CN114401043A - Modularization error code testing arrangement - Google Patents

Abstract

The invention provides a modularized error code testing device, and belongs to the technical field of communication. The modular error code testing device comprises: the tester box, it is formed with a plurality of installation cavitys that extend along its length direction, the front end of each installation cavity is equipped with installing opening, the passageway guide rail is installed to both sides, two passageway guide rails in each installation cavity all are equipped with mounting groove towards one side each other, a survey test panel for pegging graft horizontal arrangement, survey test panel's one end in the length direction fixed with the box, the other end is equipped with the connector that is used for pegging graft optical module that awaits measuring, the position that each passageway guide rail is close to the connector is equipped with along vertical arrangement's through-hole, be used for installing bulb plunger, bulb end and the survey test panel butt of bulb plunger, be equipped with a plurality of micro holes that are used for increasing the flexibility of survey test panel in the predetermined region of survey test panel. The modular error code testing device can ensure that different optical modules to be tested are well contacted with the connector.

Description

Modularization error code testing arrangement

The present application is a divisional application entitled "a modular error code testing device" with application number CN202111608718.5, application date 12/27/2021.

Technical Field

The invention relates to the technical field of communication, in particular to a modular error code testing device.

Background

The test board of the error code tester is provided with a connector for connecting the optical module to be tested, and the error code tester can test the optical module to be tested after the optical module to be tested is plugged into the connector. In order to keep the optical module to be tested working normally during the test, the optical module to be tested and the connector need to be kept connected normally. Usually, a test board with a connector is first fixed on a fixture base, and a gold finger of an optical module to be tested is inserted into the connector on the test board.

Generally, a connector is welded on a test board body, the test board with a pluggable connector can be compatible with different optical modules to be tested, and the different optical modules to be tested may have dimensional errors during manufacturing, and when the different optical modules to be tested are inserted into the connector manually or by a mechanical arm, it is not possible to ensure that the insertion positions of each optical module to be tested are consistent, for example, it is not possible to ensure that the insertion heights of the optical modules to be tested are consistent, so that the insertion heights of the optical modules to be tested correspond to the established height of the connector, so that the insertion of the optical modules to be tested generates an acting force on the connector, which may damage the welding stability of the connector, may damage the connection strength of the connector, cause the connector to fall off, affect the service life of the connector, or may not maintain the normal connection with each optical module to be tested, the appearance quality of the optical module to be tested is also affected, and poor contact affects signal integrity, resulting in test failure.

Disclosure of Invention

One object of the present invention is to provide a modular error code testing device, which can ensure that different optical modules to be tested are in good contact with a connector.

It is a further object of the present invention to improve the damage or indentation of the optical module and the connector to be tested.

A further object of the present invention is to ensure the heat dissipation effect of the optical module to be tested.

In particular, the present invention provides a modular error code testing apparatus, comprising:

the tester box is formed with a plurality of installation cavities extending along the length direction of the tester box, the front end of each installation cavity is provided with an installation opening, channel guide rails are installed on two sides of the installation cavity, two channel guide rails in each installation cavity are respectively provided with an installation groove facing to one side of each other and used for being connected with a test board horizontally arranged in an inserting mode, one end of the test board in the length direction is fixed with the box, the other end of the test board is provided with a connector used for being connected with an optical module to be tested in an inserting mode, through holes vertically arranged are formed in the positions, close to the connector, of the channel guide rails and used for installing ball head plungers, the ball head ends of the ball head plungers are abutted to the test board, a plurality of micro holes used for increasing the flexibility of the test board are arranged in preset areas of the test board, and therefore the modularized error code testing device can adapt to different assembling position errors of the optical module to be tested by utilizing the floating stroke of the ball heads of the ball head plungers and the deformation of the test board .

Optionally, the upper side and the lower side of the test plate are both provided with the ball plungers.

Optionally, the floating stroke of the ball plunger is 0.5-3 mm.

Optionally, the preset region penetrates through the width of the test board and is located in the middle of the test board in the length direction;

the diameter of each micro hole is not more than 0.15mm, and the distance between every two adjacent micro holes is not more than 2 mm.

Optionally, the modular error code testing apparatus further includes:

the joint spare is fixed in survey test panel with the both sides that the passageway guide rail corresponds, the joint spare have with mounting groove assorted installation department, the surface of installation department with bulb end butt of bulb plunger.

Optionally, the clamping member is made of an elastic material.

Optionally, the clamping member includes a plurality of clamping parts arranged at intervals along the length direction of the test board, and the width area of the preset area of the test board is the interval area of two adjacent clamping parts.

Optionally, the modular error code testing apparatus further includes:

the heat dissipation structure is attached to the heat dissipation bottom surface of the optical module to be tested;

and the compression joint structure is arranged above the optical module to be tested and the test board and used for applying pressure to the optical module to be tested and the test board together.

Optionally, the modular error code testing apparatus further includes:

the elastic plate is made of elastic materials and arranged at the bottom of the compression joint structure, and a spring is further arranged inside the elastic plate.

Optionally, the heat dissipation structure includes:

a heat sink;

the semiconductor wafer is fixed on the upper surface of the heat sink and is attached to the heat dissipation bottom surface of the optical module to be tested;

and the water cooling module is arranged at the bottom of the heat sink and used for circulating cooling liquid.

According to an embodiment of the invention, the characteristic that the height of the ball plunger is adjustable is utilized, so that the floating of the plugging height of different optical modules to be tested can be absorbed, namely, after the optical modules to be tested are plugged into the connector, the height of the test board can be adaptively adjusted, so that the optical modules to be tested are in good contact with the connector, the connector is prevented from being damaged due to large tension caused by multiple times of plugging of the optical modules to be tested with different plugging heights, the service life of the connector is shortened, and the integrity of signals and the success rate of testing are ensured. Furthermore, the flexibility of the test board can be increased by arranging the micro holes, so that the deformability of the test board is enhanced, the connector can be matched with the optical modules to be tested with different plug-in heights together with the ball plunger, the optical modules to be tested are further ensured to be in good contact with the connector, and the service life of the connector is prolonged.

Furthermore, because the fixed end and the floating end (i.e. the end in contact with the ball plunger) of the test board are two ends of the test board in the length direction, the self-deformation of the test board can be used for further adapting to the height difference of each optical module to be tested, so that the optical module to be tested and the connector are prevented from being damaged or generating indentations, and the unqualified appearance of the optical module to be tested is avoided.

According to one embodiment of the invention, the optical module to be tested can be ensured to be in close contact with the heat dissipation structure by arranging the heat dissipation structure and the compression joint structure, and the heat dissipation effect is ensured. The crimping structure is designed to act on the optical module to be tested and the test board simultaneously so as to avoid the influence on the connector when only the optical module to be tested is stressed.

According to an embodiment of the invention, the modularized error code testing device further comprises an elastic plate made of an elastic material and arranged at the bottom of the compression joint structure, and the elastic plate is arranged to prevent the force of the rigid compression joint structure from directly acting on the optical module to be tested and the testing plate, and prevent the optical module to be tested from indentation caused by hard contact through flexible contact of the elastic plate, so that the qualified appearance of the optical module to be tested is ensured.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic partial structure diagram of a modular error code testing device according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a schematic cross-sectional view of a modular error testing device at a ball plunger according to one embodiment of the present invention;

fig. 4 is a schematic structural diagram of an optical module to be tested of the modular error code testing apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a test board of the modular error code testing apparatus according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a modular error testing device at a ball plunger according to another embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a test board and a card of the modular error code testing apparatus according to another embodiment of the invention;

fig. 8 is a schematic partial structure diagram of a modular error code testing device according to another embodiment of the present invention;

fig. 9 is a partial enlarged view at B in fig. 8;

fig. 10 is a schematic structural diagram of a modular error code testing apparatus according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a heat dissipation structure of a modular error code testing device according to an embodiment of the present invention.

Reference numerals:

100-tester, 10-tester box, 101-installation cavity, 20-channel guide rail, 21-installation groove and 22-through hole;

30-test plate, 31-connector, 301-microwell;

40-optical module to be tested, 41-golden finger and 401-heat dissipation bottom surface;

50-ball plunger, 501-ball end;

60-snap member, 61-snap member;

70-a heat dissipation structure, 71-a heat sink, 72-a semiconductor wafer, 73-a water cooling module and 74-a limiting structure;

80-a crimping structure, 81-a cross beam and 82-a hydraulic pressure head;

200-temperature control box, 201-flip.

Detailed Description

Fig. 1 is a schematic partial structure diagram of a modular error code testing apparatus according to an embodiment of the present invention.

Fig. 2 is a partially enlarged view of a portion a in fig. 1. Fig. 3 is a schematic cross-sectional view of a modular error testing device at a ball plunger 50 according to an embodiment of the present invention. Fig. 4 is a schematic structural diagram of an optical module 40 to be tested of the modular error code testing apparatus according to an embodiment of the present invention. Fig. 5 is a schematic structural diagram of a test board 30 of the modular error code testing apparatus according to an embodiment of the invention. As shown in fig. 1, in one embodiment, the modular error code testing device includes a tester cabinet 10, a channel rail 20, a test board 30, and a ball plunger 50 (see fig. 3). The tester casing 10 is formed with a plurality of mounting cavities 101 extending along the length direction thereof, for example, a plurality of mounting cavities 101 sequentially arranged along the width direction of the tester casing 10, and each mounting cavity 101 has a mounting opening at the front end and channel rails 20 mounted on both sides. The sides of the two channel rails 20 facing each other in each mounting cavity 101 are provided with mounting grooves 21 for receiving horizontally arranged test boards 30. One end of the test board 30 in the length direction is fixed to the box, and the other end is provided with a connector 31 for inserting the optical module 40 to be tested. Each channel rail 20 is provided with a through hole 22 arranged vertically at a position close to the connector 31 for mounting the ball plunger 50, and the ball end 501 of the ball plunger 50 abuts against the test board 30. The ball plungers 50 may be disposed on one side of the test board 30 (see the structure on the left side in fig. 3), or may be disposed on both the upper and lower sides of the test board 30, such as in alignment (see the structure on the right side in fig. 3). The floating stroke of the ball plunger 50 is configured to cover a mounting height difference between the mounting of each optical module 40 to be tested to the connector 31 and the connector 31, for example, the floating stroke is 0.5-3 mm. Further, as shown in FIG. 5, a predetermined area of the test plate 30 is provided with a plurality of micro-holes 301 for increasing the flexibility of the test plate 30. Alternatively, the predetermined area extends across the width of the test board 30 and is located in the middle of the test board 30 in its length direction, e.g., the predetermined area occupies an area of 3-5mm in the length direction of the test board 30. In one embodiment, the diameter of the micro-holes 301 is no greater than 0.15mm, such as 0.15mm, 0.18mm, or 0.2 mm. The pitch between two adjacent micro holes 301 is not more than 2 mm. The smaller the size of the micro holes 301, the denser the arrangement, and the better the effect. In order to prevent the micro holes 301 from affecting the electrical performance, the micro holes 301 are not plated with copper, so as to avoid the problems of short circuit and the like caused by the micro holes 301 just passing through the printed wires of different circuit layers. The micro holes 301 may be drilled by laser, the drilling may be performed during the preparation of a PCB (printed circuit board, i.e., the test board 30 in this embodiment), or after the PCB is manufactured and before the electronic component is not soldered on the PCB, the micro holes 301 may be directly ablated on the PCB by a laser beam, the micro holes 301 may be directly drilled on the printed conductive traces on the PCB (at this time, the diameter of the micro holes 301 is not greater than 0.1mm, and since the diameter of the micro holes 301 is small, the influence on the electrical properties of the printed conductive traces is negligible), or the micro holes 301 may be drilled while avoiding the printed conductive traces (at this time, it may be not greater than 0.15 mm). Alternatively, the micro holes 301 may be through holes or micro pits, and are used for increasing flexibility to improve the deformability of the test board 30 when the optical module 40 to be tested is inserted, so as to better generate deformation, thereby absorbing stress caused by a difference in height between the connector 31 and the optical module 40 to be tested when the optical module 40 to be tested is inserted.

The modularized error code testing device of the embodiment can adapt to the assembly position errors of different optical modules 40 to be tested by utilizing the floating stroke of the ball head of the ball plunger and the deformation of the testing board.

In this embodiment, the channel rail 20 with the ball plunger 50 is disposed, and the test board 30 is mounted in the mounting groove 21 of the two channel rails 20, such that the ball end 501 of the ball plunger 50 abuts against the test board 30, the abutting position is close to the side of the test board 30 where the connector 31 is disposed, and the other end of the test board 30 is fixedly connected. After different optical modules 40 to be tested are inserted into the connector 31, because the heights of the various optical modules 40 to be tested when inserted into the connector 31 cannot be completely consistent, the characteristic of adjustable height of the ball plunger 50 itself is utilized in the present embodiment, so that the plug height fluctuation of the optical modules 40 to be tested can be absorbed, that is, after the optical modules 40 to be tested are inserted into the connector 31, the height of the test board 30 can be adaptively adjusted, so that the optical modules 40 to be tested and the connector 31 are in good contact, for example, the golden finger 41 of the optical modules 40 to be tested in fig. 4 is in good contact with the connector 31, the connector 31 is prevented from being damaged due to large tension caused by multiple times of insertion of the optical modules 40 to be tested with different plug heights, the service life of the connector 31 is shortened, and the integrity of signals and the success rate of testing are ensured. Furthermore, the flexibility of the test board 30 can be increased by arranging the micro holes 301, so that the deformability of the test board is enhanced, the connector 31 can be adapted to the optical modules 40 to be tested with different plugging heights together with the ball plunger 50, the optical modules 40 to be tested are further ensured to be in good contact with the connector 31, and the service life of the connector 31 is prolonged.

Further, since the fixed end and the floating end (i.e., the end in contact with the ball plunger 50) of the test board 30 are two ends of the test board 30 in the length direction, the deformation of the test board 30 itself can be used to further adapt to the height difference of each optical module 40 to be tested, so as to prevent the optical module 40 to be tested and the connector 31 from being damaged or generating indentations, and avoid causing the unqualified appearance of the optical module 40 to be tested.

Fig. 6 is a schematic cross-sectional view of a modular error testing device at a ball plunger according to another embodiment of the present invention. In another embodiment, as shown in fig. 6, the error code testing apparatus further includes a clip 60 fixed to both sides of the testing board 30 corresponding to the channel rail 20, for example, by fastening. The clip 60 has a mounting portion that matches the mounting groove 21, and the surface of the mounting portion abuts against the ball end 501 of the ball plunger 50.

In one embodiment, the clip 60 is a member extending along the length of the test board 30 and made of an elastic material so that the clip 60 can deform along with the test board 30 to absorb the height change and stress of the connector 31. The setting of the joint member 60 of this embodiment is convenient for install the test board 30, and also plays the role of assisting the test board 30 to deform.

Fig. 7 is a schematic structural diagram of a test board and a card of a modular error code testing apparatus according to another embodiment of the invention. In another embodiment, as shown in FIG. 7, the latch 60 includes a plurality of latch members 61 spaced along the length of the test board 30 to facilitate mounting of the test board 30. The width area of the predetermined area of the test board 30 is the spacing area of two adjacent sub-connector parts 61, so as to prevent the plurality of sub-connector parts 61 from obstructing the deformation of the test board 30.

Fig. 8 is a schematic partial structure diagram of a modular error code testing apparatus according to another embodiment of the present invention. Fig. 9 is a partial enlarged view at B in fig. 8. Fig. 10 is a schematic structural diagram of a modular error code testing apparatus according to an embodiment of the present invention. As shown in fig. 10, the respective components in the above-described embodiment may be integrated into a tester 100. In another embodiment of the present invention, as shown in fig. 8, the modular error code testing apparatus further includes a heat dissipation structure 70 and a press-fit structure 80, where the heat dissipation structure 70 and the press-fit structure 80 can be integrated into a temperature control box 200 (see fig. 10), where the temperature control box 200 can be provided with a flip 201 that can be rotated relative to the tester 100, so as to open the flip 201 to view components inside the temperature control box 200. The heat dissipation structure 70 is attached to the heat dissipation bottom surface 401 of the optical module 40 to be tested. The compression structure 80 is disposed above the optical module to be tested 40 and the test board 30, and is configured to apply pressure to the optical module to be tested 40 and the test board 30 together, so that the optical module to be tested 40 is in close contact with the heat dissipation structure 70. Alternatively, the crimping structure 80 uses an air cylinder as a power source, and the pressing degree between the heat dissipation structure 70 and the optical module 40 to be tested is controlled by controlling the pressure of the air cylinder.

In this embodiment, by providing the heat dissipation structure 70 and the crimping structure 80, the optical module 40 to be tested can be ensured to be in close contact with the heat dissipation structure 70, and the heat dissipation effect is ensured. The crimping structure 80 is designed to act on the optical module to be tested 40 and the test board 30 at the same time, so as to avoid the influence on the connector 31 when only the optical module to be tested 40 is stressed.

In the embodiment shown in fig. 8, the crimping structure 80 includes a plurality of pressing heads 82 and a cross beam 81 disposed across, the cross beam 81 spans over the plurality of optical modules to be tested 40, and each pressing head 82 is disposed above the cross beam 81 and directly above each optical module to be tested 40 so as to apply the pressure of the air.

In one embodiment, the modular error code testing device further includes an elastic plate (not shown) made of an elastic material and disposed at the bottom of the pressing structure 80. Alternatively, the elastic sheet is made of polyurethane PU elastic material (commonly known as "euler" rubber).

Due to the arrangement of the elastic plate in the embodiment, the force of the rigid compression joint structure 80 is prevented from directly acting on the optical module to be tested 40 and the test board 30, and the indentation of the optical module to be tested 40 caused by hard contact is avoided through the flexible contact of the elastic plate, so that the qualified appearance of the optical module to be tested 40 is ensured.

In a further embodiment, a spring (not shown) is provided inside the elastic plate. The springs can be uniformly arranged, when the crimping structure 80 is pressed down, pressure generated by deformation of the springs is applied to the surface of the optical module to be tested 40 through the high-strength adhesive, and the height difference of the upper surfaces of different optical modules to be tested 40 can be absorbed through the deformation of the high-strength adhesive.

Fig. 11 is a schematic structural diagram of a heat dissipation structure 70 of a modular error code testing apparatus according to an embodiment of the present invention. The spacing structure 74 above the leftmost heat sink 71 is hidden in fig. 11. As shown in fig. 11, in one embodiment, heat dissipation structure 70 includes heat sink 71, semiconductor fin 72, and water cooling module 73. The semiconductor fin 72 is fixed on the upper surface of the heat sink 71 and attached to the heat dissipation bottom surface 401 of the optical module 40 to be tested. The water cooling module 73 is disposed at the bottom of the heat sink 71 and used for circulating cooling liquid, thereby performing a heat exchange function.

Specifically, the heat sink 71 and the water cooling module 73 are both fixedly mounted at the box of the temperature control box, and the top of the heat sink 71 is provided with a limiting structure 74 for limiting the optical module 40 to be tested, for example, a channel is formed, so as to guide the optical module 40 to be tested to be inserted into the connector 31, and also ensure the position accuracy of the optical module 40 to be tested.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A modular error code testing apparatus, comprising:

the tester box is formed with a plurality of installation cavities extending along the length direction of the tester box, the front end of each installation cavity is provided with an installation opening, channel guide rails are installed on two sides of the installation cavity, two channel guide rails in each installation cavity are respectively provided with an installation groove facing to one side of each other and used for being connected with a test board horizontally arranged in an inserting mode, one end of the test board in the length direction is fixed with the box, the other end of the test board is provided with a connector used for being connected with an optical module to be tested in an inserting mode, through holes vertically arranged are formed in the positions, close to the connector, of the channel guide rails and used for installing ball head plungers, the ball head ends of the ball head plungers are abutted to the test board, a plurality of micro holes used for increasing the flexibility of the test board are arranged in preset areas of the test board, and therefore the modularized error code testing device can adapt to different assembling position errors of the optical module to be tested by utilizing the floating stroke of the ball heads of the ball head plungers and the deformation of the test board .

2. The modular error code testing device of claim 1,

the upper side and the lower side of the test board are both provided with the ball plunger.

3. The modular error code testing device of claim 1,

the floating stroke of the ball head plunger is 0.5-3 mm.

4. The modular error code testing device of claim 1,

the preset area penetrates through the width of the test board and is positioned in the middle of the test board in the length direction;

the diameter of each micro hole is not more than 0.15mm, and the distance between every two adjacent micro holes is not more than 2 mm.

5. The modular error code testing device according to any one of claims 1-4, further comprising:

the joint spare is fixed in survey test panel with the both sides that the passageway guide rail corresponds, the joint spare have with mounting groove assorted installation department, the surface of installation department with bulb end butt of bulb plunger.

6. The modular error code testing device of claim 5,

the clamping piece is made of elastic materials.

7. The modular error code testing device of claim 5,

the joint spare includes a plurality of edges the length direction interval of testing the board is arranged is blocked the part, the test board the width area in preset area be two adjacent the interval area of part is blocked.

8. The modular error code testing device of claim 5, further comprising:

the heat dissipation structure is attached to the heat dissipation bottom surface of the optical module to be tested;

and the compression joint structure is arranged above the optical module to be tested and the test board and used for applying pressure to the optical module to be tested and the test board together.

9. The modular error code testing device according to claim 8, further comprising:

the elastic plate is made of elastic materials and arranged at the bottom of the compression joint structure, and a spring is further arranged inside the elastic plate.

10. The apparatus of claim 8, wherein the heat sink comprises:

a heat sink;

the semiconductor wafer is fixed on the upper surface of the heat sink and is attached to the heat dissipation bottom surface of the optical module to be tested;

and the water cooling module is arranged at the bottom of the heat sink and used for circulating cooling liquid.

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