CN114355147A - Semiconductor probe test fixture and system - Google Patents

Semiconductor probe test fixture and system Download PDF

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Publication number
CN114355147A
CN114355147A CN202210033101.3A CN202210033101A CN114355147A CN 114355147 A CN114355147 A CN 114355147A CN 202210033101 A CN202210033101 A CN 202210033101A CN 114355147 A CN114355147 A CN 114355147A
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CN
China
Prior art keywords
sliding
rod
electric telescopic
wall
fixedly connected
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Withdrawn
Application number
CN202210033101.3A
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Chinese (zh)
Inventor
李文庭
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Shenzhen Gaomai Electronics Co ltd
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Shenzhen Gaomai Electronics Co ltd
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Priority to CN202210033101.3A priority Critical patent/CN114355147A/en
Publication of CN114355147A publication Critical patent/CN114355147A/en
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention provides a semiconductor probe test fixture and a semiconductor probe test system, which comprise a base, a bearing component, a fixing component, an installation component and a probe body, wherein the bearing component and the fixing component are arranged on the base, the probe body is installed on the fixing component through the installation component, the probe body is positioned above the bearing component, and the bearing component is used for bearing a semiconductor chip. According to the invention, the semiconductor chip is tested through the single probe body, when the probe body is damaged, the damaged probe body can be directly replaced without checking, so that the replacement efficiency is improved, the probe body can be quickly put into use after being replaced, the test efficiency is improved, the accuracy of a test result is ensured, and the product quality of the semiconductor chip is improved.

Description

Semiconductor probe test fixture and system
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a semiconductor probe testing jig and a semiconductor probe testing system.
Background
A semiconductor device, particularly a memory device, has a memory core for storing data, and a logic circuit for guaranteeing a normal operation of the semiconductor device and for performing a test is generally located in a peripheral region of the memory core. The logic circuit for performing the test may include a probe test logic circuit for measuring an internal voltage level or for performing a probe test to detect a defective cell. Probe testing is typically performed when the semiconductor chips are in wafer form.
The invention with the authorization number of 'CN 108535519B' discloses a semiconductor chip test probe card, wherein probes required by electrical tests of all types of chips on the same wafer are manufactured on the probe card, and because the number of the probes on the probe card is large, the damaged probe positions are not easy to determine after the probes are damaged, the damaged probes are difficult to replace, the test efficiency is easy to reduce, the test result is deviated, and the quality of the semiconductor chip is reduced.
Disclosure of Invention
The invention provides a semiconductor probe test fixture and a semiconductor probe test system, which are used for solving the technical problems that the number of probes on a probe card is large, the damaged probe position is difficult to determine after the probe is damaged, the damaged probe is difficult to replace, the test efficiency is easy to reduce, the test result is deviated, and the quality of a semiconductor chip is reduced.
In order to solve the above technical problem, the present invention discloses a semiconductor probe test fixture and system, comprising: the probe comprises a base, a bearing component, a fixing component, a mounting component and a probe body, wherein the bearing component and the fixing component are arranged on the base, the probe body is mounted on the fixing component through the mounting component, the probe body is positioned above the bearing component, and the bearing component is used for bearing a semiconductor chip.
Preferably, the bearing assembly comprises:
the first electric telescopic rod is arranged on the upper surface of the base, the fixed end of the first electric telescopic rod is fixedly connected with the upper surface of the base, the output end of the first electric telescopic rod is provided with a first sliding table, and the bottom wall of the first sliding table is connected with the upper surface of the base in a sliding manner;
the first support plate is arranged on the upper surface of the first sliding table, and the upper surface of the first sliding table is fixedly connected with the lower surface of the first support plate;
the second electric telescopic rod is arranged on the upper surface of the first supporting plate, the second electric telescopic rod is perpendicular to the first electric telescopic rod, the fixed end of the second electric telescopic rod is fixedly connected with the upper surface of the first supporting plate, the output end of the second electric telescopic rod is provided with a second sliding table, the bottom wall of the second sliding table is connected with the upper surface of the first supporting plate in a sliding manner, and the output end of the second electric telescopic rod is perpendicular to the output end of the first electric telescopic rod;
the buffer mechanism is arranged right in front of the second electric telescopic rod, the air exhaust box is arranged above the buffer mechanism, a first cavity is arranged in the air exhaust box, a second supporting plate is arranged on the upper surface of the air exhaust box, and the semiconductor chip is placed on the upper surface of the second supporting plate.
Preferably, a plurality of first through holes are formed in the second supporting plate, and the first through holes are communicated with the first cavity.
Preferably, a vacuum generator is arranged on the base, a connecting pipe is arranged between the vacuum generator and the air exhaust box, one end of the connecting pipe is communicated with the inside of the first cavity, and the other end of the connecting pipe is communicated with the input end of the vacuum generator.
Preferably, the buffer mechanism includes:
the lower surface of the buffer box is connected with the upper surface of the first supporting plate in a sliding mode, and the rear side wall of the buffer box is fixedly connected with the front side wall of the second sliding table;
the first sliding column is arranged in the buffer box, the upper end of the first sliding column penetrates through the upper end of the buffer box, extends to the outside of the buffer box and is provided with a pressing plate, the upper surface of the pressing plate is fixedly connected with the bottom wall of the air exhaust box, the first sliding column is connected with the upper end of the buffer box in a sliding mode, and a second cavity is formed in the position, close to the lower end, of the first sliding column;
the sealing ring is sleeved on the outer side of the first sliding column, the inner wall of the sealing ring is in contact with the outer wall of the first sliding column, and the outer wall of the sealing ring is in contact with the inner wall of the buffer box;
the second sliding column is arranged in the second cavity, and the upper end of the second sliding column penetrates through the bottom wall of the first sliding column, extends into the second cavity and is in sliding connection with the bottom wall of the first sliding column;
the reset spring is arranged in the second cavity, one end of the reset spring is fixedly connected with the upper end of the second sliding column, and the other end of the reset spring is fixedly connected with the inner wall of the upper side of the second cavity;
the two sliding plates are symmetrically arranged on the left side and the right side of the second sliding column, the sliding plates are arranged in the second cavity, the sliding plates are connected with the bottom wall of the second cavity in a sliding mode, and one end, far away from the second sliding column, of each sliding plate penetrates through the side wall of the first sliding column and is in contact with the inner wall of the sealing ring;
the connecting rod is arranged between the sliding plate and the second sliding column, one end of the connecting rod is hinged to the upper surface of the sliding plate, and the other end of the connecting rod is hinged to the side wall of the second sliding column.
Preferably, the fixing assembly includes: riser and diaphragm, the riser perpendicular to the base, riser one end with fixed surface is connected on the base, the riser other end sets up the diaphragm, the diaphragm is on a parallel with the base.
Preferably, the mounting assembly comprises:
the third electric telescopic rod is arranged on the lower surface of the transverse plate, the fixed end of the third electric telescopic rod is fixedly connected with the lower surface of the transverse plate, and the third electric telescopic rod is perpendicular to the transverse plate;
and the clamping mechanism is arranged at the output end of the third electric telescopic rod and is used for installing the probe body.
Preferably, the clamping mechanism includes:
the upper surface of the box body is fixedly connected with the output end of the third electric telescopic rod, the bottom wall of the box body is provided with an air outlet, and the upper end of the probe body extends into the box body through the air outlet;
the baffle plate is horizontally arranged in the box body, the left end and the right end of the baffle plate are respectively fixedly connected with the inner walls of the left side and the right side of the box body, the front side wall and the rear side wall of the baffle plate are respectively attached to the inner walls of the front side and the rear side of the box body, a second through hole is formed in the center of the baffle plate, a vent pipe is arranged in the second through hole in a sliding mode, the vent pipe is respectively communicated with the upper side and the lower side of the baffle plate, the lower end of the vent pipe is sleeved outside the probe body, and the diameter of the inner wall of the vent pipe is larger than that of the probe body;
the filter plate is arranged in the vent pipe, and the periphery of the filter plate is fixedly connected with the inner wall of the vent pipe;
the air inlet fan is arranged above the partition plate and fixedly connected with the left side wall of the box body, an air inlet hole is formed in the left side of the air inlet fan and penetrates through the left side wall of the box body;
the two first swinging rods are symmetrically arranged on the left side and the right side of the vent pipe, and one end of each first swinging rod is hinged with the lower surface of the partition plate;
the first connecting rod is arranged between the first swinging rod and the air pipe, one end of the first connecting rod is hinged with the side wall of the first swinging rod, and the other end of the first connecting rod is hinged with the side wall of the air pipe;
the sliding block is arranged on one side, away from the vent pipe, of the first swinging rod, and the upper surface of the sliding block is in sliding connection with the lower surface of the partition plate;
the push rod is arranged at one end, far away from the first swing rod, of the sliding block, and one end, far away from the sliding block, of the push rod penetrates through the side wall of the box body and is in sliding connection with the side wall of the box body;
the first spring is sleeved on the push rod, one end of the first spring is fixedly connected with the side wall of the sliding block, and the other end of the first spring is fixedly connected with the inner wall of the box body;
the vertical rod is arranged on the lower surface of the sliding block, the upper end of the vertical rod is fixedly connected with the lower surface of the sliding block, the lower end of the vertical rod is provided with a first roller, and the first roller is in contact with the side wall of the first oscillating rod;
the cross rod is arranged below the vertical rod, the vertical rod is perpendicular to the probe body, and one end of the cross rod is fixedly connected with the side wall of the box body;
the second swinging rod is arranged in front of the cross rod, the position, close to the middle, of the second swinging rod is rotatably connected with the front side wall of the cross rod through a rotating shaft, a rubber block is arranged at one end, close to the probe body, of the second swinging rod, the rubber block is in contact with the outer wall of the probe body, a second roller wheel is arranged at one end, far away from the probe body, of the second swinging rod, and the second roller wheel is abutted to the side wall of the first swinging rod;
the second spring is arranged at one end, close to the rubber block, of the second swinging rod, one end of the second spring is fixedly connected with the side wall of the second swinging rod, the other end of the second spring is fixedly connected with the inner side wall of the box body, and the second spring is parallel to the cross rod.
The invention also provides a semiconductor probe test system, which comprises any one of the semiconductor probe test jigs, and further comprises:
an industrial camera disposed on the fixed component, the industrial camera being directed at the semiconductor chip, the industrial camera being used to acquire an actual image of an upper surface of the semiconductor chip;
the first controller is electrically connected with the industrial camera and controls the bearing assembly to move according to the actual image of the upper surface of the semiconductor chip.
Preferably, the semiconductor chip further comprises an intense light source, the intense light source is arranged below the fixing component, and an output end of the intense light source is aligned with the upper surface of the semiconductor chip.
The technical scheme of the invention has the following advantages: the invention provides a semiconductor probe test fixture and a semiconductor probe test system, which comprise a base, a bearing component, a fixing component, an installation component and a probe body, wherein the bearing component and the fixing component are arranged on the base, the probe body is installed on the fixing component through the installation component, the probe body is positioned above the bearing component, and the bearing component is used for bearing a semiconductor chip. According to the invention, the semiconductor chip is tested through the single probe body, when the probe body is damaged, the damaged probe body can be directly replaced without checking, so that the replacement efficiency is improved, the probe body can be quickly put into use after being replaced, the test efficiency is improved, the accuracy of a test result is ensured, and the product quality of the semiconductor chip is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the apparatus particularly pointed out in the written description and drawings thereof.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of an overall structure of a semiconductor probe test fixture according to the present invention;
FIG. 2 is a top view of the load bearing assembly of the present invention;
FIG. 3 is a schematic view of the internal structure of the extraction box according to the present invention;
FIG. 4 is a schematic view of a damping mechanism according to the present invention;
FIG. 5 is a schematic view of a clamping mechanism according to the present invention;
FIG. 6 is a diagram of a semiconductor probe test system according to the present invention.
In the figure: 1. a base; 2. a probe body; 3. a semiconductor chip; 4. a first electric telescopic rod; 5. a first sliding table; 6. a first support plate; 7. a second electric telescopic rod; 8. a second sliding table; 9. a buffer mechanism; 10. an air extraction box; 11. a first cavity; 12. a second support plate; 13. a first through hole; 14. a vacuum generator; 15. a connecting pipe; 16. a buffer tank; 17. a first traveler; 18. pressing a plate; 19. a second cavity; 20. a seal ring; 21. a second strut; 22. a return spring; 23. a sliding plate; 24. a connecting rod; 25. a vertical plate; 26. a transverse plate; 27. a third electric telescopic rod; 28. a box body; 29. an air outlet; 30. a partition plate; 31. a breather pipe; 32. a filter plate; 33. an air inlet fan; 34. an air inlet; 35. a first swing lever; 36. a first link; 37. a slider; 38. a push rod; 39. a first spring; 40. a vertical rod; 41. a first roller; 42. a cross bar; 43. a second swing lever; 44. a rubber block; 45. a second roller; 46. a second spring; 47. an industrial camera; 48. a first controller; 49. an intense light source.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to an order or sequence, and do not limit the present invention, but only distinguish components or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions and technical features between various embodiments can be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not be within the protection scope of the present invention.
Example 1:
an embodiment of the present invention provides a semiconductor probe test fixture, as shown in fig. 1 to 6, including: the probe comprises a base 1, a bearing component, a fixing component, a mounting component and a probe body 2, wherein the bearing component and the fixing component are arranged on the base 1, the probe body 2 is arranged on the fixing component through the mounting component, the probe body 2 is positioned above the bearing component, and the bearing component is used for bearing a semiconductor chip 3.
The working principle and the beneficial effects of the technical scheme are as follows: the semiconductor chip testing device is characterized in that the base 1 is provided with a bearing component and a fixing component, the bearing component is used for bearing a semiconductor chip 3, the fixing component is used for fixing the mounting component, the mounting component is used for mounting the probe body 2, and the semiconductor chip 3 on the bearing component can be tested through the probe body 2.
Example 2
On the basis of the above embodiment 1, as shown in fig. 1 to 3, the bearing assembly includes:
the first electric telescopic rod 4 is arranged on the upper surface of the base 1, the fixed end of the first electric telescopic rod 4 is fixedly connected with the upper surface of the base 1, the output end of the first electric telescopic rod 4 is provided with a first sliding table 5, and the bottom wall of the first sliding table 5 is connected with the upper surface of the base 1 in a sliding manner;
the first supporting plate 6 is arranged on the upper surface of the first sliding table 5, and the upper surface of the first sliding table 5 is fixedly connected with the lower surface of the first supporting plate 6;
the second electric telescopic rod 7 is arranged on the upper surface of the first supporting plate 6, the second electric telescopic rod 7 is perpendicular to the first electric telescopic rod 4, the fixed end of the second electric telescopic rod 7 is fixedly connected with the upper surface of the first supporting plate 6, the output end of the second electric telescopic rod 7 is provided with a second sliding table 8, the bottom wall of the second sliding table 8 is slidably connected with the upper surface of the first supporting plate 6, and the output end of the second electric telescopic rod 7 is perpendicular to the output end of the first electric telescopic rod 4;
the buffer mechanism 9 is arranged right in front of the second electric telescopic rod 7, an air extraction box 10 is arranged above the buffer mechanism 9, a first cavity 11 is arranged in the air extraction box 10, a second support plate 12 is arranged on the upper surface of the air extraction box 10, and the semiconductor chip 3 is placed on the upper surface of the second support plate 12;
a plurality of first through holes 13 are formed in the second supporting plate 12, and the first through holes 13 are communicated with the first cavity 11;
the base 1 is provided with a vacuum generator 14, a connecting pipe 15 is arranged between the vacuum generator 14 and the air extraction box 10, one end of the connecting pipe 15 is communicated with the inside of the first cavity 11, and the other end of the connecting pipe 15 is communicated with the input end of the vacuum generator 14.
The working principle and the beneficial effects of the technical scheme are as follows: when the bearing assembly is used, the semiconductor chip 3 is placed on the upper surface of the second supporting plate 12, then the vacuum generator 14 is started, the vacuum generator 14 works to draw air in the first cavity 11, the semiconductor chip 3 is fixed on the upper surface of the second supporting plate 12 by utilizing negative pressure without damaging the semiconductor chip 3, then the first measured position of the semiconductor chip 3 is moved to the position under the probe body 2, after the probe body 2 finishes the test of the first measured position, the semiconductor chip 3 is moved, so that the second measured position of the semiconductor chip 3 is moved to the position under the probe body 2, the movement of the semiconductor chip 3 is finished by the first electric telescopic rod 4 and the second electric telescopic rod 7 together, the first sliding table 5 can be controlled to slide left and right along the base 1 by the extension of the first electric telescopic rod 4, the first sliding table 5 can drive the first supporting plate 6 to move left and right, first backup pad 6 side-to-side motion drives second electric telescopic handle 7 side-to-side motion, the flexible second electric telescopic handle 7 can drive second slip table 8 and slide around along first backup pad 6 upper surface, thereby drive buffer gear 9, exhaust chamber 10 and second backup pad 12 seesaw, just can control semiconductor chip 3 and remove, make the measured position of semiconductor just to probe body 2 lower extreme, through setting up bearing assembly, can bear semiconductor chip 3 on the one hand, on the other hand can drive semiconductor chip 3 and remove, thereby reach the purpose that single probe body 2 accomplishes the test to semiconductor chip 3 is whole.
Example 3
In addition to embodiment 2, as shown in fig. 4, the damper mechanism 9 includes:
the lower surface of the buffer box 16 is connected with the upper surface of the first supporting plate 6 in a sliding mode, and the rear side wall of the buffer box 16 is fixedly connected with the front side wall of the second sliding table 8;
the first sliding column 17 is arranged in the buffer box 16, the upper end of the first sliding column 17 penetrates through the upper end of the buffer box 16, extends to the outside of the buffer box 16 and is provided with a pressing plate 18, the upper surface of the pressing plate 18 is fixedly connected with the bottom wall of the extraction box 10, the first sliding column 17 is in sliding connection with the upper end of the buffer box 16, and a second cavity 19 is arranged at the position, close to the lower end, of the first sliding column 17;
the sealing ring 20 is sleeved on the outer side of the first sliding column 17, the inner wall of the sealing ring 20 is in contact with the outer wall of the first sliding column 17, and the outer wall of the sealing ring 20 is in contact with the inner wall of the buffer box 16;
the second sliding column 21 is arranged in the second cavity 19, and the upper end of the second sliding column 21 penetrates through the bottom wall of the first sliding column 17, extends into the second cavity 19 and is in sliding connection with the bottom wall of the first sliding column 17;
the return spring 22 is arranged in the second cavity 19, one end of the return spring 22 is fixedly connected with the upper end of the second sliding column 21, and the other end of the return spring 22 is fixedly connected with the inner wall of the upper side of the second cavity 19;
the two sliding plates 23 are symmetrically arranged on the left side and the right side of the second sliding column 21, the sliding plates 23 are arranged in the second cavity 19, the sliding plates 23 are slidably connected with the bottom wall of the second cavity 19, and one end of each sliding plate 23, which is far away from the second sliding column 21, penetrates through the side wall of the first sliding column 17 and is in contact with the inner wall of the sealing ring 20;
and the connecting rod 24 is arranged between the sliding plate 23 and the second sliding column 21, one end of the connecting rod 24 is hinged with the upper surface of the sliding plate 23, and the other end of the connecting rod 24 is hinged with the side wall of the second sliding column 21.
The working principle and the beneficial effects of the technical scheme are as follows: the buffer mechanism 9 is used for buffering the pressure applied by the semiconductor chip 3 and the probe body 2 to the semiconductor chip 3, when the semiconductor chip 3 is placed on the second support plate 12, under the action of gravity, the second support plate 12 moves downwards, the second support plate 12 drives the air extraction box 10 to move downwards, the air extraction box 10 drives the pressure plate 18 to move downwards, the pressure plate 18 drives the first sliding column 17 to slide downwards, the first sliding column 17 drives the sealing ring 20 to slide from top to bottom on the inner wall of the second cavity 19, in an initial state, the second sliding column 21 is not in contact with the bottom wall of the second cavity 19, at the moment, the two sliding plates 23 are both in contact with the inner wall of the sealing ring 20, the two sliding plates 23 press the inner wall of the sealing ring 20, so that the outer wall of the sealing ring 20 is in tight contact with the inner wall of the second cavity 19, when the sealing ring 20 slides downwards, air below the sealing ring 20 is compressed, so as to slow down sliding speed of the sealing ring 20, buffering the semiconductor chip 3, wherein the lower end of the second sliding column 21 contacts with the bottom wall of the second cavity 19, when the probe body 2 tests the semiconductor chip 3, the probe body 2 downwardly presses the semiconductor chip 3, the first sliding column 17 continues to slide downwards, the return spring 22 compresses, then the downward force of the probe body 2 is effectively buffered by the elastic force of the return spring 22, meanwhile, the first sliding column 17 continues to slide downwards, the second sliding column 21 drives the sliding plates 23 at two sides to slide towards the direction close to the second sliding column 21 through the connecting rod 24, so that the sliding plates 23 are separated from the inner wall of the sealing ring 20, a gap is generated between the outer wall of the sealing ring 20 and the inner wall of the second cavity 19, air can circulate in the second cavity 19, when the probe body 2 is separated from the semiconductor chip 3, the return spring 22 can be reset, so that the sealing ring 20 and the first sliding column 17 are reset, and when the next test is carried out, repeat above-mentioned step, through setting up this buffer gear 9, can play the guard action to probe body 2, avoid probe body 2 to extrude semiconductor chip 3 and take place the rupture damage when the test, prolonged probe body 2's life, reduce cost to, buffer gear 9 can also protect semiconductor chip 3, cushions the extrusion force of probe body 2, is impaired when avoiding semiconductor chip 3 to test, has guaranteed semiconductor chip 3's quality.
Example 4
On the basis of any of embodiments 1 to 3, as shown in fig. 1, the fixing assembly includes: the base comprises a vertical plate 25 and a transverse plate 26, wherein the vertical plate 25 is perpendicular to the base 1, one end of the vertical plate 25 is fixedly connected with the upper surface of the base 1, the transverse plate 26 is arranged at the other end of the vertical plate 25, and the transverse plate 26 is parallel to the base 1;
the mounting assembly includes:
the third electric telescopic rod 27 is arranged on the lower surface of the transverse plate 26, the fixed end of the third electric telescopic rod 27 is fixedly connected with the lower surface of the transverse plate 26, and the third electric telescopic rod 27 is perpendicular to the transverse plate 26;
and the clamping mechanism is arranged at the output end of the third electric telescopic rod 27 and is used for installing the probe body 2.
The working principle and the beneficial effects of the technical scheme are as follows: fixed subassembly includes diaphragm 26 and riser 25, riser 25 perpendicular to base 1, diaphragm 26 one end and riser 25 upper end fixed connection, diaphragm 26 lower surface fixed mounting third electric telescopic handle 27, third electric telescopic handle 27 output sets up clamping mechanism, clamping mechanism is used for fixed probe body 2, control third electric telescopic handle 27 stretches out and can remove probe body 2 to semiconductor chip 3's measured position to the completion is to semiconductor chip 3's test.
Example 5
On the basis of embodiment 4, as shown in fig. 5, the clamping mechanism includes:
the upper surface of the box body 28 is fixedly connected with the output end of the third electric telescopic rod 27, the bottom wall of the box body 28 is provided with an air outlet 29, and the upper end of the probe body 2 extends into the box body 28 through the air outlet 29;
the baffle plate 30 is horizontally arranged in the box body 28, the left end and the right end of the baffle plate 30 are respectively fixedly connected with the inner walls of the left side and the right side of the box body 28, the front side wall and the rear side wall of the baffle plate 30 are respectively attached to the inner walls of the front side and the rear side of the box body 28, the center of the baffle plate 30 is provided with a second through hole, a vent pipe 31 is arranged in the second through hole in a sliding manner, the vent pipe 31 is respectively communicated with the upper side and the lower side of the baffle plate 30, the lower end of the vent pipe 31 is sleeved outside the probe body 2, and the diameter of the inner wall of the vent pipe 31 is larger than that of the probe body 2;
the filter plate 32 is arranged in the breather pipe 31, and the periphery of the filter plate 32 is fixedly connected with the inner wall of the breather pipe 31;
the air supply fan 33 is arranged above the partition plate 30, the air supply fan 33 is fixedly connected with the left side wall of the box body 28, an air inlet hole 34 is arranged on the left side of the air supply fan 33, and the air inlet hole 34 penetrates through the left side wall of the box body 28;
the two first swing rods 35 are symmetrically arranged at the left side and the right side of the air pipe 31, and one end of each first swing rod 35 is hinged with the lower surface of the partition plate 30;
a first connecting rod 36, wherein the first connecting rod 36 is arranged between the first swing rod 35 and the vent pipe 31, one end of the first connecting rod 36 is hinged with the side wall of the first swing rod 35, and the other end of the first connecting rod 36 is hinged with the side wall of the vent pipe 31;
the sliding block 37 is arranged on the side, away from the air pipe 31, of the first swinging rod 35, and the upper surface of the sliding block 37 is in sliding connection with the lower surface of the partition plate 30;
the push rod 38 is arranged at one end, far away from the first swing rod 35, of the sliding block 37, and one end, far away from the sliding block 37, of the push rod 38 penetrates through the side wall of the box body 28 and is connected with the side wall of the box body 28 in a sliding mode;
the first spring 39 is sleeved on the push rod 38, one end of the first spring 39 is fixedly connected with the side wall of the sliding block 37, and the other end of the first spring 39 is fixedly connected with the inner wall of the box body 28;
the vertical rod 40 is arranged on the lower surface of the sliding block 37, the upper end of the vertical rod 40 is fixedly connected with the lower surface of the sliding block 37, the lower end of the vertical rod 40 is provided with a first roller 41, and the first roller 41 is in contact with the side wall of the first swinging rod 35;
the cross rod 42 is arranged below the vertical rod 40, the vertical rod 40 is perpendicular to the probe body 2, and one end of the cross rod 42 is fixedly connected with the side wall of the box body 28;
the second swing rod 43 is arranged in front of the cross rod 42, the second swing rod 43 is connected with the front side wall of the cross rod 42 through a rotating shaft in a rotating mode near the middle position, a rubber block 44 is arranged at one end, close to the probe body 2, of the second swing rod 43, the rubber block 44 is in contact with the outer wall of the probe body 2, a second roller 45 is arranged at one end, far away from the probe body 2, of the second swing rod 43, and the second roller 45 is abutted to the side wall of the first swing rod 35;
and a second spring 46, wherein the second spring 46 is arranged at one end of the second swing rod 43 close to the rubber block 44, one end of the second spring 46 is fixedly connected with the side wall of the second swing rod 43, the other end of the second spring 46 is fixedly connected with the inner side wall of the box body 28, and the second spring 46 is parallel to the cross rod 42.
The working principle and the beneficial effects of the technical scheme are as follows: when the probe body 2 is installed, the push rod 38 is pressed into the box 28 at the same time, the push rod 38 moves towards the direction close to the vent pipe 31, the push rod 38 drives the slide block 37 to slide on the lower surface of the partition board 30, the first spring 39 is stretched, the slide block 37 drives the first roller 41 to move towards the direction close to the vent pipe 31 through the vertical rod 40, the first roller 41 drives one end of the first swing rod 35 to swing towards the direction close to the vent pipe 31, the first swing rod 35 drives the vent pipe 31 to slide downwards through the first connecting rod 36, the vent pipe 31 drives the filter plate 32 to slide downwards, the first swing rod 35 drives one end of the second swing rod 43 provided with the second roller 45 to swing towards the direction close to the vent pipe 31 through the second roller 45, meanwhile, the rubber block 44 swings towards the direction close to the inner wall of the box 28, the second spring 46 is compressed, at this time, the upper end of the probe body 2 extends from the air outlet 29 at the bottom of the box 28 to the inside of the box 28, until the upper end of the probe body 2 contacts with the lower surface of the filter plate 32, in the installation process, the inner wall of the vent pipe 31 can guide the upper end of the probe body 2 to prevent the probe body 2 from deviating during installation, when the upper end of the probe body 2 abuts against the lower surface of the filter plate 32, the push rods 38 on both sides are released, under the action of the first spring 39, the slide block 37 slides in the direction away from the vent pipe 31, under the action of the second spring 46, the two rubber blocks 44 swing in the direction close to the side wall of the probe body 2, one end of the second swing rod 43 with the second roller 45 swings in the direction away from the vent pipe 31, and drives the first swing rod 35 to swing in the direction away from the vent pipe 31 through the second roller 45, the first swing rod 35 drives the vent pipe 31 to slide upwards through the first connecting rod 36 in the swing process, so that the filter plate 32 is separated from the upper end of the probe body 2 until the two rubber blocks 44 clamp the probe body 2, at the moment, the probe body 2 is completely installed, when the probe body 2 needs to be replaced, the push rod 38 is pushed into the box 28 again, the rubber block 44 is separated from the outer wall of the probe body 2, the probe body 2 can be taken out of the box 28, after the probe body 2 is tested, the air inlet fan 33 is started, air enters the box 28 from the air inlet 34 and is blown to the probe body 2 through the air pipe 31, the outer wall of the probe body 2 is cleaned by utilizing fast flowing air, the filter plate 32 can block impurities in the air and prevent the probe body 2 from being polluted by the impurities, by arranging the clamping mechanism, the probe body 2 can be clamped by utilizing the rubber blocks 44 on two sides, the probe body 2 is convenient to rapidly disassemble and assemble, the disassembly and the assembly by using a special tool are not needed, the operation is convenient and fast, the replacement efficiency is improved, the air is driven to rapidly flow by utilizing the air inlet fan 33, the cleaning of the outer wall of the probe body 2 can be completed, the probe body 2 is prevented from being broken by excessive force during manual cleaning, the cleanliness of the probe body 2 is improved, the probe body 2 is protected, when the rubber block 44 is in close contact with the outer wall of the probe body 2, the filter plate 32 is separated from the upper end of the probe body 2, the filter plate 32 can be prevented from being blocked by the probe body 2, the air flow is increased, the cleaning efficiency is improved, the vent pipe 31 has a guiding effect on the probe body 2, the probe body 2 can be positioned at the central position of the box 28, the probe body 2 is prevented from inclining, when the probe is mounted, the push rod 38 needs to be pushed into the box 28 completely, the height of the filter plate 32 is ensured to be consistent, when the probe body 2 is placed into the box 28, the length of the probe body 2 exposed outside the box 28 is the same after the upper end of the probe body 2 is abutted against the filter plate 32, the mounting consistency of the probe body 2 is improved, and the test deviation is reduced, the test accuracy of the semiconductor chip 3 is ensured.
The present invention also provides a semiconductor probe test system, as shown in fig. 6, including any one of the semiconductor probe test tools described above, and using the semiconductor probe test tool to test a semiconductor chip 3, further including:
the industrial camera 47 is arranged on the fixing component, the industrial camera 47 is aligned to the semiconductor chip 3, the industrial camera 47 is used for acquiring an actual image of the upper surface of the semiconductor chip 3, and the upper end of the industrial camera 47 is fixedly connected with the lower surface of the transverse plate 26;
the first controller 48, the first controller 48 is electrically connected with the industrial camera 47, the first controller 48 is installed on the base 1, and the first controller 48 controls the movement of the bearing component according to the actual image of the upper surface of the semiconductor chip 3.
The working principle and the beneficial effects of the technical scheme are as follows: the industrial camera 47 can acquire an actual image of the upper surface of the semiconductor chip 3 to confirm actual coordinates of a measured position on the semiconductor chip 3, then the first controller 48 can control the movement of the carrying component according to the actual image of the upper surface of the semiconductor acquired by the industrial camera 47, the first controller 48 is electrically connected to the first electric telescopic rod 4, the second electric telescopic rod 7 and the third electric telescopic rod 27 respectively, when the first controller 48 confirms the actual coordinates of the measured position on the semiconductor chip 3, the first controller 48 controls the movement of the first electric telescopic rod 4 and the second electric telescopic rod 7 according to the actual coordinates to automatically push the measured position of the semiconductor chip 3 to the lower part of the probe body 2, then the third electric telescopic rod 27 is started to move the probe body 2 to be contacted with the measured position, after testing is finished, the first controller 48 controls the third electric telescopic rod 27 to retract, and simultaneously controlling the first electric telescopic rod 4 and the second electric telescopic rod 7 to move to align the next measured position of the semiconductor chip 3 with the probe body 2, wherein the straight line distance between the next measured position and the measured position after the test is finished is the shortest when the next measured position moves, so that the test efficiency is improved, and the integral automation degree of the test system is improved.
In one embodiment, the semiconductor chip further comprises an intense light source 49, wherein the intense light source 49 is arranged below the fixing component, and the output end of the intense light source 49 is aligned with the upper surface of the semiconductor chip 3;
the upper end of the strong light source 49 is fixedly connected with the lower surface of the transverse plate 26.
The working principle and the beneficial effects of the technical scheme are as follows: the lower surface of the transverse plate 26 is also provided with the strong light source 49, and light generated by the strong light source 49 can irradiate the upper surface of the semiconductor chip 3, so that the actual image of the upper surface of the semiconductor chip 3 acquired by the industrial camera 47 is clearer and more reliable, the accuracy of the actual image is improved, and meanwhile, a worker can observe the test process conveniently and visually.
In one embodiment, further comprising:
a temperature sensor provided on the second support plate 12 for detecting an actual temperature of the surface of the semiconductor chip 3;
the luminous flux adjusting device is arranged on the transverse plate 26 and is electrically connected with the strong light source 49;
the second controller is arranged on the base 1 and is respectively and electrically connected with the temperature sensor and the luminous flux adjusting device;
the second controller controls the light flux adjusting device to adjust the actual light flux of the strong light source 49 based on the detection value of the temperature sensor, and comprises the following steps:
step 1: based on the detected value of the temperature sensor, a target luminous flux that needs to be adjusted by the luminous flux adjustment device is calculated by the following formula:
Figure BDA0003467277840000161
wherein Φ is the luminous flux modulationTarget luminous flux to be adjusted for the device, E1For a preset maximum illumination of said intense light source 49,/1Is the linear distance, h, from the intense light source 49 to the central position of the semiconductor chip 31Is the thickness, S, of the semiconductor chip 31W is the utilization coefficient of the intense light source 49, γ is the maintenance coefficient of the intense light source 49, T is the surface area of the semiconductor chip 32Is a predetermined temperature, T, of the surface of the semiconductor chip 31The actual temperature of the surface of the semiconductor chip 3 detected for the temperature sensor;
step 2: based on the calculation result in step 1, the second controller controls the light flux adjusting device to adjust the actual light flux of the strong light source 49, when the target light flux required to be adjusted by the light flux adjusting device is greater than 0, the light flux adjusting device increases the actual light flux of the strong light source 49 by the target light flux, when the target light flux required to be adjusted by the light flux adjusting device is equal to 0, the actual light flux of the strong light source 49 does not need to be adjusted, and when the target light flux required to be adjusted by the light flux adjusting device is less than 0, the light flux adjusting device decreases the actual light flux of the strong light source 49 by the target light flux.
The working principle and the beneficial effects of the technical scheme are as follows: when the strong light source 49 irradiates the semiconductor chip 3, the temperature of the semiconductor chip 3 is raised, in order to maintain the temperature of the semiconductor chip 3 at a fixed temperature, the second controller can control the luminous flux adjusting device to adjust the actual luminous flux of the strong light source 49 according to the detection value of the temperature sensor, the scheme can accurately calculate the target luminous flux which needs to be adjusted by the luminous flux adjusting device, in the calculating process, the value range of the coefficient is 0.4-0.75, the coefficient is related to the height of the strong light source 49, the higher the height of the strong light source 49 is, the smaller the coefficient is, and the value range of the maintenance coefficient is 0.8-0.85, in the invention, the coefficient is 0.6, the maintenance coefficient is 0.8, and finally, according to the calculating result, when the target luminous flux which needs to be adjusted by the luminous flux adjusting device is greater than 0, the actual luminous flux of the strong light source 49 is raised by the target luminous flux by the luminous flux adjusting device, when the target luminous flux required to be adjusted by the luminous flux adjusting device is equal to 0, the actual luminous flux of the strong light source 49 does not need to be adjusted, and when the target luminous flux required to be adjusted by the luminous flux adjusting device is less than 0, the actual luminous flux of the strong light source 49 is reduced by the luminous flux adjusting device, so that the actual luminous flux of the strong light source 49 is automatically adjusted by controlling the luminous flux adjusting device, the surface temperature of the semiconductor chip 3 is kept at a fixed temperature, the probe test result cannot be influenced by the change of the surface temperature of the semiconductor chip 3, the test accuracy is improved, and the intelligent level of the test system is further improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A semiconductor probe test fixture is characterized by comprising: the probe comprises a base (1), a bearing component, a fixing component, an installation component and a probe body (2), wherein the bearing component and the fixing component are arranged on the base (1), the probe body (2) is installed on the fixing component through the installation component, the probe body (2) is located above the bearing component, and the bearing component is used for bearing a semiconductor chip (3).
2. The semiconductor probe test fixture of claim 1, wherein the carrier assembly comprises:
the first electric telescopic rod (4) is arranged on the upper surface of the base (1), the fixed end of the first electric telescopic rod (4) is fixedly connected with the upper surface of the base (1), the output end of the first electric telescopic rod (4) is provided with a first sliding table (5), and the bottom wall of the first sliding table (5) is connected with the upper surface of the base (1) in a sliding manner;
the first supporting plate (6) is arranged on the upper surface of the first sliding table (5), and the upper surface of the first sliding table (5) is fixedly connected with the lower surface of the first supporting plate (6);
the second electric telescopic rod (7), the second electric telescopic rod (7) is arranged on the upper surface of the first supporting plate (6), the second electric telescopic rod (7) is perpendicular to the first electric telescopic rod (4), the fixed end of the second electric telescopic rod (7) is fixedly connected with the upper surface of the first supporting plate (6), the output end of the second electric telescopic rod (7) is provided with a second sliding table (8), the bottom wall of the second sliding table (8) is slidably connected with the upper surface of the first supporting plate (6), and the output end of the second electric telescopic rod (7) is perpendicular to the output end of the first electric telescopic rod (4);
buffer gear (9), buffer gear (9) set up second electric telescopic handle (7) dead ahead, buffer gear (9) top sets up exhaust chamber (10), set up first cavity (11) in exhaust chamber (10), exhaust chamber (10) upper surface sets up second backup pad (12), semiconductor chip (3) are placed second backup pad (12) upper surface.
3. The semiconductor probe test fixture according to claim 2, wherein a plurality of first through holes (13) are disposed in the second support plate (12), and the plurality of first through holes (13) are communicated with the first cavity (11).
4. The semiconductor probe test fixture according to claim 3, wherein a vacuum generator (14) is disposed on the base (1), a connecting pipe (15) is disposed between the vacuum generator (14) and the air exhaust box (10), one end of the connecting pipe (15) is communicated with the inside of the first cavity (11), and the other end of the connecting pipe (15) is communicated with an input end of the vacuum generator (14).
5. The semiconductor probe test fixture of claim 2, wherein the buffer mechanism (9) comprises:
the lower surface of the buffer box (16) is connected with the upper surface of the first supporting plate (6) in a sliding mode, and the rear side wall of the buffer box (16) is fixedly connected with the front side wall of the second sliding table (8);
the first sliding column (17) is arranged in the buffer box (16), the upper end of the first sliding column (17) penetrates through the upper end of the buffer box (16), extends to the outside of the buffer box (16) and is provided with a pressing plate (18), the upper surface of the pressing plate (18) is fixedly connected with the bottom wall of the extraction box (10), the first sliding column (17) is in sliding connection with the upper end of the buffer box (16), and a second cavity (19) is arranged at the position, close to the lower end, of the first sliding column (17);
the sealing ring (20) is sleeved on the outer side of the first sliding column (17), the inner wall of the sealing ring (20) is in contact with the outer wall of the first sliding column (17), and the outer wall of the sealing ring (20) is in contact with the inner wall of the buffer box (16);
the second sliding column (21), the second sliding column (21) is arranged in the second cavity (19), and the upper end of the second sliding column (21) penetrates through the bottom wall of the first sliding column (17), extends into the second cavity (19) and is connected with the bottom wall of the first sliding column (17) in a sliding manner;
the return spring (22) is arranged in the second cavity (19), one end of the return spring (22) is fixedly connected with the upper end of the second sliding column (21), and the other end of the return spring (22) is fixedly connected with the inner wall of the upper side of the second cavity (19);
the two sliding plates (23) are symmetrically arranged on the left side and the right side of the second sliding column (21), the sliding plates (23) are arranged in the second cavity (19), the sliding plates (23) are in sliding connection with the bottom wall of the second cavity (19), and one end, far away from the second sliding column (21), of each sliding plate (23) penetrates through the side wall of the first sliding column (17) and is in contact with the inner wall of the sealing ring (20);
the connecting rod (24) is arranged between the sliding plate (23) and the second sliding column (21), one end of the connecting rod (24) is hinged to the upper surface of the sliding plate (23), and the other end of the connecting rod (24) is hinged to the side wall of the second sliding column (21).
6. The semiconductor probe test fixture of claim 1, wherein the fixing member comprises: riser (25) and diaphragm (26), riser (25) perpendicular to base (1), riser (25) one end with fixed surface is connected on base (1), riser (25) other end sets up diaphragm (26), diaphragm (26) are on a parallel with base (1).
7. The semiconductor probe test fixture of claim 6, wherein the mounting assembly comprises:
the third electric telescopic rod (27), the third electric telescopic rod (27) is arranged on the lower surface of the transverse plate (26), the fixed end of the third electric telescopic rod (27) is fixedly connected with the lower surface of the transverse plate (26), and the third electric telescopic rod (27) is perpendicular to the transverse plate (26);
the clamping mechanism is arranged at the output end of the third electric telescopic rod (27) and is used for installing the probe body (2).
8. The semiconductor probe test fixture of claim 7, wherein the clamping mechanism comprises:
the upper surface of the box body (28) is fixedly connected with the output end of the third electric telescopic rod (27), an air outlet (29) is formed in the bottom wall of the box body (28), and the upper end of the probe body (2) extends into the box body (28) through the air outlet (29);
the probe body (2) is provided with a probe body (2) and comprises a partition plate (30), the partition plate (30) is horizontally arranged in the box body (28), the left end and the right end of the partition plate (30) are fixedly connected with the inner walls of the left side and the right side of the box body (28) respectively, the front side wall and the rear side wall of the partition plate (30) are attached to the inner walls of the front side and the rear side of the box body (28) respectively, a second through hole is formed in the center of the partition plate (30), a vent pipe (31) is arranged in the second through hole in a sliding mode, the vent pipe (31) is communicated with the upper side and the lower side of the partition plate (30) respectively, the lower end of the vent pipe (31) is sleeved outside the probe body (2), and the diameter of the inner wall of the vent pipe (31) is larger than that of the probe body (2);
the filter plate (32) is arranged in the vent pipe (31), and the periphery of the filter plate (32) is fixedly connected with the inner wall of the vent pipe (31);
the air inlet fan (33) is arranged above the partition plate (30), the air inlet fan (33) is fixedly connected with the left side wall of the box body (28), an air inlet hole (34) is formed in the left side of the air inlet fan (33), and the air inlet hole (34) penetrates through the left side wall of the box body (28);
the two first swinging rods (35) are symmetrically arranged at the left side and the right side of the air pipe (31), and one end of each first swinging rod (35) is hinged with the lower surface of the partition plate (30);
the first connecting rod (36) is arranged between the first swinging rod (35) and the air pipe (31), one end of the first connecting rod (36) is hinged with the side wall of the first swinging rod (35), and the other end of the first connecting rod (36) is hinged with the side wall of the air pipe (31);
the sliding block (37), the sliding block (37) is arranged on one side, away from the air pipe (31), of the first swinging rod (35), and the upper surface of the sliding block (37) is in sliding connection with the lower surface of the partition plate (30);
the push rod (38) is arranged at one end, far away from the first swing rod (35), of the sliding block (37), and one end, far away from the sliding block (37), of the push rod (38) penetrates through the side wall of the box body (28) and is in sliding connection with the side wall of the box body (28);
the first spring (39) is sleeved on the push rod (38), one end of the first spring (39) is fixedly connected with the side wall of the sliding block (37), and the other end of the first spring (39) is fixedly connected with the inner wall of the box body (28);
the vertical rod (40) is arranged on the lower surface of the sliding block (37), the upper end of the vertical rod (40) is fixedly connected with the lower surface of the sliding block (37), the lower end of the vertical rod (40) is provided with a first roller (41), and the first roller (41) is in contact with the side wall of the first swinging rod (35);
the cross rod (42) is arranged below the vertical rod (40), the vertical rod (40) is perpendicular to the probe body (2), and one end of the cross rod (42) is fixedly connected with the side wall of the box body (28);
the second swinging rod (43) is arranged in front of the cross rod (42), the second swinging rod (43) is close to the middle and is rotatably connected with the front side wall of the cross rod (42) through a rotating shaft, a rubber block (44) is arranged at one end, close to the probe body (2), of the second swinging rod (43), the rubber block (44) is in contact with the outer wall of the probe body (2), a second roller (45) is arranged at one end, far away from the probe body (2), of the second swinging rod (43), and the second roller (45) is abutted to the side wall of the first swinging rod (35);
the second spring (46), second spring (46) set up second swinging arms (43) are close to rubber block (44) one end, second spring (46) one end with second swinging arms (43) lateral wall fixed connection, second spring (46) other end with box (28) inside wall fixed connection, second spring (46) are on a parallel with horizontal pole (42).
9. A semiconductor probe test system comprising the semiconductor probe test fixture of any one of claims 1-8, further comprising:
an industrial camera (47), said industrial camera (47) being arranged on said fixed assembly, said industrial camera (47) being aimed at said semiconductor chip (3), said industrial camera (47) being adapted to acquire an actual image of the upper surface of said semiconductor chip (3);
the first controller (48), the first controller (48) is connected with the industrial camera (47) electrically, and the first controller (48) controls the bearing component to move according to the actual image of the upper surface of the semiconductor chip (3).
10. A semiconductor probe test system according to claim 9, further comprising an intense light source (49), said intense light source (49) being disposed below said fixed assembly, the output of said intense light source (49) being directed at the upper surface of said semiconductor chip (3).
CN202210033101.3A 2022-01-12 2022-01-12 Semiconductor probe test fixture and system Withdrawn CN114355147A (en)

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Application Number Priority Date Filing Date Title
CN202210033101.3A CN114355147A (en) 2022-01-12 2022-01-12 Semiconductor probe test fixture and system

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Application Number Priority Date Filing Date Title
CN202210033101.3A CN114355147A (en) 2022-01-12 2022-01-12 Semiconductor probe test fixture and system

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110826014A (en) * 2019-11-12 2020-02-21 南京理工大学 Valve short-circuit protection action current signal decomposition method based on VMD
CN117572220A (en) * 2024-01-16 2024-02-20 深圳市圆朗智能科技有限公司 Semiconductor tester

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110826014A (en) * 2019-11-12 2020-02-21 南京理工大学 Valve short-circuit protection action current signal decomposition method based on VMD
CN117572220A (en) * 2024-01-16 2024-02-20 深圳市圆朗智能科技有限公司 Semiconductor tester
CN117572220B (en) * 2024-01-16 2024-04-30 深圳市圆朗智能科技有限公司 Semiconductor tester

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