CN114364158A - Surface-mounted welding method in furnace - Google Patents
Surface-mounted welding method in furnace Download PDFInfo
- Publication number
- CN114364158A CN114364158A CN202210051267.8A CN202210051267A CN114364158A CN 114364158 A CN114364158 A CN 114364158A CN 202210051267 A CN202210051267 A CN 202210051267A CN 114364158 A CN114364158 A CN 114364158A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- flexible circuit
- reflow
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000003466 welding Methods 0.000 title claims abstract description 30
- 238000005476 soldering Methods 0.000 claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000008569 process Effects 0.000 abstract description 13
- 238000003860 storage Methods 0.000 description 11
- 230000008451 emotion Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 8
- 239000013598 vector Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002996 emotional effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application provides a chip-on-furnace welding method. In the embodiment of the application, the printed circuit board is fixed on the pad; vertically covering one end of a flexible circuit board on the printed circuit board, and fixing the other end of the flexible circuit board in the bonding pad; the flexible circuit board comprises at least one flexible circuit board; and sending the bonding pad with the printed circuit board and the flexible circuit board into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds. Through fixing the printed circuit board and the flexible circuit board in the reflow soldering process, poor welding of welding points is reduced, welding efficiency is improved, bubbles generated at welding positions are reduced, and device quality is improved.
Description
Technical Field
The application relates to the field of welding, in particular to a patch furnace-passing welding method.
Background
Reflow soldering refers to soldering by using a reflow oven, an infrared heating lamp or a heat gun, etc. to melt solder by controlled heating after one or more electronic components are connected to contact pads by using solder paste (a mixture of solder and flux), so as to achieve permanent bonding. Due to the demand for miniaturization of circuit boards of electronic products, sheet-like elements are emerging, and conventional soldering methods have not been adapted to the demand. With the development of surface mount technology, reflow soldering machines, which are a part of surface mount technology, have been developed accordingly, and their applications are becoming widespread, and almost all electronic product fields have been applied. A heater is provided in a solder chamber formed in a solder chamber of the reflow soldering machine to solder components on the circuit board in the solder chamber to the circuit board by the molten solder paste.
The existing paster process comprises the following process flows: incoming material detection, spot adhesive pasting, drying, reflow soldering, cleaning, detection and repair.
However, in the surface mounting process, poor welding and low welding efficiency of welding points are easy to occur on the surface, bubbles are generated at the welding position due to the factors, and the quality of the device is seriously affected by the existence of the bubbles in the surface mounting layer, so that overlarge contact resistance, poor heat dissipation performance and the like can be caused.
Disclosure of Invention
In view of the problem, the present application is proposed in order to provide a method of through-the-oven bonding of a patch that overcomes or at least partially solves the problem, comprising:
a method of patch through-furnace welding comprising: the method is used for carrying out reflow soldering treatment on the printed circuit board and the flexible circuit board, and is characterized by comprising the following steps:
fixing the printed circuit board on a pad;
vertically covering one end of a flexible circuit board on the printed circuit board, and fixing the other end of the flexible circuit board in the bonding pad; the flexible circuit board comprises at least one flexible circuit board;
and sending the bonding pad with the printed circuit board and the flexible circuit board into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds.
Preferably, the step of fixing the other end of the flexible circuit board in the pad includes:
placing the other end of the flexible circuit board in a second positioning groove of the bonding pad;
vertically covering a fixed plate above the flexible circuit board, wherein the fixed plate is arranged in the middle of the flexible circuit board; the length of the fixing plate is greater than that of the printed circuit board, and two ends of the fixing plate are connected with the welding pads.
Preferably, the fixing plate is a magnetic strip.
Preferably, at least one second positioning column is arranged in the second positioning groove;
the flexible circuit board is provided with a second positioning hole at a position corresponding to the second positioning column.
Preferably, the step of fixing the printed circuit board on the pad includes:
placing the printed circuit board in a first positioning groove of the bonding pad, wherein at least one first positioning column is arranged in the first positioning groove;
the printed circuit board is fixed in the first positioning groove through the first positioning column.
Preferably, the furnace temperature peak temperature of the reflow furnace is 245-255 ℃.
Preferably, the furnace temperature peak temperature of the reflow furnace is 240 ℃.
Preferably, the reflow soldering time is 60 to 90 seconds.
Preferably, the tin in the reflow oven is lead-free tin.
Preferably, the step of sending the pad on which the printed circuit board and the flexible circuit board are placed into a reflow oven for reflow soldering further includes:
and taking the printed circuit board and the flexible circuit board out of the bonding pad, and detecting the positions of the printed circuit board and the flexible circuit board for reflow soldering.
The application has the following advantages:
in the embodiment of the application, the printed circuit board is fixed on the pad; vertically covering one end of a flexible circuit board on the printed circuit board, and fixing the other end of the flexible circuit board in the bonding pad; the flexible circuit board comprises at least one flexible circuit board; and sending the bonding pad with the printed circuit board and the flexible circuit board into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds. Through fixing the printed circuit board and the flexible circuit board in the reflow soldering process, poor welding of welding points is reduced, welding efficiency is improved, bubbles generated at welding positions are reduced, and device quality is improved.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
FIG. 1 is a flow chart illustrating the steps of a method for bonding a chip in a furnace according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a through-furnace bonding method for bonding chips according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a computer device according to an embodiment of the present invention.
1. A printed circuit board; 2. a flexible wiring board; 3. and (7) fixing the plate.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the embodiment of the present application, by fixing the printed circuit board 1 on a pad; vertically covering one end of a flexible circuit board 2 on the printed circuit board 1, and fixing the other end of the flexible circuit board 2 in the bonding pad; the flexible circuit board 2 comprises at least one; and (3) sending the bonding pads on which the printed circuit board 1 and the flexible circuit board 2 are placed into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds. By fixing the printed circuit board 1 and the flexible circuit board 2 in the reflow soldering process, poor soldering of soldering points is reduced, soldering efficiency is improved, bubbles generated at the soldering position are reduced, and device quality is improved.
Referring to fig. 1, a method for soldering a chip in a furnace according to an embodiment of the present application is shown, the method including:
s110, fixing the printed circuit board 1 on a welding plate;
s120, vertically covering one end of the flexible circuit board 2 on the printed circuit board 1, and fixing the other end of the flexible circuit board 2 in the bonding pad; the flexible circuit board 2 comprises at least one;
s130, sending the bonding pad with the printed circuit board 1 and the flexible circuit board 2 into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds;
next, a through-furnace soldering method of the patch in the present exemplary embodiment will be further described.
As stated in step S110, the printed circuit board 1 is fixed on the pad.
In an embodiment of the present invention, the specific process of "fixing the printed circuit board 1 on the pad" in step S110 can be further described with reference to the following description.
In an embodiment of the present invention, the printed circuit board 1 is placed in a first positioning groove of the pad, and at least one first positioning column is disposed in the first positioning groove; the printed circuit board 1 is fixed in the first positioning groove through the first positioning column.
As an example, the pad is provided with a first positioning groove, multiple groups of positioning grooves may be provided in the pad, each group of positioning grooves includes one first positioning groove and a preset number of second positioning grooves, and the preset number is related to how many flexible printed circuit boards 2 need to be soldered on the printed circuit board 1.
In one embodiment, the first positioning groove is provided with six second positioning grooves; namely, one set of the positioning plates comprises a first positioning groove and six second positioning grooves arranged side by side.
As an example, the first positioning groove is adapted to the printed circuit board 1, the shape of the first positioning groove is the same as the shape of the printed circuit board 1, a first positioning column is arranged in the first positioning groove, a first positioning hole is pre-arranged at a position corresponding to the printed circuit board 1, and the first positioning hole is matched with the first positioning column, so that the printed circuit board 1 can be fixed in the pad. Placing the printed circuit board 1 in a first positioning groove of the bonding pad, wherein at least one first positioning column is arranged in the first positioning groove; the printed circuit board 1 is fixed in the first positioning groove through the first positioning column.
As an example, a buffer pad is arranged in the first positioning groove, and the buffer pad is arranged at a position where the printed circuit board 1 needs to be soldered, and if one printed circuit board 1 needs to be soldered with six flexible circuit boards 2 in the present application, six buffer pads are arranged.
As stated in step S120, vertically covering one end of the flexible printed circuit board 2 on the printed circuit board 1, and fixing the other end of the flexible printed circuit board 2 in the pad; the flexible circuit board 2 comprises at least one.
In an embodiment of the invention, the specific process of "vertically covering one end of the flexible printed circuit board 2 on the printed circuit board 1" in step S120 can be further described with reference to the following description.
In an embodiment of the present invention, one end of the flexible printed circuit board 2 covers a portion of the printed circuit board 1, and the flexible printed circuit board 2 is perpendicular to the printed circuit board, so that the flexible printed circuit board 2 covers a position corresponding to the printed circuit board 1, that is, a portion of the flexible printed circuit board 2 and the printed circuit board 1 that needs to be soldered, and overlaps.
In an embodiment of the invention, six flexible printed circuit boards 2 are covered on the printed circuit board 1, and the six flexible printed circuit boards 2 are arranged side by side with equal intervals and are arranged on the same side of the printed circuit board 1.
As stated in step S120, vertically covering one end of the flexible printed circuit board 2 on the printed circuit board 1, and fixing the other end of the flexible printed circuit board 2 in the pad; the flexible circuit board 2 comprises at least one.
In an embodiment of the present invention, the specific process of "fixing the other end of the flexible circuit board 2 in the bonding pad" in step S120 can be further described with reference to the following description.
In an embodiment of the present invention, the other end of the flexible printed circuit 2 is disposed in the second positioning groove of the pad; vertically covering a fixed plate 3 above the flexible circuit board 2, wherein the fixed plate 3 is arranged in the middle of the flexible circuit board 2; the length of the fixing plate 3 is greater than that of the printed circuit board, and two ends of the fixing plate 3 are connected with the welding pads.
In a specific embodiment, one end of each of two ends of the flexible printed circuit board 2 covers one side of the printed circuit board 1, the other end of each of the two ends is disposed in the corresponding pad, the second positioning groove is adapted to the flexible printed circuit board 2, and a second positioning column is disposed inside the second printed circuit board and used for fixing the position of the flexible printed circuit board 2 in the second positioning groove.
As an example, a second positioning hole is disposed at a position of the flexible printed circuit 2 corresponding to the second positioning column. At least one second positioning column is arranged in the second positioning groove; the flexible circuit board 2 is provided with a second positioning hole at a position corresponding to the second positioning column.
In a specific embodiment, the fixing plate 3 covers the flexible circuit board 2, so that the bonding pad, the printed circuit board 1, the flexible circuit board 2 and the fixing plate 3 are sequentially arranged from bottom to top, and the fixing plate 3 is a magnetic stripe; the position where the fixed plate 3 and the flexible printed circuit board 2 are overlapped avoids the position where the printed circuit board 1 and the flexible printed circuit board 2 need to be welded, and the position of the flexible printed circuit board 2, specifically, the position below the welding position, can be fixed.
In an embodiment, the fixing plate 3 is provided with a connecting member at each of two ends thereof, and the fixing plate 3 fixes the flexible printed circuit board 2 on the bonding pad through the connecting member. A fixing plate 3 is vertically covered above the flexible printed circuit board 2, and the fixing plate 3 is disposed on the flexible printed circuit board 2, as shown in fig. 2.
As an example, the fixing plate 3 is disposed in parallel with the printed wiring board.
In step S130, the solder pads on which the printed circuit board 1 and the flexible printed circuit board 2 are placed are sent to a reflow oven at a temperature of 200-350 ℃ for reflow soldering for 30-120 seconds.
In an embodiment of the present invention, the specific process of "sending the pads on which the printed circuit board 1 and the flexible circuit board 2 are placed into a reflow oven at a temperature of 200-350 ℃ for 30-120 seconds" in step S120 can be further described with reference to the following description.
In an embodiment of the present invention, the printed circuit board 1 and the flexible printed circuit board 2 are taken out from the bonding pad, and the positions of the printed circuit board 1 and the flexible printed circuit board 2 subjected to reflow soldering are detected.
As an example, the furnace temperature peak temperature of the reflow furnace is 245-; the reflow soldering time is 60-90 seconds; and the tin in the reflow furnace is lead-free tin.
As an example, the oven temperature peak temperature of the reflow oven is 245 degrees celsius; the time for reflow soldering is 90 seconds; and the tin in the reflow furnace is lead-free tin.
As an example, the oven temperature peak temperature of the reflow oven is 255 degrees celsius; the time for reflow soldering is 60 seconds; and the tin in the reflow furnace is lead-free tin.
As an example, the oven temperature peak temperature of the reflow oven is 200 degrees celsius; the time for reflow soldering is 120 seconds; and the tin in the reflow furnace is lead-free tin.
As an example, the oven temperature peak temperature of the reflow oven is 350 degrees celsius; the time for reflow soldering is 30 seconds; and the tin in the reflow furnace is lead-free tin.
It should be noted that reflow soldering is the most commonly used method for bonding electronic components to the printed circuit board 1 by using the surface mount technology. Through-hole reflow soldering can replace wave soldering and can effectively reduce assembly cost.
In a specific embodiment, the printing adopted equipment is a GKG-GSE full-automatic printing machine, the chip-applying equipment is a YSM10 chip mounter, and the bonding pad is adjusted according to the width and the thickness of the printed circuit board 1. The reflow furnace is a Kentai reflow furnace. The final detection is AOI (Automated Optical Inspection), which is equipment for detecting common defects encountered in welding production based on an Optical principle.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
The present embodiment and the above embodiments have repeated operation steps, and the present embodiment is only described briefly, and the rest of the schemes may be described with reference to the above embodiments.
For the system embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
Referring to fig. 3, a computer device of the patch oven welding method of the present application is shown, which may specifically include the following:
the computer device 12 described above is embodied in the form of a general purpose computing device, and the components of the computer device 12 may include, but are not limited to: one or more processors or processing units 16, a memory 28, and a bus 18 that couples various system components including the memory 28 and the processing unit 16.
The memory 28 may include computer system readable media in the form of volatile memory, such as random access memory 30 and/or cache memory 32. Computer device 12 may further include other removable/non-removable, volatile/nonvolatile computer system storage media. By way of example only, storage system 34 may be used to read from and write to non-removable, nonvolatile magnetic media (commonly referred to as "hard drives"). Although not shown in FIG. 3, a magnetic disk drive for reading from and writing to a removable, nonvolatile magnetic disk (e.g., a "floppy disk") and an optical disk drive for reading from or writing to a removable, nonvolatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to bus 18 by one or more data media interfaces. The memory may include at least one program product having a set (e.g., at least one) of program modules 42, with the program modules 42 configured to carry out the functions of embodiments of the application.
A program/utility 40 having a set (at least one) of program modules 42 may be stored, for example, in memory, such program modules 42 including but not limited to an operating system, one or more application programs, other program modules 42, and program data, each of which examples or some combination thereof may comprise an implementation of a network environment. Program modules 42 generally perform the functions and/or methodologies of the embodiments described herein.
The processing unit 16 executes programs stored in the memory 28 to execute various functional applications and data processing, such as implementing the patch oven welding method provided by the embodiment of the present application.
That is, the processing unit 16 implements fixing of the printed circuit board 1 to the pad when executing the program; vertically covering one end of a flexible circuit board 2 on the printed circuit board 1, and fixing the other end of the flexible circuit board 2 in the bonding pad; the flexible circuit board 2 comprises at least one; and (3) sending the bonding pads on which the printed circuit board 1 and the flexible circuit board 2 are placed into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds.
In an embodiment of the present application, the present application further provides a computer-readable storage medium, on which a computer program is stored, which when executed by a processor, implements the patch oven welding method as provided in all embodiments of the present application.
That is, the program when executed by the processor implements: acquiring an emotion sample image set, and establishing an emotion level matrix vector according to the emotion sample image set, a reference score and an identity matrix; the emotion sample image set consists of face sample emotion images marked with emotion level labels; the emotion level labels include normal emotions, bad emotions, and severe negative emotions; obtaining a smile sample image set, and establishing a smile matrix vector according to the smile sample image set, the benchmark score and the unit matrix; wherein the smile sample image set consists of human face sample smile images marked with smile labels; the smile tag comprises a smiling face and a non-smiling face;
acquiring video data in a preset period, wherein the video data comprises face images of a target student group; the target student group consists of a plurality of student individuals; determining a set of individual column vectors of the target student population from the video data; wherein the individual column vector group set consists of individual column vector groups corresponding to each of the student individuals in the target student group; and determining the student individuals with abnormal emotional states according to the personal column vector group set, the emotional level matrix vector, the smile matrix vector and the benchmark score.
Any combination of one or more computer-readable media may be employed. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Computer program code for carrying out operations for aspects of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the operator's computer, partly on the operator's computer, as a stand-alone software package, partly on the operator's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the operator's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider). The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, the statement that "comprises an … …" limits an element does not exclude the presence of other identical elements in the process, method, article, or terminal equipment comprising the element.
The above detailed description is provided for a chip-on-oven welding method, and the principle and the implementation of the present application are explained by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method for soldering a printed circuit board to a flexible printed circuit board by reflow soldering, comprising:
fixing the printed circuit board on a pad;
vertically covering one end of a flexible circuit board on the printed circuit board, and fixing the other end of the flexible circuit board in the bonding pad; the flexible circuit board comprises at least one flexible circuit board;
and sending the bonding pad with the printed circuit board and the flexible circuit board into a reflow oven with the temperature of 200-350 ℃ for reflow soldering for 30-120 seconds.
2. A method of soldering by a mounter according to claim 1, wherein said step of fixing the other end of the flexible wiring board in the pad comprises:
placing the other end of the flexible circuit board in a second positioning groove of the bonding pad;
vertically covering a fixed plate above the flexible circuit board, wherein the fixed plate is arranged in the middle of the flexible circuit board; the length of the fixing plate is greater than that of the printed circuit board, and two ends of the fixing plate are connected with the welding pads.
3. A patch oven welding method according to claim 2 wherein said holding plate is a magnetic strip.
4. The patch oven welding method of claim 2, wherein at least one second positioning column is arranged in the second positioning groove;
the flexible circuit board is provided with a second positioning hole at a position corresponding to the second positioning column.
5. The chip oven bonding method according to claim 1, wherein the step of fixing the printed circuit board to the pad comprises:
placing the printed circuit board in a first positioning groove of the bonding pad, wherein at least one first positioning column is arranged in the first positioning groove;
the printed circuit board is fixed in the first positioning groove through the first positioning column.
6. The through-furnace soldering method for patches according to claim 1, wherein the furnace temperature peak temperature of the reflow furnace is 245-255 ℃.
7. A method of patch oven soldering according to claim 1, wherein the oven temperature peak temperature of the reflow oven is 240 degrees celsius.
8. A patch oven bonding method according to claim 1, wherein the time for reflow soldering is 60 to 90 seconds.
9. A method of solder bonding in a reflow oven according to claim 1, wherein the tin in the reflow oven is lead-free tin.
10. The die bonder soldering method according to claim 1, wherein said step of feeding the pad on which the printed circuit board and the flexible wiring board are placed into a reflow furnace for reflow soldering further comprises:
and taking the printed circuit board and the flexible circuit board out of the bonding pad, and detecting the positions of the printed circuit board and the flexible circuit board for reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210051267.8A CN114364158B (en) | 2022-01-17 | 2022-01-17 | Surface mount device passing furnace welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210051267.8A CN114364158B (en) | 2022-01-17 | 2022-01-17 | Surface mount device passing furnace welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114364158A true CN114364158A (en) | 2022-04-15 |
| CN114364158B CN114364158B (en) | 2024-05-28 |
Family
ID=81090629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210051267.8A Active CN114364158B (en) | 2022-01-17 | 2022-01-17 | Surface mount device passing furnace welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114364158B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005032135A1 (en) * | 2005-07-07 | 2007-01-18 | Endress + Hauser Gmbh + Co. Kg | Method for soldering a circuit board with lead-free solder paste in a reflow soldering oven, circuit board for such a method and reflow soldering oven |
| CN2904342Y (en) * | 2006-03-14 | 2007-05-23 | 惠州市德赛电池有限公司 | Printed circuitboard and flexible circuitboard connecting structure |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN203942697U (en) * | 2014-06-05 | 2014-11-12 | 嘉兴职业技术学院 | Flexible printed wiring board |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
| CN113905540A (en) * | 2021-09-30 | 2022-01-07 | 深圳市华思科泰电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
-
2022
- 2022-01-17 CN CN202210051267.8A patent/CN114364158B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005032135A1 (en) * | 2005-07-07 | 2007-01-18 | Endress + Hauser Gmbh + Co. Kg | Method for soldering a circuit board with lead-free solder paste in a reflow soldering oven, circuit board for such a method and reflow soldering oven |
| CN2904342Y (en) * | 2006-03-14 | 2007-05-23 | 惠州市德赛电池有限公司 | Printed circuitboard and flexible circuitboard connecting structure |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN203942697U (en) * | 2014-06-05 | 2014-11-12 | 嘉兴职业技术学院 | Flexible printed wiring board |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
| CN113905540A (en) * | 2021-09-30 | 2022-01-07 | 深圳市华思科泰电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114364158B (en) | 2024-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1896811B (en) | Flexible printed circuit and display device using the same | |
| US8650744B2 (en) | Technique for reducing wasted material on a printed circuit board panel | |
| US9928767B2 (en) | System and method for testing chip-on-glass bonding quality | |
| Fukami et al. | Forensic analysis of water damaged mobile devices | |
| CN113495189A (en) | Test method for evaluating reliability of electronic assembly material | |
| CN114364158B (en) | Surface mount device passing furnace welding method | |
| JP2008039725A (en) | Method and apparatus for electrically inspecting printed wiring board | |
| US9867295B2 (en) | Ball grid array system | |
| US7839157B2 (en) | Surface mount testing system | |
| WO2021000842A1 (en) | Method and apparatus for testing printed circuit board (pcb) | |
| US4216051A (en) | Apparatus for making bondable finger contacts | |
| US7900808B2 (en) | Soldering method and system thereof | |
| JP5026032B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| US9265152B2 (en) | Dual side staggered surface mount dual in-line memory module | |
| KR101305920B1 (en) | Double side fpcb automatic bonding tool and method | |
| JP2002353508A (en) | Optical transmission device | |
| US7172106B2 (en) | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board | |
| JP6029162B2 (en) | Defect inspection device, component mounting system, defect inspection method, program | |
| CN220457652U (en) | Take elastic PCB board and display module assembly | |
| JP2013080877A (en) | Fpd module assembly device | |
| US20230097863A1 (en) | Method and system for stacking printed circuit board | |
| US8164915B2 (en) | System for electronic components mounted on a circuit board | |
| JPH0815717A (en) | Liquid crystal display device | |
| JP2022189359A (en) | Parts mounting system | |
| CN114650727A (en) | Circuit board assembly processing system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |