JP2013120590A - Structural material for touch panel and touch panel structure - Google Patents

Structural material for touch panel and touch panel structure Download PDF

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JP2013120590A
JP2013120590A JP2011282250A JP2011282250A JP2013120590A JP 2013120590 A JP2013120590 A JP 2013120590A JP 2011282250 A JP2011282250 A JP 2011282250A JP 2011282250 A JP2011282250 A JP 2011282250A JP 2013120590 A JP2013120590 A JP 2013120590A
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conductive metal
structural material
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metal wires
electrode substrate
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JP5734828B2 (en
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Kenji Nakatani
健司 中谷
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Touch Panel Laboratories Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a structure for a capacitive touch panel, capable of being adapted to a large-size screen.SOLUTION: A set of two to six thin conductive metal wires each having a width of 1 to 10 μm is formed in a wave shape with intervals of 1.0 to 3.0 mm therebetween and in parallel with each other, thereby configuring a conductive line on one surface of a transparent film. The conductive metal wires of each set are electrically connected with each other in each conductive line, and the conductive lines compose an electrode substrate [A] in which a large number of conductive lines form a net-like pattern. In the same way, an electrode substrate [B] is configured on one surface of another transparent film. The electrode substrate [A] and the electrode substrate [B] are affixed with each other through an insulating transparent adhesive in such a manner that the surfaces of the substrates with the conductive metal wires formed face each other and that the direction in parallel with the wave shape of the conductive metal wires of one of the substrates is orthogonal to that of the other substrate. The conductive line of each set on the electrode substrate [A] and the electrode substrate [B] is electrically connected to a terminal at its end.

Description

本発明は、タッチパネル用構造材料に関する。さらに詳しくは、静電容量式タッチパネルに有利に使用できる構造材料に関する。また本発明は静電容量式タッチパネル構造体にも関する。  The present invention relates to a structural material for a touch panel. More specifically, the present invention relates to a structural material that can be advantageously used for a capacitive touch panel. The present invention also relates to a capacitive touch panel structure.

タッチパネルは構造が比較的簡単であり且つ安価であり、指入力が可能であって、その利便性の良さから市場が拡大しつつある。そのタッチパネルは抵抗膜式、静電容量式及び光学式など種々の方式が提案されているが、これらのうち抵抗膜式及び静電容量式が主流を占めている。
特に静電容量式は、マルチ入力が比較的容易であることから携帯電話を中心にその市場が急速に増大している。しかし現在市販されている静電容量式タッチパネルはその表示面のサイズが小型であり、大きい画面のものは未だ普及してはいない。その理由の1つは、静電容量式に適した構造材料の電気特性が大きい画面に対応できる程充分でないことにある。
The touch panel has a relatively simple structure and is inexpensive, allows finger input, and the market is expanding due to its convenience. Various types of touch panels such as a resistance film type, a capacitance type, and an optical type have been proposed. Of these, the resistance film type and the capacitance type are dominant.
In particular, the capacitance type is rapidly increasing in the market centering on mobile phones, since multi-input is relatively easy. However, the capacitive touch panel currently on the market has a small display surface, and a large screen has not yet spread. One of the reasons is that the structural material suitable for the capacitance type is not sufficient to cope with a screen having a large electric characteristic.

本発明者は、透明性及び導電性が優れ、且つ大型画面化に適したタッチパネル構造材料、殊に静電容量式に適したタッチパネル構造材料を提供することを目的として研究した結果、本発明に到達したものである。  As a result of research conducted for the purpose of providing a touch panel structure material excellent in transparency and conductivity and suitable for a large screen, in particular, a touch panel structure material suitable for a capacitance type, the present inventor has obtained the present invention. It has been reached.

本発明者は、導電性金属の微細線を透明フィルムの表面に多数配列して形成させた電極基板を得ることが最近比較的可能になったことに鑑み、その電極基板における導電性金属の微細線の形や細さ、さらに多数の微細線の配置の形態を種々検討し研究を進めた結果、或る一定の微細線を一定間隔で多数波形かつ平行に配置しかつ隣接する2〜6本を一組として多数の導電ラインとして配置したものは、静電容量式タッチパネル用の構造材料として、特に大型画面用のものの構造材料として有利に利用できることが判明した。
本発明はかかる究明事実に基いて到達されたものであって、本発明によれば下記[I]〜[XII]のタッチパネル用構造材料および静電容量式タッチパネル構造体が提供される。
In light of the fact that it has recently become relatively possible to obtain an electrode substrate formed by arranging a large number of fine lines of conductive metal on the surface of a transparent film, the present inventor As a result of various investigations and researches on the shape and thinness of the lines and the arrangement of a large number of fine lines, a certain number of fine lines are arranged in parallel in a plurality of waveforms at regular intervals and 2 to 6 adjacent lines. It has been found that a plurality of conductive lines arranged as a set can be advantageously used as a structural material for a capacitive touch panel, particularly as a structural material for a large screen.
The present invention has been achieved on the basis of such investigation facts, and according to the present invention, the following structural materials for touch panels and capacitive touch panel structures [I] to [XII] are provided.

[I](1)透明フィルム(A)の片面に、(a−1)多数の導電性金属線が1.0〜3mmの間隔で波形にかつ平行して形成され、(a−2)各導電性金属線は、幅が1〜10μmであり、(a−3)各導電性金属線は、隣接する2〜6本が一組の導電ラインとなって、多数の導電ラインを形成し、(a−4)各組の導電ラインは、各組において導電性金属線が互いに電気的に接続するように導電性金属線により網状化したパターンを形成している電極基板[A]及び透明フィルム(B)の片面に(b−1)多数の導電性金属線が1.0〜3.0mmの間隔で波形にかつ平行して形成され、(b−2)各導電性金属線は、幅が1〜10μmであり、(b−3)各導電性金属線は隣接する2〜6本が一組の導電ラインとなって、多数の導電ラインを形成し、(b−4)各組の導電ラインは、各組において導電性金属線が互いに電気的に接続するように導電性金属線により網状化したパターンを形成している電極基板[B]より構成され、
(2)前記電極基板[A]及び電極基板[B]とは、それぞれの導電性金属線が形成されている面が向い合いかつそれぞれの導電性金属線の波形にかつ平行する方向が直交するように、絶縁性の透明接着剤層を介して貼り合され、
(3)前記電極基板[A]及び電極基板(B)における各組における導電ラインは、それぞれの組の端末から電気的に端子に接続されていることを特徴とするタッチパネル用構造材料。
[I] (1) On one side of the transparent film (A), (a-1) a large number of conductive metal wires are formed in parallel with a waveform at intervals of 1.0 to 3 mm, (a-2) The conductive metal wire has a width of 1 to 10 μm, and (a-3) each conductive metal wire is a set of two to six adjacent conductive lines, forming a number of conductive lines, (A-4) The electrode substrate [A] and the transparent film in which each set of conductive lines has a meshed pattern of conductive metal wires so that the conductive metal wires are electrically connected to each other in each set (B-1) A large number of conductive metal wires are formed in parallel with the waveform at intervals of 1.0 to 3.0 mm on one side of (B), and (b-2) each conductive metal wire has a width (B-3) Each conductive metal wire is a set of two to six adjacent conductive lines, and a number of conductive lines are formed. (B-4) An electrode substrate in which each set of conductive lines has a meshed pattern with conductive metal wires such that the conductive metal wires are electrically connected to each other in each set [ B],
(2) The electrode substrate [A] and the electrode substrate [B] face each other on the surface on which the respective conductive metal wires are formed, and the directions parallel to the waveforms of the respective conductive metal wires are orthogonal to each other. So that it is bonded through an insulating transparent adhesive layer,
(3) The structural material for a touch panel, wherein the conductive lines in each set of the electrode substrate [A] and the electrode substrate (B) are electrically connected to terminals from the terminals of each set.

[II]前記導電ラインにおける導電性金属線は、等間隔で波形にかつ平行に形成されている前記[I]記載の構造材料。
[III]前記導電性金属線は、幅が2〜8μmである前記[I]記載の構造材料。
[IV]前記導電性金属線は、厚みが0.1〜5μmである前記[I]記載の構造材料。
[V]前記導電性金属線は、隣接する3〜5本が一組の導電ラインを形成している前記[I]記載の構造材料。
[II] The structural material according to [I], wherein the conductive metal wires in the conductive line are formed in a waveform and in parallel at equal intervals.
[III] The structural material according to [I], wherein the conductive metal wire has a width of 2 to 8 μm.
[IV] The structural material according to [I], wherein the conductive metal wire has a thickness of 0.1 to 5 μm.
[V] The structural material according to [I], wherein 3 to 5 adjacent conductive metal lines form a set of conductive lines.

[VI]前記導電性金属線はCu、Ni、Al、Ag、Cr、これら2種以上よりなる合金またはこれら2種以上の金属の複層で積層された構造で形成されている前記[I]記載の構造材料。
[VII]前記絶縁性の透明接着剤層は、50〜300μmの厚みを有する前記[I]記載の構造材料。
[VIII]前記透明フィルムは、50〜300μmの厚みを有すポリエチレンテレフタレートフィルムである前記[I]記載の構造材料。
[IX]前記網状化した導電性金属線(網状化線)は、波形でかつ平行した導電性金属線の方向に対して直角方向に形成されている前記[I]記載の構造材料。
[X]85%以上の開口率を有する前記[I]記載の構造材料。
[XI]前記[I]記載の構造材料により構成された静電容量式タッチパネル構造体。
[XII]前記[I]記載の構造材料により構成されたタッチパネル構造体を、厚みが0.5〜4mmのガラス板或いは厚みが0.5〜2mmの透明樹脂シートで表面保護した構造を有する静電容量式タッチパネル構造体。
[VI] The conductive metal wire is formed of a structure in which Cu, Ni, Al, Ag, Cr, an alloy composed of two or more of these, or a multilayer of these two or more metals is laminated. The structural material described.
[VII] The structural material according to [I], wherein the insulating transparent adhesive layer has a thickness of 50 to 300 μm.
[VIII] The structural material according to [I], wherein the transparent film is a polyethylene terephthalate film having a thickness of 50 to 300 μm.
[IX] The structural material according to [I], wherein the meshed conductive metal wire (netted wire) is corrugated and formed in a direction perpendicular to the direction of the parallel conductive metal wire.
[X] The structural material according to the above [I], which has an aperture ratio of 85% or more.
[XI] A capacitive touch panel structure formed of the structural material described in [I].
[XII] A static structure having a structure in which the surface of the touch panel structure composed of the structural material described in [I] is protected with a glass plate having a thickness of 0.5 to 4 mm or a transparent resin sheet having a thickness of 0.5 to 2 mm. Capacitive touch panel structure.

本発明による構造材料は、微細な多数の導電性金属線が一定間隔で波形にかつ平行に透明フィルムの片面の表面に形成され、且つその金属線の数本が一組となって1つの導電ラインを形成している。そのため全体として透明性に優れ、また導電性金属線の一部に破損や断線が発生したとしても、その金属線の複数本によって一つの導電ラインが形成されしかもその複数本が互いに金属線によって網状化されたパターンを有しているので、導電ラインが断線し電気的接続が切断することはない。しかも、導電性金属線が波形でかつ平行に形成されているのでモアレ現象を防止する効果を有している。また透明フィルムの面上に形成された微細な導電性金属線は導電性に優れて、微量の静電容量も感度よく捕捉できるので、静電容量式タッチパネル用の構造材料に適している。特に大型の画面を有する静電容量式タッチパネル用の構造材料に適している。  In the structural material according to the present invention, a large number of fine conductive metal wires are formed on a surface of one side of a transparent film in a wavy shape and in parallel at regular intervals. Forming a line. Therefore, it has excellent transparency as a whole, and even if breakage or disconnection occurs in a part of the conductive metal wire, one conductive line is formed by a plurality of the metal wires, and the plurality of the metal wires are reticulated by the metal wires. In this case, the conductive line is not broken and the electrical connection is not broken. In addition, the conductive metal wires are corrugated and formed in parallel, and therefore have the effect of preventing the moire phenomenon. In addition, the fine conductive metal wire formed on the surface of the transparent film is excellent in conductivity and can capture a very small amount of capacitance with high sensitivity, and is therefore suitable as a structural material for a capacitive touch panel. It is particularly suitable for a structural material for a capacitive touch panel having a large screen.

図1は本発明のタッチパネル用構造材料を構成する電極基板の平面図を模式的に示すものである。FIG. 1 schematically shows a plan view of an electrode substrate constituting the structural material for a touch panel of the present invention.

以下、本発明のタッチパネル用構造材料を図面により説明する。
図1は、本発明のタッチパネル用構造材料を構成する電極基板の平面図を模式的に示したものである。図1において[A]は電極基板[A]を、[B]は電極基板[B]を示す、後述するように、電極基板[A]と[B]はそれぞれ透明フィルムの片面にほぼ同じパターンの導電性金属線が配置されたものであるが、両基板は全く同じ形態のパターンである必要はない。
Hereinafter, the structural material for a touch panel of the present invention will be described with reference to the drawings.
FIG. 1 schematically shows a plan view of an electrode substrate constituting the structural material for a touch panel of the present invention. In FIG. 1, [A] indicates an electrode substrate [A], and [B] indicates an electrode substrate [B]. As will be described later, the electrode substrates [A] and [B] have substantially the same pattern on one side of the transparent film. However, the two substrates do not have to have the same pattern.

本発明における電極基板[A]および[B]は、いずれも透明フィルムの片面に多数の導電性金属線が波形にかつ平行に形成されたものである。この透明フィルムとしては、樹脂フィルムであって透明性に優れたものであれば良く、例えば、ポリエステルフィルム、ポリカーボネートフィルム、ポリオレフィンフィルムまたはポリシクロオレフィンフィルムなどが例示できるが好ましくはポリエステルフィルムである。具体的には、ポリエチレンテレフタレート(PET)フィルムまたはポリエチレン−2.6−ナフタレート(PEN)フィルムが好ましく、特に好ましいのはポリエチレンテレフタレート(PET)フィルムである。これら透明フィルムは2軸延伸されたものが好ましく使用され、その厚みは、50〜300μmが適当であり、特に好ましくは80〜250μmである。  The electrode substrates [A] and [B] in the present invention are each formed by forming a large number of conductive metal wires in a wavy shape and in parallel on one side of a transparent film. The transparent film may be a resin film that has excellent transparency, and examples thereof include a polyester film, a polycarbonate film, a polyolefin film, and a polycycloolefin film, but a polyester film is preferable. Specifically, a polyethylene terephthalate (PET) film or a polyethylene-2.6-naphthalate (PEN) film is preferable, and a polyethylene terephthalate (PET) film is particularly preferable. A biaxially stretched transparent film is preferably used, and the thickness is suitably 50 to 300 μm, particularly preferably 80 to 250 μm.

先ず初めに、電極基板[A]について説明すると、透明フィルム(A)の片面の表面には、多数の導電性金属線が波形にかつ平行に形成されている。すなわち図1において、多数の波形の導電性金属線が図面上横方向に平行して形成されている。多数の導電性金属線は、隣接する2〜6本、好ましくは3〜5本が一緒になって1つの組となり、1つの導電ラインを形成している。図1では3本の導電性金属線が一緒になって1つの導電ラインとなっている。導電ラインである組は、X−1、X−2、X−3、X−4・・・X−nで示されている。  First, the electrode substrate [A] will be described. On the surface of one side of the transparent film (A), a large number of conductive metal wires are formed in a waveform and in parallel. That is, in FIG. 1, a plurality of corrugated conductive metal lines are formed in parallel in the horizontal direction in the drawing. A large number of conductive metal lines adjacent to each other, preferably 2 to 6, preferably 3 to 5, are combined into one set to form one conductive line. In FIG. 1, three conductive metal wires are combined to form one conductive line. A set of conductive lines is indicated by X-1, X-2, X-3, X-4... Xn.

多数の導電性金属線は波形にかつ平行に形成されているが、この波形の形状について説明すると、一本の金属線において波形における山と山との間(つまり隣接する2つの頂点と頂点との直線の長さ)は1〜12mm好ましくは2〜10mmが適当である。また波形における山と谷との間(つまり隣接する2つの頂点を結んだ線と、その隣接する2つの底点を結んだ線とから形成される平行線の幅)は、1〜6mm、好ましくは1.5〜5mmが適当である。多数の導電性金属線は波形にかつ平行に形成されているが、波形の中心線はほぼ直線状に形成されていることが望ましい。また“波形にかつ平行に”形成されているとは、各組の導電ラインにおいて、導電性金属線のそれぞれの波形の形状が一致していることを意味する。  A large number of conductive metal lines are formed in parallel with the corrugation. The shape of the corrugation will be described below. In one metal line, between the peaks and peaks in the corrugation (that is, two adjacent vertices and apexes). The length of the straight line) is 1 to 12 mm, preferably 2 to 10 mm. Also, the width between peaks and valleys in the waveform (that is, the width of a parallel line formed by connecting a line connecting two adjacent vertices and a line connecting the two adjacent bottom points) is 1 to 6 mm, preferably 1.5 to 5 mm is suitable. Many conductive metal lines are formed in a waveform and in parallel, but it is desirable that the center line of the waveform is formed in a substantially straight line. Further, “formed in parallel with the waveform” means that the shape of each waveform of the conductive metal line is the same in each set of conductive lines.

各組の導電ラインは、それぞれの組において導電性金属線が互いに電気的に接続するように導電性金属線により網状化したパターンを形成している。すなわち、図1では網状化している導電性金属線は、説明上点線で示されている。以下この点線で示されている導電性金属線を“網状化線”と略称することがある。図1の[A]では点線の網状化線は、説明上左右の端部にしか図示されていないが、中間部にも存在している。この網状化線は、図1では平行な多数の金属線の方向に対して、梯子状となるように形成されている。しかしこの網状化線は、平行した波形の金属線の配列方向に対して直角方向であることは好ましいことではあるが、必ずしもその必要はない。或る程度の角度をもって網状化されていてもよい、必要なことは、網状化線は、各々の組(導電性ライン)の中で、その組を形成している金属線が互いに電気的に接続して、1つの導電性ラインとなっていればよく、1つの組と他の組とが電気的に接続していないことが肝要である。つまり、組と組との間には網状化線は存在しない。  Each set of conductive lines forms a mesh pattern with conductive metal lines so that the conductive metal lines are electrically connected to each other in each set. That is, in FIG. 1, the conductive metal wires that are reticulated are indicated by dotted lines for the sake of explanation. Hereinafter, the conductive metal line indicated by the dotted line may be abbreviated as “reticulated line”. In FIG. 1A, the dotted mesh lines are shown only at the left and right ends for the sake of explanation, but are also present in the middle. The reticulated lines are formed in a ladder shape with respect to the directions of a large number of parallel metal lines in FIG. However, although it is preferable that the reticulated line is perpendicular to the arrangement direction of the parallel corrugated metal lines, it is not always necessary. It may be reticulated at a certain angle, and it is necessary that the reticulated wires are electrically connected to each other (conductive lines). It is important that one set is connected to form one conductive line, and one set and the other set are not electrically connected. That is, there is no reticulated line between sets.

各組内の網状化線は、導電性金属線が、部分的にまたは局所的に傷付いたり或いは破断した場合に、各組の導電ラインが電気的な接続を維持するために機能している。網状化線は、導電性金属線の長さ方向10mmに対して1組当たり、1本〜5本、好ましくは2〜5本であるのが望ましい。
導電性金属線は、幅が1〜10μm、好ましくは2〜8μmであるのが望ましく、その厚みは0.1〜5μm、好ましくは、0.1〜4μmであるのが有利である。また網状化線の幅および厚みは、前記した導電性金属線と同じ範囲から選択される。
導電性金属線および網状化線は、導電性金属材料が使用され、具体的にはCu、Ni、Al、Ag、Cr、これら金属の2種以上よりなる合金またはこれら金属の複層で積層された構造で形成されたものが挙げられる。これらのうち、好ましくはCu、Agであり、特にCuが加工性及び価格の点で有利である。
The reticulated wires in each set function to maintain the electrical connection of each set of conductive lines when the conductive metal wires are partially or locally damaged or broken . The number of reticulated wires is 1 to 5 wires, preferably 2 to 5 wires per set with respect to 10 mm in the length direction of the conductive metal wires.
The conductive metal wire desirably has a width of 1 to 10 μm, preferably 2 to 8 μm, and a thickness of 0.1 to 5 μm, preferably 0.1 to 4 μm. The width and thickness of the reticulated line are selected from the same range as that of the conductive metal line.
The conductive metal wire and the mesh wire are made of a conductive metal material, specifically, Cu, Ni, Al, Ag, Cr, an alloy composed of two or more of these metals, or a multilayer of these metals. And those formed with different structures. Of these, Cu and Ag are preferable, and Cu is particularly advantageous in terms of workability and price.

電気基板[A]は、2〜6本の導電性金属線が1組となって、1つの導電ライン(X−1、X−2、X−3、X−4、・・・X−n)を形成している。各組の導電性金属線の数は同じ本数であることが望ましい。図1では3本の導電性金属線が1組となっている。各組内における導電性金属線の間隔(波形の中心線と中心線の距離)は、1.0〜3mm好ましくは、1.5〜2.5mmであって波形にかつ平行に配置されている。この導電性金属線の間隔は、前記範囲内において等間隔であるのが好ましい。
各組における導電性金属線の数は、同じ本数であることが望ましく、また各組における導電性金属線の間隔も、同じ値であることが望ましい。しかし、組と組との間隔は1.5〜10mm、好ましくは2〜8mmであることが望ましく、組と組との間隔は等間隔であるのが有利である。
The electric board [A] is a set of 2 to 6 conductive metal wires, and one conductive line (X-1, X-2, X-3, X-4,... Xn ) Is formed. It is desirable that the number of conductive metal wires in each group is the same. In FIG. 1, one set of three conductive metal wires is formed. The distance between the conductive metal wires in each set (the distance between the center line of the corrugation and the center line) is 1.0 to 3 mm, preferably 1.5 to 2.5 mm, and is arranged in parallel with the corrugation. . The distance between the conductive metal lines is preferably equal within the above range.
The number of conductive metal lines in each set is desirably the same number, and the distance between the conductive metal lines in each set is preferably the same value. However, it is desirable that the distance between the pair is 1.5 to 10 mm, preferably 2 to 8 mm, and the distance between the pair is equal.

導電性金属線および網状化線は、透明フィルムの片面にフォトレジスト加工、フォトエッジング加工により形成させることができる。透明フィルムの表面に形成されている導電性金属線は、組内における金属線の間隔および組と組との間隔は、同じ値であること(等間隔であること)が加工の点および利用しコントロールする点において有利である。
以上電極基板[A]について図1により説明したが、電極基板[B]も、図1の[B]に示されているように、導電性金属線の材料、波形の形状、線の幅と厚み、一組における導電性金属線の数と間隔、網状化線の形態と数は電極基板[A]で説明した内容の範囲から選択される。
The conductive metal wire and the reticulated wire can be formed on one side of the transparent film by photoresist processing or photo edging processing. For the conductive metal wires formed on the surface of the transparent film, the distance between the metal wires in the set and the interval between the sets are the same value (equal intervals). This is advantageous in terms of control.
Although the electrode substrate [A] has been described with reference to FIG. 1, the electrode substrate [B] also has a conductive metal wire material, a corrugated shape, a line width, as shown in FIG. The thickness, the number and interval of conductive metal wires in a set, and the form and number of meshed wires are selected from the range described in the electrode substrate [A].

図1では電極基板[B]は、多数の導電性金属線が縦方向に波形にかつ平行に形成され、各組の導電ラインが3本の導電性金属線よりなり、各組がY−1、Y−2、Y−3、Y−4およびY−nとして示されているが、これは後述するように電極基板[A]及び電極基板[B]を貼り合せた場合の状態の理解のためである。
電極基板[B]は、電極基板[A]と同様に独立して導電性金属線および網状化線を透明フィルム面上に配置し形成せしめればよい。
本発明のタッチパネル用構造材料は、前記した電極基板[A]および電極基板[B]がそれぞれの導電性金属線が形成されている面が互いに向か合い且つそれぞれの導電性金属線の平行する方向が直交するように(波形の中心線が直行するように)貼り合わされたものであって、両基板は両方の導電性金属線が直接電気的に接触しないように絶縁性の透明接着剤層を介して貼り合わされている。
In FIG. 1, in the electrode substrate [B], a large number of conductive metal wires are formed in a vertical and corrugated shape in parallel, each set of conductive lines is composed of three conductive metal wires, and each set is Y-1. , Y-2, Y-3, Y-4, and Yn, which are understood as described below when the electrode substrate [A] and the electrode substrate [B] are bonded together. Because.
The electrode substrate [B] may be formed by disposing conductive metal wires and reticulated wires on the transparent film surface independently of the electrode substrate [A].
In the structural material for a touch panel of the present invention, the surfaces of the electrode substrate [A] and the electrode substrate [B] on which the respective conductive metal wires are formed face each other and the respective conductive metal wires are parallel to each other. It is laminated so that the directions are orthogonal (so that the corrugated center line is perpendicular), and both substrates are insulating transparent adhesive layers so that both conductive metal wires do not make direct electrical contact It is pasted through.

図1により説明すると、電極基板[A]と電極基板[B]とはZ−Z’で示す一点鎖線を中心に内側に折り曲げて重ねたような状態で貼り合せると、両基板の導電性金属線の平行配列がほぼ直交するようになる。
本発明のタッチパネル用構造材料は、前記したように電極基板[A]および[B]が接着剤層を介して貼り合わされた3層構造を有している。そして両基板における各組における導電ラインの端末から電気的に端子に接続されるが図1には各々の端末から端子への接続ラインは図示されてはいない。各組からそれぞれ電気的に端子を介してコントローラへ接続される。
Referring to FIG. 1, when the electrode substrate [A] and the electrode substrate [B] are bonded together in a state where they are folded inward and centered around a dot-and-dash line indicated by ZZ ′, the conductive metal of both substrates The parallel arrangement of the lines becomes almost orthogonal.
The touch panel structural material of the present invention has a three-layer structure in which the electrode substrates [A] and [B] are bonded together with an adhesive layer as described above. The terminals of the conductive lines in each set on both boards are electrically connected to the terminals, but the connection lines from the terminals to the terminals are not shown in FIG. Each set is electrically connected to the controller via a terminal.

透明接着剤としては、絶縁性であって、透明フィルムを接着しうる接着剤を使用することができる。例えば酢酸ビニル樹脂接着剤、エチレン・酢酸ビニル樹脂接着剤、アクリル樹脂接着剤、合成ゴム接着剤、シリコーン樹脂接着剤などが挙げられる。これらのうちアクリル樹脂接着剤が好ましく、一般にOCA(Optical Clear Adhesive)と称されている接着剤が有利に使用される。
本発明の前記構造材料は、開口率が85%以上、好ましくは87〜98%、特に好ましくは88〜96%であることが有利である。開口率が85%未満になると光線透過率が低くなり望ましくない。ここで開口率とは構造材料の表面の平面図における導電性金属線が形成された領域の実質面積を100とした時、導電性金属線(網状化線も含めて)が占める合計の面積を除く面積の割合を云う。
As the transparent adhesive, an adhesive that is insulative and can adhere a transparent film can be used. Examples thereof include vinyl acetate resin adhesives, ethylene / vinyl acetate resin adhesives, acrylic resin adhesives, synthetic rubber adhesives, and silicone resin adhesives. Of these, an acrylic resin adhesive is preferable, and an adhesive generally called OCA (Optical Clear Adhesive) is advantageously used.
The structural material of the present invention has an aperture ratio of 85% or more, preferably 87 to 98%, particularly preferably 88 to 96%. If the aperture ratio is less than 85%, the light transmittance is undesirably low. Here, the aperture ratio is the total area occupied by the conductive metal wires (including the meshed lines), where 100 is the real area of the region where the conductive metal wires are formed in the plan view of the surface of the structural material. This is the ratio of the area that is excluded.

前記したように、本発明の構造体は電極基板[A]/透明接着剤層/電極基板[B]の順序で積層した構造を有しているが、実際に利用するに当っては、この構造体の面をさらにガラス板或いは透明樹脂シートで表面保護した構造体であることが好ましい。
このガラス板としては厚みが0.5〜4mmのものが望ましく、透明樹脂シートとしては厚みが0.5〜2mmのものが適当である。かかる透明樹脂としては、ポリカーボネート、アクリル樹脂、ポリオレフィンまたはポリシクロオレフィンが挙げられるが、ポリカーボネートが優れている。
本発明のタッチパネル用構造材料は、静電容量式タッチパネルの部材として適している。特に電極基板[A]と[B]に形成されている導電性金属線は導電性に優れ、微細であっても一部が破損または断線しても網状化されているため一組の導電ラインとして機能が維持されているので大型画像のタッチパネル材料として有利である。
As described above, the structure of the present invention has a structure in which the electrode substrate [A] / transparent adhesive layer / electrode substrate [B] are stacked in this order. It is preferable that the surface of the structure is further protected with a glass plate or a transparent resin sheet.
The glass plate preferably has a thickness of 0.5 to 4 mm, and the transparent resin sheet has a thickness of 0.5 to 2 mm. Examples of such a transparent resin include polycarbonate, acrylic resin, polyolefin, and polycycloolefin, and polycarbonate is excellent.
The structural material for a touch panel of the present invention is suitable as a member of a capacitive touch panel. In particular, the conductive metal wires formed on the electrode substrates [A] and [B] are excellent in conductivity and are reticulated even if they are fine or partially broken or disconnected, so a set of conductive lines. This is advantageous as a touch panel material for large images.

Claims (12)

(1)透明フィルム(A)の片面に、(a−1)多数の導電性金属線が1.0〜3mmの間隔で波形にかつ平行して形成され、(a−2)各導電性金属線は、幅が1〜10μmであり、(a−3)各導電性金属線は、隣接する2〜6本が一組の導電ラインとなって、多数の導電ラインを形成し、(a−4)各組の導電ラインは、各組において導電性金属線が互いに電気的に接続するように導電性金属線により網状化したパターンを形成している電極基盤[A]及び透明フィルム(B)の片面に、(b−1)多数の導電性金属線が1.0〜3mmの間隔で波形にかつ平行して形成され、(b−2)各導電性金属線は幅が1〜10μmであり、(b−3)各導電性金属線は隣接する2〜6本が一組の導電ラインとなって、多数の導電ラインを形成し、(b−4)各組の導電ラインは各組において導電性金属線が互いに電気的に接続するように導電性金属線により網状化したパターンを形成している電極基盤[B]より構成され、
(2)前記電極基板[A]及び電極基板[B]とは、それぞれの導電性金属線が形成されている面が向い合い且つそれぞれの導電性金属線の波形にかつ平行する方向が直交するように、絶縁性の透明接着剤を介して貼り合され、かつ
(3)前記電極基板[A]及び電極基板[B]における各組における導電ラインは、それぞれの組の端末から電気的に端子に接続されている、
ことを特徴とするタッチパネル用構造材料。
(1) On one side of the transparent film (A), (a-1) a large number of conductive metal wires are formed in parallel with a waveform at intervals of 1.0 to 3 mm, and (a-2) each conductive metal The wire has a width of 1 to 10 μm, and (a-3) each conductive metal wire is a set of two to six adjacent conductive lines, forming a number of conductive lines, (a− 4) Each set of conductive lines includes an electrode substrate [A] and a transparent film (B) that form a meshed pattern of conductive metal wires so that the conductive metal wires are electrically connected to each other in each set. (B-1) A large number of conductive metal wires are formed in parallel and corrugated at intervals of 1.0 to 3 mm, and (b-2) each conductive metal wire has a width of 1 to 10 μm. Yes, (b-3) 2-6 adjacent conductive metal wires form a set of conductive lines to form a number of conductive lines. (B-4) Each set of conductive lines is composed of an electrode substrate [B] forming a meshed pattern with conductive metal wires so that the conductive metal wires are electrically connected to each other in each set. ,
(2) The electrode substrate [A] and the electrode substrate [B] face each other on the surface on which the respective conductive metal wires are formed, and the directions parallel to the waveforms of the respective conductive metal wires are orthogonal to each other. And (3) the conductive lines in each group of the electrode substrate [A] and the electrode substrate [B] are electrically connected from the terminals of the respective groups. It is connected to the,
A structural material for touch panels.
前記導電ラインにおける導電性金属線は、等間隔で波形にかつ平行に形成されている前記請求項1記載の構造材料。2. The structural material according to claim 1, wherein the conductive metal lines in the conductive line are formed in a waveform and in parallel at equal intervals. 前記導電性金属線は、幅が2〜8μmである前記請求項1記載の構造材料。The structural material according to claim 1, wherein the conductive metal wire has a width of 2 to 8 μm. 前記導電性金属線は、厚みが0.1〜5μmである前記請求項1記載の構造材料。The structural material according to claim 1, wherein the conductive metal wire has a thickness of 0.1 to 5 μm. 前記導電性金属線は、隣接する3〜5本が一組の導電ラインを形成している前記請求項1記載の構造材料。The said conductive metal wire is a structural material of the said Claim 1 in which 3-5 adjacent forms the set of conductive lines. 前記導電性金属線、Cu、Ni、Al、Ag、Cr、これら金属の2種以上よりなる合金またはこれら2種以上の金属の複層で積層された構造で形成されている前記請求項1記載の構造材料。2. The conductive metal wire, Cu, Ni, Al, Ag, Cr, an alloy composed of two or more of these metals, or a structure laminated with a multilayer of these two or more metals. Structural material. 前記絶縁性の透明接着剤層は、50〜300μmの厚みを有する前記請求項1記載の構造材料。The structural material according to claim 1, wherein the insulating transparent adhesive layer has a thickness of 50 to 300 μm. 前記透明フィルムは、50〜300μmの厚みを有すポリエチレンテレフタレートフィルムである前記請求項1記載の構造材料。The structural material according to claim 1, wherein the transparent film is a polyethylene terephthalate film having a thickness of 50 to 300 μm. 前記網状化した導電性金属線(網状化線)は波形にかつ平行した導電性金属線の方向に対して直角方向に形成されている前記請求項1記載の構造材料。2. The structural material according to claim 1, wherein the meshed conductive metal wire (meshing wire) is formed in a direction perpendicular to the direction of the conductive metal wire which is corrugated and parallel. 85%以上の開口率を有する前記請求項1記載の構造材料。The structural material according to claim 1, which has an aperture ratio of 85% or more. 前記請求項1記載の構造材料により構成された静電容量式タッチパネル構造体。A capacitive touch panel structure made of the structural material according to claim 1. 前記請求項1記載の構造材料により構成されたタッチパネル構造体を厚みが0.5〜4mmのガラス板 あるいは厚みが0.5〜2mmの透明樹脂シートで表面保護した構造を有する静電容量式タッチパネル構造体。A capacitive touch panel having a structure in which the touch panel structure formed of the structural material according to claim 1 is surface protected with a glass plate having a thickness of 0.5 to 4 mm or a transparent resin sheet having a thickness of 0.5 to 2 mm. Structure.
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