CN114364159A - Reflow soldering jig for flexible circuit board - Google Patents
Reflow soldering jig for flexible circuit board Download PDFInfo
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- CN114364159A CN114364159A CN202210080657.8A CN202210080657A CN114364159A CN 114364159 A CN114364159 A CN 114364159A CN 202210080657 A CN202210080657 A CN 202210080657A CN 114364159 A CN114364159 A CN 114364159A
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- circuit board
- flexible circuit
- heat insulation
- cover plate
- reflow soldering
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Abstract
The invention discloses a reflow soldering jig for a flexible circuit board, which is applied to a reflow soldering process of a PET base film flexible circuit board and comprises a cover plate and a support bottom, wherein the cover plate and the support bottom are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate is provided with at least one group of hollow holes for welding; the surface of the cover plate is coated with heat insulation paper to form a first heat insulation layer; the surface of the support bottom is wrapped with heat insulation paper to form a second heat insulation layer, and the first heat insulation layer and the second heat insulation layer are directly attached to and extruded on the front surface and the back surface of the flexible circuit board during welding; carry out inseparable laminating to the flexible line way board respectively through first insulating layer and second insulating layer, heat the processing of accomplishing welding position promptly to the fretwork hole, the welded in-process effectively insulates against heat to the flexible line way board for the heat is concentrated in welding position, can not disperse to around, and then guarantees to use PET to guarantee the planarization as base film flexible line way board, can not take place deformation, solves the problem that appears in the current.
Description
Technical Field
The invention relates to the field of reflow soldering jigs, in particular to a reflow soldering jig for a flexible circuit board.
Background
The flexible circuit board is a flexible circuit which is made of polyimide or polyester film as a base material through a die cutting process and has high reliability and excellent performance.
In the process of producing the flexible circuit board, a circuit connecting technology of welding and assembling by a reflow soldering method is required by the process after SMT mounting of a base film, wherein a jig is required to assist in accurate positioning and soldering of high-temperature solder paste; the polyester film PET has the advantages of high insulation and low cost, and is attracting more and more manufacturers to try to use PET as a base material to produce flexible circuit boards, however, the temperature resistance of the PET substrate is only 180 ℃, and in the reflow soldering process of the high-temperature solder paste by using the melting temperature of 235-250 ℃, the existing jig for reflow soldering mostly comprises a cover plate and a supporting plate, the cover plate and the supporting plate are buckled together, and the cover plate is provided with welding holes for accurately melting the high-temperature solder paste to thereby achieve welding with the metal sheet, however, because the PET base material is directly adhered between the cover plate and the bearing plate, and the cover plate is mostly made of metal material, the heat is dissipated to the cover plate and the supporting plate in the welding process, so that the PET base film is deformed at high temperature due to the thermal shrinkage effect to damage the flexible circuit board, and the main damage causes are deformation caused by high temperature and product brittleness; therefore, a new reflow soldering fixture is needed, which is suitable for the preparation of flexible die-cutting circuit boards using PET as the base film.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a reflow soldering jig for a flexible circuit board, which comprises a cover plate and a support base, wherein the support base is connected with the cover plate in a laminating manner and respectively extruded and laminated on two sides of the flexible circuit board, a hollow hole is matched with the welding position of the flexible circuit board, and in the welding process, a heat insulation plate and a first heat insulation layer effectively insulate heat of the flexible circuit board, so that heat is concentrated at the welding position and cannot be diffused to the periphery, further, the smoothness of the flexible circuit board with a PET (polyethylene terephthalate) base film is ensured, deformation and product brittleness are avoided, and the problems in the prior art are solved.
In order to achieve the purpose, the invention provides a reflow soldering jig for a flexible circuit board, which is applied to a reflow soldering process of a PET base film flexible circuit board and comprises a cover plate and a support bottom, wherein the cover plate and the support bottom are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate is provided with at least one group of hollow holes for welding; the surface of the cover plate is coated with heat insulation paper to form a first heat insulation layer; the surface of the support bottom is wrapped with heat insulation paper to form a second heat insulation layer, and the first heat insulation layer and the second heat insulation layer are directly attached to and extruded on the front surface and the back surface of the flexible circuit board during welding.
Preferably, the heat insulation paper is compounded by using mica paper as a base material and glass fiber cloth as a reinforcing material and selecting high-temperature resistant organic silicon resin.
Preferably, the cover plate includes a heat insulation plate and joint plates, and the heat insulation plate is connected to the joint plates by fixing bolts.
Preferably, the heat insulation plate and the bottom support are made of synthetic stone.
Preferably, the connector tiles are of metal.
Preferably, the heat insulation plate is uniformly provided with a plurality of groups of magnet units, and the cover plate and the connecting plate are magnetically attracted through the magnet units; the cover plate and the joint part are connected in a reinforcing mode through a screw structure.
Preferably, one surface of the cover plate far away from the support bottom is provided with a plurality of groups of magnetic holes for accommodating the magnetic elements.
Preferably, the base is further included, and the bottom support is attached to one surface, far away from the cover plate, of the base.
Preferably, the base is further provided with a plurality of groups of fixing holes fixedly connected with the outside.
Preferably, the support bottom is provided with a containing position used for aligning the flexible circuit board on the surface close to the flexible circuit board.
The invention has the beneficial effects that: compared with the prior art, the reflow soldering jig for the flexible circuit board is applied to the reflow soldering process of the PET base film flexible circuit board, and comprises a cover plate and a support base, wherein the cover plate and the support base are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate is provided with at least one group of hollow holes for welding; the surface of the cover plate is coated with heat insulation paper to form a first heat insulation layer; the surface of the support bottom is wrapped with heat insulation paper to form a second heat insulation layer, and the first heat insulation layer and the second heat insulation layer are directly attached to and extruded on the front surface and the back surface of the flexible circuit board during welding; in the welded process, the first heat insulation layer and the second heat insulation layer effectively insulate heat of the flexible circuit board, so that heat is concentrated at a welding position and cannot be diffused to the periphery, further, the PET is used as a base film to guarantee smoothness of the flexible circuit board, deformation cannot occur, products cannot become brittle, and the problem occurring in the prior art is solved.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a view of the base and the bottom of the present invention;
FIG. 3 is a top view of the base of the present invention;
FIG. 4 is an enlarged view of area A of the present invention;
fig. 5 is an enlarged view of the region B of the present invention.
FIG. 6 is a schematic structural view of a first insulating layer and a cover plate according to the present invention;
FIG. 7 is a schematic view of a second insulating layer and a tray according to the present invention.
The main element symbols are as follows:
1. a cover plate; 11. hollowing out holes; 12. a heat insulation plate; 13. a connector tile; 14. a magnet unit; 2. supporting the bottom;
21. a thermal insulation layer; 22. a magnetic aperture; 23. a containing position; 3. A base; 31. a fixing hole;
4. a first insulating layer; 5. a second insulating layer.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "suspended", and the like do not imply that the components are required to be absolutely horizontal or suspended, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The existing jig for reflow soldering mostly comprises a cover plate and a bearing plate, the cover plate and the bearing plate are buckled, the cover plate is provided with a welding hole, the welding hole is used for accurately melting high-temperature solder paste and further realizing the welding with a metal sheet, however, because a PET (polyethylene terephthalate) base material is directly attached to the middle of the cover plate and the bearing plate, the cover plate is mostly made of metal materials, the heat is dissipated to the cover plate and the bearing plate in the welding process, so that a PET (polyethylene terephthalate) base film is damaged due to the thermal shrinkage effect due to high-temperature deformation, and the main damage reason is deformation caused by high temperature and product brittleness; therefore, a new reflow soldering fixture is needed, which is suitable for the preparation of flexible die-cutting circuit boards using PET as the base film.
In order to solve the existing problems, the invention provides a reflow soldering jig for a flexible circuit board, which is applied to a reflow soldering process of a PET base film flexible circuit board, and please refer to fig. 1 to 7, wherein the reflow soldering jig comprises a cover plate 1 and a support base 2, and the cover plate 1 and the support base 2 are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate 1 is provided with at least one group of hollow holes 11 for welding, the front sides of the hollow holes 11 are chamfered to have a large angle of 2.5mm, and in order to place a solder paste part which is exposed by reflow welding and is pre-bonded with a nickel sheet, the solder paste exposed in high-temperature airflow can be instantly melted, so that the nickel sheet is well welded on the flexible circuit board, other areas of the flexible circuit board are protected and insulated, and the adverse effects of deformation and the like of the flexible circuit board taking PET as a base material due to high temperature are avoided; the surface of the cover plate 1 is coated with heat insulation paper to form a first heat insulation layer 4; the surface of the support base 2 is wrapped with heat insulation paper to form a second heat insulation layer 5, and the first heat insulation layer 4 and the second heat insulation layer 5 are directly attached and extruded on the front surface and the back surface of the flexible circuit board during welding; it can be understood that, the welding position is used as the important electrical position of the flexible circuit board in the actual use, from top to bottom, a nickel sheet, solder paste, a conducting layer and a base film are respectively arranged, the welding position which is blown by high temperature in the prior art is heated, the solder paste is heated to be dissolved, and then is firmly welded with the nickel sheet, hot air can indirectly act on the base film in the process, if PET is selected as the base film, part of heat is also absorbed by the traditional cover plate and the base in the high-temperature blowing process and acts on the base film to enable the temperature of the base film to rise, so that the PET base film around the welding position deforms due to high temperature, the yield is further reduced, and the advantage of the PET base film on the price is obvious and should not be abandoned; in the invention, during the work, the flexible circuit board is placed on the support bottom and is directly attached to the second heat insulation 5 layer, the hollow holes 11 are adopted to align the welding positions, when the welding positions are heated by hot air, the first heat insulation layer 4 at the uppermost end separates heat, the first heat insulation layer is attached to the second heat insulation layer, the PET base film is prevented from being deformed by hot air due to heating of the jig, the cover plate 1 or the bottom support 2 cannot be heated by preheating in air, further, the processing of the welding position can be completed only by heating the hollow hole 1 during heating, the effective heat insulation of the flexible circuit board is realized during the welding process, the heat is concentrated at the welding position and can not be dissipated to the periphery, further, the flexible circuit board with the PET as the base film is ensured to be smooth, deformation and product brittleness are avoided, and the problems in the prior art are solved;
specifically, the heat insulation paper is formed by compounding mica paper serving as a base material, glass fiber cloth serving as a reinforcing material and high-temperature-resistant organic silicon resin; the coiled insulating material is prepared by selecting mica paper as a base material, selecting glass fiber cloth as a reinforcing material, selecting high-temperature-resistant organic silicon resin for bonding, and performing high-temperature baking, drying, pressing and winding, has good high-temperature-resistant property and heat insulation, and further forms a first heat insulating layer 4 and a second heat insulating layer 5 which are perfectly matched with the jig; the cover plate 1 comprises a heat insulation plate 12 and a connecting plate 13, wherein the heat insulation plate 12 is connected with the connecting plate 13 through a fixing bolt; the heat insulation plate 1 and the support bottom 4 are made of synthetic stone; when the heat insulation board 12 and the first heat insulation layer 4 are applied to practical application, the heat insulation board 12 and the first heat insulation layer 4 form good heat insulation performance, and also have excellent temperature resistance and low heat conductivity (the heat conductivity coefficient is 0.25w/m × k), so that the heat insulation board can keep the characteristic of avoiding deformation at high temperature and good heat insulation effect when being used as a reflow soldering jig, the PET cannot deform due to high-temperature (250 ℃) baking in the reflow soldering process, and the flexible circuit board is pressed through the connecting board 13, so that the flatness of the flexible circuit board is ensured in the winding process; in the prior art, generally, in order to reduce cost, if the adopted PET is used as a base film, under the condition of no thermal insulation, the cover plate attached to the flexible circuit board is directly transferred to the PET when being heated, further certain deformation is generated on the flexible circuit board, the targeted low-temperature solder paste is adopted for welding, but the cover plate is corresponding to a nickel sheet, the welding stretching capacity of the high-temperature solder paste generally reaches 30N, the welding stretching capacity of the low-temperature solder paste is not as high as 15N, the welding firmness degree of the low-temperature solder paste is less than that of the high-temperature solder paste, the synthetic stone skillfully adopted by the application is used as the material of the cover plate 1 and the bottom support 2, the flexible circuit board adopting the PET as the base film can effectively adopt the high-temperature solder paste for reflow soldering process, and the industrial problem is solved.
In this embodiment, the heat insulating plate 12 is connected to the joint plate 13 by fixing bolts; be provided with the connecting hole of adaptation in heat insulating board 12 and linking class 13, through fixing bolt with heat insulating board 12 and the firm combination of linking board 13 be in the same place to form apron 1, in the in-process of production, apron 1 can be provided with the multiunit alone, carries out effectual pressfitting to holding in the palm the end through the mode of multiunit amalgamation, in order to form the tool, can realize that the staff realizes clearing up fast or overhauing, makes in preparation work or ending work going on smoothly.
More specifically, the connecting plates 13 are made of metal; a plurality of groups of magnet units 14 are uniformly arranged on the heat insulation plate 12, the heat insulation plate 12 and the connection plate 13 are magnetically attracted through the magnet units 14, and a screw structure is added for connecting in order to further fix the cover plate and the connection plate; a plurality of groups of magnetic holes 21 capable of accommodating magnetic elements are arranged on one surface of the heat insulation plate 12 far away from the bottom support 2; in actual work, the connecting plates 13 are made of metal, a plurality of groups of magnet units 14 are arranged on the heat insulation plate 12, and the magnet units 14 are attached to the connecting plates in an adsorption mode through a magnetic attraction effect; in order to enhance the pressing capability of the jig on the flexible circuit board in actual use, a plurality of groups of magnetic holes 21 for accommodating magnetic elements are arranged at the lower end of the support base, the magnetic elements can be adhered through high-temperature glue in the magnetic holes 21, cylindrical magnets with the diameter of 3cm are preferably selected as the magnetic elements, the interval between the cylindrical magnets is 10cm, the thickness of the corresponding support base is 4cm, enough depth is ensured for accommodating the cylindrical magnets, the cylindrical magnets are also mutually attracted and combined on the connecting plate through the magnet units 14, pressure is applied to the flexible circuit board with the PET as a substrate by means of the attraction, the flexible circuit board with the PET as the substrate is not easy to deform when reflow soldering is carried out, the flatness with the PET as the flexible circuit board is improved, and the problem that certain edge warping is caused by various external factors is solved.
In the embodiment, the device also comprises a base 3, wherein the bottom support 2 is attached to one surface of the base 4, which is far away from the cover plate; the support bottom 2 is also provided with a plurality of groups of fixing holes which are fixedly connected with the outside; the support base is mainly used for supporting the base 3, so that the base cannot shift upwards, and is fixedly connected with an external device through a fixing hole, so that the displacement phenomenon cannot occur in the work process, and the welding position accuracy of the reflow soldering process is ensured; in practice, the bottom support can be wrapped with the heat insulation paper according to actual conditions.
In this embodiment, a holding position 22 for aligning the flexible circuit board is arranged on one surface of the support base 2 close to the flexible circuit board; hold position 22 and be used for spacing going on the flexible line way board, specifically be according to flexible line way board adaptation recess, hold position 22 cooperation apron 1 and carry out complete cladding lid with the flexible line way board that holds the position with the holding for the skew can not take place for the welding position, has improved the accurate effect of welded.
The invention has the advantages that:
1) the flexible circuit board is placed in the placing position, the hollowed-out hole pairs are aligned to the welding position, the first heat insulation layer and the second heat insulation layer are respectively tightly attached to the flexible circuit board, the hollowed-out holes are heated, and therefore the welding position is machined, heat is effectively insulated to the flexible circuit board in the welding process, heat is concentrated at the welding position and cannot be diffused to the periphery, the flexible circuit board with the PET as a base film is guaranteed to be smooth, deformation and product brittleness cannot occur, and the problems in the prior art are solved;
2) the lower end of the support bottom is provided with a plurality of groups of magnetic holes for accommodating the magnetic elements, the magnetic elements can be bonded through the high-temperature glue in the magnetic holes, and the magnetic elements and the magnet units are mutually attracted on the connecting plate, so that the flatness of the flexible circuit board is improved, and the problem of warping of the product is avoided.
The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. A reflow soldering jig for a flexible circuit board is applied to a reflow soldering process of a PET base film flexible circuit board and is characterized by comprising a cover plate and a support base, wherein the cover plate and the support base are respectively positioned on the front side and the back side of the flexible circuit board; the cover plate is provided with at least one group of hollow holes for welding; the surface of the cover plate is coated with heat insulation paper to form a first heat insulation layer; the surface of the support bottom is wrapped with heat insulation paper to form a second heat insulation layer, and the first heat insulation layer and the second heat insulation layer are directly attached to the front surface and the back surface of the flexible circuit board during welding.
2. The reflow soldering jig for the flexible circuit board according to claim 1, wherein the heat insulation paper is compounded by using mica paper as a base material, glass fiber cloth as a reinforcing material and high temperature resistant organic silicon resin.
3. The reflow soldering jig for a flexible wiring board according to claim 1, wherein the cover plate comprises a heat insulating plate and a joint plate, and the heat insulating plate and the joint plate are connected by fixing bolts.
4. The reflow soldering jig for the flexible circuit board according to claim 3, wherein the heat insulation board and the base are made of synthetic stone.
5. The reflow soldering jig for a flexible circuit board according to claim 3, wherein the connection plate is made of metal.
6. The reflow soldering jig for the flexible circuit board according to claim 3, wherein the heat insulation board is uniformly provided with a plurality of groups of magnet units, and the cover plate and the connecting plate are magnetically attracted through the magnet units; the cover plate and the joint part are connected in a reinforcing mode through a screw structure.
7. The reflow soldering jig for the flexible circuit board according to claim 5, wherein a plurality of sets of magnetic holes for accommodating the magnetic elements are formed in the surface of the cover plate away from the support base.
8. The reflow soldering jig for the flexible circuit board according to claim 1, further comprising a base, wherein the support base is attached to one surface of the base, which is far away from the cover plate.
9. The reflow soldering jig for the flexible circuit board according to claim 8, wherein the base further has a plurality of sets of fixing holes for fixedly connecting with the outside.
10. The reflow soldering jig for the flexible circuit board according to claim 1, wherein a holding position for aligning the flexible circuit board is provided on a surface of the support base close to the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210080657.8A CN114364159A (en) | 2022-01-24 | 2022-01-24 | Reflow soldering jig for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210080657.8A CN114364159A (en) | 2022-01-24 | 2022-01-24 | Reflow soldering jig for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114364159A true CN114364159A (en) | 2022-04-15 |
Family
ID=81092787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210080657.8A Pending CN114364159A (en) | 2022-01-24 | 2022-01-24 | Reflow soldering jig for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114364159A (en) |
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2022
- 2022-01-24 CN CN202210080657.8A patent/CN114364159A/en active Pending
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