CN114388173B - Directional ultrasonic transparent screen - Google Patents
Directional ultrasonic transparent screen Download PDFInfo
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- CN114388173B CN114388173B CN202111062251.9A CN202111062251A CN114388173B CN 114388173 B CN114388173 B CN 114388173B CN 202111062251 A CN202111062251 A CN 202111062251A CN 114388173 B CN114388173 B CN 114388173B
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 229910052802 copper Inorganic materials 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 39
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical group O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 claims description 18
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 11
- 238000002604 ultrasonography Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 abstract description 13
- 238000013329 compounding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/043—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves
Abstract
The invention discloses a directional ultrasonic transparent screen, which comprises a conductive substrate and a plurality of conductive layers, wherein the conductive layers are sequentially laminated up and down and are arranged on the conductive substrate, one of the conductive layers comprises an in-plane conductive layer and a frame conductive layer, the width of the frame conductive layer is less than 1.5mm, the thickness is less than 1 mu m, the thickness of the in-plane conductive layer is less than or equal to the thickness of the frame conductive layer, the total light transmittance of the conductive layers is more than 80%, and the sheet resistance is at least 1 milliohm-500 milliohms. The full light transmittance of the conductive layer formed by compounding the invention is above 80%, the sheet resistance can be 1 milliohm-500 milliohm at the lowest, the width of the frame wire is lower than 1.5mm, the ultra-narrow frame is realized, the thickness of the frame wire is below 1 mu m, and the formed conductive layer has excellent flatness.
Description
Technical Field
The invention relates to the technical field of directional sounding, in particular to a directional ultrasonic transparent screen.
Background
With the continuous development of display markets, consumers have increasingly stringent requirements on visual effects of display screens, and not only have diversified requirements on appearance designs of the display screens, but also have increasingly higher requirements on screen occupation ratios. The trend in the overall screen technology is to pursue a screen ratio of 90% or more through ultra-narrow frame or even frame-free design.
For the directional ultrasonic transparent screen, in order to meet customer experience, the requirement of an ultra-narrow frame is also gradually becoming the need, and the lower the square resistance of a sounding layer and a substrate layer of the directional ultrasonic transparent screen is, the better the overall performance of the screen is. The mainstream optical transparent conductive film in the market at present comprises an indium tin oxide conductive layer or a nano silver conductive layer, wherein when the sheet resistance of the indium tin oxide conductive layer is lower than 40 omega, the total light transmittance of the indium tin oxide conductive layer is basically lower than 78%, the haze is higher than 2%, and the indium tin oxide conductive film has the advantages of high reliability and poor ductility. When the sheet resistance of the nano silver conductive layer is 10Ω, the total light transmittance of the nano silver conductive layer is about 78%, the ductility of the nano silver conductive layer is higher than that of indium tin oxide, but the finished product of the nano silver conductive layer needs to be provided with a waterproof and air-proof insulating layer on the surface. For the directional ultrasonic transparent screen with high camber, a nano silver conductive layer with high ductility is preferably adopted as the conductive layers of the sounding layer and the substrate layer. The lower the sheet resistance of the conductive layer, the higher the sound pressure, no matter the curved surface directional ultrasonic screen or the non-curved surface.
However, the performance of the optically transparent conductive film needs to be further improved to realize a narrower frame and a directional ultrasound transparent screen with better performance. Therefore, how to provide a directional ultrasonic transparent screen with good overall performance and ultra-narrow frame is a problem to be solved at present.
Disclosure of Invention
The invention aims to provide a directional ultrasonic transparent screen.
In order to achieve the above object, the present invention provides a directional ultrasound transparent screen, comprising a conductive device of a superconducting narrow frame, the conductive device of the superconducting narrow frame comprising: the conductive substrate comprises an in-plane visible area and a frame area positioned at the periphery of the in-plane visible area;
the multilayer conducting layer, the multilayer conducting layer stacks gradually from top to bottom, and set up in on the conductive substrate, one of them layer of multilayer conducting layer includes the face conducting layer and is located the frame conducting layer in the frame region, the face conducting layer is including having a plurality of lines of certain width and interval, a plurality of lines are arranged and are latticed, every the width of line is more than 20um, and the interval between two adjacent lines is greater than 200um, the line of frame conducting layer is integrated structure, the width of frame conducting layer is less than 1.5mm, and thickness is less than 1 mu m, the thickness of in-plane conducting layer is less than or equal to the thickness of frame conducting layer, just the total light transmittance of multilayer conducting layer is more than 80%, and the sheet resistance is minimum 1 milliohm ~500 milliohm.
In a preferred embodiment, the multi-layer conductive layer includes a first conductive layer and at least one second conductive layer, the first conductive layer is disposed on the conductive substrate, the second conductive layer is disposed on the first conductive layer, the first conductive layer includes the in-plane conductive layer and the frame conductive layer, the first conductive layer is a copper trace, and the second conductive layer is an indium tin oxide conductive layer or a nano silver wire conductive layer.
In a preferred embodiment, the multi-layer conductive layer includes a first conductive layer and at least one second conductive layer, the first conductive layer is disposed on the conductive substrate, the second conductive layer is disposed on the first conductive layer, the second conductive layer includes the in-plane conductive layer and the frame conductive layer, the first conductive layer is an indium tin oxide conductive layer or a nano silver wire conductive layer, and the second conductive layer is a copper trace.
In a preferred embodiment, the multi-layer conductive layer includes a first conductive layer and at least one second conductive layer, where the first conductive layer is disposed on the conductive substrate, and the second conductive layer is disposed on the first conductive layer, where the first conductive layer includes the in-plane conductive layer and the frame conductive layer, the first conductive layer is a metal mesh, and the second conductive layer is an indium tin oxide conductive layer, or a nano silver wire conductive layer and a copper trace conductive layer, or an indium tin oxide conductive layer and a copper trace conductive layer.
In a preferred embodiment, the in-plane conductive layer and the bezel conductive layer are realized in one operation or in separate operations.
In a preferred embodiment, when the in-plane conductive layer and the frame conductive layer are implemented by one operation, the operation steps include: and plating copper on the whole surface of the conductive substrate or the first conductive layer to form a first copper layer, and then exposing and developing the first copper layer to form a frame conductive layer and an in-plane copper wiring.
In a preferred embodiment, when the in-plane conductive layer and the frame conductive layer are implemented by performing operations in multiple times, the operation steps include: the frame conductive layer is formed on the conductive substrate or the first conductive layer in a spraying or sputtering mode; and the in-plane conductive layer is formed by firstly carrying out whole-plane copper plating on the conductive substrate or the area of the first conductive layer except the frame conductive layer to form a second copper layer, and then carrying out exposure development on the second copper layer to form an in-plane copper wiring.
In a preferred embodiment, the other conductive layers of the multi-layer conductive layer are formed by spraying or sputtering.
Compared with the prior art, the invention has the following beneficial effects:
1. the optical transparent conductive layer is composited by a plurality of conductive layers, the conductive performance of the conductive layer is improved, the total light transmittance of the composited conductive layer is more than 80%, the sheet resistance can be 1 milliohm-500 milliohms at the lowest, the width of the frame wire is lower than 1.5mm, the ultra-narrow frame is realized, the thickness of the frame wire is less than 1 mu m, and the formed conductive layer has excellent flatness.
2. The invention adopts the latticed copper wire or metal lattice to replace the prior indium tin oxide conductive layer or nano silver layer, thereby greatly reducing the sheet resistance while ensuring the full light transmittance of the conductive layer, and greatly improving the sound pressure performance of the manufactured directional ultrasonic transparent screen compared with the prior optical transparent conductive layer.
Drawings
FIG. 1 is a schematic diagram of a conductive device according to the present invention;
FIG. 2 is a schematic diagram of a conductive substrate according to the present invention;
FIG. 3 is a schematic top view of a conductive structure according to the present invention;
FIG. 4 is a schematic view of a conductive substrate with a spacing structure according to the present invention;
fig. 5 is a schematic structural diagram of a conductive device in embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of a conductive device in embodiment 2 of the present invention;
fig. 7 is a schematic structural diagram of a conductive device in embodiment 3 of the present invention.
The reference numerals are:
1. the device comprises a conductive substrate, 11, an in-plane visible area, 12, a frame area, 2, a conductive layer, 21, an in-plane conductive layer, 211, a wiring, 22, a frame conductive layer, 3, a limiting structure, 31, a first limiting part, 32 and a second limiting part.
Detailed Description
The following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
As shown in fig. 1, the conductive device with a superconductive narrow frame disclosed by the invention comprises a conductive substrate 1 and a plurality of conductive layers 2 formed on the conductive substrate 1. In practice, the conductive substrate 1 may be a substrate layer, such as glass, or a sound-emitting layer, such as a PET substrate. As shown in fig. 2, the conductive substrate 1 specifically includes an in-plane visible area 11 and a frame area 12 located at the periphery of the in-plane visible area 11. In practice, the width of the frame region 12 is generally 3mm or less.
The multi-layer conductive layer 2 is arranged on the conductive substrate 1, and is arranged on the conductive substrate 1 in a stacked manner. One of the multiple conductive layers 2 includes an in-plane conductive layer 21 located in the in-plane visible area 11 and a frame conductive layer 22 located in the frame area 12, where the in-plane conductive layer 21 is used for loading current, and the frame conductive layer 22 is used for frame routing. Specifically, the multi-layer conductive layer 2 includes a first conductive layer and at least one second conductive layer, where the first conductive layer is disposed on the conductive substrate, and the second conductive layer is disposed on the first conductive layer, and when implemented, the conductive layers including the in-plane conductive layer 21 and the frame conductive layer 22 may be the first conductive layer or the second conductive layer.
Preferably, the in-plane conductive layer 21 includes a plurality of traces 211 having a certain width and a certain pitch, and the plurality of traces 211 are generally arranged in a grid shape. In order to ensure the in-plane visual effect, the width of the trace 211 of the in-plane conductive layer 21 is generally more than 20um, and the interval between two adjacent traces 211 is more than 200um. The frame conductive layer 22 is located at the periphery of the in-plane conductive layer 21, and preferably, in order to ensure that the frame wiring can work normally under high current and increase heat dissipation, the frame conductive layer 22 is designed as an integrated unit, i.e. not divided into finer lines. Preferably, the width of the frame conductive layer 22 is 1.5mm or less and the thickness is 1 μm or less. In addition, in order to ensure that the frame wire can normally work under high current, the thickness of the in-plane conductive layer 21 may be different from the thickness of the frame conductive layer 22, preferably, the thickness of the in-plane conductive layer 21 is smaller than or equal to the thickness of the frame conductive layer 22, for example, the thickness of the in-plane conductive layer 21 is in a nanometer (nm) level, for example, 10 nm, and the thickness and the width of the in-plane conductive layer 21 can be calculated according to the loaded current value.
The conductive layer (such as the first conductive layer or the second conductive layer) including the in-plane conductive layer 21 and the frame conductive layer 22 is preferably a copper trace or a metal mesh. Wherein, the in-plane conductive layer 21 and the frame conductive layer 22 may be realized by one operation or by a plurality of operations. Specifically, for example, when copper is routed, the in-plane conductive layer 21 and the frame conductive layer 22 may be formed on the conductive substrate 1 or the first conductive layer by sputtering or spraying a first copper layer, and then the in-plane conductive layer 21 and the frame conductive layer 22 are formed simultaneously at one time by exposing and developing the first copper layer. In other embodiments, the in-plane conductive layer 21 and the frame conductive layer 22 may be implemented in multiple operations, specifically, the frame conductive layer 22 is formed on the conductive substrate 1 or the first conductive layer by spraying or sputtering; the in-plane conductive layer 21 is formed by first performing copper plating on the entire surface of the conductive substrate 1 or the region of the first conductive layer except the frame conductive layer 22 to form a second copper layer, and then performing exposure development on the second copper layer to form an in-plane copper trace.
The frame conductive layer 22 is preferably shaped by the spacing structure 3. Specifically, as shown in fig. 4, the limiting structure 3 includes a first limiting portion 31 and a second limiting portion 32, and a frame conductive region is enclosed between the first limiting portion 31 and the second limiting portion 32, and the frame conductive layer 22 is formed in the frame conductive region.
Other conductive layers of the multi-layer conductive layer 2 may employ one or a combination of indium tin oxide, nano silver wires, copper traces. In particular, the coating can be formed by spraying or sputtering.
Through the matching of the parameters of the conducting layer material, the line width, the interval, the frame conducting layer thickness, the width and the like of the in-plane conducting layer, the total light transmittance of the finally formed multi-layer conducting layer is more than 80%, and the sheet resistance is at least 1 milliohm to 500 milliohms.
The structure of a superconducting narrow-frame conductive device according to the present invention will be described in several embodiments.
Example 1
As shown in fig. 5, the conductive device with a superconducting narrow frame disclosed in embodiment 1 of the present invention includes a conductive substrate 1, a first conductive layer and a second conductive layer, wherein the first conductive layer is disposed on the conductive substrate 1, and the second conductive layer is disposed on the first conductive layer. The first conductive layer is a copper trace, and as shown in fig. 3, the first conductive layer includes an in-plane conductive layer 21 and a frame conductive layer 22, and the in-plane conductive layer 21 and the frame conductive layer 22 are preferably implemented by one operation. Specifically, a copper layer is first generated on the conductive substrate 1 by a full-face sputtering method, and then the in-plane conductive layer 21 and the frame conductive layer 22 are formed by an exposure and development method, in which the thickness of the in-plane conductive layer 21 is the same as the thickness of the frame conductive layer 22. In this embodiment 1, in order to ensure the visual effect, the width of the copper trace of the in-plane conductive layer 21 is more than 20um, the distance between two adjacent copper traces is more than 200um, and the thickness of the in-plane conductive layer 21 can reach the nanometer level, specifically, the thickness and the width of the copper trace can be calculated according to the loaded current value. In order to ensure the normal operation of high current and increase heat dissipation, the copper traces of the frame conductive layer 22 are designed as an integral unit and are not divided into finer lines. For example, the width of the frame conductive layer 22 is 1.5mm or less and the thickness thereof is 1 μm or less.
In addition, in order to ensure that the frame wiring can work normally under high current, the copper thickness of the frame conductive layer 22 and the thickness of the in-plane conductive layer 21 of the in-plane visible area 11 can be designed in different ways: if the thickness of the in-plane conductive layer 21 in the in-plane visible area 11 is in the nanometer (nm) level, the thickness and width of the frame conductive layer 22 are calculated by the frame trace according to the loaded current value, for example, the thickness can reach several um levels. At this time, the in-plane conductive layer 21 and the frame conductive layer 22 are implemented by a plurality of operations, specifically, the frame conductive layer 22 is formed in the frame region 12 of the conductive substrate 1 by spraying or sputtering; the in-plane conductive layer 21 is formed by first performing copper plating on the entire surface of the in-plane visible region 11 of the conductive substrate 1 to form a second copper layer, and then performing exposure development on the second copper layer to form an in-plane copper trace.
When the second conductive layer is implemented, indium tin oxide or nano silver wires can be adopted, and the second conductive layer can be formed on the first conductive layer in a spraying or sputtering mode.
The total light transmittance of the finally formed multilayer conductive layer in embodiment 1 of the invention is more than 80%, and the sheet resistance can reach milliohm level at the lowest in the frame area, for example, can be 1 milliohm to 500 milliohm at the lowest.
Example 2
As shown in fig. 6, the conductive device with a superconducting narrow frame according to embodiment 2 of the present invention includes a conductive substrate 1, a first conductive layer and a second conductive layer, wherein the first conductive layer is disposed on the conductive substrate, and the second conductive layer is disposed on the first conductive layer. When the first conductive layer is implemented, indium tin oxide or nano silver wires can be adopted, and the first conductive layer can be formed on the conductive substrate 1 in a spraying or sputtering mode. The second conductive layer is a copper trace, which includes an in-plane conductive layer 21 and a frame conductive layer 22, and the in-plane conductive layer 21 and the frame conductive layer 22 are preferably implemented by one operation. Specifically, a copper layer is first generated on the first conductive layer by adopting a whole-surface sputtering method, and then the in-surface conductive layer 21 and the frame conductive layer 22 are formed by adopting an exposure and development method, wherein the thickness of the in-surface conductive layer 21 is the same as that of the frame conductive layer 22. In this embodiment 2, in order to ensure the visual effect, the width of the copper trace of the in-plane conductive layer 21 is more than 20um, the distance between two adjacent copper traces is more than 200um, and the thickness of the in-plane conductive layer 21 can reach the nanometer level, specifically, the thickness and the width of the copper trace can be calculated according to the loaded current value. In order to ensure the normal operation of high current and increase heat dissipation, the copper traces of the frame conductive layer 22 are designed as an integral unit and are not divided into finer lines. For example, the width of the frame conductive layer 22 is 1.5mm or less and the thickness thereof is 1 μm or less.
In addition, in order to ensure that the frame wiring can work normally under high current, the copper thickness of the frame conductive layer 22 and the thickness of the in-plane conductive layer 21 in the in-plane visible region can be designed in different ways: if the thickness of the in-plane conductive layer 21 in the in-plane visible area 11 is in the nanometer (nm) level, the thickness and width of the frame conductive layer 22 are calculated by the frame trace according to the loaded current value, for example, the thickness can reach several um levels. At this time, the in-plane conductive layer 21 and the frame conductive layer 22 are implemented by a plurality of operations, specifically, the frame conductive layer 22 is formed in the frame region 12 of the first conductive layer by spraying or sputtering; the in-plane conductive layer 21 is formed by performing copper plating on the entire surface of the in-plane visible region of the first conductive layer to form a second copper layer, and then exposing and developing the second copper layer to form an in-plane copper trace.
The total light transmittance of the finally formed multilayer conductive layer in embodiment 2 of the invention is more than 80%, and the sheet resistance can reach milliohm level at the lowest in the frame area, for example, can be 1 milliohm to 500 milliohm at the lowest.
Example 3
As shown in fig. 7, the conductive device with a superconducting narrow frame according to embodiment 3 of the present invention includes a conductive substrate 1, a first conductive layer and a second conductive layer, wherein the first conductive layer is disposed on the conductive substrate 1, and the second conductive layer is disposed on the first conductive layer. The first conductive layer is a metal mesh, and includes an in-plane conductive layer 21 and a frame conductive layer 22. Specifically, in order to ensure the visual effect, the metal wire width of the metal mesh of the in-plane conductive layer 21 is more than 20um, the distance between two adjacent metal wires is more than 200um, the thickness of the in-plane conductive layer 21 can reach the nanometer level, and the thickness and the width of the metal wires can be calculated according to the loaded current value. In order to ensure the normal operation of high current and increase heat dissipation, the metal wiring of the frame conductive layer 22 is designed as an integrated one and is not divided into finer lines. If the width of the frame conductive layer 22 is 1.5mm or less, the thickness is 1 μm or less, and the flatness is excellent.
In addition, in order to ensure that the frame wiring can work normally under high current, the thickness of the frame conducting layer and the thickness of the in-plane conducting layer can be designed differently: if the thickness of the in-plane conducting layer is in the level of nanometers (nm), the thickness and the width of the conducting layer of the frame are calculated according to the loaded current value by the frame wiring, and if the thickness can reach the level of several um.
When the second conductive layer is implemented, indium tin oxide or nano silver wires, or a copper wiring conductive layer is added to the nano silver wires conductive layer, or a copper wiring conductive layer is added to the indium tin oxide conductive layer.
The total light transmittance of the finally formed multilayer conductive layer in embodiment 1 of the invention is more than 80%, and the sheet resistance can reach milliohm level at the lowest in the frame area, for example, can be 1 milliohm to 500 milliohm at the lowest.
The invention also discloses a directional ultrasonic transparent screen, which comprises the conductive device with the superconducting narrow frame.
The invention has the advantages that 1, the optical transparent conductive layer is realized by compounding a plurality of conductive layers, the full light transmittance of the conductive layer formed by compounding is above 80 percent while the conductive performance of the conductive layer is improved, the sheet resistance can be 1 milliohm-500 milliohm at the lowest, the width of the frame wire is lower than 1.5mm, the ultra-narrow frame is realized, the thickness of the frame wire is below 1 mu m, and the formed conductive layer has excellent flatness. 2. The invention adopts the latticed copper wire or metal lattice to replace the prior indium tin oxide conductive layer or nano silver layer, thereby greatly reducing the sheet resistance while ensuring the full light transmittance of the conductive layer, and greatly improving the sound pressure performance of the manufactured directional ultrasonic transparent screen compared with the prior optical transparent conductive layer.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (8)
1. The utility model provides a directional ultrasonic transparent screen which characterized in that, directional ultrasonic transparent screen includes the electrically conductive device of the narrow frame of superconductive, the electrically conductive device of the narrow frame of superconductive includes:
the conductive substrate comprises an in-plane visible area and a frame area positioned at the periphery of the in-plane visible area;
the multilayer conducting layer, the multilayer conducting layer stacks gradually from top to bottom, and set up in on the conductive substrate, one of them conducting layer in the multilayer conducting layer is copper wire or metal net, one of them conducting layer is including being located the in-plane conducting layer in the in-plane visual area with be located the frame conducting layer in the frame region, the in-plane conducting layer is including having a plurality of wires of certain width and interval, a plurality of wires are arranged and are the latticed, every the width of wire is more than 20um, and the interval between two adjacent wires is greater than 200um, the wire of frame conducting layer is integrated structure, the width of frame conducting layer is below 1.5mm, and thickness is below 1 mu m, the thickness of in-plane conducting layer is less than or equal to the thickness of frame conducting layer, just the total light transmissivity of multilayer conducting layer is more than 80%, and the sheet resistance is 1 milliohm to 500 milliohm at the minimum.
2. The directional ultrasound transparent screen of claim 1, wherein the plurality of conductive layers comprises a first conductive layer and at least one second conductive layer, the first conductive layer is disposed on the conductive substrate, the second conductive layer is disposed on the first conductive layer, the first conductive layer comprises the in-plane conductive layer and a frame conductive layer, the first conductive layer is a copper trace, and the second conductive layer is an indium tin oxide conductive layer or a nano silver wire conductive layer.
3. The directional ultrasound transparent screen of claim 1, wherein the plurality of conductive layers comprises a first conductive layer and at least one second conductive layer, the first conductive layer is disposed on the conductive substrate, the second conductive layer is disposed on the first conductive layer, the second conductive layer comprises the in-plane conductive layer and a frame conductive layer, the first conductive layer is an indium tin oxide conductive layer or a nano-silver wire conductive layer, and the second conductive layer is a copper trace.
4. The directional ultrasound transparent screen of claim 1, wherein the multi-layer conductive layer comprises a first conductive layer and at least one second conductive layer, the first conductive layer is disposed on the conductive substrate, the second conductive layer is disposed on the first conductive layer, the first conductive layer comprises the in-plane conductive layer and a frame conductive layer, the first conductive layer is a metal mesh, and the second conductive layer is an indium tin oxide conductive layer, or a nano silver wire conductive layer and a copper trace conductive layer, or an indium tin oxide conductive layer and a copper trace conductive layer.
5. A directional ultrasound transparent screen as claimed in claim 2 or claim 3, wherein the in-plane conductive layer and the bezel conductive layer are achieved in one operation or in separate operations.
6. The directional ultrasound transparent screen of claim 5, wherein the in-plane conductive layer and the bezel conductive layer are implemented in one operation, the operation steps comprising: and plating copper on the whole surface of the conductive substrate or the first conductive layer to form a first copper layer, and then exposing and developing the first copper layer to form a frame conductive layer and an in-plane copper wiring.
7. The directional ultrasound transparent screen of claim 5, wherein the in-plane conductive layer and the frame conductive layer are implemented by separate operations, the operating steps comprising: the frame conductive layer is formed on the conductive substrate or the first conductive layer in a spraying or sputtering mode; and the in-plane conductive layer is formed by firstly carrying out whole-plane copper plating on the conductive substrate or the area of the first conductive layer except the frame conductive layer to form a second copper layer, and then carrying out exposure development on the second copper layer to form an in-plane copper wiring.
8. A directional ultrasound transparent screen as claimed in claim 1, wherein the other conductive layers of the multi-layer conductive layer are formed by spraying or sputtering.
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