CN114361198A - Manufacturing method of color filter substrate and color filter substrate - Google Patents
Manufacturing method of color filter substrate and color filter substrate Download PDFInfo
- Publication number
- CN114361198A CN114361198A CN202111646798.3A CN202111646798A CN114361198A CN 114361198 A CN114361198 A CN 114361198A CN 202111646798 A CN202111646798 A CN 202111646798A CN 114361198 A CN114361198 A CN 114361198A
- Authority
- CN
- China
- Prior art keywords
- micro
- soft magnetic
- led
- magnetic material
- color filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000696 magnetic material Substances 0.000 claims abstract description 81
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 29
- 230000002950 deficient Effects 0.000 claims abstract description 14
- 238000012216 screening Methods 0.000 claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 33
- 229910052799 carbon Inorganic materials 0.000 claims description 20
- 239000002086 nanomaterial Substances 0.000 claims description 18
- 229910021389 graphene Inorganic materials 0.000 claims description 11
- 230000008030 elimination Effects 0.000 claims 2
- 238000003379 elimination reaction Methods 0.000 claims 2
- 230000005415 magnetization Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 21
- 239000000463 material Substances 0.000 description 14
- 238000001514 detection method Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002134 carbon nanofiber Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002077 nanosphere Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The application relates to a manufacturing method of a color filter substrate and the color filter substrate, wherein the method comprises the following steps: silk-screening tin paste doped with soft magnetic materials to a contact of a micro-LED driving circuit; magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and removing the external magnetic field; transferring the micro-LED chip to a soft magnetic material-doped solder paste for pre-binding; electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are unbound and removed; after the replacement is finished, powering off the micro-LED driving circuit, and carrying out high-temperature curing on the tin paste doped with the soft magnetic material to obtain the color filter substrate after the micro-LED chip binding is finished; the high temperature curing is applied at a temperature higher than the curie temperature of the soft magnetic material. The micro-LED chip is pre-bound by the aid of soft magnetic material-doped solder paste magnetization, so that bad LEDs are removed before high-temperature curing, pads in a bonding area are protected from being damaged, and the product yield of the color filter substrate is greatly improved.
Description
Technical Field
The application relates to the technical field of display process and preparation, in particular to a manufacturing method of a color filter substrate and the color filter substrate.
Background
With the development of display technology, various displays and manufacturing processes thereof are continuously developed and iterated, and various mature LED display technologies have appeared so far. Compared with the conventional LCD Display (Liquid Crystal Display), in the field, the OLED (Organic Light Emitting Diode/Organic electroluminescent Display), Mini-LED, Micro-LED, QLED (Quantum Dot Light Emitting Diode) and other new displays have the advantages of higher contrast, lower power consumption, flexibility and the like. With the improvement of the requirements of the production efficiency, the quality, the cost and the like of the product, higher requirements are also provided for the manufacturing process of the LED display.
In the manufacturing process of the Micro-LED-based color filter substrate, some newly added defects, such as LED unlightness or insufficient brightness, can appear in the LED transfer bonding process, can be found when a Cell Test (unit Test) is lighted and a Panel is displayed to be lighted, targeted repair is carried out, and the LEDs or tin and the like which need to be removed are generally removed by using laser. However, in the implementation process, the inventor finds that the laser removing process for the poor LED lamp has the risk of residual tin and Cu Pad Peeling (copper Pad stripping), and has the technical problem of reducing the product yield.
Disclosure of Invention
Accordingly, it is desirable to provide a method for manufacturing a color filter substrate and a color filter substrate, which can greatly improve the yield of the color filter substrate.
A method for manufacturing a color filter substrate comprises the following steps:
silk-screening tin paste doped with soft magnetic materials to a contact of a micro-LED driving circuit;
magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and removing the external magnetic field;
transferring the micro-LED chip to a soft magnetic material-doped solder paste for pre-binding;
electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are unbound and removed;
after the replacement is finished, powering off the micro-LED driving circuit, and carrying out high-temperature curing on the tin paste doped with the soft magnetic material to obtain the color filter substrate after the micro-LED chip binding is finished; the high temperature curing is applied at a temperature higher than the curie temperature of the soft magnetic material.
In one embodiment, the soft magnetic material is a carbon nanomaterial.
In one embodiment thereof, the carbon nanomaterial is graphene.
A color filter substrate comprises a display back plate, a micro-LED driving circuit and a micro-LED chip, wherein the micro-LED driving circuit is arranged on the display back plate, and the micro-LED driving circuit and the micro-LED chip are bound by adopting the following manufacturing method:
silk-screening tin paste doped with soft magnetic materials to a contact of a micro-LED driving circuit;
magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and removing the external magnetic field;
transferring the micro-LED chip to a soft magnetic material-doped solder paste for pre-binding;
electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are unbound and removed;
after the replacement is finished, powering off the micro-LED driving circuit, carrying out high-temperature curing on the tin paste doped with the soft magnetic material, and binding the micro-LED chip; the high temperature curing is applied at a temperature higher than the curie temperature of the soft magnetic material.
In one embodiment, the soft magnetic material is a carbon nanomaterial.
In one embodiment thereof, the carbon nanomaterial is graphene.
One of the above technical solutions has the following advantages and beneficial effects:
according to the manufacturing method of the color filter substrate and the color filter substrate, the tin paste doped with the soft magnetic material is adopted for silk-screen printing, then the soft magnetic material is magnetized and doped by adopting an external magnetic field, so that the soft magnetic material is magnetized to generate magnetic force, and the transferred micro-LED chip is pre-bound by utilizing the generated magnetic force (pre-binding force). Removing the external magnetic field, carrying out power-on detection on the micro-LED driving circuit, testing the yield of the LED, then carrying out unbinding and removing on the damaged bad LED, then pre-binding the good LED to the vacancy of the bad LED to realize the removal and replacement of the LED, carrying out a high-temperature curing process after all the bad LEDs are replaced, applying a curing temperature higher than the Curie temperature of the soft magnetic material to carry out high-temperature curing on the tin paste doped with the soft magnetic material, completing the binding of the micro-LED chip and demagnetizing the soft magnetic material to obtain the bound color filter substrate.
Compared with the prior art, the solder paste with the soft magnetic material is added through magnetization, and the bonding can be carried out with the LED before high-temperature curing, so that the LED is changed to be simple and efficient after the abnormality is detected, the residual solder paste is easier to process, and the pad in the bonding area is ensured not to be damaged, thereby achieving the purpose of greatly improving the product yield of the color filter substrate.
Drawings
Fig. 1 is a schematic structural diagram of a color filter substrate after the bonding is completed in the embodiment of the present application.
Fig. 2 is a schematic structural diagram of a color filter substrate after silk-screening of a solder material in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a color filter substrate after magnetization processing in an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a color filter substrate at an LED chip transfer pre-bonding stage in the embodiment of the present application.
Fig. 5 is a schematic diagram of a damaged LED culling replacement process in an embodiment of the application.
Fig. 6 is a schematic flow chart illustrating a method for manufacturing a color filter substrate according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In one embodiment, as shown in FIG. 1, a color filter substrate 100 includes a display backplane 12, a micro-LED driver circuit 14, and a micro-LED chip 16. The micro-LED driving circuit 14 is arranged on the display back plate 12, and the micro-LED driving circuit 14 and the micro-LED chip16 are bound by adopting the following manufacturing method, which comprises the following steps:
silk-screen printing the soft magnetic material-doped solder paste on the contact of the micro-LED driving circuit 14;
magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and removing the external magnetic field;
transferring the micro-LED chip16 to solder paste doped with soft magnetic materials for pre-binding;
electrifying the micro-LED driving circuit 14, detecting the LED yield on the micro-LED chip16, and replacing the defective LEDs with good LEDs after the defective LEDs are unbound and removed;
after the replacement is finished, the micro-LED drive circuit 14 is powered off, the tin paste doped with the soft magnetic material is cured at high temperature, and the micro-LED chip16 is bound; the high temperature curing is applied at a temperature higher than the curie temperature of the soft magnetic material.
In some embodiments, the soft magnetic material is a carbon nanomaterial. It can be understood that the tin paste doped with the soft magnetic material is mainly obtained by doping the carbon nano material in the Sn paste, and the carbon nano material used can be carbon nanotubes, carbon nanofibers, carbon nanospheres or other carbon nano materials which can be used as the soft magnetic material. In the present application, the soft magnetic material doped in the solder paste provides a "pseudo-fixing/pre-binding" effect for confirming whether the fixation of the LED chip is qualified or not, for NG (damaged) LED chip replacement is facilitated and for protecting the pads of the bonding region from damage before the solder paste is cured at a high temperature. The specific process of screen printing the solder paste onto the contact of the micro-LED driving circuit 14 can be understood by referring to the conventional screen printing process in the art.
The external magnetic field can be generated by an existing special magnetic field generating device or a temporarily built magnetic field coil device, as long as the external magnetic field can be applied to the soft magnetic material to magnetize the soft magnetic material so as to generate a corresponding magnetizing magnetic field, so as to provide the magnetic force required for pre-binding with the LED chip (i.e., the micro-LED chip 16). The transfer technology adopted when the LED chip is transferred to the driving circuit after the solder paste is silk-screened can be understood by referring to the existing batch transfer technology of LED chips in the field.
Before the soldering material (i.e. the solder paste) is cured at a high temperature, the micro-LED driving circuit 14 can be powered on to perform lighting test on the LED lamp in the bonding area, and check whether the LED lamp on the LED chip is NG or not, whether the pre-fixing is qualified or not, and the like, so as to realize the LED yield detection. And when the NG LED lamp is detected (namely the chip where the LED lamp is located is determined to be a bad LED), the bad LED is unbound and removed, and the good LED is replaced.
After the detection is finished, the micro-LED driving circuit 14 can be powered off, then the whole substrate is sent to a welding material high-temperature curing process, and the bonding of the LED chip is finished after the soldering material is cured at high temperature (the temperature is higher than the Curie temperature of the soft magnetic material). Since the temperature applied at the time of high-temperature solidification has exceeded the curie temperature of the soft magnetic material, the magnetic properties of the soft magnetic material have been eliminated and exist only as a conductive material.
It should be noted that, as shown in fig. 1, the contact 141 of the micro-LED driving circuit 14 is mechanically connected (e.g., pre-bonded or final formal bonded) with the contact electrode 161 of the micro-LED chip16 through the solder 010, and the electrical connection between the aforementioned components can also be realized after the substrate is powered on. Like parts are understood in the following drawings.
Specifically, firstly, a proper amount of solder with soft magnetic particles dispersed therein is applied to the contact of the micro-LED driving circuit 14 by screen printing, so as to obtain the structural state shown in fig. 2. Then, the solder material to which the soft magnetic material is added is magnetized by an applied magnetic field to generate a certain magnetic force (i.e., a pre-binding force), and then the applied magnetic field is removed to obtain a state shown in fig. 3, in which B1 represents the applied magnetic field and B2 represents the magnetization magnetic field of the soft magnetic material. Then, the LED chip is transferred to be pre-bound, and the structural state as shown in fig. 4 is obtained. Further, the micro-LED driving circuit 14 is energized to detect the yield of the LED, and if the NG LED is detected, the NG LED is unbound and removed, and then the NG LED is replaced with a good-quality LED and pre-bound to the original position of the NG LED, and the corresponding structural state after the process is as shown in fig. 5.
Optionally, during the detection, processing such as pre-binding correction or re-pre-binding may be performed on the LED chip that is not qualified in pre-binding (for example, deviation occurs in the pre-binding position, the pre-binding fails, and the like). And finally, after the detection and replacement are finished, entering a high-temperature curing process, and curing the soldering tin material at a high temperature to finish formal binding of the LED chip, wherein the corresponding structural state is shown in figure 1.
In the production and manufacturing process of the color filter substrate, the soft magnetic material is doped with tin paste for silk printing, then the soft magnetic material is magnetized and doped by an external magnetic field, so that the soft magnetic material is magnetized to generate magnetic force, and the transferred micro-LED chip16 is pre-bound by the generated magnetic force (pre-binding force). And after the external magnetic field is removed, carrying out power-on detection on the micro-LED drive circuit 14, testing the yield of LEDs, then carrying out unbinding and removing on damaged bad LEDs, then prebinding the good LEDs to the vacant positions of the bad LEDs to realize the removal and replacement of the LEDs, carrying out a high-temperature curing process after all the bad LEDs are replaced, applying a curing temperature higher than the Curie temperature of the soft magnetic material to carry out high-temperature curing on the tin paste doped with the soft magnetic material, completing the binding of the micro-LED chip16 and demagnetizing the soft magnetic material, and obtaining the bound color filter substrate.
Compared with the prior art, the solder paste with the soft magnetic material is added through magnetization, and the bonding can be carried out with the LED before high-temperature curing, so that the LED is changed to be simple and efficient after the abnormality is detected, the residual solder paste is easier to process, and the pad in the bonding area is ensured not to be damaged, thereby achieving the purpose of greatly improving the product yield of the color filter substrate.
In one embodiment, the carbon nanomaterial is graphene. It can be understood that, in the present embodiment, graphene is used as a doping material of the solder, so that a stronger pre-binding performance can be achieved by utilizing the excellent performance of graphene. It can be understood by those skilled in the art that, in the preparation of the above-mentioned soft magnetic material-doped solder paste, the specific doping concentration of graphene can be determined according to the actually required magnitude of the pre-binding force.
In one embodiment, as shown in fig. 6, a method for fabricating a color filter substrate is provided, which includes the following steps S12 to S20:
s12, silk-screening the tin paste doped with the soft magnetic material to a contact of the micro-LED driving circuit;
s14, magnetizing the solder paste doped with the soft magnetic material by using the external magnetic field, and then removing the external magnetic field;
s16, transferring the micro-LED chip to solder paste doped with soft magnetic materials for pre-binding;
s18, electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are unbound and removed;
s20, powering off the micro-LED driving circuit after replacement is completed, and performing high-temperature curing on the tin paste doped with the soft magnetic material to obtain the color filter substrate after the micro-LED chip is bound; the high temperature curing is applied at a temperature higher than the curie temperature of the soft magnetic material.
It is understood that the solder paste doped with the soft magnetic material can be prepared by mixing the soft magnetic material in a certain ratio in the conventional preparation of the solder material. When the soft magnetic material-doped solder paste is prepared, the specific doping concentration of the soft magnetic material can be determined according to the actually required pre-binding force and the type of the specifically selected soft magnetic material.
In some embodiments, the soft magnetic material is a carbon nanomaterial. It can be understood that the tin paste doped with the soft magnetic material is mainly obtained by doping the carbon nano material in the Sn paste, and the carbon nano material used can be carbon nanotubes, carbon nanofibers, carbon nanospheres or other carbon nano materials which can be used as the soft magnetic material. In the present application, the soft magnetic material doped in the solder paste provides a "pseudo-fixing/pre-binding" effect for confirming whether the fixation of the LED chip is qualified or not, for NG (damaged) LED chip replacement is facilitated and for protecting the pads of the bonding region from damage before the solder paste is cured at a high temperature. The specific process of silk-screening the solder paste to the contact of the micro-LED driving circuit can be understood by referring to the same principle of the traditional silk-screening process in the field.
The external magnetic field can be generated by the existing special magnetic field generating equipment or a temporarily built magnetic field coil device, as long as the external magnetic field can be applied to the soft magnetic material to magnetize the soft magnetic material so as to generate a corresponding magnetizing magnetic field, so as to provide the magnetic force required by pre-binding with the LED chip (i.e. micro-LED chip). The transfer technology adopted when the LED chip is transferred to the driving circuit after the solder paste is silk-screened can be understood by referring to the existing batch transfer technology of LED chips in the field.
Before the welding material (namely the solder paste) is cured at a high temperature, the micro-LED driving circuit can be electrified to perform lighting test on the LED lamp in the bonding area, check whether the LED lamp on the LED chip is NG or not, check whether the pre-fixing is qualified or not and the like, and realize the LED yield detection. And when the NG LED lamp is detected (namely the chip where the LED lamp is located is determined to be a bad LED), the bad LED is unbound and removed, and the good LED is replaced.
After the detection is finished, the micro-LED driving circuit can be powered off, then the whole substrate is sent into a welding material high-temperature curing process, and the bonding of the LED chip can be finished after the soldering material is cured at high temperature (the temperature is higher than the Curie temperature of the soft magnetic material). Since the temperature applied at the time of high-temperature solidification has exceeded the curie temperature of the soft magnetic material, the magnetic properties of the soft magnetic material have been eliminated and exist only as a conductive material.
Specifically, firstly, a proper amount of solder with dispersed soft magnetic material particles is taken and printed on the contact of the micro-LED driving circuit by silk screen printing, and the structural state shown in fig. 2 is obtained. Then, the solder material to which the soft magnetic material is added is magnetized by an external magnetic field to generate a certain magnetic force (i.e., a pre-binding force), and then the external magnetic field is removed to obtain a state shown in fig. 3. Then, the LED chip is transferred to be pre-bound, and the structural state as shown in fig. 4 is obtained. And then, carrying out energization detection on the micro-LED driving circuit, testing the yield of the LEDs, if NG LEDs are detected, unbinding and rejecting the NG LEDs, replacing the NG LEDs with good-quality LEDs and pre-binding the good-quality LEDs to the original positions of the NG LEDs, wherein the corresponding structural state after the process is shown in fig. 5.
Optionally, during the detection, processing such as pre-binding correction or re-pre-binding may be performed on the LED chip that is not qualified in pre-binding (for example, deviation occurs in the pre-binding position, the pre-binding fails, and the like). And finally, after the detection and replacement are finished, entering a high-temperature curing process, and curing the soldering tin material at a high temperature to finish formal binding of the LED chip, wherein the corresponding structural state is shown in fig. 6.
In the manufacturing method of the color filter substrate, the soft magnetic material is doped by tin paste doped with the soft magnetic material for silk screen printing, then the soft magnetic material is magnetized and doped by an external magnetic field, so that the soft magnetic material is magnetized to generate magnetic force, and the transferred micro-LED chip is pre-bound by the generated magnetic force (pre-binding force). Removing the external magnetic field, carrying out power-on detection on the micro-LED driving circuit, testing the yield of the LED, then carrying out unbinding and removing on the damaged bad LED, then pre-binding the good LED to the vacancy of the bad LED to realize the removal and replacement of the LED, carrying out a high-temperature curing process after all the bad LEDs are replaced, applying a curing temperature higher than the Curie temperature of the soft magnetic material to carry out high-temperature curing on the tin paste doped with the soft magnetic material, completing the binding of the micro-LED chip and demagnetizing the soft magnetic material to obtain the bound color filter substrate.
Compared with the prior art, the solder paste with the soft magnetic material is added through magnetization, and the bonding can be carried out with the LED before high-temperature curing, so that the LED is changed to be simple and efficient after the abnormality is detected, the residual solder paste is easier to process, and the pad in the bonding area is ensured not to be damaged, thereby achieving the purpose of greatly improving the product yield of the color filter substrate.
In one embodiment, the carbon nanomaterial is graphene. It can be understood that, in the present embodiment, graphene is used as a doping material of the solder, so that a stronger pre-binding performance can be achieved by utilizing the excellent performance of graphene.
It should be understood that, although the steps in the flowchart of fig. 6 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 6 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A method for manufacturing a color filter substrate is characterized by comprising the following steps:
silk-screening tin paste doped with soft magnetic materials to a contact of a micro-LED driving circuit;
magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and then removing the external magnetic field;
transferring the micro-LED chip to the soft magnetic material-doped solder paste for pre-binding;
electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are subjected to unbinding and elimination;
after the replacement is finished, the micro-LED driving circuit is powered off, and the tin paste doped with the soft magnetic material is cured at high temperature to obtain the color filter substrate after the binding of the micro-LED chip is finished; the high temperature curing is applied at a temperature above the Curie temperature of the soft magnetic material.
2. The method of claim 1, wherein the soft magnetic material is a carbon nanomaterial.
3. The method of claim 2, wherein the carbon nanomaterial is graphene.
4. The color filter substrate is characterized by comprising a display back plate, a micro-LED driving circuit and a micro-LED chip, wherein the micro-LED driving circuit is arranged on the display back plate, and the micro-LED driving circuit and the micro-LED chip are bound by adopting the following manufacturing method:
silk-screening tin paste doped with soft magnetic materials to a contact of the micro-LED driving circuit;
magnetizing the tin paste doped with the soft magnetic material by using an external magnetic field, and then removing the external magnetic field;
transferring the micro-LED chip to the soft magnetic material-doped solder paste for pre-binding;
electrifying the micro-LED driving circuit, detecting the LED yield on the micro-LED chip, and replacing the defective LEDs with good LEDs after the defective LEDs are subjected to unbinding and elimination;
after the replacement is finished, the micro-LED driving circuit is powered off, the tin paste doped with the soft magnetic material is cured at high temperature, and the micro-LED chip is bound; the high temperature curing is applied at a temperature above the curie temperature of the soft magnetic material.
5. The color filter substrate according to claim 4, wherein the soft magnetic material is a carbon nanomaterial.
6. The color filter substrate according to claim 5, wherein the carbon nanomaterial is graphene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111646798.3A CN114361198A (en) | 2021-12-30 | 2021-12-30 | Manufacturing method of color filter substrate and color filter substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111646798.3A CN114361198A (en) | 2021-12-30 | 2021-12-30 | Manufacturing method of color filter substrate and color filter substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114361198A true CN114361198A (en) | 2022-04-15 |
Family
ID=81103229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111646798.3A Pending CN114361198A (en) | 2021-12-30 | 2021-12-30 | Manufacturing method of color filter substrate and color filter substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114361198A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911240A (en) * | 2022-12-29 | 2023-04-04 | 重庆惠科金渝光电科技有限公司 | Display panel and preparation method thereof |
-
2021
- 2021-12-30 CN CN202111646798.3A patent/CN114361198A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911240A (en) * | 2022-12-29 | 2023-04-04 | 重庆惠科金渝光电科技有限公司 | Display panel and preparation method thereof |
| CN115911240B (en) * | 2022-12-29 | 2024-01-26 | 重庆惠科金渝光电科技有限公司 | Display panel and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107026124B (en) | Manufacture miniature light-emitting diode display method and miniature light-emitting diode display | |
| CN107251237B (en) | Repairing method, manufacturing method and device of micro light-emitting diode and electronic equipment | |
| US10944023B2 (en) | Micro-LED transfer method and manufacturing method | |
| CN101408681B (en) | Display panel | |
| CN110137128A (en) | Method to handle array of semiconductor devices | |
| US9504146B2 (en) | Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device | |
| JP2018517298A (en) | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus | |
| US11362249B2 (en) | Display module and manufacturing method thereof | |
| JP2018515942A (en) | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus | |
| CN114361198A (en) | Manufacturing method of color filter substrate and color filter substrate | |
| US10854779B2 (en) | Micro-LED transfer method and manufacturing method | |
| CN107479274A (en) | The bonding method and display device of display panel and external circuitses | |
| CN108428638A (en) | Detection method of light emitting diode | |
| CN110416264A (en) | The binding method and display device of display device | |
| JPH0714880A (en) | Mounting method for chip of semiconductor integrated circuit and electronic equipment mounted therewith | |
| CN112490261A (en) | Micro LED detection and transfer method | |
| JP2021110875A (en) | Manufacturing method for display device, display device, and intermediate for manufacturing display device | |
| CN111490143B (en) | Display back plate, manufacturing method thereof and micro light-emitting diode display | |
| CN115274942A (en) | Transfer method of miniature flip chip | |
| CN109541853A (en) | A kind of light source assembly, production method and backlight module | |
| US20230065563A1 (en) | Light-emitting chip transfer system and light-emitting chip transfer method | |
| CN112968022B (en) | LED display backboard and massive transfer method and repair method thereof | |
| TWI723899B (en) | Microchip transfer method and electronic module | |
| US20210217804A1 (en) | Method of manufacturing display apparatus, display apparatus, and structure for manufacturing display apparatus | |
| CN115732524A (en) | Light emitting chip transfer system and light emitting chip transfer method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |