CN114378458A

CN114378458A - Wafer cutting bifocal laser processing device

Info

Publication number: CN114378458A
Application number: CN202210232191.9A
Authority: CN
Inventors: 张立; 周建红
Original assignee: Shenzhen Guihua Intelligent Technology Co ltd
Current assignee: Shenzhen Guihua Intelligent Technology Co ltd
Priority date: 2022-03-09
Filing date: 2022-03-09
Publication date: 2022-04-22

Abstract

The invention discloses a wafer cutting double-focus laser processing device which comprises an installation box, a light inlet upper light cavity assembly, a light inlet lower light cavity assembly, an automatic focus positioning assembly, a piezoelectric cutting assembly, a piezoelectric CCD positioning assembly and a height measuring assembly.

Description

Wafer cutting bifocal laser processing device

Technical Field

The invention relates to the technical field of laser cutting equipment, in particular to a wafer cutting double-focus laser processing device.

Background

The laser cutting equipment focuses laser emitted from a laser into a laser beam with high power density through an optical path system. The laser beam irradiates the surface of the workpiece to make the workpiece reach a melting point or a boiling point, and simultaneously, the high-pressure gas coaxial with the laser beam blows away the molten or gasified metal. And finally, the material is cut along with the movement of the relative position of the light beam and the workpiece, so that the cutting purpose is achieved.

The existing laser cutting equipment is generally focused and positioned by a single camera, the position of a workpiece is fed back, the deviation of the running track calculation of the laser cutting equipment is large, the positioning precision of the workpiece is low, the cutting effect of the workpiece is influenced, the processing quality of the workpiece is further influenced, and the processing effect of the laser cutting equipment is poor, so that the wafer cutting double-focus laser processing device is provided.

Disclosure of Invention

The present invention is directed to a bifocal laser processing apparatus for wafer cutting, which solves the above problems.

In order to achieve the purpose, the invention provides the following technical scheme: a wafer cutting bifocal laser processing device comprises an installation box, an incident light upper light cavity assembly, an incident light lower light cavity assembly, a focus automatic positioning assembly, a piezoelectric cutting assembly, a piezoelectric CCD positioning assembly and a height measurement assembly, wherein the incident light upper light cavity assembly is arranged on the right side of the upper surface of the installation box, the incident light lower light cavity assembly is arranged on the right side of the interior of the installation box, the light outlet end of the incident light upper light cavity assembly is opposite to the light inlet end of the incident light lower light cavity assembly, the focus automatic positioning assembly is arranged on the left side of the interior of the installation box, the light outlet end of the incident light lower light cavity assembly is opposite to the light inlet end of the focus automatic positioning assembly, the piezoelectric cutting assembly is arranged on the left side of the lower side wall of the installation box, the light outlet end of the focus automatic positioning assembly is opposite to the light inlet end of the piezoelectric cutting assembly, the piezoelectric CCD positioning assembly is arranged on the lower portion of the left side wall of the installation box, the height measurement assembly is arranged at the left end of the lower side wall of the installation box.

Preferably, the light incident glazing cavity assembly comprises a light incident cavity, the light incident cavity is arranged at the right part of the upper side wall of the installation box, two groups of first steering mirror bracket assemblies are arranged in the light incident cavity along the diagonal, the light incident ends of the first steering mirror bracket assemblies correspond to two groups of right side walls of the light incident cavity and are respectively connected with a light incident protection barrel in a penetrating manner, the light emergent ends of the first steering mirror bracket assemblies correspond to two groups of lower side walls of the light incident cavity, the light incident ends of the second steering mirror bracket assemblies are respectively provided with a fixed slide assembly, each light incident end of the second steering mirror bracket assemblies is respectively opposite to the light emergent ends of the first steering mirror bracket assemblies on the corresponding sides, the slide adjusting device is arranged on the upper part of the right side of the installation box, the light emergent ends of the first steering mirror bracket assemblies corresponding to two groups of the slide adjusting device are respectively provided with a movable slide assembly, and a corrugated dust cover is arranged between the lower side wall of the light inlet cavity and the right part of the upper side wall of the mounting box.

Preferably, focus automatic positioning subassembly includes the laser head optical cavity, the laser head optical cavity is installed the inside left side of install bin, the income optical end in laser head optical cavity with it is relative to turn to the light-emitting end of mirror holder subassembly two, piezoelectricity cutting assembly includes the mounting bracket, the mounting bracket is installed the lower side wall left side of install bin, the adapter is installed on the upper portion of mounting bracket, the mid-mounting of mounting bracket has objective, the cutting head is installed to the lower part of mounting bracket, the adapter objective with the cutting head is installed along a plumb line, the light-emitting end in laser head optical cavity with the income optical end of objective is relative.

Preferably, the upside of laser head optical cavity is connected with the focusing camera, laser head optical cavity surface both sides all are connected with the pointolite.

Preferably, a light shield is installed on the lower portion of the installation frame, and an air knife is arranged on one side of the light shield.

Preferably, the piezoelectric CCD positioning assembly comprises two CCD cameras and two groups of camera adjusting devices, the two groups of camera adjusting devices are symmetrically arranged on the lower portion of the left side wall of the mounting box in a front-back mode, and the two CCD cameras are respectively arranged on the corresponding camera adjusting devices.

Preferably, the height measurement assembly comprises a height-adjusting manual adjusting device and a height measuring instrument, the height-adjusting manual adjusting device is installed at the left end of the lower side wall of the installation box, and the height measuring instrument is installed on the height-adjusting manual adjusting device.

Compared with the prior art, the invention has the beneficial effects that: a wafer cutting double-focus laser processing device obtains the positioning information of a workpiece through a piezoelectric CCD positioning component, a laser beam is turned by a light inlet upper optical cavity component and a light inlet lower optical cavity component, the focus automatic positioning component carries out automatic focusing and reflects the laser beam to the piezoelectric cutting component, the piezoelectric cutting component automatically cuts according to the track calculated by the positioning information, the height measurement component regularly measures the height and automatically adjusts the cutting position of the piezoelectric cutting component according to the change value of the height, the automation degree of the laser processing device can be higher, the cutting processing precision of the workpiece is higher, the cutting processing efficiency of the workpiece is improved at the same time, a double-light incident protection cylinder is arranged on an optical cavity through the positioning of a double-CCD camera, a double-turning mirror frame component I is arranged in the optical cavity, a double-turning mirror frame component II is arranged on the right side inside an installation box, the processing can be more accurate, and the laser beams with two different powers and focuses can be conveniently used for processing products, the laser processing method is suitable for certain workpieces needing two different laser parameters to be processed.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is an internal perspective view of the present invention;

FIG. 3 is a front sectional view of the light inlet plenum assembly of the present invention;

FIG. 4 is a perspective view of the drop in light cavity assembly of the present invention;

FIG. 5 is a perspective view of the automatic focus positioning assembly and piezoelectric cutting assembly of the present invention;

FIG. 6 is a perspective view of the automatic focus positioning assembly of the present invention;

figure 7 is a perspective view of a piezoelectric cutting assembly of the present invention.

In the figure: 1-light inlet upper light cavity component, 101-light inlet cavity, 102-turning mirror bracket component I, 103-light inlet protective cylinder, 104-fixed slide component, 105-corrugated dustproof cover, 2-light inlet lower light cavity component, 201-turning mirror bracket component II, 202-slide adjusting device, 203-moving slide component, 3-focus automatic positioning component, 301-laser head light cavity, 302-focusing camera, 303-point light source, 4-piezoelectric cutting component, 401-mounting rack, 402-adapter, 403-objective lens, 404-cutting head, 405-light shielding cover, 406-air knife, 5-piezoelectric CCD positioning component, 501-CCD camera, 502-camera adjusting device, 6-height measuring component, 601-height adjusting manual adjusting device, 103-turning mirror bracket component, 602-altimeter, 7-installation box.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution of a wafer cutting dual-focus laser processing apparatus: a wafer cutting double-focus laser processing device comprises an installation box 7, an incident light upper light cavity component 1, an incident light lower light cavity component 2, a focus automatic positioning component 3, a piezoelectric cutting component 4, a piezoelectric CCD positioning component 5 and a height measurement component 6, wherein the incident light end of the incident light upper light cavity component 1 is opposite to the light outlet of a laser, the incident light upper light cavity component 1 is used for reflecting a laser beam to the incident light lower light cavity component 2, the incident light lower light cavity component 2 reflects the laser beam to the focus automatic positioning component 3, the focus automatic positioning component 3 reflects the laser beam to the piezoelectric cutting component 4, so that the laser beam guided out by the piezoelectric cutting component 4 cuts a workpiece, the piezoelectric CCD positioning component 5 is used for shooting and positioning the workpiece, the height measurement component 6 is used for measuring the height of the laser cutting device at any time, the incident light upper light cavity component 1 is arranged on the right side of the upper surface of the installation box 7, light cavity subassembly 2 is established under income light the inside right side of install bin 7, just go into light and go out the light end of light cavity subassembly 1 with go into light under the light end of light cavity subassembly 2 is relative, focus automatic positioning component 3 establishes the inside left side of install bin 7, go into light under the light end of light cavity subassembly 2 with focus automatic positioning component 3's income light end is relative, piezoelectricity cutting component 4 establishes the lower lateral wall left side of install bin 7, focus automatic positioning component 3 goes out the light end with piezoelectricity cutting component 4's income light end is relative, piezoelectricity CCD locating component 5 establishes the left side wall lower part of install bin 7, height-measuring component 6 establishes the lower lateral wall left end of install bin 7, this laser processing device installs on numerical control slide mechanism, and numerical control slide mechanism includes X, Y, Z axle straight line slide mechanism, can control this processingequipment at X, and the processing equipment is in the lower lateral wall left end of installation bin 7, Y, Z the adjustment of any position along the axis direction, the operation of the numerical control sliding mechanism is controlled by the controller, the operation track of the laser processing device is controlled, the piezoelectric CCD positioning component 5 firstly positions the workpiece position, the positioning information is transmitted to the controller for processing, the actual coordinate position and the steering angle of the product are judged, the controller controls the operation of the numerical control sliding mechanism by the calculated cutting track, the laser beam guided out by the piezoelectric cutting component 4 can accurately cut the workpiece, the controller controls the focus automatic positioning component 3 to automatically focus according to the definition algorithm, the piezoelectric cutting component 4 automatically cuts according to the set track, in the processing process, the height measuring component 6 can measure the position height at any time and transmit the height information back to the controller, the controller controls the focus automatic positioning component 3 to focus at any time, the height measurement is carried out at regular time, and the focal length is automatically compensated according to the change value of the height, the follow-up processing of the wafer cutting double-focus laser processing is realized, so that the laser processing device has higher operation accuracy and higher automation degree, and the cutting efficiency of workpieces is improved.

Particularly, light cavity subassembly 1 is including going into light cavity 101 in going into light, it installs to go into light cavity 101 the last lateral wall right part of install bin 7, the inside of going into light cavity 101 is equipped with two sets of mirror holder subassembly 102 that turns to along the diagonal, the right side wall of going into light cavity 101 corresponds two sets of it all has a light protection section of thick bamboo 103 to turn to the income light end of mirror holder subassembly 102, the lower lateral wall of going into light cavity 101 corresponds two sets of it all is equipped with fixed slide subassembly 104 to turn to the light-emitting end of mirror holder subassembly 102, and the laser beam is thrown into light cavity 101 by a light protection section of thick bamboo 103, turns to mirror holder subassembly 102 and carries out 90 degrees turns to the laser beam.

The optical cavity subassembly 2 includes two sets of mirror holder subassembly two 201 and slide adjusting device 202 that turn to under income light, two sets of turn to mirror holder subassembly two 201 and establish the inside right side of install bin 7, and two sets of turn to the income light end of mirror holder subassembly two 201 all with correspond the side turn to mirror holder subassembly one 102 light-emitting end relative, turn to mirror holder subassembly two 201 and turn to the laser beam that mirror holder subassembly one 102 reflects again, inject into in focus automatic positioning component 3, slide adjusting device 202 is established the inside right side upper portion of install bin 7, it is corresponding two sets of on the slide adjusting device 202 the light-emitting end that turns to mirror holder subassembly one 102 all is equipped with removal slide subassembly 203, slide adjusting device 202 conveniently carries out the adjustment of position to removal slide subassembly 203, go into the lower lateral wall of optical cavity 101 with install ripple 105 between the last lateral wall right part of install bin 7, the installation box 7 is provided with a light inlet hole corresponding to the corrugated dust cover 105, so that laser beams can be conveniently injected into the light inlet lower light cavity component 2 from the light inlet upper light cavity component 1.

The fixed slide assembly 104 and the moving slide assembly 203 are diffractive optics that achieve spot shaping by specific patterns, form specific laser intensity distributions within the material, induce the material to crack along specific crystalline phases, and are used to improve processing efficiency.

The light entrance protecting cylinder 103 and the corrugated dust cover 105 are used for protecting and sealing the whole light entrance glazing cavity assembly 1, and preventing external air and dust from entering, so as to avoid polluting internal optical assemblies; the first steering frame assembly 102 and the second steering frame assembly 201 are used for adjusting the optical path by using the reflection principle.

The double-entrance light protection cylinder 103 can be provided with different lasers, and the laser beam with the power and the focal length is used for emitting the laser beam, so that the laser processing device can process workpieces by using lasers with two different powers and focal lengths, is suitable for processing certain workpieces requiring two different laser parameters,

particularly, focus automatic positioning subassembly 3 includes laser head optical cavity 301, laser head optical cavity 301 is installed the inside left side of install bin 7, install bin 7 all is equipped with the unthreaded hole between the income light position of laser head optical cavity 301 and the position of turning to mirror holder subassembly two 201 reflection light and between the income light position of laser head optical cavity 301 light-emitting position and piezoelectric cutting subassembly 4, make things convenient for the laser beam to pass, the income light end of laser head optical cavity 301 is connected with the light pipe adapter sleeve and is relative with the laser exit end that turns to mirror holder subassembly two 201, it is relative to receive the laser beam that turns to mirror holder subassembly two 201 reflection, the income light end of laser head optical cavity 301 with it is relative to turn to the light end of mirror holder subassembly two 201, piezoelectric cutting subassembly 4 includes installation frame 401, installation adapter 401 is installed the lower side wall left side of install bin 7, adapter 402 is installed on the upper portion of installation frame 401, the mid-mounting of mounting bracket 401 has objective 403, cutting head 404 is installed to the lower part of mounting bracket 401, adapter 402 objective 403 with cutting head 404 is installed along a plumb line, the light-emitting end of laser head optical cavity 301 with the income light end of objective 403 is relative, and the light-emitting end of laser head optical cavity 301 makes the laser beam jet into cutting head 404 through adapter 402, objective 403, makes cutting head 404 jet out laser, cuts processing to the work piece.

Particularly, the upside of laser head optical cavity 301 is connected with focusing camera 302, laser head optical cavity 301 surface both sides all are connected with pointolite 303, and one side pointolite 303 is opened, and when opposite side pointolite 303 was closed, cross target can be seen to focusing camera 302 for automatic focusing. Another side pointolite 303 is opened, when one side pointolite 303 is closed, the product surface can be seen to focusing camera 302 for observe the cutting effect, the switch of pointolite 303 is controlled to the controller, focusing camera 302 passes through camera vision algorithm and calculates, calculation information passes to the controller, the controller is according to calculation information adjustment numerical control sliding mechanism package Z axle straight line sliding mechanism and carries out autofocus, adjust the cross target to the clearest.

Specifically, a light shield 405 is mounted at the lower part of the mounting frame 401, an air knife 406 is arranged at one side of the light shield 405, and the air knife 406 is convenient for air blowing and dust removal during laser cutting.

Specifically, piezoelectricity CCD locating component 5 includes two CCD cameras 501 and two sets of camera adjusting device 502, and is two sets of camera adjusting device 502 front and back symmetry is installed the left side wall lower part of install bin 7, two CCD cameras 501 install respectively correspondingly on the camera adjusting device 502, camera adjusting device 502 makes things convenient for the adjustment of CCD camera 501 position, and two CCD cameras 501 shoot the location simultaneously, make CCD camera 501 convey data information to the controller and handle, can confirm the coordinate position and the angle of deflection value of product simultaneously, make the cutting accuracy of work piece higher.

Particularly, height measurement subassembly 6 is including heightening manual adjusting device 601 and altimeter 602, heighten manual adjusting device 601 and install the lower lateral wall left end of install bin 7, altimeter 602 installs heighten on the manual adjusting device 601, altimeter 602 carries out the height finding at any time to convey height finding information to the controller, the controller is according to the operation of height information control numerical control slide mechanism, adjusts piezoelectric cutting subassembly 4's cutting position at any time when the cutting, promotes processing quality and effect.

The working principle is as follows: when a workpiece is cut and processed, the position of a product is positioned through the piezoelectric CCD positioning component 5, the double CCD cameras 501 are used for repeated positioning during positioning, data shot by the CCD cameras 501 are transmitted to the controller for processing, product data shot by the two CCD cameras 501 are compared and analyzed, and the actual coordinate position and the steering angle of the product are judged; the focus automatic positioning component 3 automatically focuses through a controller according to a definition algorithm, and simultaneously controls the height measuring component 6 to measure the height of the position; after focusing is finished, the laser emits laser, and the controller controls the sliding mechanism to operate according to the calculated cutting track, so that the piezoelectric cutting assembly 4 can automatically cut the workpiece according to the set track; in the processing process, the height measuring component 6 measures the height regularly and automatically adjusts the cutting position of the piezoelectric cutting component 4 according to the change value of the height, so that the follow-up processing of wafer cutting double-focus laser processing is realized, the cutting of the workpiece is more accurate, and the automation degree is higher.

And because two incident light protection cylinders 103 are arranged, two lasers can be used for emitting laser beams with different powers and focal lengths, only one incident light protection cylinder 103 can emit the laser beam at the same time, the laser beam enters the incident light upper cavity component 1, is reflected by the turning mirror frame component I102, then turns 90 degrees and vertically passes through the fixed glass slide component 104 and the corrugated dust cover 105 to enter the incident light lower cavity component 2, then the laser beam passes through the movable glass slide component 203 and is turned by the turning mirror frame component II 201, the direction of the laser beam is changed to be parallel to the original direction and can be emitted into the laser head optical cavity 301, light is reflected by a coating lens in the laser head optical cavity 301, wafer cutting bifocal laser processing is realized, the laser processing device can realize the processing of products by lasers with two different powers and focal lengths, and is suitable for the processing of certain products which need two different laser parameters, the double CCD cameras 501 are used for positioning, the coordinate position and the deflection angle value of a product can be determined at the same time, and cutting machining is more accurate.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer cutting bifocus laser beam machining device, includes install bin (7), goes into light optical cavity subassembly (1), goes into light down optical cavity subassembly (2), focus automatic positioning subassembly (3), piezoelectricity cutting assembly (4), piezoelectricity CCD locating component (5) and height finding subassembly (6), its characterized in that: the light inlet and glazing cavity component (1) is arranged on the right side of the upper surface of the installation box (7), the light-incident lower light cavity component (2) is arranged on the right side in the installation box (7), and the light outlet end of the light inlet upper light cavity component (1) is opposite to the light inlet end of the light inlet lower light cavity component (2), the automatic focus positioning component (3) is arranged on the left side of the inside of the installation box (7), the light outlet end of the light inlet lower light cavity component (2) is opposite to the light inlet end of the focus automatic positioning component (3), the piezoelectric cutting component (4) is arranged on the left side of the lower side wall of the installation box (7), the light outlet end of the focus automatic positioning component (3) is opposite to the light inlet end of the piezoelectric cutting component (4), the piezoelectric CCD positioning component (5) is arranged at the lower part of the left side wall of the installation box (7), the height measurement assembly (6) is arranged at the left end of the lower side wall of the installation box (7).

2. The wafer cutting bifocal laser machining apparatus of claim 1, wherein: go into light glazing chamber subassembly (1) including going into light chamber (101), it installs to go into light chamber (101) the last lateral wall right part of install bin (7), the inside of going into light chamber (101) is equipped with two sets of mirror holder subassembly (102) that turn to along the diagonal, the right side wall of going into light chamber (101) corresponds two sets of turn to the income light end of mirror holder subassembly (102) and all through connection has income light protection section of thick bamboo (103), the lower lateral wall of going into light chamber (101) corresponds two sets of turn to the light-emitting end of mirror holder subassembly (102) and all be equipped with fixed slide subassembly (104), light chamber subassembly (2) includes two sets of mirror holder subassembly two (201) and slide adjusting device (202) that turn to under the income light, two sets of turn to mirror holder subassembly two (201) and establish the inside right side of install bin (7), and two sets of turn to the income light end of mirror holder subassembly two (201) all with correspond the side turn to mirror holder subassembly one (102) light-emitting end relative, the glass slide adjusting device (202) is arranged at the upper portion of the right side of the interior of the installation box (7), the light emitting ends, corresponding to the two first turning mirror frame assemblies (102), of the glass slide adjusting device (202) are respectively provided with a movable glass slide assembly (203), and a corrugated dust cover (105) is arranged between the lower side wall of the light inlet cavity (101) and the right portion of the upper side wall of the installation box (7).

3. The wafer cutting bifocal laser machining apparatus of claim 2, wherein: focus automatic positioning subassembly (3) include laser head optical cavity (301), install laser head optical cavity (301) the inside left side of install bin (7), the income light end in laser head optical cavity (301) with it is relative to turn to the play light end of mirror holder subassembly two (201), piezoelectricity cutting assembly (4) include mounting bracket (401), mounting bracket (401) are installed the lower side wall left side of install bin (7), adapter (402) are installed on the upper portion of mounting bracket (401), the mid-mounting of mounting bracket (401) has objective (403), cutting head (404) are installed to the lower part of mounting bracket (401), adapter (402), objective (403) with installation of a plumb line is followed to cutting head (404), the play light end of laser head optical cavity (301) with the income light end of objective (403) is relative.

4. The wafer cutting bifocal laser machining apparatus of claim 3, wherein: the upside of laser head optical cavity (301) is connected with focusing camera (302), laser head optical cavity (301) surface both sides all are connected with pointolite (303).

5. The wafer cutting bifocal laser machining apparatus of claim 3, wherein: a light shield (405) is installed on the lower portion of the installation frame (401), and an air knife (406) is arranged on one side of the light shield (405).

6. The wafer cutting bifocal laser machining apparatus of claim 3, wherein: piezoelectric CCD locating component (5) include two CCD cameras (501) and two sets of camera adjusting device (502), and are two sets of camera adjusting device (502) front and back symmetry is installed the left side wall lower part of install bin (7), two CCD cameras (501) are installed respectively and are corresponded on camera adjusting device (502).

7. The wafer-cutting bifocal laser machining apparatus of claim 6, wherein: height finding subassembly (6) are including heightening manual adjusting device (601) and altimeter (602), heighten manual adjusting device (601) and install the lower lateral wall left end of install bin (7), altimeter (602) is installed heighten on the manual adjusting device (601).