CN114390835A - High-power controller mainboard - Google Patents
High-power controller mainboard Download PDFInfo
- Publication number
- CN114390835A CN114390835A CN202210117330.3A CN202210117330A CN114390835A CN 114390835 A CN114390835 A CN 114390835A CN 202210117330 A CN202210117330 A CN 202210117330A CN 114390835 A CN114390835 A CN 114390835A
- Authority
- CN
- China
- Prior art keywords
- board
- power
- port
- controller
- driving signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 238000013461 design Methods 0.000 claims abstract description 8
- 239000000428 dust Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 238000004146 energy storage Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
- H02P25/16—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the circuit arrangement or by the kind of wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-power controller mainboard which is arranged in a controller shell and comprises a power board, wherein a power MOS tube driving signal connecting port, a controller three-phase electrical connecting port and a temperature acquisition sensor are arranged on the power board; the capacitor plate is provided with a driving signal port and a plurality of through holes, and the driving signal port is connected with the driving signal connecting port of the power MOS tube through a contact pin; the control panel is connected with the port of the capacitor plate, and a main control power supply, a main control MCU and a program burning debugging port are arranged on the control panel; the function connecting plate is connected with the control plate; and the phase line copper column is connected with the power board, and sequentially penetrates through the three-phase electric connection port of the controller and the capacitor board to be connected with the control board. The controller mainboard provided by the invention adopts a wireless structure design, is convenient to install, has high automatic production degree, wide power range and high waterproof performance, and reaches the automobile level.
Description
Technical Field
The invention relates to the technical field of controller circuit board design, in particular to a high-power controller mainboard.
Background
With the wide application and development of high-power motors, the performance requirements of the high-power motors on controllers are higher and higher, at present, a common high-power controller mainly comprises a power supply board, a driving board, a control board and other functional components, and is often complex in structure and disordered in arrangement, so that the installation and production cost is increased; and the heat dispersion of the high-power controller mainboard during operation is not high, and the working performance of the control panel mainboard is greatly influenced. Therefore, a high power controller motherboard with low production and installation cost and high performance is needed.
Disclosure of Invention
In view of the technical defects, the invention aims to provide a high-power controller main board which adopts a wireless structure design and comprises a power board, a capacitor board, a control board and a function connecting board which are sequentially connected, and is convenient to install and high in automatic production degree.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a high-power controller mainboard, which is arranged in a controller shell and comprises,
the power board is provided with a power MOS tube driving signal connection port, a controller three-phase electrical connection port and a temperature acquisition sensor;
the capacitor plate is provided with a driving signal port and a plurality of through holes, and the driving signal port is connected with the driving signal connecting port of the power MOS tube through a contact pin;
the control panel is connected with the capacitor plate and is provided with a main control power supply, a main control MCU and a program burning debugging port;
the function connecting plate is connected with the control plate;
and the phase line copper column is connected with the power board, and sequentially penetrates through the three-phase electric connection port of the controller and the capacitor board and is connected with the control board.
Preferably, the power MOS driving signal connection port is electrically connected to the driving signal port through a pin, and the pin is welded to the bottom end of the driving signal port.
Preferably, a function switching port is arranged on the control board, and the control board is connected with the function connecting port on the bottom layer of the function connecting board through the function switching port.
Preferably, the bottom of the controller shell is a heat dissipation base, and the heat dissipation base is fixedly connected with the power board.
Preferably, a plurality of binding posts and a multi-pin wiring terminal are arranged on the controller shell.
Preferably, the controller shell is a closed cavity, a pressure release valve, a vent valve and a dust cover are arranged on the controller shell, and a current fuse is fixedly connected to the connecting column.
Preferably, the power board is an aluminum substrate, the power MOS driving signal connection ports include J21, J22 and/or J23 ports, and the power board is further provided with power positive electrode ports V1 and V2 and power negative electrode ports G1 and G2.
Preferably, the plurality of via holes on the capacitor plate comprise an opening for passing through the phase line copper column and an opening for connecting with the positive and negative ports of the power supply on the power board, and the capacitor plate is further provided with a torque compensation capacitor, an energy storage capacitor, a power plate driving power supply and a power plate driving circuit.
Preferably, the control panel is further provided with a control unit, a phase current signal acquisition unit, a CAN communication port, a function switching port and current rings H1 and H2, the control panel is connected with the function connecting plate through the function switching port, and the current rings H1 and H2 are provided with holes for the phase wire copper columns to pass through.
Preferably, the control panel is a four-layer panel design, and comprises a weak current signal layer, a strong current signal layer, a weak current stratum and a strong current stratum.
The invention has the beneficial effects that:
(1) the controller mainboard adopts a wireless structure design, chip board layers in the controller are connected with ports through components, and the controller mainboard is connected with a multi-pin wiring terminal through a wiring terminal, so that the whole installation is convenient, and the automatic production degree is high.
(2) The controller shell is provided with the pressure release valve, the vent valve and the heat dissipation base, so that when the temperature and the pressure in the controller are high and high, the internal pressure can be reduced, the sealing structure is effectively controlled, and the waterproof performance is improved.
(3) The controller mainboard can be provided with and use different numbers of power MOS tubes, the power range is wide, and the current fuse is arranged on the controller shell, so that fuses with different current-carrying capacities can be installed according to different power requirements, and the service life and the performance of the controller are ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a power board structure diagram of a main board of a high-power controller according to an embodiment of the present invention;
fig. 2 is a structural diagram of a capacitor board of a main board of a high-power controller according to an embodiment of the present invention;
fig. 3 is a control board structure diagram of a high-power controller motherboard according to an embodiment of the present invention;
fig. 4 is a functional connection board structure diagram of a high-power controller motherboard according to an embodiment of the present invention;
fig. 5 is a structural diagram of a heat dissipation base of a high-power controller motherboard according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a phase line copper pillar and a bus copper pillar mounted on a motherboard of a high-power controller according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an insulating pad mounted on a motherboard of a high-power controller according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a housing of a main board of a high-power controller according to an embodiment of the present invention.
Description of reference numerals:
the device comprises a power board 1, a capacitance board 2, a torque compensation capacitor 21, an energy storage capacitor 22, a power board driving power supply 23, a power board driving circuit 24, a control board 3, a main control power supply 31, a main control MCU32, a functional unit 33, a phase current signal acquisition unit 34, a program burning debugging port 35, a CAN communication port 36, a functional connecting board 4, a heat dissipation base 5, a phase current copper column 6, a bus copper column 7, an insulating pad 8, a shell 9 and a vent valve 91.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1 to 8, the present invention provides a high power controller motherboard disposed in a controller housing 9, including,
the power board 1 is provided with a power MOS tube driving signal connection port, a controller three-phase electrical connection port and a temperature acquisition sensor;
the capacitor plate 2 is provided with a driving signal port and a plurality of through holes, and the driving signal port is connected with a driving signal connecting port of the power MOS tube through a contact pin;
the control panel 3 is connected with the capacitor plate 2, and a main control power supply 31, a main control MCU32 and a program burning debugging port 35 are arranged on the control panel 3;
the functional connecting plate 4 is connected with the control plate 3;
and the phase line copper column 6 is connected with the power board 1, and the phase line copper column 6 sequentially penetrates through the three-phase electrical connection port of the controller and the capacitor board 2 and is connected with the control board 3.
The program burning debugging port 35UD1 is connected with an encryption chip, so that software design can be effectively protected. 2.54 contact pins are welded at the bottom ends of JS21, JS22 and JS23 ports on the control board 3, and are electrically connected with JS24, JS25 and JS26 ports of the capacitor board 2 through the 2.54 contact pins.
In a preferred embodiment of the present invention, the power MOS transistor driving signal connection port is electrically connected to the driving signal port through a pin, and the pin is soldered to a bottom end of the driving signal port.
In a preferred embodiment of the present invention, the control board 3 is provided with a function switching port, and the control board 3 is connected to a function connection port on the bottom layer of the function connection board 4 through the function switching port.
As a preferred embodiment of the present invention, the bottom of the controller housing 9 is a heat dissipation base 5, the heat dissipation base 5 is fixedly connected to the power board 1, and the heat dissipation base 5 is provided with fixing screw holes corresponding to the sizes of the openings of the power board 1.
In a preferred embodiment of the present invention, the controller housing 9 is provided with a plurality of terminals and multi-pin terminals connected to the controller main board.
In a preferred embodiment of the present invention, the controller housing 9 is a sealed cavity, and is provided with a pressure relief valve, a vent valve 91 and a dust cover, and the connecting column is fixedly connected with a current fuse. The controller shell 9 is provided with a pressure release valve, so that the internal pressure can be reduced when the temperature and the pressure in the controller are high and high, the sealing structure is effectively controlled, and the waterproof performance is improved; the dust cover is arranged, so that high voltage can be isolated, and short circuit and the like caused by contact of foreign matters and the like can be prevented; the current fuse is arranged, fuses with different current-carrying capacities are installed according to power requirements, the current-carrying value of the fuses can be automatically cut off for protection, and the current can be automatically recovered after being reduced, so that the service life of the controller and the performance of the controller are ensured; the installed vent valve 91 can use the controller shell 9 to have consistent internal and external pressure, and the waterproof performance is improved.
In a preferred embodiment of the present invention, the power board 1 is an aluminum substrate, the power MOS driving signal connection ports include J21, J22 and J23 ports, and the power board 1 is further provided with power positive ports V1 and V2, power negative ports G1 and G2, and a temperature sensor for monitoring the temperature of the power board 1. Specifically, the power board 1 may adopt an aluminum board design with a board thickness of 2mm, and the controller three-phase electrical connection ports include A, B and C three phases, wherein the a phase includes an a1 port and an a2 port, the B phase includes a B1 port and a B2 port, and the C phase includes a C1 port and a C2 port.
Further, positive negative pole port of power with controller three-phase electrical connection port adopts special-shaped copper post to connect and draws forth, and special-shaped copper post includes generating line copper post 7 and phase line copper post 6, generating line copper post 7 with the embedded screw hole that is provided with in 6 tops of phase line copper post for fixed connection power cord and motor three-phase line, well upper portion are provided with the ring grooving, increase the rubber circle during the assembly, promote waterproof performance, whole tin-plating increases holistic electric property. Meanwhile, the power board 1 can weld MOS tubes with different numbers according to power requirements, and 2.54 pin sockets are welded at ports J21, J22 and J23, so that the power board is conveniently connected with control signals output by the capacitor board 2; the ports J21, J22 and J23 are designed by adopting two-way signal connection, so that the connection effectiveness and reliability are ensured.
As a preferred embodiment of the present invention, the plurality of via holes on the capacitor plate 2 include an opening A, B, C for passing through the phase copper column 6 and openings V1, V2, G1, and G2 for connecting with the positive and negative power ports of the power supply on the power board 1, and the capacitor plate 2 is further provided with a torque compensation capacitor 21, an energy storage capacitor 22, a power board driving power supply 23, a power board driving circuit 24, and an electrical connection end. The driving signal ports on the capacitor plate 2 comprise J18, J19 and J20 ports, and are electrically connected with the power plates 1J21, J22 and J23 through 2.54 pins welded at the bottom ends. The capacitance value and the number of the torque compensation capacitors 21 can be adjusted according to the magnitude of the bus current.
Furthermore, the power board 1 is further provided with V01, V02, G01 and G02 openings, which are respectively connected with V11, V22, G11 and G22 on the capacitor board 2. Specifically, hollow copper columns with tin-plated surface layers are welded on the openings of V01, V02, G1, G2, V1, V2, G01 and G02, and can be correspondingly electrically connected with a copper-clad circuit of the PCB with the bottom layer window of the capacitor plate 2. In other words, the ports of the capacitor plates 2V11, V22, G1, G2, V1, V2, G11 and G22 are circular pad openings, and are provided with windows to expose the PCB and cover copper, and the bus copper post 7 can be effectively contacted after being placed, so that good electrical characteristics are formed. The V11 and V22 ports are power supply anodes and are connected with the anodes of the power plates 1V01 and V02 through copper column cushion blocks. The ports G11 and G22 are power supply cathodes and are connected with the cathodes of the power boards 1G01 and G02 through copper column cushion blocks. The V1 and V2 ports on the power board 1 are power supply positive electrodes, the G1 and G2 ports are power supply negative electrodes, and the positive electrodes V1 and V2 and the negative electrodes G1 and G2 on the capacitor board 2 are correspondingly connected through a bus copper column 7.
As a preferred embodiment of the present invention, the control board 3 is further provided with a function unit 33, a phase current signal collecting unit 34, a CAN communication port 36, a function switching port, and current loops H1, H2, the control board 3 is connected to the function connection board 4 through the function switching port, the current loops H1, H2 are provided with openings for the phase copper post 6 to pass through, and the current loops collect phase current signals through the linear hall. The function switching ports are connected with J01, J02, J03 and J04 ports on the function connecting plate 4, and comprise J11, J21, J1, J2 and J13 ports.
As a preferred embodiment of the invention, the top layer L1 of the functional connecting plate 4 is welded with a 23-pin integrated socket, and the ports of the bottom layers J01, J02, J03 and J04 are welded with JXHB-2.54 pin bases, so that the waterproof performance can be effectively improved, and the installation is convenient.
In a preferred embodiment of the present invention, the control board 3 is a four-layer board design, including a weak current signal layer, a strong current signal layer, a weak current ground layer and a strong current ground layer.
Based on the above-mentioned structure of the controller motherboard, the present invention also provides a specific installation implementation, which comprises,
1. the bottom of the power board 1 is uniformly coated with heat-conducting silicone grease, the power board 1 is placed on the heat dissipation base 5, the hole center of V01 corresponds to the hole center of the heat dissipation base 5 identifier 1, the hole center of V02 corresponds to the hole center of the heat dissipation base 52, and the rest hole positions correspond to one another.
2. Three-phase copper columns (high) are respectively placed in the area of the power board 1A, B, C, and the hole positions correspond to each other.
3. Insulating pads 8 are respectively placed at fixing holes of the phase line copper columns 6, the power board 1 and the heat dissipation base 5 are fixed through screws, and three phases of the power board 1A, B, C are led out through the phase line copper columns 6.
4. The capacitor plate 2 is placed on the power plate 1, the phase line copper column 6 penetrates through three holes of the capacitor plate 2A, B, C, and 2.54 pins welded at ports of J18, J19 and J20 are electrically connected with pin bases welded at ports of the power plates 1J21, J22 and J23.
5. The bottom layer of the capacitor plate 2 is provided with a windowing exposed PCB copper-clad plate, is electrically connected with ports V01, V02, G1, G2, V1, V2, G01 and G02 which are welded with hollow copper columns, and is fixed through screws.
6. The bus copper column 7 is placed in the areas of the capacitor plates 2GND and VCC, and insulating materials are placed in the holes of the bus copper column 7 and the holes of V11, V22, G11 and G22 and are fixed by screws. The capacitor plates 2V11, V22, G11 and G22 are electrically connected with the power plates 1V01, V02, G01 and G02 through hollow copper columns, G1, G2, V1 and V2 in the power plate 1 are electrically connected with the capacitor plates 2G1, G2, V1 and V2, and the positive and negative poles of a power supply of the power plate 1 are led out through the bus copper columns 7.
7. After the capacitor plate 2 is fixed, the control panel 3 is placed on the capacitor plate 2, so that the H1 and H2 current sensors respectively pass through the B-phase and C-phase line copper columns 6, and JS21, JS22 and JS23 on the control panel 3 are respectively electrically connected with 2.54 pin bases welded on the capacitor plates 2JS24, JS25 and JS26 through welded 2.54 pins, and the control panel 3 is fixed on the capacitor plate 2 through an airplane card.
8. J1, J2, J11, J13 and J21 are connected with J01, J02, J03 and J04 on the function connecting plate 4 through a flexible flat cable provided with XHB-2.54 pins and are connected with L1 welded with 23 pins, and all functions are led out.
9. The functional connecting plate 4 is fixed on the shell, and current fuses with different current-carrying capacities are installed according to power requirements after the shell is installed. As shown in figure 8, a fixed current fuse is connected between the binding posts B + and 6, B-is a power supply negative pole binding post, B + is a power supply positive pole binding post, and 2, 3, 4 and 5 in figure 8 are dust cover mounting holes.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A high-power controller mainboard is arranged in a controller shell and is characterized by comprising,
the power board is provided with a power MOS tube driving signal connection port, a controller three-phase electrical connection port and a temperature acquisition sensor;
the capacitor plate is provided with a driving signal port and a plurality of through holes, and the driving signal port is connected with the driving signal connecting port of the power MOS tube through a contact pin;
the control panel is connected with the capacitor plate and is provided with a main control power supply, a main control MCU and a program burning debugging port;
the function connecting plate is connected with the control plate;
and the phase line copper column is connected with the power board, and sequentially penetrates through the three-phase electric connection port of the controller and the capacitor board and is connected with the control board.
2. The main board of a high power controller according to claim 1, wherein the driving signal connection port of the power MOS transistor is electrically connected to the driving signal port through a pin, and the pin is soldered to a bottom end of the driving signal port.
3. The main board of a high power controller as claimed in claim 1, wherein the control board is provided with a function switching port, and the control board is connected to the function connection port on the bottom layer of the function connection board through the function switching port.
4. The high power controller motherboard as recited in claim 1 wherein the bottom of said controller housing is a heat sink base, said heat sink base being fixedly connected to said power board.
5. A high power controller board according to claim 1, wherein the controller case is provided with a plurality of terminals and a plurality of pin terminals.
6. The main board of a high-power controller according to claim 5, wherein the controller housing is a closed cavity, and is provided with a pressure relief valve, a vent valve and a dust cover, and the connecting column is fixedly connected with a current fuse.
7. The main board of a high power controller as claimed in claim 1, wherein the power board is made of aluminum substrate, the power MOS driving signal connection ports include J21, J22 and/or J23 ports, and the power board is further provided with power positive ports V1 and V2 and power negative ports G1 and G2.
8. The power controller board according to claim 1, wherein the vias on the capacitor board include an opening for passing through the phase copper pillar and an opening for connecting with the positive and negative terminals of the power source on the power board, and the capacitor board further includes a torque compensation capacitor, an energy storage capacitor, a power board driving power source and a power board driving circuit.
9. The main board of a high power controller according to claim 1, wherein the control board is further provided with a control unit, a phase current signal acquisition unit, a CAN communication port, a function switching port and current loops H1, H2, the control board is connected with the function connecting board through the function switching port, and the current loops H1, H2 are provided with openings for the phase copper columns to pass through.
10. A high power controller motherboard as recited in claim 1 wherein said control board is a four-layer board design comprising a weak current signal layer, a strong current signal layer, a weak current ground layer and a strong current ground layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117330.3A CN114390835A (en) | 2022-02-08 | 2022-02-08 | High-power controller mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117330.3A CN114390835A (en) | 2022-02-08 | 2022-02-08 | High-power controller mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114390835A true CN114390835A (en) | 2022-04-22 |
Family
ID=81205740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210117330.3A Pending CN114390835A (en) | 2022-02-08 | 2022-02-08 | High-power controller mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114390835A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116633238A (en) * | 2023-07-26 | 2023-08-22 | 成都金洹科科技有限公司 | High-power electric vehicle controller based on aluminum substrate |
| WO2024016849A1 (en) * | 2022-07-20 | 2024-01-25 | 苏州汇川控制技术有限公司 | Power unit and high-voltage frequency converter |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202565215U (en) * | 2012-05-09 | 2012-11-28 | 黄永强 | DC brushless motor controller |
| US8934246B1 (en) * | 2013-01-04 | 2015-01-13 | James Nelson Keig | Modular motor control unit for marine use |
| WO2017092192A1 (en) * | 2015-11-30 | 2017-06-08 | 中山大洋电机股份有限公司 | Electric motor controller |
| CN108964566A (en) * | 2018-08-13 | 2018-12-07 | 南京埃克锐特机电科技有限公司 | Switched reluctance motor controller is used in a kind of driving of electric car |
| US20190335627A1 (en) * | 2016-11-18 | 2019-10-31 | Byd Company Limited | Load controller and electric vehicle having load controller |
| CN212344308U (en) * | 2020-05-11 | 2021-01-12 | 烟台宏瑞汽车有限责任公司 | Motor controller for vehicle |
| CN213694355U (en) * | 2020-10-27 | 2021-07-13 | 枞阳盛控新能源科技有限公司 | Double-main-drive controller assembly for electric automobile |
| CN214901843U (en) * | 2021-05-13 | 2021-11-26 | 华中科技大学 | Internal circuit board mounting structure of motor controller |
-
2022
- 2022-02-08 CN CN202210117330.3A patent/CN114390835A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202565215U (en) * | 2012-05-09 | 2012-11-28 | 黄永强 | DC brushless motor controller |
| US8934246B1 (en) * | 2013-01-04 | 2015-01-13 | James Nelson Keig | Modular motor control unit for marine use |
| WO2017092192A1 (en) * | 2015-11-30 | 2017-06-08 | 中山大洋电机股份有限公司 | Electric motor controller |
| US20190335627A1 (en) * | 2016-11-18 | 2019-10-31 | Byd Company Limited | Load controller and electric vehicle having load controller |
| CN108964566A (en) * | 2018-08-13 | 2018-12-07 | 南京埃克锐特机电科技有限公司 | Switched reluctance motor controller is used in a kind of driving of electric car |
| CN212344308U (en) * | 2020-05-11 | 2021-01-12 | 烟台宏瑞汽车有限责任公司 | Motor controller for vehicle |
| CN213694355U (en) * | 2020-10-27 | 2021-07-13 | 枞阳盛控新能源科技有限公司 | Double-main-drive controller assembly for electric automobile |
| CN214901843U (en) * | 2021-05-13 | 2021-11-26 | 华中科技大学 | Internal circuit board mounting structure of motor controller |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016849A1 (en) * | 2022-07-20 | 2024-01-25 | 苏州汇川控制技术有限公司 | Power unit and high-voltage frequency converter |
| CN116633238A (en) * | 2023-07-26 | 2023-08-22 | 成都金洹科科技有限公司 | High-power electric vehicle controller based on aluminum substrate |
| CN116633238B (en) * | 2023-07-26 | 2023-09-29 | 成都金洹科科技有限公司 | High-power electric vehicle controller based on aluminum substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5764540B2 (en) | Battery module | |
| CN114390835A (en) | High-power controller mainboard | |
| KR100891430B1 (en) | Inverter for hybrid electric vehicle | |
| CN113271021A (en) | Motor controller power module and electric vehicle | |
| CN111757631A (en) | Controller binding post mounting and screwing device and mounting method | |
| EP4280241A1 (en) | Aluminum electrolytic capacitor integrated module | |
| US6867972B2 (en) | Power component assembly for mechatronic integration of power components | |
| CN111031713A (en) | Motor controller and electric control assembly | |
| CN106910849B (en) | Battery module | |
| CN211879491U (en) | Battery management electricity is connected module spare and battery management electricity with coupling assembling | |
| CN212324495U (en) | Motor controller and electric control assembly | |
| CN113921925B (en) | Battery array, battery module and electric vehicle | |
| CN112638100A (en) | Controller and controller module | |
| CN112532148A (en) | Motor controller and electric automobile | |
| CN217063596U (en) | Motor drive device | |
| CN112074079B (en) | Motor controller circuit board and motor controller | |
| CN213213965U (en) | Novel PCB (printed circuit board) | |
| CN221263573U (en) | Brushless motor structure for miniaturized direct-connection type high-temperature-resistant pump | |
| JP5130870B2 (en) | Motor control device | |
| CN112918551A (en) | Motor and controller integrated machine of automobile power-assisted steering pump | |
| CN214757430U (en) | Controller and controller module | |
| CN219761452U (en) | Motor controller driving circuit board assembly, motor controller and vehicle | |
| CN221632802U (en) | Battery cell electrode assembly conductive integrated structure and battery cell using same | |
| CN214315121U (en) | Motor controller and electric automobile | |
| CN221856875U (en) | Starting controller of unmanned aerial vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |