CN111106523A - Fixing assembly of pumping module and laser - Google Patents
Fixing assembly of pumping module and laser Download PDFInfo
- Publication number
- CN111106523A CN111106523A CN201911294091.3A CN201911294091A CN111106523A CN 111106523 A CN111106523 A CN 111106523A CN 201911294091 A CN201911294091 A CN 201911294091A CN 111106523 A CN111106523 A CN 111106523A
- Authority
- CN
- China
- Prior art keywords
- laser
- radiator
- shell
- resonant cavity
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
- H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Lasers (AREA)
Abstract
The invention provides a fixing component of a pumping module and a laser, comprising: the refrigerator comprises a shell, a radiator, a refrigerator and a fan assembly. The shell is limited to a resonant cavity and a mounting cavity, and a flange for separating the resonant cavity and the mounting cavity is arranged on the inner wall of the shell. The radiator is located the installation intracavity, and the part of radiator is supported against the flange, and the one end and the pumping module of the resonant cavity of orientation of radiator are connected. The refrigerator is located between the heat sink and the pump module. The fan assembly is connected with the shell, and one end of the fan assembly, facing the resonant cavity, is abutted to one end, far away from the resonant cavity, of the radiator. According to the fixing assembly of the pumping module, the radiator is fixed and limited through the fan assembly and the flange of the shell, so that the problem that the shell is mechanically deformed due to the fact that the radiator is fixed to the shell through screws, and the resonant cavity is detuned and laser output energy is reduced can be solved. Moreover, the fixing assembly is simple in structure and convenient to assemble.
Description
Technical Field
The invention relates to the technical field of lasers, in particular to a fixing assembly of a pumping module and a laser.
Background
Laser Diode (LD) pumped all-solid-state laser (DPSSL) has become the mainstream direction of solid-state laser development because of its advantages of high efficiency, long life, compact structure, etc., and is widely used in the fields of laser processing, laser ranging, target indication, laser radar, etc.
For most high peak power pulsed lasers, of the type onboard, onboard or hand-held, etc., miniaturization and weight reduction of the laser is required. The laser comprises a laser resonant cavity, a laser diode pumping source, a Q-switching component, a power supply system, a temperature control system, a beam expanding system and the like. In general, a laser is formed by a metal housing as a bearing structure of a laser resonator, and an optical element is fixed to the metal housing through a metal element seat to form the laser resonator.
The typical laser diode pumping source mainly comprises a laser diode, a semiconductor cooler (TEC), a radiator and an axial fan, wherein the semiconductor cooler controls the temperature of the laser diode at a constant temperature value, and redundant heat generated by the TEC is transferred to the external environment through the radiator and the axial fan.
For most airborne, vehicle-mounted or handheld high-peak-power pulse lasers, the lasers are required to have strong environmental adaptability and can normally work at the ambient temperature of minus 50 ℃ to plus 65 ℃.
For most diode pumped solid state lasers, the laser diode and the TEC are mounted on a heat sink that is fixed to the laser housing by screws.
In practical applications of diode pumped solid-state lasers of the above type, due to the requirements of miniaturization and light weight of the lasers, the weight of the lasers is usually reduced by reducing the thickness of the laser housing. The method can reduce the strength of the laser shell structure, when the radiator of the diode is fixed on the laser shell, because the thickness and the strength of the shell and the radiator mounting substrate are similar, the laser shell can generate internal stress and slightly deform in the process of locking the fixing screw, so that the laser resonant cavity is detuned, and the laser output energy is reduced. And the situation that the shell is further deformed due to temperature change of the radiator and expansion and contraction of heat under the condition of extreme temperature environment occurs, so that the output energy of the laser is further reduced, and even laser cannot be output.
If the mechanical deformation caused by the installation of the radiator is reduced or eliminated, the problems that the laser resonant cavity is detuned and the laser output energy is reduced under the requirement of miniaturization and light weight of the laser can be solved.
Disclosure of Invention
The invention aims to solve the technical problem that laser output energy is reduced due to mechanical deformation of a laser shell, and provides a fixing assembly of a pumping module and a laser.
The fixing assembly of the pumping module according to the embodiment of the present invention includes:
the device comprises a shell, a first connecting piece and a second connecting piece, wherein the shell defines a resonant cavity and a mounting cavity, and a flange for separating the resonant cavity and the mounting cavity is arranged on the inner wall of the shell;
the radiator is positioned in the mounting cavity, the part of the radiator is abutted against the flange, and one end of the radiator, which faces the resonant cavity, is connected with the pumping module;
a refrigerator between the heat sink and the pumping module;
the fan assembly is connected with the shell, and one end, facing the resonant cavity, of the fan assembly is abutted to one end, far away from the resonant cavity, of the radiator.
According to the fixing assembly of the pumping module, the radiator is fixed and limited through the fan assembly and the flange of the shell, so that the problem that the shell is mechanically deformed due to the fact that the radiator is fixed to the shell through screws, resonant cavity detunes and laser output energy is reduced can be solved. Moreover, the fixing assembly is simple in structure and convenient to assemble.
According to some embodiments of the invention, a fixing frame is provided between the heat sink and the inner wall of the housing.
In some embodiments of the present invention, the fixing frame is a soft heat insulation member.
According to some embodiments of the invention, the fixing frame is preferably a piece of polytetrafluoroethylene.
In some embodiments of the invention, the fan assembly comprises:
a fan bracket connected with the housing;
the fan is connected with the fan support, and one end of the fan, which faces the resonant cavity, abuts against the radiator.
According to some embodiments of the invention, the structural strength of the fan mount is less than the structural strength of the housing.
In some embodiments of the invention, the refrigerator is a semiconductor refrigerator.
According to some embodiments of the invention, the pump module is diode pumped.
A laser according to an embodiment of the present invention includes:
a laser crystal;
and the pumping module is fixed by adopting the fixing component of the pumping module.
According to the laser provided by the embodiment of the invention, the diode pumping module can be fixed in the shell frame of the laser by adopting the fixing component of the pumping module, the deformation of the shell of the laser is eliminated by utilizing the elastic deformation of the fan bracket, no mounting stress exists between the radiator and the shell of the laser due to the non-screw fastening, the shell of the laser can be kept in a stable state, the factor of resonant cavity detuning is eliminated, the stability of the output energy of the laser when the laser works in a high-temperature and low-temperature environment is ensured, and the fixing structure allows the shell of the laser to be further reduced in thickness, so that the effect of light weight is achieved. Moreover, the fixing mode allows the laser shell to be designed as light and thin as possible, so that the light and small size of the whole laser is facilitated, and the structural stability of the laser shell in a high-temperature and low-temperature environment is ensured.
According to some embodiments of the invention, the laser is a side-pumped laser or an end-pumped laser.
Drawings
Fig. 1 is a schematic structural diagram of a pump module fixing assembly according to an embodiment of the present invention.
Reference numerals:
the fixing member (100) is fixed to the frame,
the housing 10, the resonant cavity 101, the mounting cavity 102, the flange 110,
the radiator 20, the refrigerator 30, the fan assembly 40, the fan 410, the fan bracket 420, the fixing frame 50,
the pump module 600.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1, the fixing assembly 100 of the pumping module 600 according to the embodiment of the present invention includes: a housing 10, a heat sink 20, a refrigerator 30, and a fan assembly 40.
Specifically, the housing 10 defines a resonant cavity 101 and a mounting cavity 102, and the inner wall of the housing 10 is provided with a flange 110 separating the resonant cavity 101 and the mounting cavity 102.
The heat sink 20 is located in the mounting cavity 102, a portion of the heat sink 20 abuts against the flange 110, and an end of the heat sink 20 facing the resonant cavity 101 is connected to the pump module 600. The refrigerator 30 is located between the heat sink 20 and the pump module 600.
The fan assembly 40 is connected to the housing 10, and an end of the fan assembly 40 facing the resonant cavity 101 abuts against an end of the heat sink 20 away from the resonant cavity 101. Thereby, the heat sink 20 can be fixed in abutment between the fan assembly 40 and the flange 110 of the housing 10.
According to the fixing assembly 100 of the pumping module 600 of the embodiment of the invention, the heat sink 20 is fixed and limited by the fan assembly 40 and the flange 110 of the housing 10, so that the problem that the housing 10 is mechanically deformed due to the fact that the heat sink 20 is fixed to the housing 10 by screws, which causes the resonant cavity 101 to be detuned and the laser output energy to be reduced can be avoided. Moreover, the fixing assembly 100 is simple in structure and convenient to assemble.
According to some embodiments of the present invention, a fixing frame 50 is provided between the heat sink 20 and the inner wall of the case 10. As shown in fig. 1, a fixing frame 50 is provided at a gap between the radiator 20 and the housing 10. Thus, the limit radiator 20 can be fixed by the fixing frame 50, and the stability and reliability of fixing the radiator 20 can be further improved.
In some embodiments of the present invention, the fixing frame 50 is a soft heat insulation member. It should be noted that, by providing the fixing frame 50 as a soft member, the fixing frame 50 can be easily assembled between the heat sink 20 and the housing 10, and moreover, the heat sink 20 and the housing 10 can be effectively prevented from being deformed by compression. In addition, the fixing frame 50 has good heat insulation performance, and can effectively avoid the problem that the heat on the heat sink 20 is transferred to the casing 10, which causes deformation due to inconsistent temperatures at different positions of the casing 10. For example, the fixing frame 50 may be a teflon member.
In some embodiments of the present invention, as shown in FIG. 1, fan assembly 40 comprises: a fan bracket 420 and a fan 410, the fan bracket 420 being connected with the case 10. For example, the fan bracket 420 and the casing 10 may be fixed by screws, adhesive or other fixing means. The fan 410 is connected to the fan bracket 420, and an end of the fan 410 facing the resonant cavity 101 is abutted against the heat sink 20.
According to some embodiments of the present invention, the structural strength of the fan bracket 420 is less than that of the case 10. It is understood that by setting the structural strength of the fan bracket 420 to be less than that of the housing 10, the elastic deformation of the fan bracket 420 can be used to eliminate the deformation of the laser housing 10.
In some embodiments of the present invention, refrigerator 30 may be a semiconductor refrigerator 30 (TEC). The semiconductor cooler 30 has good cooling and heat-conducting properties, and can effectively improve the cooling effect.
According to some embodiments of the invention, the pump module 600 is diode pumped. That is, the pumping module 600 may employ laser diode pumping.
A laser according to an embodiment of the present invention includes: the laser crystal and the pumping module 600, the pumping module 600 is fixed by the fixing component 100 of the pumping module 600.
According to the laser provided by the embodiment of the invention, the diode pump module 600 can be fixed in the frame of the laser shell 10 by the fixing component 100 of the pump module 600, the deformation of the laser shell 10 is eliminated by utilizing the elastic deformation of the fan support 420, no mounting stress exists between the heat radiator 20 and the laser shell 10 due to the screw-free fastening, the laser shell 10 can be kept in a stable state, the detuning factor of the resonant cavity 101 is eliminated, the stability of the output energy of the laser in the working process under the high and low temperature environments is ensured, and the fixing structure allows the laser shell 10 to further reduce the thickness of the shell 10, so that the light weight effect is achieved. Moreover, the fixing mode allows the laser housing 10 to be designed as light and thin as possible, which is beneficial to the light and small size of the whole machine and ensures the structural stability of the housing 10 of the laser housing 10 in the high and low temperature environment.
According to some embodiments of the invention, the laser is a side-pumped laser or an end-pumped laser. That is, the laser may be a side-pumped laser, an end-pumped laser, or other pumping type laser.
The fixing assembly 100 of the pump module 600 and the laser according to the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the following description is only exemplary, and not a specific limitation of the invention.
The fixing assembly 100 of the pump module 600 according to the present invention can be applied to a diode side pump laser, the heat sink 20 is confined in the fixed mounting cavity 102 by the frame and the flange 110 of the laser housing 10, and the gap between the heat sink 20 and the laser housing 10 is filled with a soft and heat-insulating material such as teflon around the heat sink 20. The radiator 20 is limited by the fan assembly 40 to move, the structural strength required by the fan support 420 is far less than the strength of the shell 10, the deformation of the laser shell 10 is eliminated by utilizing the elastic deformation of the fan support 420, so that the laser has no installation stress, and the detuning factor of the resonant cavity 101 is eliminated, thereby solving the problem that the laser resonant cavity 101 is detuned and the laser output energy is reduced due to the mechanical deformation caused by the radiator 20 of the conventional diode pumping solid laser in the screw installation and fixing process, and ensuring the stability of the laser output energy when the laser works in a high-temperature and low-temperature environment.
This fixed subassembly 100 can fix diode pump module 600 inside the casing 10 frame of laser instrument, utilize the elastic deformation elimination laser instrument casing 10 of fan bracket 420 self deformation, because the fastening of no screw, there is not installation stress between radiator 20 and the laser instrument casing 10, the casing 10 of laser instrument can the steady state, the factor of resonant cavity 101 mistuning has been eliminated, the stability of output energy of laser instrument during operation under high low temperature environment has been guaranteed, this fixed knot constructs and allows laser instrument casing 10 further to reduce casing 10 thickness, reach lightweight effect.
Moreover, the fixing mode allows the laser housing 10 to be designed as light and thin as possible, which is beneficial to the light and small size of the whole machine and ensures the structural stability of the housing 10 of the laser housing 10 in the high and low temperature environment.
The fixed assembly 100 can also be applied to an end-pumped structure or other pumping means where the laser cavity 101 can be mechanically independent from the pump module 600. The fixed size of the laser diode can be properly adjusted according to the actual use requirement condition so as to meet the actual application requirement.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that it is intended by the appended drawings and description that the invention may be embodied in other specific forms without departing from the spirit or scope of the invention.
Claims (10)
1. A fixing assembly of a pump module, comprising:
the device comprises a shell, a first connecting piece and a second connecting piece, wherein the shell defines a resonant cavity and a mounting cavity, and a flange for separating the resonant cavity and the mounting cavity is arranged on the inner wall of the shell;
the radiator is positioned in the mounting cavity, the part of the radiator is abutted against the flange, and one end of the radiator, which faces the resonant cavity, is connected with the pumping module;
a refrigerator between the heat sink and the pumping module;
the fan assembly is connected with the shell, and one end, facing the resonant cavity, of the fan assembly is abutted to one end, far away from the resonant cavity, of the radiator.
2. The pump module fixing assembly of claim 1, wherein a fixing frame is disposed between the heat sink and the inner wall of the housing.
3. The pump module fixing assembly of claim 2, wherein the fixing frame is a soft heat insulator.
4. The pump module fixing assembly of claim 2, wherein the fixing frame is a teflon member.
5. The pump module securing assembly of claim 1, wherein the fan assembly comprises:
a fan bracket connected with the housing;
the fan is connected with the fan support, and one end of the fan, which faces the resonant cavity, abuts against the radiator.
6. A fixing assembly of a pump module according to claim 5, characterized in that the structural strength of the fan bracket is less than the structural strength of the housing.
7. A fixing assembly of a pump module according to claim 1, wherein the refrigerator is a semiconductor refrigerator.
8. A fixation assembly of a pump module according to any of claims 1-7, characterized in that the pump module is diode pumped.
9. A laser, comprising:
a laser crystal;
pump module, which is fixed with a fixing assembly of a pump module according to any of claims 1 to 8.
10. The laser of claim 9, wherein the laser is a side-pumped laser or an end-pumped laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911294091.3A CN111106523A (en) | 2019-12-16 | 2019-12-16 | Fixing assembly of pumping module and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911294091.3A CN111106523A (en) | 2019-12-16 | 2019-12-16 | Fixing assembly of pumping module and laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111106523A true CN111106523A (en) | 2020-05-05 |
Family
ID=70422942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911294091.3A Pending CN111106523A (en) | 2019-12-16 | 2019-12-16 | Fixing assembly of pumping module and laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111106523A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005188A (en) * | 2006-01-17 | 2007-07-25 | 深圳市大族激光科技股份有限公司 | Full wind cooling type end pump laser |
| CN103187684A (en) * | 2011-12-29 | 2013-07-03 | 常州第二电子仪器有限公司 | Cooling and heat insulation device for high-power semiconductor pump surge laser |
| CN104518424A (en) * | 2015-01-12 | 2015-04-15 | 赵立华 | Package structure of high-power semiconductor laser |
| CN106439530A (en) * | 2016-11-09 | 2017-02-22 | 重庆三烁光电科技有限公司 | LED lamp with good heat dissipating effect |
| CN106524069A (en) * | 2017-01-22 | 2017-03-22 | 唐春燕 | Solar LED streetlamp |
| CN207009892U (en) * | 2017-05-26 | 2018-02-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | The encapsulating structure of semiconductor laser |
| CN108106749A (en) * | 2017-11-24 | 2018-06-01 | 中国电子科技集团公司第十研究所 | A kind of temperature checking method and device |
| CN208448710U (en) * | 2018-03-06 | 2019-02-01 | 常州埃依琦科技有限公司 | A kind of gas and oil separating plant of transformer online monitoring |
| CN209544816U (en) * | 2019-04-12 | 2019-10-25 | 北京蓝溪华兴光电科技有限公司 | A kind of air-cooled hundred-watt level semiconductor Optical Maser System |
| CN209751345U (en) * | 2018-11-19 | 2019-12-10 | 庆阳欧维机电设备有限公司 | electronic cold compress device |
-
2019
- 2019-12-16 CN CN201911294091.3A patent/CN111106523A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005188A (en) * | 2006-01-17 | 2007-07-25 | 深圳市大族激光科技股份有限公司 | Full wind cooling type end pump laser |
| CN103187684A (en) * | 2011-12-29 | 2013-07-03 | 常州第二电子仪器有限公司 | Cooling and heat insulation device for high-power semiconductor pump surge laser |
| CN104518424A (en) * | 2015-01-12 | 2015-04-15 | 赵立华 | Package structure of high-power semiconductor laser |
| CN106439530A (en) * | 2016-11-09 | 2017-02-22 | 重庆三烁光电科技有限公司 | LED lamp with good heat dissipating effect |
| CN106524069A (en) * | 2017-01-22 | 2017-03-22 | 唐春燕 | Solar LED streetlamp |
| CN207009892U (en) * | 2017-05-26 | 2018-02-13 | 中国科学院苏州纳米技术与纳米仿生研究所 | The encapsulating structure of semiconductor laser |
| CN108106749A (en) * | 2017-11-24 | 2018-06-01 | 中国电子科技集团公司第十研究所 | A kind of temperature checking method and device |
| CN208448710U (en) * | 2018-03-06 | 2019-02-01 | 常州埃依琦科技有限公司 | A kind of gas and oil separating plant of transformer online monitoring |
| CN209751345U (en) * | 2018-11-19 | 2019-12-10 | 庆阳欧维机电设备有限公司 | electronic cold compress device |
| CN209544816U (en) * | 2019-04-12 | 2019-10-25 | 北京蓝溪华兴光电科技有限公司 | A kind of air-cooled hundred-watt level semiconductor Optical Maser System |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7075964B2 (en) | Diode-pumped solid-state laser oscillator | |
| US20100195679A1 (en) | Solid-state laser comprising a resonator with a monolithic structure | |
| US4161747A (en) | Shock isolator for operating a diode laser on a closed-cycle refrigerator | |
| JPH07142803A (en) | Laser diode pumping solid-state laser | |
| CN111106523A (en) | Fixing assembly of pumping module and laser | |
| JP3018717B2 (en) | Short wavelength laser light source and method of manufacturing short wavelength laser light source | |
| US10356960B2 (en) | Device for radiating heat of capacitor of an inverter in an electric compressor | |
| JPH07307506A (en) | Laser oscillator | |
| CN114361916B (en) | Heat sink structural part for laser and laser with heat sink structural part | |
| JP2008163767A (en) | Electric compressor | |
| Smith et al. | 100 mW laser diode pumped Nd: YAG laser | |
| CN115864108A (en) | Optical fiber laser based on TEC and temperature control method thereof | |
| US3399359A (en) | Solid-state laser | |
| US20040057490A1 (en) | Microlaser cavity assembly and associated packaging method | |
| CN114784604A (en) | Small laser emission module, preparation method thereof and laser | |
| US20200266599A1 (en) | Dynamic, thermally-adaptive cuboid crystal mount for end-pumped conductively cooled solid state laser applications | |
| JP3355985B2 (en) | refrigerator | |
| US8594147B1 (en) | Monolithic diode pumped solid-state laser for high shock environments | |
| CN111525372A (en) | Laser cooling system | |
| CN111342331A (en) | Semiconductor side pumping temperature-control-free laser | |
| JP2015084381A (en) | Solid state laser oscillator | |
| CN113314935B (en) | High-power polarized laser device | |
| CN116260033A (en) | Bonding integrated miniature laser | |
| RU218788U1 (en) | SOLID-STATE LASER EMITTER | |
| JPH1154820A (en) | Semiconductor laser pumped solid-state laser and optical device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200505 |