necessary for the establishment of the PCB signal wire crosstalk simulation calculation model and input the lamination information, the target PCB glass fiber cloth parameters and the target wiring parameters into the evaluation system, the evaluation system automatically executes the modeling and crosstalk simulation calculation work, and a crosstalk simulation result is output to be referred to the user. By applying the PCB wiring crosstalk evaluation method provided by the embodiment of the application, when the design requirement of a user exceeds the design guide of a chip factory, the rationality of the current PCB design can be rapidly determined by the user, the user can conveniently carry out parameter debugging, and therefore an ideal PCB design scheme can be rapidly obtained.
In specific implementation, for step S101, the stacking information of the target PCB plate stacking layer, the target PCB glass fiber cloth parameter, and the type of each parameter in the target wiring parameter are set in advance according to the parameters required for constructing the PCB signal line crosstalk simulation calculation model, and an input interface for inputting each parameter is provided for a user, and an input frame or an option for inputting the stacking information of the target PCB plate stacking layer, the target PCB glass fiber cloth parameter, and the target wiring parameter is provided on the input interface.
For step S102 and step S103, to build the PCB signal line crosstalk simulation calculation model, a target PCB board lamination simulation module and a target PCB fiberglass cloth simulation module need to be built first. The steps of generating the target PCB laminated simulation module based on the laminated information of the target PCB and generating the target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters can be carried out simultaneously or sequentially, and then the work of building a PCB signal line crosstalk simulation calculation model by combining the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters is carried out.
In order to build a PCB signal wire crosstalk simulation calculation model according to various parameters, a modeling script can be written in advance through a Python program, various parameters selected by a user are built into an HFSS simulation project through the Python program output by running the modeling script, Python program control HFSS simulation software is called to automatically execute simulation, and the PCB signal wire crosstalk simulation calculation model is output.
For step S104 and step S105, ADS simulation software may be executed specifically, after all simulation data are collected by AEL program control, the collected simulation data are returned to the above described evaluation system, and the crosstalk simulation result is obtained by integration and output to a user for viewing, so that the user determines whether the crosstalk simulation result meets the industrial specification, if yes, the PCB routing may be set according to each parameter of the PCB signal line crosstalk simulation calculation model, and if not, simulation evaluation is performed again.
In practical applications, other programming languages or simulation software may also be used, and the embodiments of the present application are not limited herein.
The PCB wiring crosstalk evaluation method provided by the embodiment of the application receives lamination information, target PCB glass fiber cloth parameters and target wiring parameters of a target PCB lamination input by a user, generates a target PCB lamination simulation module based on the lamination information of the target PCB lamination, and generates a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters, so that a PCB signal line crosstalk simulation calculation model is automatically set up by combining the target PCB lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters, and then crosstalk simulation is carried out on the PCB signal line crosstalk simulation calculation model to obtain and output a crosstalk simulation result. The modeling simulation workload of an engineer is reduced, the influence of the PCB glass fiber effect and the PCB lamination on the crosstalk value between the wires is comprehensively considered, the quick and accurate assessment on the crosstalk between the PCB wires is realized, the risk that the engineer selects a wiring scheme causing the unconventional crosstalk value in the PCB design process can be greatly reduced, and the wiring area planning can be quickly calculated, so that the product development quality is improved.
Example two
Fig. 2(a) is a schematic diagram of an inner layer structure of a crosstalk simulation calculation model of a PCB signal line according to an embodiment of the present application; fig. 2(b) is a schematic diagram of an outer layer structure of a PCB signal line crosstalk simulation calculation model according to an embodiment of the present application.
On the basis of the above embodiments, in order to be suitable for practical application, the embodiments of the present application further describe steps S101 to S103.
In step S101, a user provides lamination information of a target PCB lamination, specifically, the user may input the designed lamination information of the target PCB lamination, or a lamination database may be pre-established for the user to select the target PCB lamination, or a sub-lamination database may be pre-established for the user to automatically screen the sub-lamination after inputting lamination requirements and generate the target PCB lamination meeting the lamination requirements.
The method for evaluating PCB trace crosstalk provided in the embodiment of the present application may further include:
establishing a sub-laminated database in advance according to the PCB material electrical characteristic parameters of different PCB plates;
receiving the input lamination information of the target PCB plate lamination in step S101, specifically:
receiving input lamination requirements for target PCB lamination;
in step S102, a target PCB lamination simulation module is generated based on lamination information of the target PCB lamination, and the method specifically includes:
selecting a target sub-lamination from the sub-lamination database according to lamination requirements;
and generating a target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.
Different PCB boards have different electrical characteristic parameters of the PCB material. The PCB laminate structure generally includes a copper foil layer (copper), a prepreg layer (PP, Preprg), and a core layer (core). The electrical characteristic parameters of the PCB material may specifically include a prepreg layer PP type, a Core layer Core type, a dielectric constant Dk, a dielectric loss Df, and the like, and these data determine the impedance, line width, and line distance of the PCB trace. The method comprises the steps of providing lamination information of a target PCB lamination for a user, calculating electrical characteristic parameters corresponding to different PCB materials through corresponding sub-lamination relational expressions in advance to obtain lamination information of different sub-laminations, establishing sub-lamination databases of different sub-laminations according to the lamination information of different sub-laminations, and accordingly, when the user provides lamination requirements, automatically selecting the target sub-laminations from the sub-lamination databases by an evaluation system, and generating a target PCB lamination simulation module meeting the lamination requirements according to the lamination information of the target sub-laminations. The lamination requirements can comprise required thickness, required line width, required line distance and the like, and the evaluation system automatically screens the sub-lamination database to obtain target PCB laminates meeting the requirements of each target sub-lamination generation to meet each lamination requirement.
The form of the sub-hierarchy database can be referred to table 1.
TABLE 1 sub-stack database data sheet
Wherein "oz" is the copper thickness weight unit of the substrate. The "RTF" is a double-sided roughened copper foil.
It should be noted that table 1 is only an alternative form of the sub-layer database, and other forms can be used for representation, and more types of plates and types of selected signal lines can be included.
Optionally, the user may select a target sub-stack from the master-slave sub-stack database, and the stack information of the target PCB board stack may specifically include a stack board (Stackup Material) (for example, using S7040G) and a stack Type (Stackup Type) (for example, using microstrip lines).
Further, generating a target PCB lamination simulation module of a target PCB lamination satisfying lamination requirements based on lamination information of each target sub-lamination may specifically include:
when the target sub-lamination only comprises an inner layer PCB structure and an outer layer PCB structure, generating a single-layer target PCB lamination based on lamination information of the inner layer PCB structure and lamination information of the outer layer PCB structure;
when the target sub-laminate includes a multi-layer sub-laminate structure, a multi-layer target PCB board laminate is generated based on each sub-laminate structure.
Because the high-speed signal line usually adopts a differential line, the differential line is usually wired on a single layer of the PCB, and in a few cases, the differential line is wired in a cross-layer mode through a via hole. The input interface of the lamination information of the target PCB sheet lamination provided by the embodiment of the present application may include a common interface for selecting an inner PCB structure and an outer PCB structure of a desired single-layer PCB, and an extended interface of a multi-layer PCB lamination structure for selecting a plurality of target sub-laminations to generate signal line routing.
In order to facilitate the user to input the target PCB fiberglass cloth parameters, the embodiment of the application may further include pre-establishing a PCB fiberglass cloth database, and listing the selectable PCB fiberglass cloth parameters in the PCB fiberglass cloth database on the input interface for the user to select. Since the Glass fiber fabrics of different models (types) correspond to corresponding specifications, that is, the Glass fiber fabric Type (Glass Type) corresponds to parameters such as Glass fiber Density (weather sensitivity), Glass Resin Ratio (Glass/Resin Ratio), Relative dielectric constant (Relative Permittivity), and the like, the target PCB Glass fiber fabric parameter may be only the Glass fiber fabric Type. The types of glass fiber cloth commonly used nowadays are 1078, 1080, 1086, 2116, 1506, 7628, etc.
Then, in step S102, the PCB fiberglass cloth parameters may be provided to the user in the form of table 2 for the user to select the target PCB fiberglass cloth parameters, and a corresponding target PCB fiberglass cloth simulation module is generated based on the target PCB fiberglass cloth parameters.
TABLE 2 target PCB glass fiber cloth parameter Table
The target wiring parameters that need to be input by the user in step S101 may specifically include: the device comprises a signal line broken line angle, a total signal line length, a signal line segment number, a signal line impedance value, a signal frequency point and a signal line interval. For differential signals, the target wiring parameters may specifically include: differential line bend Angle (Differential line Angle), Differential line total Length (Differential line Length), Differential line Segment Length (Differential line Segment Length), Differential line Segment Number (Differential line Segment Number), Differential line impedance value (Differential line Ohm), Differential line frequency point (Differential line sequence) and Differential line pitch (Spacing for Pair to Pair).
When testing the crosstalk value of the differential line, a conventional method for establishing a crosstalk simulation calculation model of 3 pairs of differential lines is adopted to construct a crosstalk simulation calculation model of a PCB signal line, which may refer to fig. 2(a) and 2(b), and corresponding parameters are shown in tables 3 and 4, respectively.
Table 3 internal layer structure parameter table of PCB signal line crosstalk simulation calculation model
Table 4 outer layer structure parameter table of PCB signal line crosstalk simulation calculation model
In fig. 2(a) and 2(b), "TOP _ roughess" is the TOP Roughness, and "BOT _ roughess" is the bottom Roughness.
Taking the relevant parameters of the lamination information of the target PCB plate lamination shown in tables 3 and 4 as examples, the target PCB fiberglass cloth simulation module generated in the previous step is combined to generate the PCB signal line crosstalk simulation calculation model shown in fig. 2(a) and 2 (b).
According to the PCB wiring crosstalk evaluation method provided by the embodiment of the application, a user needs to input lamination information of a target PCB lamination, a signal wire broken line angle, a signal wire total length, a signal wire section number, a signal wire impedance value, a signal frequency point, a signal wire interval and a glass fiber cloth type, an evaluation system can automatically build a PCB signal wire crosstalk simulation calculation model, then perform crosstalk simulation test on the PCB signal wire crosstalk simulation calculation model to obtain a series of simulation data for simulation evaluation, and further obtain a crosstalk simulation result corresponding to the PCB signal wire crosstalk simulation calculation model according to a crosstalk value calculation formula corresponding to parameters such as lamination information of the target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters and output the crosstalk simulation result to the user for reference.
It should be noted that, the PCB trace crosstalk evaluation method provided in the embodiment of the present application is described by taking only target wiring parameters input by a user as a set of fixed parameters, for example, for differential lines, 3 pairs of regular differential lines are generated to perform crosstalk simulation. In practical applications, engineers often need to select an irregular trace design according to design requirements, such as the length of each signal line segment (e.g., L1, L2, L3, L4, L5, and L6 shown in fig. 3), and the fold line angle of each signal line segment (e.g., (ii) (i.e., L1, L2, L3, L4, L5, and L6 shown in fig. 3)
、
、
、
、
、
) All can be different, namely, the routing parameters of each broken line segment customized by a user are supported.
EXAMPLE III
Fig. 3 is a schematic plan view of a crosstalk simulation calculation model of a PCB signal line according to an embodiment of the present application; fig. 4(a) is a schematic diagram of a crosstalk simulation result of a first example PCB signal line provided in the embodiment of the present application; fig. 4(b) is a schematic diagram of a crosstalk simulation result of a second example PCB signal line provided in the embodiment of the present application; fig. 4(c) is a schematic diagram of a crosstalk simulation result of a third example PCB signal line provided in the embodiment of the present application; fig. 4(d) is a schematic diagram of a crosstalk simulation result of a fourth example PCB signal line provided in the embodiment of the present application; fig. 5 is a schematic diagram illustrating evaluation of crosstalk between differential traces according to an embodiment of the present application.
On the basis of the above embodiments, in order to be suitable for practical application, the embodiment of the present application takes the signal line as a differential line as an example, and further describes a specific implementation manner of performing crosstalk simulation on the PCB signal line crosstalk simulation calculation model in step S104 to obtain a crosstalk simulation result.
The conventional method for establishing the crosstalk simulation calculation model of the 3 pairs of differential wires is adopted to construct a crosstalk simulation calculation model of the PCB signal wire, as shown in fig. 3, 3 pairs of differential wires D1, D2 and D3 are generated, the distances between the differential wires are controlled to be 10 mils, 20 mils, 30 mils and 40 mils respectively, and four times of crosstalk simulation evaluation are performed respectively, and other parameters can be referred to table 5.
Table 5 differential line crosstalk simulation evaluation parameter table
Based on the input parameters shown in table 5, crosstalk simulation results shown in fig. 4(a), 4(b), 4(c), and 4(d) are obtained, respectively, and the crosstalk simulation results are calculated from crosstalk data at different signal frequency points.
Referring to fig. 5, a specific calculation procedure for calculating the crosstalk simulation results shown in fig. 4(a), 4(b), 4(c), and 4(d) according to the crosstalk data at each end of the differential line interval is as follows:
for differential line D1, there are:
for differential line D2, there are:
for differential line D3, there are:
then under the current input parameters, the Far-End line-to-line crosstalk (Far End X-Talk) of the differential line is:
the Near End line external crosstalk (Near End X-Talk) of the differential lines is:
the resultant composite alien Crosstalk (PSXTalk) is:
in step S105, the calculated waveform of the integrated line-out crosstalk as shown in fig. 4(a), 4(b), 4(c), and 4(d) may be output as a crosstalk simulation result.
Further, in order to facilitate a user to intuitively obtain whether the current trace design meets the industrial specification, that is, whether the crosstalk value meets the design requirement, the method for evaluating the PCB trace crosstalk provided by the embodiment of the present application may further include:
comparing the crosstalk simulation result with an industrial standard crosstalk value corresponding to the signal frequency point in the target wiring parameter to obtain a crosstalk evaluation result;
and outputting a crosstalk evaluation result.
In practical application, the allowable value of the off-line crosstalk of the differential line corresponds to the signal frequency point, and the corresponding industrial standard crosstalk value is determined according to the differential line frequency point input in the step. If the crosstalk simulation result is larger than the industrial standard crosstalk value, outputting a crosstalk evaluation result with unqualified wiring design; and if the crosstalk simulation result is smaller than the industrial standard crosstalk value, outputting a crosstalk evaluation result with qualified wiring design.
It should be noted that, the method for evaluating PCB trace crosstalk provided in the embodiment of the present application is only described in terms of a crosstalk simulation method for differential lines, and for other types of signal lines, a wiring method for generating simulation corresponding to the type of the signal line and a corresponding crosstalk value calculation formula may be adopted.
Example four
Fig. 6 is a schematic view of a trace design according to an embodiment of the present application.
On the basis of the above embodiment, considering the current situation that the signal rate is continuously increased, the crosstalk influence of the PCB glass fiber effect on the high-speed signal is more and more obvious. The PCB glassfiber effect is that when the signal line trace is 0 ° or 90 ° along the glass fiber weaving direction, the characteristic impedance of the respective positive and negative signals on the differential lines will be different due to the micro-difference of the sensed media structure (characteristic) on the path of the electric field flow. For example, a glass fiber cloth area through which one signal line passes is only woven by glass fibers, and a glass fiber cloth area through which the other signal line passes includes epoxy resin in addition to the woven glass fibers, so that the former is mainly affected by the dielectric coefficient of the glass fibers, and the latter is also affected by the dielectric coefficient of the epoxy resin, and the dielectric coefficients of the two are completely different, which causes the characteristic impedance and the transmission time delay of the pair of differential lines to be mismatched, thereby affecting the eye diagram. To avoid this effect, when designing the PCB trace, the signal line should be prevented from being parallel or perpendicular to the weaving direction of the PCB glass fiber cloth.
Therefore, in the method for evaluating PCB trace crosstalk provided in the embodiment of the present application, in step S103: before a PCB signal line crosstalk simulation calculation model is built by combining the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters, the method further comprises the following steps:
judging whether the routing design corresponding to the target wiring parameters is influenced by the PCB glass fiber effect;
if yes, entering step S103, and building a PCB signal wire crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters;
and if not, outputting the information that the wiring design is not compliant.
In the specific implementation, referring to fig. 6, for different signal frequency points, there are different standards to define the angles and lengths of signal line traces, the square Root of the Sum of the lengths of the parallel vertical traces and the horizontal traces woven by the glass fiber, and the total length of the whole trace is defined by the Root-Sum-square method (Root-Sum-square) plus the total length of the whole trace.
The square root of the sum length of the parallel vertical routing length and the horizontal routing length woven by the glass fiber is shown as the following formula:
wherein,H 1 、H 2 、H 3 … … is the vertical length of the signal line segment,V 1 、V 2 、V 3 … … is the horizontal length of the signal line segment.
The statistical square tolerance of the total length of the whole-section routing is shown as follows:
wherein,L 1 、L 2 、L 3 、L 4 、L 5 、L 6 … … are signal line segment lengths.
The square tolerance of the maximum total track length statistics of the whole sections corresponding to each signal frequency point can be referred to table 6.
Table 6 maximum full-segment total track length statistics square tolerance table corresponding to each signal frequency point
Before a PCB signal line crosstalk simulation calculation model is built, calculating the total length statistical square tolerance of the full-section wiring corresponding to a target wiring parameter input by a user according to the formula, further evaluating whether the total length statistical square tolerance of the full-section wiring does not exceed the maximum total length statistical square tolerance of the full-section wiring corresponding to a signal frequency point input by the user, if so, confirming that the wiring design corresponding to the target wiring parameter is not influenced by the PCB glass fiber effect, and entering the step of building the PCB signal line crosstalk simulation calculation model; if not, confirming that the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect, outputting information that the wiring design is not in compliance, and prompting a user to change the target wiring parameter.
It should be noted that, the method for evaluating crosstalk of PCB traces provided in the embodiment of the present application is only described in terms of a crosstalk simulation method for differential wires, and if the method is applied to other types of signal wires, a corresponding evaluation method for influence of a PCB glass fiber effect may be adopted, or a method for directly evaluating and confirming that angles of fold lines of all the signal wires (that is, angles formed by the signal wires and a knitting direction of the PCB glass fiber cloth) are not 0 ° or 90 °.
According to the PCB wiring crosstalk evaluation method provided by the embodiment of the application, whether wiring design is influenced by the PCB glass fiber effect is evaluated before a PCB signal wire crosstalk simulation calculation model is built, so that the rationality of wiring design is guaranteed, and the simulation success rate is improved.
On the basis of the above detailed description of each embodiment corresponding to the PCB trace crosstalk evaluation method, the present application also discloses a PCB trace crosstalk evaluation system, device, equipment and storage medium corresponding to the above method.
EXAMPLE five
Fig. 7 is a schematic structural diagram of a PCB trace crosstalk evaluation system according to an embodiment of the present application.
As shown in fig. 7, the PCB trace crosstalk evaluation system provided in the embodiment of the present application includes:
a PCB lamination module 701 for generating a target PCB lamination simulation module based on input lamination information of the target PCB lamination;
a PCB fiberglass cloth module 702, configured to generate a target PCB fiberglass cloth simulation module based on the input target PCB fiberglass cloth parameters;
and the crosstalk simulation calculation module 703 is configured to combine the target PCB board lamination simulation module, the target PCB glass fiber cloth simulation module and the input target wiring parameters to build a PCB signal line crosstalk simulation calculation model, perform crosstalk simulation on the PCB signal line crosstalk simulation calculation model, and obtain and output a crosstalk simulation result.
Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:
the sub-lamination database module is used for establishing a sub-lamination database in advance according to the PCB material electrical characteristic parameters of different PCB plates;
correspondingly, the PCB lamination module 701 generates a target PCB lamination simulation module based on the input lamination information of the target PCB lamination, which specifically includes:
selecting a target sub-lamination from a sub-lamination database of the sub-lamination database module based on the input lamination requirement for the lamination of the target PCB;
and generating a target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.
Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:
the routing design evaluation module is used for judging whether the routing design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect or not before the crosstalk simulation calculation module 703 is combined with the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build a PCB signal line crosstalk simulation calculation model; if yes, the crosstalk simulation calculation module 703 executes a step of building a crosstalk simulation calculation model of the PCB signal line in combination with the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters; and if not, outputting the information that the wiring design is not compliant.
Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:
and the crosstalk evaluation module is used for comparing the crosstalk simulation result with the industrial standard crosstalk value corresponding to the signal frequency point in the target wiring parameter to obtain and output a crosstalk evaluation result.
Since the embodiment of the system part corresponds to the embodiment of the method part, the embodiment of the system part is described with reference to the embodiment of the method part, and is not repeated here.
EXAMPLE six
Fig. 8 is a schematic structural diagram of a PCB trace crosstalk evaluation apparatus according to an embodiment of the present application.
As shown in fig. 8, the PCB trace crosstalk evaluation apparatus provided in the embodiment of the present application includes:
the receiving unit 801 is configured to receive input lamination information of a target PCB plate lamination, target PCB fiberglass cloth parameters, and target wiring parameters;
a first modeling unit 802, configured to generate a target PCB lamination simulation module based on lamination information of a target PCB lamination;
a second modeling unit 803, configured to generate a target PCB fiberglass cloth simulation module based on the target PCB fiberglass cloth parameters;
the third modeling unit 804 is used for building a PCB signal line crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;
the crosstalk simulation unit 805 is used for performing crosstalk simulation on the crosstalk simulation calculation model of the PCB signal line to obtain a crosstalk simulation result;
the first output unit 806 is configured to output a crosstalk simulation result.
Further, the PCB trace crosstalk evaluation apparatus provided in the embodiment of the present application may further include:
the sub-lamination data unit is used for establishing a sub-lamination database in advance according to the PCB material electrical characteristic parameters of different PCB plates;
then, the receiving unit 801 receives input lamination information of target PCB lamination, specifically:
receiving input lamination requirements for target PCB lamination;
the first modeling unit 802 generates a target PCB lamination simulation module based on lamination information of the target PCB lamination, and specifically includes:
selecting a target sub-lamination from the sub-lamination database according to lamination requirements;
and generating a target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.
Further, the PCB trace crosstalk evaluation apparatus provided in the embodiment of the present application may further include:
the judging unit is used for judging whether the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect before the third modeling unit 804 is combined with the target PCB laminating simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build the PCB signal line crosstalk simulation calculation model, and if so, entering the third modeling unit 804 to perform the step of combining the target PCB laminating simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build the PCB signal line crosstalk simulation calculation model; if not, entering a second output unit;
and the second output unit is used for outputting the information that the wiring design is not compliant.
Further, the PCB trace crosstalk evaluation apparatus provided in the embodiment of the present application may further include:
the comparison unit is used for comparing the crosstalk simulation result with an industrial standard crosstalk value corresponding to the signal frequency point in the target wiring parameter to obtain a crosstalk evaluation result;
and the third output unit is used for outputting the crosstalk evaluation result.
Since the embodiments of the apparatus portion and the method portion correspond to each other, please refer to the description of the embodiments of the method portion for the embodiments of the apparatus portion, which is not repeated here.
EXAMPLE seven
Fig. 9 is a schematic structural diagram of a PCB trace crosstalk evaluation device according to an embodiment of the present application.
As shown in fig. 9, the PCB trace crosstalk evaluation apparatus provided in the embodiment of the present application includes:
a memory 910 for storing a computer program 911;
a processor 920 configured to execute a computer program 911, wherein when the computer program 911 is executed by the processor 920, the steps of the PCB trace crosstalk evaluation method according to any one of the above embodiments are implemented.
Among other things, processor 920 may include one or more processing cores, such as a 3-core processor, an 8-core processor, and so on. The processor 920 may be implemented in at least one hardware form of a digital Signal processing (dsp), a Field-Programmable Gate Array (FPGA), a Programmable Logic Array (pla), or a digital Signal processing (dsp). Processor 920 may also include a main processor and a coprocessor, where the main processor is a processor for Processing data in an awake state, and is also called a central Processing unit (cpu); a coprocessor is a low power processor for processing data in a standby state. In some embodiments, the processor 920 may be integrated with an image processor GPU (graphics Processing unit), which is responsible for rendering and drawing the content required to be displayed by the display screen. In some embodiments, processor 920 may also include an Artificial Intelligence (AI) (artificial intelligence) processor for processing computational operations related to machine learning.
Memory 910 may include one or more storage media, which may be non-transitory. Memory 910 may also include high speed random access memory, as well as non-volatile memory, such as one or more magnetic disk storage devices, flash memory storage devices. In this embodiment, the memory 910 is at least used for storing the following computer program 911, wherein after the computer program 911 is loaded and executed by the processor 920, relevant steps in the PCB trace crosstalk evaluation method disclosed in any of the foregoing embodiments can be implemented. In addition, the resources stored in the memory 910 may also include an operating system 912, data 913, and the like, and the storage may be a transient storage or a permanent storage. Operating system 912 may be Windows, among others. Data 913 may include, but is not limited to, data involved in the above-described methods.
In some embodiments, the PCB trace crosstalk evaluation apparatus may further include a display 930, a power supply 940, a communication interface 950, an input output interface 960, a sensor 970, and a communication bus 980.
Those skilled in the art will appreciate that the configuration shown in fig. 9 does not constitute a limitation of the PCB trace crosstalk evaluation apparatus and may include more or fewer components than those shown.
The PCB wiring crosstalk evaluation device provided by the embodiment of the application comprises the memory and the processor, and the processor can realize the PCB wiring crosstalk evaluation method when executing the program stored in the memory, and the effect is the same as the above.
Example eight
It should be noted that the above-described embodiments of systems, apparatuses, and devices are merely illustrative, for example, the division of modules is only one division of logical functions, and there may be other divisions when the actual implementation is performed, for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form. Modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present application may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a separate product, may be stored in a storage medium. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium and executes all or part of the steps of the methods described in the embodiments of the present application, or all or part of the technical solutions.
To this end, an embodiment of the present application further provides a storage medium, where the storage medium stores a computer program, and the computer program, when executed by a processor, implements the steps of the PCB trace crosstalk evaluation method.
The storage medium may include: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory ROM (Read-Only Memory), a random Access Memory ram (random Access Memory), a magnetic disk, or an optical disk.
The computer program contained in the storage medium provided in this embodiment can implement the steps of the PCB trace crosstalk evaluation method described above when being executed by a processor, and the effect is the same as above.
The method, system, device, equipment and storage medium for evaluating PCB trace crosstalk provided by the present application are described in detail above. The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The system, the device, the equipment and the storage medium disclosed by the embodiment correspond to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (11)
1. A PCB trace crosstalk evaluation method is characterized by comprising the following steps:
receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;
generating a target PCB laminated simulation module based on the laminated information of the target PCB, and generating a target PCB fiberglass cloth simulation module based on the target PCB fiberglass cloth parameters;
combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation model;
carrying out crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;
and outputting the crosstalk simulation result.
2. The PCB trace crosstalk evaluation method of claim 1, further comprising:
establishing a sub-laminated database in advance according to the PCB material electrical characteristic parameters of different PCB plates;
receiving input lamination information of the target PCB lamination, specifically:
receiving input lamination requirements for lamination of the target PCB plate;
the generating of the target PCB lamination simulation module based on the lamination information of the target PCB lamination specifically includes:
selecting a target sub-lamination from the sub-lamination database according to the lamination requirement;
and generating the target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.
3. The PCB trace crosstalk evaluation method according to claim 2, wherein the generating the target PCB board lamination simulation module of the target PCB board lamination satisfying the lamination requirement based on the lamination information of each target sub lamination specifically comprises:
when the target sub-lamination only comprises an inner layer PCB structure and an outer layer PCB structure, generating a single-layer target PCB lamination based on lamination information of the inner layer PCB structure and lamination information of the outer layer PCB structure;
when the target sub-laminate includes a multi-layer sub-laminate structure, generating a multi-layer target PCB board laminate based on each of the sub-laminate structures.
4. The PCB trace crosstalk evaluation method of claim 1, wherein the target PCB fiberglass cloth parameter is specifically a fiberglass cloth type.
5. The PCB trace crosstalk evaluation method of claim 1, wherein the target routing parameters specifically include: the device comprises a signal line broken line angle, a total signal line length, a signal line segment number, a signal line impedance value, a signal frequency point and a signal line interval.
6. The PCB trace crosstalk evaluation method according to claim 1, wherein before the combining the target PCB board lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation model, the method further comprises:
judging whether the routing design corresponding to the target routing parameters is influenced by the PCB glass fiber effect;
if so, the step of building a PCB signal wire crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters is carried out;
and if not, outputting the information that the wiring design is not compliant.
7. The PCB trace crosstalk evaluation method of claim 1, further comprising:
comparing the crosstalk simulation result with an industrial standard crosstalk value corresponding to a signal frequency point in the target wiring parameter to obtain a crosstalk evaluation result;
and outputting the crosstalk evaluation result.
8. A PCB trace crosstalk evaluation device, comprising:
the receiving unit is used for receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;
the first modeling unit is used for generating a target PCB lamination simulation module based on lamination information of the target PCB lamination;
the second modeling unit is used for generating a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;
the third modeling unit is used for building a PCB signal line crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;
the crosstalk simulation unit is used for performing crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;
and the first output unit is used for outputting the crosstalk simulation result.
9. A PCB trace crosstalk evaluation system, comprising:
the PCB lamination module is used for generating a target PCB lamination simulation module based on the input lamination information of the target PCB lamination;
the PCB glass fiber cloth module is used for generating a target PCB glass fiber cloth simulation module based on the input target PCB glass fiber cloth parameters;
and the crosstalk simulation calculation module is used for combining the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the input target wiring parameters, building a PCB signal wire crosstalk simulation calculation model, performing crosstalk simulation on the PCB signal wire crosstalk simulation calculation model, and obtaining and outputting a crosstalk simulation result.
10. A PCB trace crosstalk evaluation device, comprising:
a memory for storing a computer program;
a processor for executing the computer program, wherein the computer program when executed by the processor implements the steps of the PCB trace crosstalk evaluation method according to any one of claims 1 to 7.
11. A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the PCB trace crosstalk evaluation method according to any one of claims 1 to 7.
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