JP2011003517A - Method for manufacturing molding with electrostatic capacity switch - Google Patents

Method for manufacturing molding with electrostatic capacity switch Download PDF

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JP2011003517A
JP2011003517A JP2009164218A JP2009164218A JP2011003517A JP 2011003517 A JP2011003517 A JP 2011003517A JP 2009164218 A JP2009164218 A JP 2009164218A JP 2009164218 A JP2009164218 A JP 2009164218A JP 2011003517 A JP2011003517 A JP 2011003517A
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sheet
resin
molding
mold
molded product
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Hitoshi Fukumoto
仁司 福本
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Toyo Label KK
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PROBLEM TO BE SOLVED: To obtain an electrostatic capacity touch switch excellent in design without disconnection etc. by setting an electrostatic capacity touch sensor and a design sheet in an injection molding die and performing simultaneous molding, or to manufacture an electrostatic capacity touch sensor, by performing simultaneous molding of an electrostatic capacity touch sensor as a molding formed by injection molding and a preheated design sheet with an adhesive by means of vacuum molding and then cutting an unnecessary part to obtain an electrostatic capacity switch panel with a design sheet as a molding.SOLUTION: A method for manufacturing the molding with an electrostatic capacity switch includes the steps of: separating a design sheet 1 from a sensor sheet 2 including a conductive ink layer printed thereon, setting the design sheet 1 to a cavity die 11, setting the sensor sheet 2 including the conductive ink layer printed thereon to a core die 12, and introducing a resin 10 to cool and solidify; and opening the die to take out a molding with an electrostatic capacity switch.

Description

発明が属する技術分野Technical field to which the invention belongs

本発明は静電容量スイッチ付き成型品の製造方法に関する。    The present invention relates to a method for manufacturing a molded article with a capacitance switch.

従来技術Conventional technology

従来、家電製品、音響機器、自動車のカーナビゲーションなどの表示パネルやキーボタンなどに用いられるスイッチの一つに静電容量スイッチがある。これまでの成型品スイッチは単に成型品に接着剤等でセンサースイッチフィルムを貼り付けるもので、試作で行われているものも導電インキ層の上に意匠を印刷した一枚ものシートをインサート成型したものである。  2. Description of the Related Art Conventionally, a capacitance switch is one of switches used for display panels and key buttons for home appliances, audio equipment, car car navigation, and the like. The conventional molded product switch is simply a sensor switch film attached to the molded product with an adhesive or the like, and even what is being prototyped is insert molded with a sheet of design printed on the conductive ink layer Is.

しかし単に成型品にセンサーシートを貼り付ける方法では温度とか湿度の厳しい環境で使用する場合、センサーシートが波打ったり、剥がれたりする心配があり、性能的に問題があり、又、意匠シートに直接導電インキを印刷する場合導電インキ層の厚さが下地の凹凸によって一部薄くなったりして、断線の危険がある場合もあり、安全なセンサーシート付き成型品とはならなかった。  However, if the sensor sheet is simply pasted on the molded product, the sensor sheet may be wavy or peeled off when used in an environment with severe temperature and humidity. When printing conductive ink, the thickness of the conductive ink layer may be partially thinned due to the unevenness of the base, and there may be a risk of disconnection, so that it was not a safe molded product with a sensor sheet.

本発明はインサート成型に使用しても静電容量スイッチ機能得るための静電容量スイッチ付き成型品の製造方法を提供することを目的とする。  An object of this invention is to provide the manufacturing method of the molded article with a capacitance switch for obtaining a capacitance switch function even if it uses it for insert molding.

本発明は前記目的を達成するため、以下のような特徴を有する。  In order to achieve the above object, the present invention has the following features.

意匠シート１と導電インキ層を印刷したセンサーシート２を分け、意匠シートをキャビティ金型１１にセットし、導電インキ層を印刷したセンサーシートをコア金型１２にセットして樹脂１０を流し込んで冷却固化する工程と、型開きして静電容量スイッチ付き成型品を取り出す工程とを備えた静電容量スイッチ付き成型品の製造方法を提供するものである。  The design sheet 1 and the sensor sheet 2 printed with the conductive ink layer are separated, the design sheet is set in the cavity mold 11, the sensor sheet printed with the conductive ink layer is set in the core mold 12, and the resin 10 is poured and cooled. The present invention provides a method for producing a molded article with a capacitance switch, comprising a step of solidifying and a step of opening the mold and taking out a molded article with a capacitance switch.

又は、導電性インキ層を形成したセンサーシート２の印刷面に接着剤を塗布し、該接着層６に樹脂が接するようにコア金型１２にセットする工程と、型閉じして金型内に成型樹脂１０を流し込み、冷却固化する工程と、型開きして静電容量スイッチ付き成型品を取り出す行程と、一方図３に示すように、印刷した意匠シート１に接着剤を塗布し、プレヒートした該意匠シート１と、該センサーシート付き成型品とを真空成型機で同時成型し、不要部分をカットして、意匠シート付き静電スイッチパネル成型品を形成する工程とを備えた製造方法を提供するものである。Alternatively, a step of applying an adhesive to the printing surface of the sensor sheet 2 on which the conductive ink layer is formed and setting the core mold 12 so that the resin is in contact with the adhesive layer 6 and closing the mold in the mold The step of pouring the molding resin 10 and cooling and solidifying, the step of opening the mold and taking out the molded product with the capacitance switch, and on the other hand, applying the adhesive to the printed design sheet 1 and preheating as shown in FIG. Providing a manufacturing method comprising the step of simultaneously molding the design sheet 1 and the molded product with the sensor sheet with a vacuum molding machine, cutting unnecessary portions, and forming an electrostatic switch panel molded product with the design sheet To do.

または、予め樹脂で成型品をインジェクション成型で製造する工程と、、該成型品に接着剤を塗布したセンサーシートを貼り付ける工程と、一方接着剤を塗布した意匠柄シートをプレヒートし、該プレヒートシートとセンサーシート付き成型品とを真空成型で同時に成型する工程と、不要部分をカットして意匠シート付き静電容量スイッチセンサーを形成する工程とを備えた製造方法を提供するものである。  Alternatively, a step of manufacturing a molded product with resin in advance by injection molding, a step of attaching a sensor sheet coated with an adhesive to the molded product, and a pre-heated design pattern sheet coated with an adhesive, the preheated sheet And a molded product with a sensor sheet are simultaneously formed by vacuum molding, and a manufacturing method is provided which includes a step of forming an electrostatic capacitance switch sensor with a design sheet by cutting unnecessary portions.

意匠シート及びセンサーシートの基材としては耐熱性のあるポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）、ポリエチレンナフタレート（ＰＥＮ）、ＡＢＳ樹脂（アクリロニトリル、ブタジエン、スチレンの共重合体）、ポリカーボネート（ＰＣ）、ポリサルフォン（ＰＳ）、塩化ビニル（ＰＣＢ）等が使用できる。  As base materials for design sheets and sensor sheets, heat-resistant polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), ABS resin (acrylonitrile, butadiene, styrene copolymer), polycarbonate ( PC), polysulfone (PS), vinyl chloride (PCB) and the like can be used.

意匠シートへの柄づけはスクリーン印刷で簡単にできるが、グラビア印刷、オフセット印刷等も利用できる。インキの材質はポリビニル系樹脂、ポリアミド樹脂、ポリエステル樹脂、アクリル樹脂、ポリウレタン樹脂、ポリビニルアセタール樹脂、ポリエステルウレタン樹脂、セルロースエステル樹脂、アルキッド樹脂などの樹脂をバインダーとし、適切な色の顔料、または染料を着色剤として含有する着色インキを用いるとよい。加飾層４の厚さとしては、１〜３０μｍが好ましい。  Design on the design sheet can be easily done by screen printing, but gravure printing, offset printing, etc. can also be used. The ink material is a resin such as polyvinyl resin, polyamide resin, polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin, and a suitable color pigment or dye. A color ink contained as a colorant may be used. As thickness of the decoration layer 4, 1-30 micrometers is preferable.

また、接着層６を必要に応じて形成してもよい。接着層６は基体シート３の導電性インキ層が形成された側の最表面に形成すればよい。
接着層６はインサート法により意匠シートとセンサーシートと成型樹脂との接着性を上げるための層である。成型樹脂１０の材質がポリアクリル系樹脂の場合は、接着層６の材質としてはポリアクリル系樹脂を用いるとよい。また、成型樹脂の材質がポリフェニレンオキシド・ポリスチレン樹脂、ポリカーボネート系樹脂、スチレン共重合体系樹脂、ポリスチレン系ブレンド樹脂、ポリアミド系樹脂の場合は、これらの樹脂と親和性のあるポリアクリル系樹脂、ポリスチレン系樹脂、ポリアミド系樹脂などを、接着層６の材質として使用すればよい。接着層６の形成方法としては、グラビアコート法、ロールコート法、コンマコート法などのコーティングや、グラビア印刷、スクリーン印刷法などを用いるとよい。
接着層６の乾燥膜厚は、１〜５μｍとするのが一般的である。Moreover, you may form the contact bonding layer 6 as needed. The adhesive layer 6 may be formed on the outermost surface of the base sheet 3 on the side where the conductive ink layer is formed.
The adhesive layer 6 is a layer for increasing the adhesion between the design sheet, the sensor sheet, and the molding resin by an insert method. When the material of the molding resin 10 is a polyacrylic resin, it is preferable to use a polyacrylic resin as the material of the adhesive layer 6. If the molding resin is polyphenylene oxide / polystyrene resin, polycarbonate resin, styrene copolymer resin, polystyrene blend resin, or polyamide resin, polyacrylic resin or polystyrene resin that has an affinity for these resins Resin, polyamide resin, or the like may be used as the material for the adhesive layer 6. As a method for forming the adhesive layer 6, it is preferable to use a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, or the like.
The dry film thickness of the adhesive layer 6 is generally 1 to 5 μm.

センサーシートは電極部に透明の導電インキを印刷するが、導電インキとしてＰＥＤＯＴ／ＰＳＳ（ポリエチレンジオキシチオフェン／ポリスチレンスルフォン酸）を含有するインキを使用するのが好ましい。
透明の窓部５にも電極を配置することができるからである。また、ＰＥＤＯＴ／ＰＳＳを含有するインキは抵抗値を低くできるので導電インキ層によって電極だけでなく、給電線９を形成することもできる。給電線は製品外部で露出するようにしても良い。給電線は銀ペーストなど抵抗値の低いが目に見えるものも使用できる。
導電性インキ層の厚さとしては、１〜５０μｍとするのが好ましい。厚さが１μｍに満たないと給電線の断線の恐れが生じ、５０μｍを超えると青みがかって透明性が悪くなってしまうからであるThe sensor sheet prints a transparent conductive ink on the electrode part, but it is preferable to use an ink containing PEDOT / PSS (polyethylenedioxythiophene / polystyrene sulfonic acid) as the conductive ink.
This is because electrodes can be arranged also in the transparent window portion 5. In addition, since the resistance value of the ink containing PEDOT / PSS can be lowered, not only the electrode but also the feeder 9 can be formed by the conductive ink layer. The power supply line may be exposed outside the product. The power supply line can be used with a low resistance value such as silver paste.
The thickness of the conductive ink layer is preferably 1 to 50 μm. If the thickness is less than 1 μm, there is a risk of disconnection of the power supply line, and if it exceeds 50 μm, it becomes bluish and the transparency becomes worse.

上記構成である静電容量センサー付き成型品を形成する方法を説明する。  A method of forming a molded article with a capacitance sensor having the above-described configuration will be described.

成型樹脂１０としては、例えばポリエチレン、ポリプロピレン等のポリオレフィン系樹脂、ポリスチレン系樹脂、ポリ塩化ビニル系樹脂、ポリ（メタ）アクリレート系樹脂、アクリル系樹脂、ポリアセタール樹脂、ポリエチレンテレフタレート、ポリブチレンテレフタレート等のポリエステル樹脂、ポリアミド樹脂、ポリカーボネート樹脂、ポリフェニレンサルファイド樹脂、ポリイミド樹脂等の公知の熱可塑性樹脂がいずれも使用できる。これらの樹脂は単独あるいは２種以上を混合して使用することも可能である。  Examples of the molding resin 10 include polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins, poly (meth) acrylate resins, acrylic resins, polyacetal resins, polyesters such as polyethylene terephthalate and polybutylene terephthalate. Any known thermoplastic resin such as resin, polyamide resin, polycarbonate resin, polyphenylene sulfide resin, and polyimide resin can be used. These resins can be used alone or in admixture of two or more.

インサート法によって静電容量スイッチ付き成型品を得るにはつぎのようにして行う。（図２参照）まず、意匠シートを柄の施されていない基体シート３の面がキャビティ金型１１に接するように、可動型と固定型とからなる樹脂成型用金型にセットし、次いで静電容量スイッチを形成するセンサーシートの導電インキを形成していない基体面をコア金型１２に接するようにセンサーシートをセットして、金型を閉じ、樹脂１０を流し込み、所定の圧力を加え、その後、冷却固化して型開きして成型品を取り出す。  In order to obtain a molded article with a capacitance switch by the insert method, it is performed as follows. (See FIG. 2) First, the design sheet is set in a resin molding die composed of a movable die and a fixed die so that the surface of the substrate sheet 3 on which the pattern is not applied is in contact with the cavity die 11, and then statically static. Set the sensor sheet so that the surface of the sensor sheet that forms the capacitance switch is not in contact with the core mold 12, close the mold, pour the resin 10, apply a predetermined pressure, Thereafter, it is cooled and solidified, and the mold is opened to take out the molded product.

または、図２に示すようにインサート法によって静電容量センサーシートを同様にして導電インキを形成していない基体面３をコア金型１２に接するようにセットし、キャビティ金型１１により型閉じし、樹脂１０を流し込み、所定の圧力を加えた後、冷却固化し、型開きしてタッチセンサー付き成型品をとりだす。一方図３に示すように、接着剤付き意匠シート１をプレヒートし、そこにタッチセンサー付き成型品と合わせて真空成型機で成型し、タッチセンサー付き成型品１３を取り出し、不要部分をカットし、意匠シート付き静電容量スイッチパネル成型品１４を形成する。  Alternatively, as shown in FIG. 2, the capacitance sensor sheet is similarly set by the insert method so that the base surface 3 on which the conductive ink is not formed is in contact with the core mold 12 and the mold is closed by the cavity mold 11. Then, after pouring the resin 10 and applying a predetermined pressure, it is cooled and solidified, and the mold is opened to take out a molded product with a touch sensor. On the other hand, as shown in FIG. 3, the design sheet 1 with adhesive is preheated, and then molded with a molded product with a touch sensor and molded with a vacuum molding machine, the molded product 13 with a touch sensor is taken out, and unnecessary portions are cut, A capacitance switch panel molded product 14 with a design sheet is formed.

基体シートに意匠柄を印刷し、その上に導電インキ層を積層させた１枚のセンサーシート面に樹脂を流し込んで一体成型する静電容量スイッチ付き成型品の製造が試みられている。本発明は導電性インキ層を形成したセンサーシートと意匠付き加飾シートをそれぞれ別個の工程で作成してから、樹脂を流し込んで一体成型する静電容量スイッチ付き成型品のため、それぞれのシートの作成段階で不良発生の検査ができる。一枚のセンサーシート面に意匠柄の印刷と導電性インキ層を形成する場合は、重なり合った両層を同時に検査しなければならず、検査が複雑になるのに対し、導電性インキ層を形成したセンサーシートと意匠付き加飾シートをそれぞれ別個の工程で作成する本シートの検査は個別に行えるため、検査が単純に、容易に行える効果がある。さらに一枚のセンサーシート面に意匠柄の印刷と導電性インキ層を形成する場合はいずれか一方に欠陥があれば、シート全体が不良品になるのに対し、意匠柄の印刷と導電性インキ層をそれぞれ別個に作成したシートでは、一方に欠陥があれば片方のみが不良となり他方は良品となり、成型品の不良率の低減効果がり、工業生産におけるコスト面でも有利となる。
また、電極の上に直接凹凸面のキャビティ金型が押し付けられるので細い電極線の場合は断線の恐れもあり、二層にすることにより、センサーシートはコア金型に固定されるので断線がし難いと考えられるし、予めAttempts have been made to produce a molded product with a capacitance switch in which a design pattern is printed on a base sheet and a resin sheet is poured onto the surface of a single sensor sheet to integrally mold the resin sheet. The present invention is a molded product with a capacitance switch in which a sensor sheet on which a conductive ink layer is formed and a decorative sheet with a design are prepared in separate steps, and then poured into a resin and integrally molded. It is possible to inspect the occurrence of defects at the production stage. When printing a design pattern and forming a conductive ink layer on one sensor sheet surface, both overlapping layers must be inspected at the same time, making the inspection complicated, while forming a conductive ink layer Since the inspection of the present sheet for producing the sensor sheet and the decorative sheet with design in separate steps can be performed individually, there is an effect that the inspection can be performed simply and easily. Furthermore, when a design pattern print and a conductive ink layer are formed on one sensor sheet surface, if either one is defective, the entire sheet becomes a defective product, whereas the design pattern print and the conductive ink layer In a sheet in which layers are separately formed, if there is a defect on one side, only one side becomes defective and the other becomes a non-defective product, which has an effect of reducing the defective rate of molded products, which is advantageous in terms of cost in industrial production.
In addition, since the cavity mold with the uneven surface is pressed directly on the electrode, there is a risk of disconnection in the case of a thin electrode wire, and by using two layers, the sensor sheet is fixed to the core mold, so the disconnection will not occur. It ’s difficult,

意匠シート１として１８８μｍのポリエチレンテレフタレート（ＰＥＴ）３にスイッチ模様４をスクリーン印刷で施し、その上にアクリル系の接着剤をスクリーン印刷法で塗布し接着層６を形成する。一方センサーシート２として１８８μｍのＰＥＴフィルム３にＤＥＰＯＴ／ＰＳＳを含有するインキのデナトロン（ナガセ産業製）をスクリーン印刷して、電極部８を形成し、給電線９は銀ペースト（ＤＷ１２１−Ｈ 東洋紡製）をスクリーン印刷して形成して、その上にアクリル系の接着剤をスクリーン印刷して接着層６を形成する。
該意匠シート１を射出成型用のキャビティ金型１１に接着層６が樹脂と接するようにセットする。コア金型１２には該センサーシート２の接着層６に樹脂が接するようにセットし、型閉じする。２２０℃に加熱したアクリル樹脂を５０℃に加熱した金型内に射出圧力８００ｋｇ／ｃｍ２で流し込み、保圧５００ｋｇ／ｃｍ２に保ち、冷却固化した後、型開きして成型品を取り出した。
できた成型品は静電容量スイッチとして指で入力し機能することが確認された。A switch pattern 4 is applied to a 188 μm polyethylene terephthalate (PET) 3 as a design sheet 1 by screen printing, and an acrylic adhesive is applied thereon by a screen printing method to form an adhesive layer 6. On the other hand, as a sensor sheet 2, a 188 μm PET film 3 is screen-printed with DENAT / PSS-containing ink DENATRON (manufactured by Nagase Sangyo) to form the electrode part 8, and the feeder 9 is a silver paste (DW121-H manufactured by Toyobo) ) Is screen-printed, and an acrylic adhesive is screen-printed thereon to form the adhesive layer 6.
The design sheet 1 is set in a cavity mold 11 for injection molding so that the adhesive layer 6 is in contact with the resin. The core mold 12 is set so that the resin contacts the adhesive layer 6 of the sensor sheet 2, and the mold is closed. The heated acrylic resin 220 ° C. pouring an injection pressure of 800 kg / cm 2 in a heated mold to 50 ° C., kept at the holding pressure 500 kg / cm 2, was cooled and solidified, taken out molded article was opened mold.
The resulting molded product was confirmed to function by inputting with a finger as a capacitance switch.

センサーシート２として１８８μｍのＰＥＴフィルム３にＤＥＰＯＴ／ＰＳＳを含有するインキのデミトロン（ナガセ産業製）をスクリーン印刷して電極８および給電線９を形成し、その上にアクリル系の接着剤をスクリーン印刷し、接着層６を形成して、接着層６に樹脂が接するように射出成型用のコア金型１２にセットし、型閉じする。２３０℃に加熱したアクリル樹脂を６０℃に加熱した金型内に射出圧力８００ｋｇ／ｃｍ２で流し込み、保圧６００ｋｇ／ｃｍ２に保ち、冷却固化した後、型開きして成型品を取り出した。一方意匠シート１として１８８μｍのＰＥＴフィルム３にＰＥＴ用インキ（十条ケミカル製）をスクリーン印刷し、スイッチ柄４を形成して、その上にアクリル系の接着剤をスクリーン印刷し、接着層６を形成して、該シート１を１２０℃に加熱し、真空成型機に該センサー成型品と合わせてセットし、真空成型する。できた不要部分付き成型品１３の不要部分をとって出来上がった成型品１４は意匠シート付きの静電容量タッチセンサーとして指で入力し、機能することが確認された。As the sensor sheet 2, a 188 μm PET film 3 is screen-printed with an ink Demitron (manufactured by Nagase Sangyo) containing DEPOT / PSS to form an electrode 8 and a power supply line 9, and an acrylic adhesive is screen-printed thereon. Then, the adhesive layer 6 is formed, set in the core mold 12 for injection molding so that the resin contacts the adhesive layer 6, and the mold is closed. The heated acrylic resin 230 ° C. poured in to an injection pressure of 800 kg / cm 2 mold heated to 60 ° C., kept at the holding pressure 600 kg / cm 2, was cooled and solidified, taken out molded article was opened mold. On the other hand, PET ink (manufactured by Jujo Chemical) is screen-printed on a 188 μm PET film 3 as the design sheet 1 to form a switch pattern 4 and then an acrylic adhesive is screen-printed thereon to form an adhesive layer 6. Then, the sheet 1 is heated to 120 ° C., set in a vacuum molding machine together with the sensor molded product, and vacuum molded. It was confirmed that the molded product 14 obtained by taking the unnecessary part of the molded product 13 with the unnecessary part was input with a finger as a capacitive touch sensor with a design sheet and functioned.

図４に示すように、インジェクション成型で作成した樹脂成型品１５に接着剤を塗布したセンサーシート２を貼り付け、一方接着剤を塗布した意匠柄シート１を１２０℃にプレヒートし、該成型品と真空成型で同時に成型し、不用部分をカットして静電容量タッチセンサー付き成型品１４を得た。得られたセンサー付き成型品は静電容量スイッチ付き成型品として指で簡単に入力し、機能することが確認された。  As shown in FIG. 4, the sensor sheet 2 coated with an adhesive is attached to a resin molded product 15 created by injection molding, and the design pattern sheet 1 coated with an adhesive is preheated to 120 ° C. At the same time by vacuum molding, unnecessary portions were cut to obtain a molded product 14 with a capacitive touch sensor. It was confirmed that the obtained molded product with a sensor could be easily input with a finger as a molded product with a capacitance switch and functioned.

１意匠シート
２センサーシート
３基体シート
４加飾層（意匠、柄）
５窓部
６接着層
７導電インキ層
８電極
９給電線
１０樹脂
１１金型（キャビティ）
１２金型（コア）
１３静電容量スイッチ付き成型品バリ付き
１４静電容量スイッチ付き真空成型品
１５樹脂成型品1 design sheet 2 sensor sheet 3 base sheet 4 decorative layer (design, pattern)
5 Window 6 Adhesive layer 7 Conductive ink layer 8 Electrode 9 Feed line 10 Resin 11 Mold (cavity)
12 molds (core)
13 Molded product with capacitance switch 14 With burr 14 Vacuum molded product with capacitance switch 15 Resin molded product

Claims (4)

導電性インキ層を形成した静電容量スイッチ付きセンサーシートと意匠フィルムを同じ金型内に設置し、インジェクション成型する成型方法  Molding method in which a sensor sheet with a capacitance switch and a design film with a conductive ink layer are placed in the same mold and injection molded 請求項１の意匠シートの印刷面に接着剤を塗布し、接着層に樹脂が接するようにキャビティ金型にセットし、請求項１の導電性インキ層を形成したセンサーフィルムの印刷面に接着剤を塗布し、該接着層に樹脂が接するようにコア金型にセットする工程と、型閉じして金型内に成形樹脂を流し込み、冷却固化する工程と、型開きして静電容量タッチスイッチ付き成型品を取り出す工程とを備えた静電容量スイッチ付き成型品の製造方法  An adhesive is applied to the printing surface of the design sheet according to claim 1, and is set in a cavity mold so that the resin is in contact with the adhesive layer, and the adhesive is applied to the printing surface of the sensor film on which the conductive ink layer is formed. And setting the core mold so that the resin is in contact with the adhesive layer, closing the mold and pouring the molding resin into the mold, cooling and solidifying, and opening the mold and the capacitance touch switch For producing a molded product with a capacitance switch, comprising the step of taking out the molded product with a capacitor または、請求項１の導電性インキ層を形成したセンサーフィルムの印刷面に接着剤を塗布し、該接着層に樹脂が接するようにコア金型にセットする工程と、型閉じして金型内に成型樹脂を流し込み、冷却固化する工程と、型開きして静電容量スイッチ付き成型品を取り出す工程と、一方印刷した意匠シートに接着剤を塗布し、プレヒートした該意匠シートと、該センサーシート付き成型品とを真空成型で同時成型し、不要部分をカットし、意匠シート付き静電容量スイッチパネル成型品を形成する工程を備えた製造方法Or a step of applying an adhesive to the printing surface of the sensor film on which the conductive ink layer of claim 1 is formed, and setting the core mold so that the resin is in contact with the adhesive layer; A step of pouring a molding resin into the substrate, cooling and solidifying, a step of opening the mold and taking out the molded product with the capacitance switch, and applying the adhesive to the printed design sheet and preheating the design sheet, and the sensor sheet A manufacturing method comprising the steps of simultaneously forming a molded product with a vacuum by vacuum molding, cutting unnecessary portions, and forming a capacitive switch panel molded product with a design sheet または、予め樹脂でインジェクション成型した成型品に裏面に接着剤を塗布して、センサーシートを貼り付け、表側に意匠柄シートに接着剤を塗布したものをプレヒートし、該センサーシート付き成型品と同時に真空成型して静電容量スイッチセンサー付き成型品を製造する製造方法  Alternatively, an adhesive is applied to the back side of a molded product that has been injection molded with a resin in advance, a sensor sheet is attached, and a design pattern sheet that is coated with an adhesive on the front side is preheated, simultaneously with the molded product with the sensor sheet. Manufacturing method for manufacturing molded products with capacitance switch sensor by vacuum forming
JP2009164218A 2009-06-18 2009-06-18 Method for manufacturing molding with electrostatic capacity switch Pending JP2011003517A (en)

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* Cited by examiner, † Cited by third party
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KR101317249B1 (en) 2013-07-11 2013-10-10 (주)드림텍 Method of manufacturing fingerprint recognition home key with improved structure of tightly contacting between fingerprint recognition sensor and mold and fingerprint recognition home key thereof
KR101317247B1 (en) 2013-06-11 2013-10-10 (주)드림텍 Method of manufacturing home key with function of fingerprint recognition
JP2015170536A (en) * 2014-03-10 2015-09-28 株式会社丸三金属 Control panel and method of manufacturing control panel
JP2017056624A (en) * 2015-09-16 2017-03-23 凸版印刷株式会社 Production method of molding
KR20200070741A (en) * 2018-12-10 2020-06-18 유한회사 대구특수금속 Method for manufacturing operating pannel included emitting type capacitive overlay touch input unit
KR20200070742A (en) * 2018-12-10 2020-06-18 유한회사 대구특수금속 Operating pannel included emitting type capacitive overlay touch input unit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317247B1 (en) 2013-06-11 2013-10-10 (주)드림텍 Method of manufacturing home key with function of fingerprint recognition
KR101317249B1 (en) 2013-07-11 2013-10-10 (주)드림텍 Method of manufacturing fingerprint recognition home key with improved structure of tightly contacting between fingerprint recognition sensor and mold and fingerprint recognition home key thereof
JP2015170536A (en) * 2014-03-10 2015-09-28 株式会社丸三金属 Control panel and method of manufacturing control panel
JP2017056624A (en) * 2015-09-16 2017-03-23 凸版印刷株式会社 Production method of molding
KR20200070741A (en) * 2018-12-10 2020-06-18 유한회사 대구특수금속 Method for manufacturing operating pannel included emitting type capacitive overlay touch input unit
KR20200070742A (en) * 2018-12-10 2020-06-18 유한회사 대구특수금속 Operating pannel included emitting type capacitive overlay touch input unit
KR102181290B1 (en) * 2018-12-10 2020-11-20 유한회사 대구특수금속 Operating pannel included emitting type capacitive overlay touch input unit
KR102181289B1 (en) * 2018-12-10 2020-11-20 유한회사 대구특수금속 Method for manufacturing operating pannel included emitting type capacitive overlay touch input unit

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