CN114361916B - Heat sink structural part for laser and laser with heat sink structural part - Google Patents
Heat sink structural part for laser and laser with heat sink structural part Download PDFInfo
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- CN114361916B CN114361916B CN202111445508.9A CN202111445508A CN114361916B CN 114361916 B CN114361916 B CN 114361916B CN 202111445508 A CN202111445508 A CN 202111445508A CN 114361916 B CN114361916 B CN 114361916B
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- 239000013078 crystal Substances 0.000 claims abstract description 47
- 230000003287 optical effect Effects 0.000 claims abstract description 42
- 238000009434 installation Methods 0.000 claims abstract description 23
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 230000013011 mating Effects 0.000 claims description 5
- 238000005070 sampling Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 2
- 238000005086 pumping Methods 0.000 description 19
- 238000013461 design Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000007787 solid Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
The invention provides a heat sink structural member for a laser and the laser with the heat sink structural member, wherein the heat sink structural member is provided with a first installation position for installing a laser crystal, a second installation position for installing a polarizing element and a third installation position for installing an optical element; wherein the two fixing arms near the first installation position are at least partially connected to form an arch bridge-shaped reinforcing structure. Therefore, the first mounting position, the second mounting position and the third mounting position are arranged on the heat sink structural member, and the laser crystal, the polarizing element and other optical elements are integrally mounted and fixed on the heat sink structural member, so that the laser diode, the laser crystal, the polarizing element and other optical elements are subjected to temperature control in high and low temperature environments at the same time, and the optical elements such as the laser crystal and the like are prevented from being influenced by temperature to generate stress in the high and low temperature environments, and the beam quality of output laser is further influenced. Moreover, the structural strength of the heat sink structural member is enhanced by forming an arch bridge-like reinforcing structure.
Description
Technical Field
The invention relates to the technical field of lasers, in particular to a heat sink structural member for a laser and the laser with the heat sink structural member.
Background
All-solid-state laser (DPSSL) pumped by Laser Diode (LD) has become the main stream direction of solid laser development due to the advantages of high efficiency, long service life, compact structure and the like, and is widely applied in the fields of laser processing, laser ranging, target indication, laser radar and the like.
The pumping mode of the laser diode mainly comprises two modes of end pumping and side pumping. The end-face pumping is easy to realize the matching of pumping light and laser modes, so that the efficiency is high, the beam quality is good, and the end-face pumping is an ideal choice of a low-power laser device. Side pumping can simply increase the pumping length to carry more pumping energy than end pumping, so that in lasers requiring larger output power, side pumping is commonly used to pump solid laser media. YAG is the most commonly used laser crystal and has extremely excellent optical, thermal and mechanical properties.
The output energy of a diode pumped YAG laser is closely related to the operating temperature of the diode. The spectral width of a laser diode is typically around 3nm, which is comparable to the absorption spectral width of Nd: YAG. The emission band of the laser diode with the center wavelength of 808nm can be well matched with the neodymium absorption band in spectrum, and high pumping efficiency is generated.
In the related art, due to the material difference of different parts of the laser, in an environment with larger temperature change, the expansion coefficients of the different parts of the laser are different, so that gaps are generated between the parts of the laser and a heat sink structure to influence the heat dissipation effect of each part of the laser, or an optical element is stressed to generate stress birefringence, and further the output quality of laser is influenced. In addition, due to the miniaturization and light weight design requirements of the laser, the heat sink component of the laser has the problem of insufficient structural strength.
Disclosure of Invention
The invention aims to solve the technical problems of improving the heat dissipation effect of each component of a laser, reducing the probability of influence of temperature change on optical elements in a resonant cavity and improving the structural strength of a heat sink of the laser.
According to the heat sink structural member for the laser, which is provided with a first mounting position for mounting a laser crystal, a second mounting position for mounting a polarizing element and a third mounting position for mounting an optical element; wherein two fixing arms near the first installation position are at least partially connected to form an arch bridge-shaped reinforcing structure.
According to some embodiments of the invention, the heat sink structure comprises:
the back of the base plate is connected with the semiconductor refrigerator, the front of the base plate is provided with the first installation position, the second installation position and the third installation position, the two fixing arm parts are arranged on the front of the base plate in a staggered way, and the two fixing arms are connected towards the positions of each other to form an arch bridge-shaped reinforcing structure.
In some embodiments of the invention, the fixing arm comprises a plurality of bent arm sections, and the thickness of each arm section of the fixing arm gradually decreases along the direction away from the substrate.
According to some embodiments of the invention, the inner surface of the stationary arm includes a plurality of mating surfaces for soldering the laser diode array.
In some embodiments of the invention, the substrate is partially recessed at the location where the first mounting location is located to form a groove.
According to some embodiments of the invention, the optical element mounted at the third mounting location comprises a wedge mirror tuning cavity or a crystal tuning laser cavity.
In some embodiments of the invention, the fixed arm is provided with a temperature sampling hole.
According to some embodiments of the invention, the laser crystal, the polarizing element and the optical element are adhesively secured to the heat sink structure or secured to the heat sink structure by a mount.
A laser according to an embodiment of the present invention includes:
a semiconductor refrigerator;
a heat sink structure for a laser as claimed in any one of claims 1 to 8, the heat sink structure being secured to the semiconductor refrigerator;
the laser crystal is arranged at the first installation position of the heat sink structural member;
a polarizing element mounted to the second mounting location of the heat sink structure;
and the optical element is arranged at the third installation position of the heat sink structural member.
According to some embodiments of the invention, the working medium of the laser crystal comprises two Nd: YAG crystals.
The heat sink structural member for the laser and the laser with the heat sink structural member realize the integral temperature control technology of the laser diode, the laser crystal and the optical element, so that a laser working medium is kept at a relatively constant temperature when working in a limiting temperature environment, the length of the working medium is shortened as much as possible, and the mechanical stress of the laser crystal is reduced.
The heat sink structural member is mechanically connected with the upper part of the rotationally symmetrical pumping surface for reinforcing structural design, the structural strength of the diode heat sink structural member can be greatly improved, when the diode heat sink structural member, the TEC and the radiator are fixedly connected with each other, the diode laser heat sink structural member can be kept in a stable state, deformation is not easy to occur, and the heat sink structural member and the TEC are in good contact and high-efficiency heat transfer. The fixing mode allows the design of the laser heat sink structural member as light and thin as possible, and is beneficial to the light and small-sized of the whole machine.
Besides the laser crystal, the heat sink structural member can be provided with other optical elements which are easily affected by temperature, such as a polaroid, so that the optical elements are always consistent with the temperature of the laser diode, and the problem that the laser energy output is affected due to the characteristic change of the optical elements caused by severe change of the ambient temperature is avoided.
Drawings
Fig. 1 is a schematic diagram of a heat sink structure for a laser according to an embodiment of the present invention.
Description of the drawings:
the heat sink structure 100,
the substrate 10, the first mounting location 101, the second mounting location 102, the third mounting location 103, the recess 105,
fixing arm 20, mating surface S1, reinforcing structure 210, temperature sampling hole 30.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the present invention is given with reference to the accompanying drawings and preferred embodiments.
In the related art, for most high peak power pulse lasers of the type on-board, on-board or hand-held, a semiconductor refrigerator (TEC) is selected to control the temperature of the laser diode. The typical pumping source of the laser diode mainly comprises a laser diode, a semiconductor refrigerator (TEC), a radiator and an axial flow fan, wherein the semiconductor refrigerator controls the temperature of the laser diode to be a constant temperature value, and redundant heat generated by the TEC is transmitted into the external environment through the radiator and the axial flow fan.
For most of onboard, vehicle-mounted or handheld high-peak power pulse lasers, the lasers are required to have strong environment adaptability and can work normally at the environment temperature of-50 ℃ to +65 ℃. For a conventional non-water-cooling laser, a YAG crystal as a laser working medium is directly adhered to a heat sink, heat generated during laser working is dissipated in a conduction mode, and the crystal has no temperature control measure. Because the whole machine is required to work in an environment of minus 50 ℃ to +65 ℃, the temperature change of a laser working medium can be more than 100 ℃, and because the crystal is fixed in an adhesive mode and has a longer length, the adhesion of two materials with different expansion coefficients can generate larger tangential stress under the condition of wide temperature change, the oscillation of laser in a resonant cavity is influenced, and the stability of laser energy is reduced.
For many high peak power pulse lasers of the on-board, or hand-held type, miniaturization and weight reduction of the laser are required. In general, a laser is formed by using a metal housing as a carrying structure of a laser resonator, and an optical element is fixed to the metal housing through a metal element seat to form the laser resonator.
For most electro-optic Q-switched lasers, a polarizer is selected as the polarizing element. The transmittance of the polarizing film plated on the polarizing plate for horizontal and vertical polarized light can be changed at different ambient temperatures, so that the extinction ratio is poorer at a low temperature than that of a normal polarizing plate at a normal temperature.
The applicant has found that in practical applications, due to the miniaturization and light weight requirements of the diode pumped solid state laser, the design of the diode pumped solid state laser is generally reduced by adopting a method for reducing the thickness of the diode laser heat sink. The method can reduce the strength of the heat sink structure, when the lower part of the diode laser heat sink is placed into the semiconductor refrigerator and then is fixed on the radiator, the strength of the diode heat sink is weakened, the fixing hole sites of the diode heat sink need to be fixed across two sides of the TEC, the diode heat sink deforms due to the large span, and a gap is formed between the diode heat sink and the TEC, so that the temperature control effect of the TEC is seriously weakened. The deformation of the diode heat sink simultaneously causes the laser crystal fixed on the heat sink to generate tiny displacement, and affects laser oscillation and beam quality.
If the mechanical deformation caused by the installation of the diode heat sink is reduced or eliminated, and meanwhile, a good pumping structure is applied and the adverse effect caused by temperature change is eliminated, the problem of dynamic energy reduction of laser output in a low-temperature environment of the laser under the requirement of miniaturization and light weight of the laser can be solved. Therefore, the invention provides a heat sink structural member for a laser and the laser with the heat sink structural member.
As shown in fig. 1, a heat sink structure 100 for a laser according to an embodiment of the present invention, the heat sink structure 100 is provided with a first mounting site 101 for mounting a laser crystal, a second mounting site 102 for mounting a polarizing element, and a third mounting site 103 for mounting an optical element; wherein the two securing arms 20 adjacent to the first mounting location 101 are at least partially connected to form an arch-bridge-like reinforcement structure 210.
According to the heat sink structural member 100 for a laser in the embodiment of the invention, by arranging the first mounting position 101, the second mounting position 102 and the third mounting position 103 on the heat sink structural member 100, and integrally mounting and fixing the laser crystal, the polarizing element and other optical elements on the heat sink structural member 100, the laser diode, the laser crystal, the polarizing element and other optical elements are simultaneously subjected to temperature control in high and low temperature environments, so that the optical elements such as the laser crystal and the like are prevented from being subjected to stress caused by temperature influence in the high and low temperature environments, and the beam quality of output laser is further influenced. The heat sink structure 100 is compact in design, and achieves the effect of miniaturization and multifunction of the laser diode heat sink structure 100.
In addition, the structural strength of the heat sink structural member 100 is enhanced by forming the arched bridge-shaped reinforcing structure 210, the installation stability of the integrated optical element is ensured, and the problem that the heat sink structural member 100 of the existing diode pump solid laser causes mechanical deformation in the screw installation and fixation process, so that gaps are generated between the heat sink structural member and the semiconductor refrigerator to influence the heat dissipation effect and further influence the output energy is solved.
As shown in fig. 1, a heat sink structure 100, according to some embodiments of the invention, includes: the substrate 10, the back of the substrate 10 is connected with the semiconductor refrigerator, the front of the substrate 10 is provided with a first installation position 101, a second installation position 102 and a third installation position 103, the two fixing arms 20 are arranged on the front of the substrate 10 in a staggered mode, and the two fixing arms 20 are connected towards each other to form an arch bridge-shaped reinforcing structure 210. The design of the reinforcement structure 210 can ensure the structural strength of the heat sink structural member 100, and can reduce the weight of the heat sink structural member 100, thereby realizing the light weight and miniaturized design of the heat sink structural member 100.
In some embodiments of the present invention, as shown in fig. 1, the fixing arm 20 includes a plurality of bent arm sections, and the thickness of each arm section of the fixing arm 20 gradually decreases in a direction away from the substrate 10. Thereby, the structural strength of the fixing arm 20 can be ensured on the basis of the weight reduction of the fixing arm 20.
According to some embodiments of the present invention, as shown in fig. 1, the inner surface of the stationary arm 20 includes a plurality of mating surfaces S1 for welding a laser diode array (LD). In this way, a rotationally symmetrical pump structure can be formed by the plurality of mating surfaces S1. Thereby improving the uniformity of the fluorescence distribution inside the laser crystal.
In some embodiments of the present invention, as shown in fig. 1, a portion of the substrate 10 where the first mounting location 101 is disposed is recessed to form a recess 105. Thereby, a sufficient mounting space can be provided for the laser diode array
According to some embodiments of the invention, the optical element mounted at the third mounting location 103 comprises a wedge mirror tuning cavity or a crystal tuning laser cavity. The wedge mirror may be placed at the third mounting position 103 to adjust the resonant cavity or the high refractive index crystal may be placed to adjust the laser path length of the laser resonant cavity, as required.
In some embodiments of the present invention, the stationary arm 20 is provided with a temperature sampling hole 30. Therefore, the temperature of the laser crystal and the heat sink structural member 100 can be collected through the temperature sampling hole 30, and the temperature can be conveniently adjusted and controlled.
According to some embodiments of the present invention, the laser crystal, the polarizing element, and the optical element are adhesively fixed to the heat sink structure 100, whereby the fixing efficiency of the laser crystal, the polarizing element, and the optical element can be improved. Alternatively, the laser crystal, polarizing element, and optical element may be secured to the heat sink structure 100 by fasteners (e.g., screws). Thus, the laser crystal, the polarizing element, and the optical element can be firmly and stably fixed.
A laser according to an embodiment of the present invention includes: semiconductor refrigerators, heat sink structures 100, laser crystals, polarizing elements, and optical elements.
The heat sink structure 100 is the heat sink structure 100 for a laser as described above, and the heat sink structure 100 is fixed to a semiconductor refrigerator. The laser crystal is mounted to a first mounting location 101 of the heat sink structure 100, the polarizing element is mounted to a second mounting location 102 of the heat sink structure 100, and the optical element is mounted to a third mounting location 103 of the heat sink structure 100.
According to the laser provided by the embodiment of the invention, the mounting positions of the laser crystal, the polarizing element and other optical elements are integrated on the heat sink structural member 100, so that the laser diode, the laser crystal, the polarizing element and other optical elements are simultaneously subjected to temperature control in high and low temperature environments, the temperature of the optical elements and the heat sink structural member 100 of the laser diode is kept constant all the time, and the stress generated by the optical elements such as the laser crystal and the like under the influence of the temperature in the high and low temperature environments is avoided, and the beam quality of output laser is further influenced.
The heat sink structural member 100 is mechanically connected above the rotationally symmetrical pumping surface, so that the structural strength of the heat sink structural member 100 is increased, the installation stability of an integrated optical element is ensured, and the problem that the heat sink of the existing diode pumping solid laser causes mechanical deformation in the process of installing and fixing a screw, so that a gap is generated between the heat sink structural member and a semiconductor refrigerator to influence the heat dissipation effect and further influence the output energy is solved.
According to some embodiments of the invention, the working medium of the laser crystal comprises two Nd: YAG crystals. The laser working medium of the present invention is not limited to a Nd/YAG crystal, and Nd/YVO may be selected as required 4 And the like. The laser working medium adopts a short rod mode, so that the bonding length of two different materials is shortened, the bonding stress between the laser working substance and an adjacent heat sink is reduced, and the working energy stability of the laser at the limit temperature is improved.
In summary, the heat sink structural member 100 for a laser and the laser with the heat sink structural member provided by the invention realize the whole temperature control technology of the laser diode, the laser crystal and the optical element, so that the laser working medium is kept at a relatively constant temperature when working in a limiting temperature environment, and meanwhile, the length of the working medium is shortened as much as possible, and the mechanical stress to which the laser crystal is subjected is reduced.
The heat sink structural member 100 is designed to mechanically connect with the reinforcing structure 210 above the rotationally symmetrical pumping surface, the structural strength of the diode heat sink structural member 100 can be greatly improved, when the diode heat sink structural member 100, the TEC and the radiator are connected and fixed with each other, the diode laser heat sink structural member 100 can be kept in a stable state, deformation is not easy to generate, and the heat sink structural member 100 and the TEC are in good contact and high-efficiency heat transfer. This manner of fixation allows for a design of the laser heat sink structure 100 that is as thin and lightweight as possible, which is advantageous for light weight and miniaturization of the overall machine.
Besides being capable of mounting laser crystals, the heat sink structural member 100 can also be provided with other optical elements which are easily affected by temperature, such as a polaroid, so that the optical elements are always consistent with the temperature of the laser diode, and the problem that the laser energy output is affected due to the characteristic change of the optical elements caused by severe change of the ambient temperature is avoided.
Other forms of side pumping structures may be employed with the heat sink structure 100. The fixed size of the laser diode can be properly adjusted according to the actual use requirement condition so as to meet the actual application requirement.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that these drawings are included in the spirit and scope of the invention, it is not to be limited thereto.
Claims (9)
1. A heat sink structure for a laser, the heat sink structure being provided with a first mounting location for mounting a laser crystal, a second mounting location for mounting a polarizing element and a third mounting location for mounting an optical element; wherein two fixing arms close to the first installation position are at least partially connected to form an arch bridge-shaped reinforcing structure;
the heat sink structure includes:
the back of the base plate is connected with the semiconductor refrigerator, the front of the base plate is provided with the first installation position, the second installation position and the third installation position, the two fixing arm parts are arranged on the front of the base plate in a staggered way, and the two fixing arms are connected towards the positions of each other to form an arch bridge-shaped reinforcing structure.
2. The heat sink structure for a laser of claim 1, wherein the securing arms comprise a plurality of bent arm segments, each of the arm segments having a thickness that tapers away from the substrate.
3. The heat sink structure for a laser of claim 1, wherein the inner surface of the stationary arm includes a plurality of mating surfaces for welding the laser diode array.
4. The heat sink structure for a laser of claim 1, wherein the portion of the substrate where the first mounting location is located is recessed to form a groove.
5. The heat sink structure for a laser of claim 1, wherein the optical element mounted in the third mounting location comprises an optical element having a wedge mirror tuning cavity or a crystal tuning laser cavity.
6. The heat sink structure for a laser of claim 1, wherein the stationary arm is provided with a temperature sampling hole.
7. The heat sink structure for a laser of claim 1, wherein the laser crystal, the polarizing element and the optical element are adhesively secured to the heat sink structure or secured to the heat sink structure by a securing member.
8. A laser, comprising:
a semiconductor refrigerator;
a heat sink structure for a laser as claimed in any one of claims 1 to 7, the heat sink structure being connected to the semiconductor refrigerator;
the laser crystal is arranged at the first installation position of the heat sink structural member;
a polarizing element mounted to the second mounting location of the heat sink structure;
and the optical element is arranged at the third installation position of the heat sink structural member.
9. The laser of claim 8, wherein the working medium of the laser crystal comprises two Nd: YAG crystals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111445508.9A CN114361916B (en) | 2021-11-30 | 2021-11-30 | Heat sink structural part for laser and laser with heat sink structural part |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111445508.9A CN114361916B (en) | 2021-11-30 | 2021-11-30 | Heat sink structural part for laser and laser with heat sink structural part |
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| CN114361916A CN114361916A (en) | 2022-04-15 |
| CN114361916B true CN114361916B (en) | 2023-12-26 |
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| CN114361916A (en) | 2022-04-15 |
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