CN114347366A - Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) - Google Patents
Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) Download PDFInfo
- Publication number
- CN114347366A CN114347366A CN202111643884.9A CN202111643884A CN114347366A CN 114347366 A CN114347366 A CN 114347366A CN 202111643884 A CN202111643884 A CN 202111643884A CN 114347366 A CN114347366 A CN 114347366A
- Authority
- CN
- China
- Prior art keywords
- circuit
- outgoing line
- ink
- printed
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000001746 injection moulding Methods 0.000 title claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 239000004332 silver Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 11
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 abstract 2
- -1 polyethylene terephthalate Polymers 0.000 abstract 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 2
- 238000002372 labelling Methods 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a method for protecting the injection molding outgoing line position of a flexible switch in IMC (in-mold labeling), wherein a circuit silver paste is high-tensile silver paste, because the position of a circuit outgoing line port is stretched by a silver paste carrier PET (polyethylene terephthalate), the circuit breaking phenomenon can occur after the high-tensile conventional silver paste is subjected to high-tensile, solvent-based ink is used as insulating ink at the position of the circuit outgoing line port, the thickness of the insulating ink is printed at 10-15U, a layer of glue is printed after the insulating printing is finished, the glue needs to be larger than the single side 2MM of the circuit outgoing line port in length, a layer of PP (polypropylene) protective film is pasted at the position of the glue after the printing is finished, other related ink is printed after the pasting is finished, the position of the circuit outgoing line port cannot be crushed by a mold under the condition of normal injection molding, and the circuit cannot be crushed by improving the thickness and toughness of the insulating ink and adding a layer of protective film when the mold is closed; the product yield is improved, the signal to noise ratio is increased after the circuit is injected, the touch sensitivity is better, a touch film laminating process is not used, the use of raw materials is reduced, and the environmental pollution is reduced.
Description
The technical field is as follows:
the invention belongs to the technical field and particularly relates to a method for protecting an injection molding outgoing line position of a flexible switch in an IMC (in-molded capacitive touch panel).
Background art:
in the modern times, people have improved appearance requirements, the process of combining IMC film interior decoration and flexible electronic circuits is developed, the flexible circuits are directly printed on the back of an IMD decoration sheet, and then the flexible circuits are directly injected with plastic parts.
The invention content is as follows:
the invention aims to solve the problems and provide a method for protecting the injection molding line-out position of a flexible switch in an IMC.
In order to solve the above problems, the present invention provides a technical solution:
the protection method for the injection molding outgoing line position of the flexible switch in the IMC comprises the following steps:
t1, circuit silver thick liquid adopt high tensile silver thick liquid, because there is the drawing of silver thick liquid carrier PET at the position of circuit outlet, the phenomenon of opening circuit can appear after conventional silver thick liquid is high tensile.
T2, use solvent-based ink at the position insulating ink of circuit outlet, thickness printing is in 10-15U, this department is the circuit outlet position, crowd the circuit in the time of moulding plastics easiest, print a layer glue after insulating printing is accomplished, glue needs to be greater than the unilateral 2MM of circuit outlet in the aspect of length, paste one deck PP protection film in the glue position after the printing is accomplished, print other relevant printing ink after the laminating is accomplished, this technology is because there is insulating ink and the double-deck protection of PP protection film when moulding plastics, metal material on the mould has a stroke buffering with silver thick liquid when the mould compound die, better protection the circuit.
The invention has the beneficial effects that: the invention mainly protects the position of a line outlet in the IMC process from being crushed by a mold under the condition of normal injection molding, and the line can not be crushed when the mold is closed by improving the thickness and the toughness of the insulating ink and adding a layer of protective film; the product yield is improved, the signal to noise ratio is increased after the circuit is injected, the touch sensitivity is better, a touch film laminating process is not used, the use of raw materials is reduced, and the environmental pollution is reduced.
The specific implementation mode is as follows:
the specific implementation mode adopts the following technical scheme: in the method for protecting the injection molding outgoing line position of the flexible switch in the IMC, high-tensile silver paste is adopted as circuit silver paste, because the PET of the silver paste carrier is stretched at the position of the line outlet, the conventional silver paste has an open circuit phenomenon after high stretching, the insulating ink at the position of the line outlet is solvent-based ink, the thickness of the insulating ink is printed in 10-15U, which is the position of the line outlet, the circuit is most easily damaged by squeezing during injection molding, a layer of glue is printed after the insulation printing is finished, the length of the glue is required to be larger than the single side of a line outlet by 2MM, a layer of PP protective film is pasted at the glue position after the printing is finished, and other related printing ink is printed after the pasting is finished, when the die is closed, the metal material and the silver paste on the die can buffer each stroke, so that the circuit is protected better.
While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (1)
- The method for protecting the injection molding outgoing line position of the flexible switch in the IMC is characterized by comprising the following steps of:t1, circuit silver thick liquid adopt high tensile silver thick liquid, because there is the drawing of silver thick liquid carrier PET at the position of circuit outlet, the phenomenon of opening circuit can appear after conventional silver thick liquid is high tensile.T2, solvent type ink is used for the insulating ink at the position of the line outlet, the thickness of the insulating ink is printed in a range of 10-15U, a layer of glue is printed after the insulating printing is finished, the glue needs to be larger than the single side 2MM of the line outlet in length, a layer of PP protective film is pasted at the position of the glue after the printing is finished, and other related ink is printed after the pasting is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111643884.9A CN114347366A (en) | 2021-12-29 | 2021-12-29 | Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111643884.9A CN114347366A (en) | 2021-12-29 | 2021-12-29 | Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114347366A true CN114347366A (en) | 2022-04-15 |
Family
ID=81104026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111643884.9A Pending CN114347366A (en) | 2021-12-29 | 2021-12-29 | Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114347366A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590360U (en) * | 2009-12-31 | 2010-09-22 | 广东德怡电子科技有限公司 | Moistureproof membrane switch |
| CN206193720U (en) * | 2016-08-19 | 2017-05-24 | 蓝思科技（长沙）有限公司 | Touch screen that can unify and make |
| CN111923323A (en) * | 2020-06-23 | 2020-11-13 | 苏州斯普兰蒂电子有限公司 | Preparation process of in-mold injection product with built-in LED lamp circuit |
| CN112201508A (en) * | 2020-10-29 | 2021-01-08 | 捷讯精密橡胶（苏州）有限公司 | Light and thin flexible circuit board |
-
2021
- 2021-12-29 CN CN202111643884.9A patent/CN114347366A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590360U (en) * | 2009-12-31 | 2010-09-22 | 广东德怡电子科技有限公司 | Moistureproof membrane switch |
| CN206193720U (en) * | 2016-08-19 | 2017-05-24 | 蓝思科技（长沙）有限公司 | Touch screen that can unify and make |
| CN111923323A (en) * | 2020-06-23 | 2020-11-13 | 苏州斯普兰蒂电子有限公司 | Preparation process of in-mold injection product with built-in LED lamp circuit |
| CN112201508A (en) * | 2020-10-29 | 2021-01-08 | 捷讯精密橡胶（苏州）有限公司 | Light and thin flexible circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5849419A (en) | Uniaxially oriented label film with compatibilizer | |
| US20070170621A1 (en) | Cover and method for manufacturing the same | |
| US20170320292A1 (en) | Plastic Laminate Structure and Touch Sensing Device Having the Same | |
| CN102700053B (en) | In-mold labeling process | |
| EP1291164A4 (en) | Transfer foil having low-reflection layer and production method for molded product using this | |
| CN210174337U (en) | Scratch-proof transparent film, scratch-proof surface product and scratch-proof composite sheet | |
| US8241456B2 (en) | Method for producing electric-wave-transmissible transferring member | |
| CN102034625A (en) | Key manufacturing method and key manufactured by same | |
| US20110079933A1 (en) | Imd/imr transfer pattern method | |
| CN101439603A (en) | Label for in-mold labeling and article with the label | |
| CN114347366A (en) | Protection method for injection molding outgoing line position of flexible switch in IMC (in-molded Circuit) | |
| CN101396858A (en) | Decoration ejection molding method in mold | |
| CN201179712Y (en) | Dual-color dual-material jet apparatus | |
| US20110117326A1 (en) | Three-dimensional print film structure | |
| JP2011003517A (en) | Method for manufacturing molding with electrostatic capacity switch | |
| CN109868081B (en) | High-temperature-resistant low-shrinkage protective film | |
| CN214266941U (en) | Scratch-resistant environment-friendly biaxially oriented polyolefin heat shrinkable film | |
| JP4287245B2 (en) | Sandwich injection molding method | |
| JPH0490204A (en) | Manufacture of parabolic antenna | |
| JP2005262872A (en) | Mold for in-mold-decorating both faces and method for manufacturing in-mold decorated molded object with both faces decorated | |
| JPH07299840A (en) | Production of thin-walled molded product | |
| CN221022152U (en) | Mold gate structure for solving film sticking shift | |
| JP2000238070A (en) | Method for producing in-mold decorating molding sheet and in-mold decorated molded article | |
| CN103568199A (en) | Processing process of non-print in-mold insert injection products | |
| CN220627070U (en) | Anti-counterfeiting in-mold label with radio frequency function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220415 |
|
| RJ01 | Rejection of invention patent application after publication |