CN114350282A - Hot melt adhesive with quick adhesion performance and preparation method thereof - Google Patents
Hot melt adhesive with quick adhesion performance and preparation method thereof Download PDFInfo
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- CN114350282A CN114350282A CN202111662254.6A CN202111662254A CN114350282A CN 114350282 A CN114350282 A CN 114350282A CN 202111662254 A CN202111662254 A CN 202111662254A CN 114350282 A CN114350282 A CN 114350282A
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- hot melt
- melt adhesive
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 15
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 15
- 229920001577 copolymer Polymers 0.000 claims abstract description 11
- 229920000098 polyolefin Polymers 0.000 claims abstract description 11
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 9
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 9
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 8
- 239000004743 Polypropylene Substances 0.000 claims abstract description 6
- -1 polypropylene Polymers 0.000 claims abstract description 6
- 229920001155 polypropylene Polymers 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000005469 granulation Methods 0.000 claims description 3
- 230000003179 granulation Effects 0.000 claims description 3
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 3
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 3
- 229920001684 low density polyethylene Polymers 0.000 claims description 3
- 239000004702 low-density polyethylene Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 3
- 229920005629 polypropylene homopolymer Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000002671 adjuvant Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a hot melt adhesive with quick adhesion performance and a preparation method thereof, wherein the hot melt adhesive comprises the following components in parts by weight: 43-60 parts of polyolefin and copolymer thereof, 12-18 parts of polar compatilizer, 8-16 parts of thermoplastic elastomer, 5-8 parts of polyamide resin, 1-2 parts of tackifier, 3-7 parts of synthetic wax, 6-10 parts of homopolymerized polypropylene, 0.5-2 parts of antioxidant and 0.5-1 part of auxiliary agent. The hot melt adhesive of the invention adopts polar compatilizer, thermoplastic elastomer, polyamide resin, tackifier, synthetic wax, homopolymerized polypropylene, antioxidant and auxiliary agent to modify polyolefin and copolymer thereof, so that the polyolefin and the copolymer thereof have better fluidity, can be rapidly diffused on the surface of an adherend, can reach high bonding strength after being cooled, and can greatly expand the application range of the hot melt adhesive.
Description
Technical Field
The invention relates to the technical field of hot melt adhesives, in particular to a hot melt adhesive with quick adhesion performance and a preparation method thereof.
Background
The hot melt adhesive is a plastic adhesive, the physical state of which changes along with the change of temperature within a certain temperature range, and the chemical property of which is unchanged, is nontoxic and tasteless, and belongs to an environment-friendly chemical product. The product is solid, so the product is convenient to package, transport and store, and has no solvent, pollution and toxicity; and the production process is simple, the added value is high, the bonding strength is high, the speed is high, and the like.
The hot melt adhesive is a solid meltable polymer which does not need a solvent and contains 100 percent of moisture; it is solid at normal temperature, and is heated to melt to certain temperature to become fluid liquid with certain viscosity.
The fast operation is a great characteristic of the hot melt adhesive. The operation time of the hot melt adhesive is about 15 seconds generally, and along with the wide application of a modern production mode, namely a production line, the requirement on the operation time of the hot melt adhesive is shorter and shorter, for example, the requirement on the operation time of the hot melt adhesive for book binding and sound box manufacturing reaches about 5 seconds. This requires that the hot melt adhesive function quickly and also have a high adhesive strength, but both quick adhesion and adhesive strength are often difficult to achieve, since hot melt adhesives generally consist of polymers which are compounds having a relatively high molecular weight (generally having a weight average molecular weight of at least 10)4) After the hot melt adhesive is contacted with an adherend, rapid diffusion among molecules is difficult to realize, and even after the hot melt adhesive is completely diffused, in the cooling process, the macromolecular chains are difficult to be instantly frozen, so the bonding force is not strong, and how to solve the problem is very important for the wide application of the hot melt adhesive.
Disclosure of Invention
The invention aims to provide a hot melt adhesive with quick bonding performance and a preparation method thereof, aiming at the defects in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a hot melt adhesive with quick adhesion performance, which comprises the following components in parts by weight:
further, the polyolefin and the copolymer thereof are one or more of linear low density polyethylene, ethylene-vinyl acetate copolymer resin and ethylene-ethyl acrylate copolymer resin.
Further, the polar compatilizer is maleic anhydride modified low-density polyethylene with the density ranging from 0.920 to 0.930g/cm3The melt index is 0.8-2.3 g/10min, wherein the grafting rate of the maleic anhydride is 0.50-1%.
Further, the thermoplastic elastomer is a styrene-butadiene block copolymer.
Further, the polyamide resin is nylon 1212.
Further, the tackifier is one or more of rosin and derivatives thereof, terpene resin and modified resin thereof, petroleum resin, thermoplastic phenolic resin and low molecular weight polystyrene.
Further, the antioxidant is one or more of antioxidant B215, antioxidant 1010, antioxidant 168, antioxidant 1076 and antioxidant 3114.
Further, the auxiliary agent is atactic polypropylene.
The second aspect of the invention provides a preparation method of a hot melt adhesive, which comprises the following steps:
step one, weighing polyolefin and copolymer thereof, polar compatilizer, thermoplastic elastomer, polyamide resin, tackifier, synthetic wax, homo-polypropylene, antioxidant and auxiliary agent according to a ratio, and then uniformly mixing, wherein the mixing temperature is 40-60 ℃;
step two, adding the uniformly mixed raw materials into an extruder, and extruding the mixture by an extruding granulation extruder at the extrusion temperature of 180-.
By adopting the technical scheme, compared with the prior art, the invention has the following technical effects:
the hot melt adhesive of the invention adopts polar compatilizer, thermoplastic elastomer, polyamide resin, tackifier, synthetic wax, homopolymerized polypropylene, antioxidant and auxiliary agent to modify polyolefin and copolymer thereof, so that the polyolefin and the copolymer thereof have better fluidity, can be rapidly diffused on the surface of an adherend, can reach high bonding strength after being cooled, and can greatly expand the application range of the hot melt adhesive.
Detailed Description
The following specific examples further illustrate the invention but are not to be construed as limiting the invention. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention discloses a hot melt adhesive with quick bonding performance, which comprises the following components in parts by weight:
as a preferable example, the polyolefin and the copolymer thereof are one or more of linear low density polyethylene, ethylene-vinyl acetate copolymer resin and ethylene-ethyl acrylate copolymer resin.
As a preferred example, the polar compatibilizer is maleic anhydride modified low density polyethylene having a density in the range of 0.920 to 0.930g/cm3The melt index is 0.8-2.3 g/10min, wherein the grafting rate of the maleic anhydride is 0.50-1%.
As a preferred example, the thermoplastic elastomer is a styrene-butadiene block copolymer.
As a preferable example, the polyamide resin is nylon 1212.
As a preferable example, the tackifier is one or more of rosin and derivatives thereof, terpene resin and modified resin thereof, petroleum resin, thermoplastic phenolic resin and low molecular weight polystyrene.
As a preferable example, the antioxidant is one or more of antioxidant B215, antioxidant 1010, antioxidant 168, antioxidant 1076 and antioxidant 3114.
As a preferred example, the auxiliary agent is atactic polypropylene.
The invention also discloses a preparation method of the hot melt adhesive, which comprises the following steps:
step one, weighing polyolefin and copolymer thereof, polar compatilizer, thermoplastic elastomer, polyamide resin, tackifier, synthetic wax, homo-polypropylene, antioxidant and auxiliary agent according to a ratio, and then uniformly mixing, wherein the mixing temperature is 40-60 ℃;
step two, adding the uniformly mixed raw materials into an extruder, and extruding the mixture by an extruding granulation extruder at the extrusion temperature of 180-.
Example 1
The embodiment provides a hot melt adhesive, which comprises the following components in parts by weight:
example 2
The embodiment provides a hot melt adhesive, which comprises the following components in parts by weight:
example 3
The embodiment provides a hot melt adhesive, which comprises the following components in parts by weight:
example 4
The embodiment provides a hot melt adhesive, which comprises the following components in parts by weight:
the hot melt adhesive samples prepared in the above examples 1 to 4 and the hot melt adhesive products purchased from the market were subjected to performance tests according to respective test standards, and multidimensional comparison was performed for different compounding times in the peel strength test, which was divided into 1s, 2s, 3s, 4s, and 5s, and the peel strength was standard GB/T2790. The results are shown in Table 1.
TABLE 1
It can be seen that, compared with the hot melt adhesive products purchased in the market, the hot melt adhesives of the embodiments 1 to 4 of the present invention have higher peel strength after being compounded for a short time, and the products purchased in the market cannot exert the bonding effect within 2s, and after the hot melt adhesives of the embodiments 1 to 4 of the present invention are compounded for sufficient 5s, the hot melt adhesives of the embodiments 1 to 4 of the present invention have higher peel strength, which indicates that the bonding speed is higher and the bonding effect is better.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (9)
2. the hot melt adhesive according to claim 1, wherein the polyolefin and the copolymer thereof are one or more of linear low density polyethylene, ethylene-vinyl acetate copolymer resin and ethylene-ethyl acrylate copolymer resin.
3. The hot melt adhesive of claim 1, wherein the polar compatibilizer is maleic anhydride-modified low density polyethylene having a density in the range of 0.920 to 0.930g/cm3The melt index is 0.8-2.3 g/10min, wherein the grafting rate of the maleic anhydride is 0.50-1%.
4. The hot melt adhesive of claim 1, wherein the thermoplastic elastomer is a styrene-butadiene block copolymer.
5. The hot melt adhesive of claim 1, wherein the polyamide resin is nylon 1212.
6. The hot melt adhesive according to claim 1, wherein the tackifier is one or more of rosin and derivatives thereof, terpene resin and modified resin thereof, petroleum resin, thermoplastic phenolic resin, and low molecular weight polystyrene.
7. The hot melt adhesive according to claim 1, wherein the antioxidant is one or more of antioxidant B215, antioxidant 1010, antioxidant 168, antioxidant 1076 and antioxidant 3114.
8. The hot melt adhesive of claim 1, wherein the adjuvant is atactic polypropylene.
9. A method for preparing a hot melt adhesive according to any one of claims 1 to 8, comprising the steps of:
step one, weighing polyolefin and copolymer thereof, polar compatilizer, thermoplastic elastomer, polyamide resin, tackifier, synthetic wax, homo-polypropylene, antioxidant and auxiliary agent according to a ratio, and then uniformly mixing, wherein the mixing temperature is 40-60 ℃;
step two, adding the uniformly mixed raw materials into an extruder, and extruding the mixture by an extruding granulation extruder at the extrusion temperature of 180-.
Priority Applications (1)
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CN202111662254.6A CN114350282A (en) | 2021-12-30 | 2021-12-30 | Hot melt adhesive with quick adhesion performance and preparation method thereof |
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CN202111662254.6A CN114350282A (en) | 2021-12-30 | 2021-12-30 | Hot melt adhesive with quick adhesion performance and preparation method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115181514A (en) * | 2022-07-25 | 2022-10-14 | 广州市嘉雁粘合剂有限公司 | Environment-friendly hot melt adhesive for spring mattress and preparation method thereof |
CN115477905A (en) * | 2022-10-12 | 2022-12-16 | 太仓斯迪克新材料科技有限公司 | Polyolefin hot melt adhesive with quick surface drying and preparation method thereof |
Citations (3)
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JP2001139911A (en) * | 1999-10-29 | 2001-05-22 | Three M Innovative Properties Co | Hot-melt adhesive composition for bonding polyolefin |
CN108048000A (en) * | 2017-12-26 | 2018-05-18 | 上海邦中新材料有限公司 | A kind of sanitary napkin special bonding resin and preparation method thereof |
CN112724893A (en) * | 2020-12-25 | 2021-04-30 | 上海邦中高分子材料股份有限公司 | Adhesive resin for barrier base material and preparation method thereof |
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2021
- 2021-12-30 CN CN202111662254.6A patent/CN114350282A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139911A (en) * | 1999-10-29 | 2001-05-22 | Three M Innovative Properties Co | Hot-melt adhesive composition for bonding polyolefin |
CN108048000A (en) * | 2017-12-26 | 2018-05-18 | 上海邦中新材料有限公司 | A kind of sanitary napkin special bonding resin and preparation method thereof |
CN112724893A (en) * | 2020-12-25 | 2021-04-30 | 上海邦中高分子材料股份有限公司 | Adhesive resin for barrier base material and preparation method thereof |
Non-Patent Citations (1)
Title |
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姚其海等著: "《塑料改性技术及其应用研究》", 30 April 2019, 北京理工大学出版社 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115181514A (en) * | 2022-07-25 | 2022-10-14 | 广州市嘉雁粘合剂有限公司 | Environment-friendly hot melt adhesive for spring mattress and preparation method thereof |
CN115477905A (en) * | 2022-10-12 | 2022-12-16 | 太仓斯迪克新材料科技有限公司 | Polyolefin hot melt adhesive with quick surface drying and preparation method thereof |
CN115477905B (en) * | 2022-10-12 | 2023-08-22 | 太仓斯迪克新材料科技有限公司 | Polyolefin hot melt adhesive with rapid surface drying and preparation method thereof |
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Application publication date: 20220415 |