JP2001139911A - Hot-melt adhesive composition for bonding polyolefin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a new-type hot-melt adhesive composition having high adhesivity to polyolefins as well as high heat-resistance. SOLUTION: The objective adhesive composition contains (1) a polyolefin- based hot-melt adhesive containing a thermoplastic polyolefin or an olefinic thermoplastic elastomer as a base polymer, (2) a polyamide resin and (3) a compatibilizing agent for the above components. The hot-melt adhesive (1) may contain a tackifier and/or a wax. The preferable compatibilizing agent (3) is an acid-modified polyolefin resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a hot melt adhesive composition. More particularly, the present invention relates to a new type of hot melt adhesive composition with good adhesion to polyolefin materials and high heat resistance.

[0002]

2. Description of the Related Art A hot-melt adhesive is a solid adhesive containing no solvent such as water or an organic solvent and having a solid content of 100% at room temperature, and is heated and melted and applied to an adherend in a molten state.
Bonding can be performed by solidification by cooling. Due to the absence of solvent, the hot melt adhesive does not require drying (removal of solvent) after application and does not require any special drying equipment. Because of this property, hot melt adhesives can shorten the bonding operation time and improve the working environment, and are therefore widely used in various industrial fields.

[0003] A hot melt adhesive is generally composed of a thermoplastic resin as a main component (base polymer) and, if necessary, a tackifier, a wax and the like. Representative examples of thermoplastic resins include ethylene-vinyl acetate (EVA) copolymers, polyolefins, polyamides, polyesters, and the like.

[0004] As described above, hot melt adhesives have various uses, and are widely used as adhesives for general industry in, for example, automobiles, buildings, electric appliances and the like. Therefore, the adherend adhered by the hot melt adhesive and the conditions of use thereof are various, and various hot melt adhesives for such various applications are currently being developed and supplied to the market.

[0005] There are various types of adherends, and the conditions under which the adherends (and thus the adhesive) are used also vary.
For example, the material of the adherend includes metal, wood, ceramic, paper, plastic, and the like. Regarding usage conditions,
Various use temperatures from low to high temperatures and various required adhesive strengths can be considered.

[0006] Among various adherend materials, plastic is one of the most commonly used materials, and there are various types of plastics. Until now, plastic materials containing chlorine, such as vinyl chloride, have been widely used.However, the disposal of chlorine-containing plastics involves the problem of generating harmful substances, such as dioxins. The use of chlorine-free materials, such as polyolefins, in place of chlorine-containing plastic materials tends to become more prevalent.

[0007] Polyolefin materials such as polypropylene and polyethylene are known as poor adhesion materials because of their low surface energy when viewed as adherends.
If polyolefin is selected as the thermoplastic resin, which is the base polymer of the hot melt adhesive used for bonding polyolefin materials, good adhesion can be obtained because the solubility parameters of both the adherend and the adhesive are close. Can be However, a hot melt adhesive using a thermoplastic polyolefin as a base polymer is inferior in heat resistance to a hot melt adhesive using another high softening point resin as a base polymer.

As a hot-melt adhesive having good heat resistance, there is a hot-melt adhesive having a polyamide resin as a base polymer. However, the solubility parameters of the polyamide resin and the polyolefin resin are far apart (the solubility parameter of polyamide is generally about 13, while that of polypropylene and polyethylene is about 8). Poor adhesion to polyolefin materials.

There are a number of documents describing hot melt adhesives, representative examples of which are JP-A-54-85235, JP-A-64-26688, and JP-A-4-87.
86, JP-A-7-138551, JP-A-7-138551
-150123.

JP-A-54-85235 discloses that a polyamide and a polyethylene-based polymer (polyethylene or ethylene-based copolymer) are crosslinked with a radical initiator, thereby improving the compatibility between the polyamide and the polyethylene-based polymer. Hot melt adhesives are described. Due to the use of crosslinking with a radical initiator, it is difficult to control the manufacturing process and conditions for this adhesive. In the invention of this publication, no compatibilizer is used, and this publication describes that it exhibits excellent adhesion performance to metal bonding, but mentions the adhesion of polyolefin adherends. It has not been.

JP-A-64-26688 discloses a polyolefin-based hot melt adhesive composition containing an atactic polypropylene as an adhesive component and a styrene-based thermoplastic elastomer contributing to improvement of impact resistance and the like. Have been. In addition, it describes that high shear stirring is performed by various known methods to make the adhesive seemingly uniform so as to overcome the poor compatibility of the two and sufficiently exhibit the properties of both components in the adhesive. This hot melt adhesive
The impact resistance and the like are improved by containing the styrene-based thermoplastic elastomer, but the heat resistance is not always satisfactory.

JP-A-4-8786 and JP-A-7-78
138551 discloses a moisture-reactive curable hot melt adhesive having good adhesion to polyolefins and excellent heat resistance. Basically, this type of adhesive
It has a characteristic that it does not exhibit its original performance unless it comes into contact with moisture, and therefore cannot be said to be necessarily suitable for bonding a polyolefin-based adherend that is not easily permeable to moisture.

JP-A-7-150123 describes a hot melt adhesive containing a copolymerized polyester resin, an ethylene-ethyl acrylate copolymer and a compatibilizer. This hot melt adhesive is intended to improve the adhesiveness of the polyester hot melt adhesive with heat resistance to the polyolefin resin adherend, and describes the use of a compatibilizer, Polyamide resins different from polyester resins, non-polar polyolefins different from polar ethylene-ethyl acrylate, and combinations of effective compatibilizers are not described. Further, even though the adhesion to the polyolefin resin adherent is improved, the polyester resin having essentially poor adhesion to the polyolefin-based adherend,
Hot-melt adhesives containing polar ethylene-acrylate do not have as good adhesion to polyolefin-based adherends as those employing polyolefin as the base polymer. Further, the heat resistance of the adhesive in which the polyester resin is blended with the polyolefin copolymer is still insufficient when compared with the heat resistance of the adhesive in which the polyamide resin is blended.

[0014]

As described above, not only does the polyolefin-based material exhibit good adhesiveness to the adherend, but also the adhesiveness is improved from room temperature of about 25 ° C. to high temperature (8 ° C.).
A high heat-resistant hot-melt adhesive that can be secured over a temperature range of about 0 ° C.) has not been available. Accordingly, an object of the present invention is to provide a new type of hot-melt adhesive composition having both good adhesion to a polyolefin material and high heat resistance.

More specifically, the present invention provides the following properties as an index of adhesiveness: tensile shear adhesive strength (JIS K 6850) 1.5 MPa or more 180 ° peel adhesive strength (JIS K 6854) 0 kN / m or more, and as an index of heat resistance, a load heat resistance temperature (JIS
(Measured in accordance with K 6833) of more than 80 ° C., in particular more than 100 ° C., for the purpose of providing a polyolefin-based hot melt adhesive composition.

Here, the reason why the load heat resistance temperature as an index of heat resistance is set to 80 ° C. or higher is because a general test method for adhesives for the automobile industry, which is one of the large consumers of hot melt adhesives. In the prescribed JIS K 6829, the test conditions for the “high temperature” adhesive strength and the “heat aging” adhesive strength are 80.
This is based on the fact that the temperature is set to ± 2 ° C. and that the maximum load heat resistance of the ordinary olefin-based hot melt adhesive is about 80 ° C.

[0017]

The hot melt adhesive composition of the present invention comprises (1) a polyolefin hot melt adhesive having a thermoplastic polyolefin or an olefin thermoplastic elastomer as a base polymer, and (2) a polyamide resin. And (3) a compatibilizer therefor.

The polyolefin-based hot melt adhesive of the component (1) in the hot melt adhesive composition of the present invention can contain one or both of a tackifier and a wax, if necessary.

Preferably, the hot melt adhesive composition of the present invention comprises 1 to 200 parts by weight of the polyamide resin of the component (2) per 100 parts by weight of the polyolefin hot melt adhesive of the component (1). (3) 1 compatibilizer
-100 parts by weight.

Preferably, the compatibilizer of component (3) is an acid-modified polyolefin resin. More preferably, the hot melt adhesive composition of the present invention comprises the component (3)
Polyetheramine as an auxiliary agent for the compatibilizer.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The hot melt adhesive composition of the present invention is obtained by adding a polyamide resin to a polyolefin hot melt adhesive having a thermoplastic polyolefin or a thermoplastic olefin elastomer as a base polymer,
Both are poorly compatible with each other by the action of a compatibilizer for them, so-called "sea-island structure", and are thus compatible with each other to ensure good compatibility with the polyolefin material. It is intended to exhibit both adhesiveness and high heat resistance. In the composition compatible with this sea-island structure, the polyolefin-based adhesive corresponds to the “sea” portion, and the polyamide-based resin corresponds to the “island” portion.

The hot melt adhesive used in the hot melt adhesive composition of the present invention is a polyolefin hot melt adhesive having a thermoplastic polyolefin or an olefin thermoplastic elastomer as a base polymer,
If necessary, one or both of a tackifier and a wax can be included.

The thermoplastic polyolefin or the thermoplastic olefin-based elastomer of the base polymer which can be used in the present invention includes amorphous polyolefin, amorphous poly-α-olefin (propylene homopolymer, ethylene-propylene copolymer, 1-butene). -Propylene copolymer), ethylene-propylene copolymer (EPM), ethylene-propylene-diene (EPD)
M) copolymers and the like. Those in which a functional group is partially grafted to these polymers can also be used. As the base polymer, an amorphous polyolefin or an amorphous poly-α-olefin, which is known to exhibit good adhesive performance among the base polymers of a hot melt adhesive for bonding a polyolefin, is particularly preferred. A mixture of two or more thermoplastic polyolefins or thermoplastic olefin-based elastomers may be used as the base polymer.

Specific examples of the thermoplastic polyolefin or thermoplastic olefin-based elastomer include Eastflex (amorphous polyolefin-based) manufactured by Eastman Chemical Co., Ltd., and Ubetac (amorphous poly-α-olefin-based manufactured by Ube Industries). ), Bestplast (amorphous poly-α-olefin system) manufactured by Huls, Thermolan (EPM / EPDM system) manufactured by Mitsubishi Chemical Corporation, Idemitsu TPO (EPM / EPDM system) manufactured by Idemitsu Petrochemical Company, Mitsui Chemicals Admer (modified polyolefin type) manufactured by the company.

The hot melt adhesive used in the present invention may contain a tackifier in addition to the base polymer.
The tackifier may not necessarily be used when the base polymer exhibits appropriate tackiness.

As the tackifier, any known tackifier resin that can be used for a hot melt adhesive can be used. Examples of tackifiers that can be used include hydrocarbon-based petroleum resins, terpene resins, modified terpene resins, alkylphenol-based resins, rosins, rosin derivatives, coumarone indene resins, and styrene resins. Among them, hydrocarbon petroleum resins are particularly preferred tackifiers. The reason is that the hydrocarbon-based petroleum resin has a good compatibility of the base polymer with the thermoplastic polyolefin or the thermoplastic olefin-based elastomer, and by adding this, the adhesion of the adhesive composition to the polyolefin-based material can be more improved. Because you can. Representative examples of the hydrocarbon-based petroleum resin tackifiers include Alcon manufactured by Arakawa Chemical Co., Ltd. and Rigalite manufactured by Hercules. It is also possible to use mixtures of two or more tackifiers.

The hot melt adhesive used in the present invention is effective for lowering the melt viscosity of the adhesive and improving its coatability, and also has other physical properties (eg, hardness and softening point) of the adhesive. , Hot-tack property, etc.).

As the wax, any known wax that can be used for a hot melt adhesive can be used. Examples of waxes that can be used include low molecular weight polyethylene, low molecular weight polypropylene, Fischer-Tropsch wax, microcrystalline wax, paraffin wax and the like. Among them, Fischer-Tropsch wax is particularly preferable because it has good compatibility with thermoplastic polyolefins or thermoplastic olefin-based elastomers and can easily adjust the melt viscosity of the adhesive. A typical example of Fischer-Tropsch wax is the Sasol H series manufactured by Sasol. It is also possible to use mixtures of two or more waxes.

As described above, the hot melt adhesive used in the present invention may be composed of only a base polymer, or may contain one or both of a tackifier and a wax in addition to the base polymer. The hot melt adhesive used in the present invention has a base polymer thermoplastic polyolefin or olefinic thermoplastic elastomer of 10 to 100% by weight, a tackifier of 0 to 60% by weight, and a wax of 0 to 40% by weight. Can be included. When the base polymer content is less than 10% by weight, a hot melt adhesive mainly composed of a thermoplastic polyolefin or an olefin-based thermoplastic elastomer is used.
It may not be possible to form the "sea" part of the "sea-island structure". When the content of the tackifier exceeds 60% by weight, the ratio of the tackifier in the composition increases, so that the original cohesive force of the polyolefin as the main component cannot be obtained. If the wax content exceeds 40% by weight, the original adhesion of the hot melt adhesive composition may be hindered.

The polyamide resin which is added to the hot melt adhesive composition of the present invention and contributes to the improvement of the heat resistance thereof is as follows:
Generally, it comprises a polycondensate of a dibasic acid such as adipic acid, sebacic acid or dimer acid with a diamine such as ethylenediamine or hexamethylenediamine, or a ring-opening polymer of a lactam such as ε-caprolactam. Among them, a polycondensate of a polymerized fatty acid, an alkylenedicarboxylic acid, and an alkylenediamine is particularly preferable because it generally shows good adhesive performance and physical properties as a hot melt adhesive.
Typical examples of this type of polycondensate polyamide resin are:
Sanmide manufactured by Sanwa Chemical Co., Ltd., and UNILETS manufactured by Union Camp. In addition, usable polyamide-based resins include Macromelt manufactured by Henkel and Azamide manufactured by Shellex Chemical. Polyether polyamides such as Pebax manufactured by Atochem and TEPA manufactured by Tosoh can also be used. It is also possible to use a mixture of two or more polyamide resins.

The amount of the polyamide resin in the hot melt adhesive composition of the present invention is selected so as to improve the heat resistance of the adhesive without impairing the adhesion of the polyolefin material to the adherend. It is generally 1 to 200 parts by weight based on 100 parts by weight of the hot melt adhesive. If the amount is less than 1 part by weight, the polyamide resin cannot be sufficiently dispersed in the entire composition, and the intended effect of improving heat resistance cannot be obtained. If the amount exceeds 200 parts by weight, the phase inversion (“sea” hot melt adhesive and “island” in “sea-island structure”)
(The phenomenon that the relationship between the polyamide-based resins in the portions is reversed) tends to occur, and good adhesion of the polyolefin material to the adherend cannot be obtained. More preferably, the compounding amount of the polyamide resin is 5 to 150 parts by weight, most preferably 15 to 150 parts by weight, based on 100 parts by weight of the polyolefin hot melt adhesive.

In the hot melt adhesive composition of the present invention,
A compatibilizer for increasing the compatibility between the thermoplastic polyolefin or olefin-based thermoplastic elastomer of the base polymer and the polyamide-based resin for improving heat resistance is used.
Suitable compatibilizers include polyolefin resins modified with carboxylic compounds, such as maleic acid or itaconic acid, or maleic anhydride or itaconic anhydride. Above all, a polyolefin resin modified with maleic anhydride is particularly preferred, since the effect of improving the compatibility of both the polyolefin base polymer and the polyamide resin is good. Representative examples of the maleic anhydride-modified polyolefin resin include Eumex manufactured by Sanyo Chemical Industries, Ltd. and AC polyethylene manufactured by Allied Signal. Other acid-modified polyolefin resins that can be used as a compatibilizer include, for example, Epolene manufactured by Eastman Chemical Company.
Mixtures of two or more compatibilizers can also be used.

The amount of the compatibilizer to be used is selected so as to improve the dispersion state of the polyamide resin in the polyolefin-based hot melt adhesive, and is generally selected based on 100 parts by weight of the polyolefin-based hot melt adhesive. Is 1 to 1
00 parts by weight. If the amount is less than 1 part by weight, the dispersion of the polyamide-based resin becomes insufficient, and phase separation easily occurs.
If it exceeds 100 parts by weight, the proportion of the compatibilizer in the total amount of the composition becomes large, and the adhesiveness of the adhesive composition to the polyolefin adherend and the heat resistance may be adversely affected. More preferably, the compounding amount of the compatibilizer is 1 to 100 parts by weight of the polyolefin-based hot melt adhesive.
50 parts by weight, most preferably 10 to 20 parts by weight.

In the hot melt adhesive composition of the present invention,
Auxiliaries may be used to enhance the compatibility effect of the compatibilizer. Suitable auxiliaries include polyetheramines. Examples of the polyetheramine include Jeffamine M-2070 manufactured by Huntsman. When the polyamide resin used is a copolymer, for example, a polyether polyamide, by using polyetheramine as an auxiliary agent, the compatibility between the polyolefin base polymer and the polyether portion in the polyether polyamide is further improved. Can be.

The amount of the auxiliary agent for the compatibilizer is from 0.01 to 1 when the amount of the compatibilizer is 1. This is because in this range, the effect of improving the compatibility of the compatibilizer can be enhanced, and the improved physical properties of the adhesive composition are not adversely affected. If it is less than 0.01, the effect as an auxiliary agent becomes thin, and improvement in compatibility cannot be expected.
If it exceeds 1, the adhesiveness to the polyolefin adherend and the heat resistance may be adversely affected. The amount of the auxiliary agent is preferably 0.1 to 0.
8, most preferably 0.2 to 0.5.

The hot-melt adhesive composition of the present invention contains an antioxidant and an antioxidant to such an extent that the original performance is not impaired in practical use.
Contains additives such as stabilizers, plasticizers, fillers, pigments, thermoplastics, thermally conductive particles and fibers, electrically conductive particles and fibers, glass microspheres, expandable and expanded plastic microspheres, and thermoplastic elastomers May be.

As an example, the hot-melt adhesive composition of the present invention can be used in all cases including the case where the polyolefin-based hot-melt adhesive of the component (1) contains one or both of a tackifier and a wax in addition to the base polymer. Ingredient (1) ~
It can be prepared by combining (3), melting, and substantially uniformly dispersing the polyamide resin of the component (2) in the polyolefin hot melt adhesive of the component (1). When the polyolefin-based hot-melt adhesive of the component (1) contains one or both of a tackifier and a wax in addition to the base polymer, they are first combined together and melted to form a homogeneous mixture (hot-melt adhesive). ), The polyamide resin of the component (2) and the compatibilizer of the component (3) are further added to the mixture, and the mixture is melted to substantially uniformly disperse the polyamide resin in the hot melt adhesive. It can also be prepared by dispersing. When the hot melt adhesive (1) contains one or both of a tackifier and a wax, the latter method is preferred in that the hot melt adhesive (1) and the polyamide resin (2) have a sea-island structure. This is preferable because it is easier to form.

In order to add the above-mentioned additives to the hot melt adhesive composition, the components may be mixed together with the components (1) to (3), and the component (1) may be prepared in advance. It may be added later when the remaining components (2) and (3) are added.

The hot melt adhesive composition of the present invention is applied to an adherend using various types of applicators, such as a nozzle type, a roll type, and a blade type, in the same manner as a normal hot melt adhesive composition. Can be provided. For example, the hot melt adhesive composition of the present invention is used in the form of a rod or slag when used for hand tools. Needless to say, the applicators and the method of applying them are well known to both hot melt adhesive suppliers and users. In addition, the hot melt adhesive composition of the present invention may be supplied as a heat activated film at the time of use.

[0040]

Next, the present invention will be described in more detail by way of examples.

Examples 1 to 5, Comparative Example 1 A hot melt adhesive composition was prepared according to the formulation shown in Table 1.
For this preparation, a 500 ml metal container and a mixer were used. Each component was put into a metal container so that the total blended amount was 200 g, and was sufficiently melted by a heater set at 200 ° C. Thereafter, the mixture was stirred with a mixer until the composition became uniform. Mixer rotation speed is up to 1000r
pm. After sufficiently stirring, the molten composition was taken out and cooled and solidified at room temperature. In preparing the compositions of Examples 1 to 5, a polyolefin-based hot melt adhesive having the composition shown above the dotted line in the table was first prepared, and then this adhesive was prepared below the dotted line in the table. The indicated polyamide resin, tackifier and, if necessary, polyetheramine were added.

With respect to the samples of each of the prepared examples, the tensile shear adhesive strength, the 180 ° peel adhesive strength, and the heat resistance under load were evaluated as follows.

1. Tensile shear bond strength In accordance with JIS K 6850 (test method for tensile shear bond strength of adhesive), evaluation was performed under the following conditions. Substrate: Polypropylene (Mitsubishi Chemical's Noblen M
H-8, 2 × 25 × 100 mm) Tensile speed: 50 mm / min

2.180 ° Peeling Adhesive Strength In accordance with JIS K 6854 (Testing method for peeling adhesive strength of adhesive), evaluation was made under the following conditions. Substrate: Polypropylene (Mitsubishi Chemical's Noblen M
H-8, 2 × 25 × 100 mm) # 16 metal mesh (25 × 200 mm) Pulling speed: 50 mm / min

3. Heat resistance under load In accordance with JIS K 6833 (general test method for adhesives), evaluation was performed under the following conditions. Adhering material: Birch wood (5 × 25 × 50 mm) Adhesive area: 25 × 25 mm Load: 1 kg Procedure: A shear-type test piece is prepared under the above conditions, and a weight with the above load is attached and hung in an oven. 3 as it is
After holding at 8 ° C. for 15 minutes, the temperature of the oven is increased at a rate of temperature increase of 2 ° C./5 minutes, and the temperature at which the weight falls off is measured.

Table 2 shows the evaluation results.

[0047]

[Table 1]

[0048]

[Table 2]

From the results in Table 2, it can be seen that when a polyamide resin is mixed with a polyolefin hot melt adhesive using a compatibilizer, the heat resistance is greatly reduced (at least about 30) without impairing the adhesion to the polyolefin adherend. (° C. or more).

[Examples 6 and 7, Reference Example and Comparative Example 2,
3] Azamide amide 226 manufactured by Shellex Chemical Co., Ltd. as polyamide resin (PA) in 100 parts by weight of the same hot melt adhesive as used in Examples 1 to 5.
1, and 25 parts by weight of Umex 1010 manufactured by Sanyo Chemical Industries, Ltd. were blended as a compatibilizer to prepare a hot melt adhesive composition. The polyamide resin accounts for 25% by weight of the composition (about 41.7 parts by weight per 100 parts by weight of the hot melt adhesive (Example 6)),
50% by weight (1 per 100 parts by weight of hot melt adhesive)
25 parts by weight (Example 7)) and 75 parts by weight (375 parts by weight with respect to 100 parts by weight of hot melt adhesive (Reference Example)). Further, compositions having a polyamide resin content of 0% by weight (Comparative Example 2) and 100% by weight (Comparative Example 3) were also prepared. The samples of each example were evaluated in the same manner as described above, and the results as shown in FIGS. 1 to 3 and Table 3 were obtained.

[0051]

[Table 3]

The hot-melt adhesive compositions of Examples 1 to 7 have the following properties, which are the indices of the adhesiveness and heat resistance set as the goals of the present invention: tensile shear adhesive strength (JIS K 6850) 5 MPa or more 180 ° peel adhesion strength (JIS K 6854) 4.0 kN / m or more It can be seen that both satisfy the load heat resistance temperature (JIS K 6833)> 80 ° C.

[0053]

As described above, according to the present invention, it is possible to provide a hot melt adhesive composition having both good adhesiveness to a polyolefin material and high heat resistance.

[Brief description of the drawings]

FIG. 1 is a graph in which the results of tensile shear bond strength obtained in Examples 5 to 7 are plotted against polyamide content.

FIG. 2 is a graph in which the results of 180 ° peel adhesion obtained in Examples 5 to 7 are plotted against polyamide content.

FIG. 3 is a graph in which the load heat resistance temperatures obtained in Examples 5 to 7 are plotted against polyamide content.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J040 BA182 BA202 DA001 DA002 DA012 DA022 DA101 DA111 DA112 DA121 DA122 DA131 DA132 DA151 DA152 DA162 DB032 DK012 DL041 DL042 DN032 DN072 EB072 EG012 EG022 EL012 GA12 HB02 JA08 JA09 JB01 KA11 LA06 MA08

Claims (5)

[Claims] 1. A polyolefin-based hot melt adhesive having a thermoplastic polyolefin or an olefin-based thermoplastic elastomer as a base polymer, (2) a polyamide-based resin, and (3) a compatibilizer therefor. A hot melt adhesive composition comprising: 2. The hot melt adhesive composition according to claim 1, wherein the polyolefin hot melt adhesive of the component (1) further contains one or both of a tackifier and a wax. 3. A polyolefin hot melt adhesive of component (1) is used in an amount of 1 to 200 parts by weight of a polyamide resin of component (2) and 1 to 100 parts by weight of a compatibilizer of component (3) per 100 parts by weight of the hot melt adhesive. The hot melt adhesive composition according to claim 1, comprising: 4. The hot melt adhesive composition according to claim 1, wherein the compatibilizer of the component (3) is an acid-modified polyolefin resin. 5. The hot melt adhesive composition according to claim 1, further comprising a polyetheramine as an auxiliary of the compatibilizer of the component (3).