CN114355729A - Photoresist coating equipment and gluing developing system - Google Patents
Photoresist coating equipment and gluing developing system Download PDFInfo
- Publication number
- CN114355729A CN114355729A CN202011090398.4A CN202011090398A CN114355729A CN 114355729 A CN114355729 A CN 114355729A CN 202011090398 A CN202011090398 A CN 202011090398A CN 114355729 A CN114355729 A CN 114355729A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- thermoelectric module
- flexible thermoelectric
- coating apparatus
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses photoresist coating equipment and a gluing and developing system, wherein the photoresist coating equipment comprises a carrying platform, a driving device, a glue supply device and a first flexible thermoelectric module, wherein the carrying platform is used for placing a wafer to be coated; the driving device is connected with the carrying platform to drive the carrying platform to rotate; the photoresist supply device comprises a photoresist pipeline for conveying photoresist; the first flexible thermoelectric module is used for adjusting the temperature and is connected with the photoresist pipeline. According to the photoresist coating equipment provided by the invention, the temperature of the photoresist supply device is regulated by using the first flexible thermoelectric module, so that the inconvenience in installation and the hidden leakage danger caused by temperature regulation by using constant-temperature water are avoided, the installation space is saved by using the first flexible thermoelectric module, and the temperature regulation effect is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to photoresist coating equipment and a photoresist coating and developing system.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
The photoresist coating process is an important process in the manufacturing process of a semiconductor silicon wafer, when photoresist is coated, a nozzle drips photoresist on the central position of the upper surface of a wafer, then the wafer rotates to uniformly coat, photoresist glue liquid uniformly flows to cover the upper surface of the whole wafer, the glue liquid rapidly flows to form a film under the action of centrifugal force of high-speed rotation, and a thinner in the glue liquid volatilizes to form a glue layer with a certain thickness on the wafer.
During the photoresist coating process, it is necessary to ensure that the temperature of the wafer and the photoresist is within a set range so as to avoid affecting the critical dimension uniformity. For example, since the stage for rotating the wafer is usually driven by a driving device such as a motor, and the motor generates a large amount of heat during operation, the heat is transferred to the wafer through the stage, which affects the temperature of the wafer during coating, and thus the temperature of the wafer needs to be lowered.
The prior art sets up the water pipe usually in photoresist coating equipment, and required temperature when utilizing the mode of constant temperature hydrologic cycle in the water pipe to maintain the photoresist coating, but constant temperature water pipe and water circle device can occupy great space, and the damage of constant temperature water pipe can lead to water to reveal moreover, influences semiconductor product yield.
Disclosure of Invention
A first aspect of the present invention provides a resist coating apparatus, including:
the carrying platform is used for placing a wafer to be coated;
the driving device is connected with the carrying platform to drive the carrying platform to rotate;
the photoresist feeding device comprises a photoresist pipeline for conveying photoresist;
the first flexible thermoelectric module is used for adjusting the temperature and is connected with the photoresist pipeline.
A second aspect of the present invention proposes a paste developing system including the resist coating apparatus as described above.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. In the drawings:
FIG. 1 schematically shows a schematic structural view of a resist coating apparatus according to an embodiment of the present invention;
FIG. 2 schematically illustrates a bottom view of the flange of FIG. 1 coupled to a flexible thermoelectric module;
figure 3 schematically illustrates a bottom view of the flange of figure 1 coupled to a plurality of flexible thermoelectric modules.
The reference numbers are as follows:
100. a photoresist coating apparatus;
10. a stage;
20. a drive device; 21. a flange plate;
30. a wafer;
40. a photoresist pipeline;
51. a first flexible thermoelectric module; 52. a second flexible thermoelectric module;
60. a photoresist nozzle;
70. a mechanical arm;
81. a first heat radiation fin; 82. and a second heat dissipation fin.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1 to 3, according to an embodiment of the present invention, the present invention provides a photoresist coating apparatus 100, the photoresist coating apparatus 100 includes a stage 10, a driving device 20, a glue supplying device and a first flexible thermoelectric module 51, wherein the stage 10 is used for placing a wafer 30 to be coated; the driving device 20 is connected with the carrier 10 to drive the carrier 10 to rotate; the photoresist supply device comprises a photoresist pipeline 40 for conveying photoresist; the first flexible thermoelectric module 51 is used for adjusting temperature, and the first flexible thermoelectric module 51 is connected with the photoresist pipe 40.
On the basis of the above embodiments, in the embodiment of the present invention, the first flexible thermoelectric module 51 is disposed in the photoresist coating apparatus 100, and the first flexible thermoelectric module 51 is connected to the photoresist pipeline 40 of the photoresist supplying device, so as to adjust the temperature of the photoresist in the photoresist pipeline 40. It should be noted that, in the present embodiment, the adjusting of the temperature may include cooling and heating, and the first flexible thermoelectric module 51 ensures that the device connected thereto is within the set temperature range through cooling or heating, so as to prevent product defects caused by improper temperature; the temperature range of the first flexible thermoelectric module 51 may be set to 5 deg.c-80 deg.c.
It should be noted that the first flexible thermoelectric module 51 is used for temperature control in the present embodiment, and the first flexible thermoelectric module 51 can convert the temperature difference into electric power, and in some possible embodiments, the first flexible thermoelectric module 51 generally includes a plurality of N-type thermoelectric elements and P-type thermoelectric elements electrically connected to convert the temperature difference into electric power. In this embodiment, the photoresist pipe 40 of the photoresist supply device may also be connected to one or more first flexible thermoelectric modules 51, and the specific number of the first flexible thermoelectric modules 51 may be selected according to actual situations. In addition, other portions of the photoresist supply apparatus, other than the photoresist pipe 40, which require temperature adjustment, may be connected to the first flexible thermoelectric module 51.
As shown in fig. 1, the photoresist coating apparatus 100 includes a photoresist supply device, the photoresist supply device includes a photoresist pipeline 40 for delivering photoresist, and since the photoresist coating apparatus 100 needs to be maintained within a set temperature range in an operating state, in this embodiment, the photoresist pipeline 40 is connected to the first flexible thermoelectric module 51, and the first flexible thermoelectric module 51 is used to ensure that the temperature of the photoresist pipeline 40 is within the set range, so as to ensure that the temperature of the photoresist in the photoresist pipeline 40 is within the set range. Illustratively, the first flexible thermoelectric module 51 may be directly attached to the photoresist line 40 of the adhesive supply device.
In addition, the photoresist coating apparatus 100 may also include a controller and a plurality of temperature sensors, wherein the plurality of temperature sensors may be respectively disposed on the driving device and the photoresist pipeline for detecting the temperature of the region; the controller is in communication connection with the temperature sensor and the first flexible thermoelectric module 51, respectively, so as to determine whether temperature adjustment is required according to the temperature detected by the temperature sensor, and control the temperature of the first flexible thermoelectric module 51 according to the determination result.
In summary, the photoresist coating apparatus 100 provided in this embodiment includes a stage 10, a driving device 20, a photoresist supplying device, and a first flexible thermoelectric module 51, where the driving device 20 is connected to the stage 10, so as to drive the wafer 30 on the stage 10 to rotate for coating the photoresist, and in this embodiment, by connecting the first flexible thermoelectric module 51 to the photoresist pipe 40 of the photoresist supplying device, the adjustment of the photoresist temperature is realized, so that the temperature of the photoresist is within a set range; from this, the photoresist coating apparatus 100 proposed in this embodiment utilizes the first flexible thermoelectric module 51 to adjust the temperature, avoids the inconvenient installation and the hidden danger of revealing that result from adjusting the temperature with constant temperature water, and the first flexible thermoelectric module 51 not only saves the installation space, but also improves the temperature adjustment effect.
In one embodiment of the present invention, the first flexible thermoelectric module 51 includes a flexible substrate and a plurality of thermoelectric elements mounted on the flexible substrate. In particular, the flexible substrate can be bent to facilitate connection with a device requiring temperature adjustment; the thermoelectric element specifically includes a plurality of N-type thermoelectric elements and P-type thermoelectric elements, and electrodes connecting the thermoelectric elements. A plurality of N-type thermoelectric elements and P-type thermoelectric elements may be arranged in an array on the flexible substrate. The size and shape of the first flexible thermoelectric module 51 in this embodiment can be adjusted to suit the size and shape of the respective devices connected thereto.
In one embodiment of the present invention, the photoresist line 40 may be connected to one first flexible thermoelectric module 51, or may be connected to a plurality of first flexible thermoelectric modules 51. A first flexible thermoelectric module 51 is wrapped around the photoresist tubing 40. Preferably, the photoresist tubing 40 is connected to a first flexible thermoelectric module 51 in this embodiment.
Illustratively, as shown in fig. 1, one first flexible thermoelectric module 51 may be tightly wrapped on the photoresist pipeline 40, and it can be understood that the photoresist pipeline 40 is generally cylindrical, so the first flexible thermoelectric module 51 in this embodiment may be bent to form a cylinder or an arc to be wrapped on the outer side of the photoresist pipeline 40, thereby the first flexible thermoelectric module 51 is tightly attached to the photoresist pipeline 40, and the temperature adjusting effect on the photoresist pipeline 40 and the internal photoresist is ensured.
On the basis of the above embodiment, the photoresist coating apparatus 100 further includes first heat dissipation fins 81, and the first heat dissipation fins 81 are installed at the periphery of the first flexible thermoelectric module 51 for further improving the heat dissipation effect. Exemplarily, as shown in fig. 1, a plurality of first heat dissipation fins 81 are connected to the periphery of the first flexible thermoelectric module 51 attached to the outer sidewall of the photoresist pipe 40, and the arrangement of the first heat dissipation fins 81 in this embodiment ensures the heat dissipation effect on the photoresist pipe 40.
In addition, as shown in fig. 1, the photoresist coating apparatus 100 further includes a plurality of photoresist nozzles 60 and a robot arm 70, the plurality of photoresist nozzles 60 are mounted on the robot arm 70 to move with the robot arm 70, and the plurality of photoresist nozzles 60 are respectively communicated with different photoresist pipelines 40 and located above the stage 10, and are used for spraying photoresist on the wafer 30 on the stage 10; it should be noted that each photoresist nozzle 60 can be in communication with its corresponding photoresist line 40.
Further, a vacuum chuck is arranged on the carrier 10 and used for vacuum-adsorbing the wafer 30 on the carrier 10, and it can be understood that the photoresist coating apparatus 100 further includes a vacuum adsorption device, the vacuum adsorption device is connected with the vacuum chuck, after the wafer 30 is placed on the carrier 10, the vacuum adsorption device is started, the vacuum chuck adsorbs the wafer 30 well, and the stability of the wafer 30 in the subsequent photoresist coating process is ensured.
With reference to fig. 1, the photoresist coating apparatus 100 includes a stage 10 for placing a wafer 30 to be coated, and a driving device 20 is connected to the stage 10 for driving the stage 10 to rotate, so as to drive the wafer 30 to rotate, thereby completing the photoresist coating.
It can be understood that, because the driving device 20 generates a large amount of heat during operation, the heat may be transferred to the stage 10 through an intermediate component such as a flange and further transferred to the wafer 30, which may affect the critical dimension of the wafer 30, for this reason, the photoresist coating apparatus 100 further includes the second flexible thermoelectric module 52, and the second flexible thermoelectric module 52 is connected to the driving device 20, and in addition, on the basis of the above embodiments, one or more second flexible thermoelectric modules 52 may be connected to the stage 10, so as to reduce the temperature of the driving device 20 and the stage 10, thereby preventing the heat generated by the driving device 20 from being transferred to the wafer 30.
It should be noted that the second flexible thermoelectric module 52 may be directly attached to the driving device 20 or the stage 10, and preferably, in this embodiment, the second flexible thermoelectric module 52 is attached to the driving device 20, and the second flexible thermoelectric module 52 may be bent, so that it can be in close contact with the driving device 20 when attached to the driving device 20. Thus, the provision of the second flexible thermoelectric module 52 not only saves the installation space, but also improves the effect of temperature regulation. In the embodiment, the second flexible thermoelectric module 52 is connected to the driving device 20, and the heat generated by the driving device 20 is reduced by using the second flexible thermoelectric module 52, so that the size defect caused by the heat transfer to the wafer 30 is avoided.
In one embodiment of the invention, the driving device 20 comprises a motor, the motor comprises a flange 21 for connecting with the carrier 10, and the flange 21 is connected with the second flexible thermoelectric module 52. Specifically, the flange 21 may be provided with one second flexible thermoelectric module 52 in an attaching manner, or may be provided with a plurality of second flexible thermoelectric modules 52 in an attaching manner, and the second flexible thermoelectric module 52 may be specifically attached to the outer side wall of the flange 21 in a close manner, so as to reduce the temperature of the flange 21 and prevent the heat from being transferred to the wafer 30.
Illustratively, as shown in FIG. 2, the flange 21 is connected to a second flexible thermoelectric module 52. The second flexible thermoelectric module 52 is attached to the outer side wall of the flange 21, and for example, the flange 21 is formed in a cylindrical shape, and the second flexible thermoelectric module 52 is bent in a cylindrical shape so as to be closely fitted to the flange 21. The second flexible thermoelectric module 52 may be bonded to the flange 21, or may be connected to the flange 21 by bolts, and the connection manner between the second flexible thermoelectric module 52 and the flange 21 is not particularly limited in this embodiment.
In another embodiment of the present invention, as shown in fig. 3, flange 21 is connected to a plurality of second flexible thermoelectric modules 52. Illustratively, a plurality of second flexible thermoelectric modules 52 are attached to the outer side wall of the flange 21. Specifically, the plurality of second flexible thermoelectric modules 52 are disposed on the flange plate 21, and may be specifically bonded to the outer side wall of the flange plate 21, so that the second flexible thermoelectric modules 52 are closely attached to the flange plate 21, and the temperature regulation effect is ensured.
Further, when the flange 21 is connected to the plurality of second flexible thermoelectric modules 52, the plurality of second flexible thermoelectric modules 52 may be uniformly arranged along the circumferential direction of the flange 21, specifically, taking the shape of the flange 21 as a cylinder as an example, as shown in fig. 3, the plurality of second flexible thermoelectric modules 52 are curved into an arc shape, and the plurality of second flexible thermoelectric modules 52 may be closely adjacent to each other and joined to form a cylinder shape, so as to be closely fitted with the flange 21; the second flexible thermoelectric module 52 may be bonded to the flange 21, or may be connected to the flange 21 by bolts, and the connection manner between the second flexible thermoelectric module 52 and the flange 21 is not particularly limited in this embodiment. The manner in which the plurality of second flexible thermoelectric modules 52 are uniformly arranged in this embodiment further improves the heat dissipation effect of the second flexible thermoelectric modules 52 on the flange 21.
On the basis of the above embodiment, the photoresist coating apparatus 100 further includes second heat dissipation fins 82, and the second heat dissipation fins 82 are installed on the periphery of the second flexible thermoelectric module 52 for further improving the heat dissipation effect. Illustratively, as shown in fig. 1 to 3, a plurality of second heat dissipation fins 82 are attached to the periphery of the second flexible thermoelectric module 52 attached to the outer side wall of the flange 21. The arrangement of the second heat dissipating fins 82 in this embodiment ensures the heat dissipation effect on the driving device 20.
According to an embodiment of the present invention, the present invention provides a paste developing system including the photoresist coating apparatus 100 in the above embodiment. In addition, the gluing and developing system further comprises a photosensitive liquid pipeline for conveying photosensitive liquid and an imaging liquid pipeline for conveying imaging liquid, the flexible thermoelectric modules for adjusting the temperature can be respectively arranged on the photosensitive liquid pipeline and the imaging liquid pipeline, and the temperature of the photosensitive liquid pipeline and the temperature of the imaging liquid pipeline are adjusted to be within a set range, so that the yield of products is further guaranteed
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. A photoresist coating apparatus, comprising:
the carrying platform is used for placing a wafer to be coated;
the driving device is connected with the carrying platform to drive the carrying platform to rotate;
the photoresist feeding device comprises a photoresist pipeline for conveying photoresist;
the first flexible thermoelectric module is used for adjusting the temperature and is connected with the photoresist pipeline.
2. The photoresist coating apparatus of claim 1, wherein the first flexible thermoelectric module comprises a flexible substrate and a plurality of thermoelectric elements mounted on the flexible substrate.
3. The photoresist coating apparatus of claim 1, wherein the first flexible thermoelectric module is wrapped around the photoresist conduit.
4. The photoresist coating apparatus of claim 1, further comprising first heat fins disposed at a periphery of the first flexible thermoelectric module.
5. The apparatus of claim 1, wherein the drive device comprises a motor, the apparatus further comprising a second flexible thermoelectric module coupled to a flange of the motor, the second flexible thermoelectric module configured to regulate temperature.
6. The photoresist coating apparatus of claim 5, wherein the second flexible thermoelectric module is attached to an outer sidewall of the flange.
7. The photoresist coating apparatus of claim 5, further comprising second heat fins disposed at a periphery of the second flexible thermoelectric module.
8. The photoresist coating apparatus of claim 1, further comprising a plurality of photoresist nozzles and a robot arm, the plurality of photoresist nozzles being mounted on the robot arm to move with the robot arm, the plurality of photoresist nozzles being in communication with the photoresist conduits, respectively, and being located above the stage.
9. The photoresist coating apparatus of claim 1, wherein a vacuum chuck is disposed on the stage for vacuum-sucking the wafer on the stage.
10. A paste developing system comprising the resist coating apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011090398.4A CN114355729A (en) | 2020-10-13 | 2020-10-13 | Photoresist coating equipment and gluing developing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011090398.4A CN114355729A (en) | 2020-10-13 | 2020-10-13 | Photoresist coating equipment and gluing developing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114355729A true CN114355729A (en) | 2022-04-15 |
Family
ID=81090374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011090398.4A Pending CN114355729A (en) | 2020-10-13 | 2020-10-13 | Photoresist coating equipment and gluing developing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114355729A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115097696A (en) * | 2022-08-26 | 2022-09-23 | 天霖(张家港)电子科技有限公司 | Optimize gummed developing machine |
-
2020
- 2020-10-13 CN CN202011090398.4A patent/CN114355729A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115097696A (en) * | 2022-08-26 | 2022-09-23 | 天霖(张家港)电子科技有限公司 | Optimize gummed developing machine |
| CN115097696B (en) * | 2022-08-26 | 2022-11-18 | 天霖(张家港)电子科技有限公司 | Optimize gummed developing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7150118B2 (en) | joining system | |
| CN102636960B (en) | Unit for supplying treating liquid, and apparatus and method for treating substrate using the same | |
| KR101790447B1 (en) | Substrate processing apparatus and substrate processing method | |
| US6548111B1 (en) | Method for controlling a temperature of a microelectronic substrate | |
| US8554360B2 (en) | Substrate transfer method and substrate transfer apparatus | |
| CN106463363A (en) | Pedestal fluid-based thermal control | |
| JP6422695B2 (en) | Substrate processing apparatus and substrate processing method | |
| US8403601B2 (en) | Substrate transfer apparatus and substrate treatment system | |
| US20060121741A1 (en) | Device for supplying a solution onto a substrate and method for supplying the solution onto the substrate by using the same | |
| TWI627693B (en) | Substrate processing apparatus and substrate processing method | |
| US20150034133A1 (en) | Substrate treating apparatus | |
| CN114355729A (en) | Photoresist coating equipment and gluing developing system | |
| US20180021806A1 (en) | Thermal processing device, substrate processing apparatus and thermal processing method | |
| JP2022141653A (en) | Cmp machine with improved throughput and process flexibility | |
| JP3585217B2 (en) | Substrate processing equipment | |
| KR101380179B1 (en) | Film forming apparatus and film forming method | |
| US20160183329A1 (en) | Method of heating/cooling a substrate | |
| US20180277399A1 (en) | Substrate processing apparatus and substrate processing method | |
| US9090990B2 (en) | Manufacturing apparatus and method for semiconductor device | |
| KR20180027357A (en) | Substrate cleaning device and substrate processing apparatus including the same | |
| US8006636B2 (en) | Substrate treatment apparatus | |
| JP2505915B2 (en) | Substrate transfer device | |
| TW202141171A (en) | Position alignment device, pattern forming device and method of manufacturing article wherein the position alignment device includes a substrate holding portion, a substrate temperature regulating part, driving parts and a control part | |
| JPH11251405A (en) | Substrate treating equipment | |
| JP3504863B2 (en) | Resist coating method and substrate processing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |