CN114415268A - Method for manufacturing optical phase plate - Google Patents
Method for manufacturing optical phase plate Download PDFInfo
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- CN114415268A CN114415268A CN202210109429.9A CN202210109429A CN114415268A CN 114415268 A CN114415268 A CN 114415268A CN 202210109429 A CN202210109429 A CN 202210109429A CN 114415268 A CN114415268 A CN 114415268A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 60
- 238000005520 cutting process Methods 0.000 claims abstract description 38
- 238000007639 printing Methods 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 7
- 238000007781 pre-processing Methods 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000013467 fragmentation Methods 0.000 claims description 3
- 238000006062 fragmentation reaction Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000004049 embossing Methods 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lens Barrels (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
The invention provides a method for manufacturing an optical phase plate. The manufacturing method of the optical phase plate comprises the following steps: pretreatment: plating an antireflection film and a printing shading layer on the surface of one side of the glass wafer to be cut, and setting the shading layer into a plurality of sub shading layers arranged in an array; cutting treatment: and cutting the cutting channels formed among the plurality of sub-shading layers of the glass wafer to be cut. The invention solves the problems of low efficiency and poor precision in the manufacturing of the optical phase plate in the prior art.
Description
Technical Field
The invention relates to the field of optical element processing, in particular to a manufacturing method of an optical phase plate.
Background
The optical phase plate is an integral part of the optical system of the imaging lens. The optical phase plate technology is that an optical phase plate is placed at an aperture diaphragm of an incoherent traditional optical system, so that the optical phase plate modulates and phase-modulates and encodes the wavefront of an incident light field at a pupil, and then a digital image processing method is used for decoding to realize computational imaging. At present, most optical phase plates are manufactured by a resin injection molding process, and the number of the optical phase plates produced by the manufacturing method every time is limited, so that mass production is difficult to realize; the processing efficiency is low, the processing size is limited, and the requirements of the mobile phone imaging field on the optical phase plate with high precision and small size are not met.
That is, the manufacturing of the optical phase plate in the prior art has problems of low efficiency and poor precision.
Disclosure of Invention
The invention mainly aims to provide a method for manufacturing an optical phase plate, which aims to solve the problems of low efficiency and poor precision in the manufacturing of the optical phase plate in the prior art.
In order to achieve the above object, the present invention provides a method for manufacturing an optical phase plate, comprising: pretreatment: plating an antireflection film and a printing shading layer on the surface of one side of the glass wafer to be cut, and setting the shading layer into a plurality of sub shading layers arranged in an array; cutting treatment: and cutting the cutting channels formed among the plurality of sub-shading layers of the glass wafer to be cut.
Further, in the step of preprocessing, a shading layer is printed on the surface of one side, away from the glass wafer to be cut, of the antireflection film; reserving light through holes on each sub-shading layer; and stamping and forming a plurality of phase plate structures on the other side surface of the glass wafer to be cut, so that the phase plate structures correspond to the light through holes one to one.
Further, the method also comprises a marking step when the shading layer is printed on the surface of one side, away from the glass wafer to be cut, of the antireflection film in the pretreatment process, wherein the marking step comprises the following steps: and printing a positioning mark on the peripheral side of the light shielding layer.
Further, the pre-processing process further comprises an alignment step, the alignment step is performed after the marking step and in the process of stamping and forming a plurality of phase plate structures on the other side surface of the glass wafer to be cut, and the alignment step comprises the following steps: and identifying the alignment mark, aligning the alignment structure on the imprinting master plate with the alignment mark to imprint, and enabling the plurality of phase plate structures to correspond to the plurality of light through holes one to one.
Further, the cutting process also comprises the following steps: laser hidden cutting step of the glass wafer: adjusting the focal position of the laser, and controlling the focal point of the laser to cut off the interior of the glass wafer to be cut; a separation step: and the separation of the single-particle optical phase plate is realized through fragmentation.
Further, the pretreatment process also comprises the following steps: and selecting the glass wafer with the diameter more than or equal to 100mm and less than or equal to 200mm as the glass wafer to be cut.
Further, the pretreatment process also comprises the following steps: and reserving cutting channels with the width of more than or equal to 100 mu m and less than or equal to 800 mu m between the plurality of sub-shading layers in the process of printing the shading layers.
Further, the pretreatment process also comprises the following steps: in the process of printing the shading layer, reserving light through holes with the diameter being more than or equal to 0.2mm and less than or equal to 5.0mm on the sub shading layer; and/or adjusting the diameter of the phase plate structure in the range of 0.1mm to 4.9mm during imprinting of the plurality of phase plate structures.
Further, the pretreatment process also comprises the following steps: setting the thickness of the antireflection film within the range of more than or equal to 0.2 mu m and less than or equal to 3 mu m; and/or the thickness of the light shielding layer is set to be in a range of 2 μm or more and 15 μm or less.
Further, the pretreatment process also comprises the following steps: in the process of printing the shading layer on the surface of one side, away from the glass wafer to be cut, of the antireflection film, printing of the shading layer is achieved by adopting a screen printing process or a black photoresist photoetching process; and/or in the process of stamping and forming a plurality of phase plate structures on the other side surface of the glass wafer to be cut, stamping and forming of the phase plate structures are realized by adopting a nano stamping process.
By applying the technical scheme of the invention, the manufacturing method of the optical phase plate comprises pretreatment and cutting treatment, wherein the pretreatment comprises the following steps: plating an antireflection film and a printing shading layer on the surface of one side of the glass wafer to be cut, and setting the shading layer into a plurality of sub shading layers arranged in an array; cutting treatment: and cutting the cutting channels formed among the plurality of sub-shading layers of the glass wafer to be cut.
The anti-reflection film and the shading layer are plated on the surface of one side of the glass wafer to be cut, the shading layer is arranged into a plurality of sub shading layers which are arranged in an array mode, then cutting processing is carried out on cutting channels formed among the plurality of sub shading layers of the glass wafer to be cut, and separation of single components is achieved. The arrangement can integrate the sub-shading layers with various sizes on the glass wafer to be cut, so that the optical phase plates with various sizes can be obtained, only suitable parameters need to be adjusted, the limitation of machining size cannot be caused, meanwhile, the arrangement of the plurality of sub-shading layers arranged in an array mode can be adjusted according to requirements, the optical phase plates with required number can be obtained according to the required number of the sub-shading layers, the adjustment convenience is improved, and meanwhile, the universality of the manufacturing method of the optical phase plates is improved. In addition, the manufacturing method of the optical phase plate can be suitable for processing and producing optical phase plates with different sizes and different quantities, the problems of low processing efficiency and limited processing size of the traditional resin injection molding process are solved, 64 optical phase plates can be produced by a single glass wafer, the production efficiency is greatly increased, and meanwhile, the processing precision is ensured under the condition of not increasing the cost, so that the optical phase plate produced by the method can meet the high-precision requirement of an imaging lens and can be better matched with the imaging lens.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a flow chart of a method of manufacturing an optical phase plate of an alternative embodiment of the invention;
FIG. 2 shows a schematic structural diagram of a glass wafer to be cut of an optical phase plate according to an alternative embodiment of the present invention;
FIG. 3 is a schematic view of one side surface of a glass wafer to be cut having a light-shielding layer according to the present invention;
FIG. 4 shows a schematic view of one side surface of a glass wafer to be cut of the present invention with a phase plate structure;
FIG. 5 shows a schematic structural diagram of a single-grain optical phase plate of the method for fabricating an optical phase plate of the present invention;
fig. 6 shows a schematic view of one side surface of the optical phase plate of a single grain in fig. 5 having the light shielding layer.
Wherein the figures include the following reference numerals:
10. a glass wafer to be cut; 20. an anti-reflection film; 30. a light sub-shielding layer; 40. cutting a channel; 50. cutting a center line of the street; 60. a light through hole; 70. aligning and marking; 80. phase plate structure.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
The invention provides a method for manufacturing an optical phase plate, aiming at solving the problems of low efficiency and poor precision in the manufacturing of the optical phase plate in the prior art.
As shown in fig. 1 to 6, the method for manufacturing an optical phase plate includes a pretreatment and a cutting treatment, the pretreatment: plating an antireflection film 20 and a printing shading layer on the surface of one side of the glass wafer 10 to be cut, and setting the shading layer into a plurality of sub shading layers 30 arranged in an array; cutting treatment: the dicing streets 40 formed between the plurality of sub-light shielding layers 30 of the glass wafer 10 to be diced are subjected to a dicing process.
The separation of the single components is realized by plating an antireflection film 20 and printing a shading layer on one side surface of the glass wafer 10 to be cut, arranging the shading layer into a plurality of sub shading layers 30 arranged in an array, and then performing cutting treatment on cutting channels 40 formed among the plurality of sub shading layers 30 of the glass wafer 10 to be cut. The arrangement can integrate the sub-shading layers 30 with various sizes on the glass wafer 10 to be cut, so as to obtain the optical phase plates with various sizes, and only needs to adjust proper parameters, so that the limitation of the processing size is avoided, meanwhile, the arrangement of the plurality of sub-shading layers 30 arranged in an array can be adjusted according to the requirement, the optical phase plates with required number can be obtained according to the sub-shading layers 30 with required number, the adjustment convenience is improved, and meanwhile, the universality of the manufacturing method of the optical phase plates is improved. In addition, the manufacturing method of the optical phase plate can be suitable for processing and producing optical phase plates with different sizes and different quantities, the problems of low processing efficiency and limited processing size of the traditional resin injection molding process are solved, 64 optical phase plates can be produced by a single glass wafer, the production efficiency is greatly increased, and meanwhile, the processing precision is ensured under the condition of not increasing the cost, so that the optical phase plate produced by the method can meet the high-precision requirement of an imaging lens and can be better matched with the imaging lens.
It should be noted that the sizes of the plurality of sub-light-shielding layers 30 arranged in an array are the same, that is, the sizes of the plurality of optical phase plates produced by one glass wafer are the same. The sub-light-shielding layers 30 are square, and a plurality of sub-light-shielding layers 30 form a square array, although the specific shape can be adjusted as required. The manufacturing method of the optical phase plate can realize the processing of the optical phase plate with low cost, high efficiency and high precision.
Specifically, in the preprocessing step, a screen printing process or a black photoresist photoetching process is adopted to print a shading layer on the surface of one side of the antireflection film 20 away from the glass wafer 10 to be cut; reserving light through holes 60 on each sub-shading layer 30; on the other side surface of the glass wafer 10 to be cut, the resin glue is used to realize the imprinting molding of the plurality of phase plate structures 80 through the nanoimprint process, so that the plurality of phase plate structures 80 correspond to the plurality of light passing holes 60 one to one. It should be noted that, the one-to-one correspondence between the plurality of phase plate structures 80 and the plurality of light-transmitting holes 60 means that the centers of the plurality of phase plate structures 80 and the centers of the plurality of light-transmitting holes 60 are overlapped in a one-to-one correspondence manner, which is beneficial to ensuring the processing precision of the plurality of optical phase plates formed after cutting and is beneficial to ensuring the performance stability of the plurality of optical phase plates.
Specifically, the method further comprises a marking step when a light shielding layer is printed on the surface of one side, away from the glass wafer 10 to be cut, of the antireflection film 20, wherein the marking step comprises the following steps: alignment marks 70 are printed on the periphery of the light-shielding layer. The marking step is performed simultaneously with the step of printing the light shielding layer, and the alignment mark 70 formed by the marking step is beneficial to alignment in the process of imprinting the subsequent phase plate structure 80, so that the processing precision is guaranteed. As shown in fig. 3, the alignment marks 70 are cross-shaped and two, and the two alignment marks 70 are symmetrically distributed around the center of the whole light shielding layer.
Specifically, the pre-processing process further includes an alignment step, the alignment step is performed after the marking step and during the process of forming the plurality of phase plate structures 80 by stamping on the other side surface of the glass wafer 10 to be cut, and the alignment step includes: identifying the alignment mark 70, aligning the alignment structure on the imprinting master plate with the alignment mark 70 for imprinting, so that the centers of the plurality of phase plate structures 80 are correspondingly overlapped with the centers of the plurality of light through holes 60 one by one, and then separating the single-grain optical phase plates by a laser cutting or knife wheel cutting process.
Specifically, the cutting process further includes: laser hidden cutting step of the glass wafer: adjusting the focal position of the laser, and controlling the focal point of the laser to cut off the interior of the glass wafer 10 to be cut; a separation step: and the separation of the single-particle optical phase plate is realized through fragmentation. The glass wafer laser hidden cutting process is adopted to cut the single-grain optical phase plate, so that the completeness and the appearance attractiveness of the separation of the optical phase plate are guaranteed, and the performance stability of the optical phase plate can be guaranteed.
Specifically, the pretreatment process further comprises: selecting a glass wafer with the diameter more than or equal to 100mm and less than or equal to 200mm as the glass wafer 10 to be cut. In the process of printing the light shielding layer, the cutting channels 40 with the width of more than or equal to 100 μm and less than or equal to 800 μm are reserved among the plurality of sub-light shielding layers 30, namely, the cutting channels 40 with the width of more than or equal to 100 μm and less than or equal to 800 μm are reserved on the periphery of the single sub-light shielding layer 30, and ink is not dropped. Meanwhile, a light through hole 60 with the diameter being more than or equal to 0.2mm and less than or equal to 5.0mm is reserved on the sub-shading layer 30; that is, the cutting street 40 is reserved, the light-passing hole 60 is reserved, and ink does not flow into the light-passing hole 60 with the diameter of 0.2mm or more and 5.0mm or less reserved in each sub-light-shielding layer 30. In the imprinting of the plurality of phase plate structures 80, the diameter of the phase plate structure 80 is adjusted in the range of 0.1mm to 4.9 mm.
Specifically, the pretreatment process further comprises: setting the thickness of the antireflection film 20 within the range of more than or equal to 0.2 μm and less than or equal to 3 μm; the thickness of the light-shielding layer is set to be in the range of 2 μm or more and 15 μm or less. Through the reasonable arrangement of the thicknesses of the anti-reflection film 20 and the shading layer, the anti-reflection film 20 can be plated on the glass wafer 10 to be cut, the shading layer can be printed on the anti-reflection film 20, the connection stability among the glass wafer 10 to be cut, the anti-reflection film 20 and the shading layer is further facilitated, the matching precision is guaranteed, and the glass wafer 10 to be cut, the anti-reflection film 20 and the shading layer with different thicknesses can be arranged according to specific requirements.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The invention provides a method for manufacturing an optical phase plate on a glass wafer.
As shown in fig. 2 to 6, the specific steps include: selecting a glass wafer 10 to be cut with the thickness of 0.3mm and the diameter of 152.4mm, and plating an antireflection film 20 with the thickness of 0.5 mu m on the surface of one side of the glass wafer 10 to be cut, wherein the antireflection film 20 is an AR optical antireflection film; then, printing a light shielding layer on the surface of one side, away from the glass wafer 10 to be cut, of the antireflection film 20 by a screen printing process; the shading layer is formed by a square array with the side length of 2.5mm, and cutting channels 40 with the width of 400 mu m are reserved between a plurality of sub shading layers 30 in each row and each column; a light through hole 60 with the diameter of 1.3mm is reserved in the middle of the single sub-shading layer 30; the periphery of the light shielding layer is symmetrically distributed with alignment marks 70 perpendicular to the transverse direction or the longitudinal direction of the light shielding layer, the distance from the alignment marks 70 to the center of the light shielding layer is 130mm, and the alignment marks 70 are also manufactured through a screen printing process; forming a specific phase plate structure 80 on the other side surface of the glass wafer 10 to be cut by a resin glue nanoimprint process; the phase plate structure 80 is aligned and stamped through the alignment structure on the stamping master plate and the alignment mark 70 on the periphery of the light shielding layer, so that the centers of the phase plate structures 80 and the centers of the light through holes 60 are correspondingly superposed one by one; finally, cutting is carried out along the central line 50 of the cutting path through laser cutting, and the separation of the single-grain optical phase plate is realized.
It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of fabricating an optical phase plate, comprising:
pretreatment: plating an antireflection film (20) and a printing shading layer on the surface of one side of a glass wafer (10) to be cut, and setting the shading layer into a plurality of sub shading layers (30) arranged in an array;
cutting treatment: and cutting the cutting channels (40) formed among the plurality of the sub-shading layers (30) of the glass wafer (10) to be cut.
2. A method of manufacturing an optical phase plate according to claim 1, wherein, in the pre-treatment step,
printing the shading layer on the surface of one side, away from the glass wafer (10) to be cut, of the antireflection film (20);
reserving light through holes (60) on each sub-shading layer (30);
and stamping a plurality of phase plate structures (80) on the other side surface of the glass wafer (10) to be cut, so that the plurality of phase plate structures (80) correspond to the plurality of light through holes (60) one by one.
3. The method for manufacturing an optical phase plate according to claim 2, further comprising a marking step of printing a light shielding layer on a surface of the antireflection film (20) on a side away from the glass wafer (10) to be cut,
the marking step comprises: and printing a positioning mark (70) on the peripheral side of the light shielding layer.
4. The method of fabricating an optical phase plate according to claim 3, further comprising an alignment step during the pre-processing, the alignment step being performed after the marking step and during the embossing of the plurality of phase plate structures (80) on the other side surface of the glass wafer (10) to be cut,
the alignment step comprises: identifying the alignment mark (70), aligning an alignment structure on the stamping master plate with the alignment mark (70) for stamping, and enabling a plurality of phase plate structures (80) to correspond to the plurality of light through holes (60) one by one.
5. The method of fabricating an optical phase plate according to claim 1, further comprising during the cutting process:
laser hidden cutting step of the glass wafer: adjusting the focus position of a laser, and controlling the focus of the laser to cut off the interior of the glass wafer (10) to be cut;
a separation step: and realizing the separation of single particles of the optical phase plate through fragmentation.
6. The method of fabricating an optical phase plate according to claim 1, further comprising during the pre-processing:
and selecting a glass wafer with the diameter more than or equal to 100mm and less than or equal to 200mm as the glass wafer (10) to be cut.
7. The method of fabricating an optical phase plate according to claim 1, further comprising during the pre-processing:
and in the process of printing the shading layer, the cutting channels (40) with the width of more than or equal to 100 mu m and less than or equal to 800 mu m are reserved among the plurality of sub shading layers (30).
8. The method of fabricating an optical phase plate according to claim 2, further comprising during the pre-processing:
in the process of printing the light shielding layer, reserving the light through hole (60) with the diameter of more than or equal to 0.2mm and less than or equal to 5.0mm on the sub light shielding layer (30); and/or
Adjusting a diameter of the phase plate structure (80) to be in a range of 0.1mm to 4.9mm during imprinting of a plurality of the phase plate structures (80).
9. The method of fabricating an optical phase plate according to claim 1, further comprising during the pre-processing:
setting the thickness of the antireflection film (20) within the range of more than or equal to 0.2 mu m and less than or equal to 3 mu m; and/or
The thickness of the light-shielding layer is set to be within a range of 2 μm or more and 15 μm or less.
10. The method of fabricating an optical phase plate according to claim 2, further comprising during the pre-processing:
in the process of printing the shading layer on the surface of one side, away from the glass wafer (10) to be cut, of the antireflection film (20), printing of the shading layer is achieved through a screen printing process or a black photoresist photoetching process; and/or
In the process of stamping and forming a plurality of phase plate structures (80) on the other side surface of the glass wafer (10) to be cut, the stamping and forming of the phase plate structures (80) are realized by adopting a nano stamping process.
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| CN202210109429.9A CN114415268B (en) | 2022-01-28 | 2022-01-28 | Method for manufacturing optical phase plate |
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| CN114966938A (en) * | 2022-05-25 | 2022-08-30 | Oppo广东移动通信有限公司 | Phase plate manufacturing method, phase plate and electronic device |
| CN114994882A (en) * | 2022-06-24 | 2022-09-02 | Oppo广东移动通信有限公司 | Lens, camera, electronic device and manufacturing method of lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114966938A (en) * | 2022-05-25 | 2022-08-30 | Oppo广东移动通信有限公司 | Phase plate manufacturing method, phase plate and electronic device |
| CN114994882A (en) * | 2022-06-24 | 2022-09-02 | Oppo广东移动通信有限公司 | Lens, camera, electronic device and manufacturing method of lens |
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| CN114415268B (en) | 2024-07-12 |
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