CN114346673B - Automatic processing equipment of field effect transistor with shock-absorbing function - Google Patents
Automatic processing equipment of field effect transistor with shock-absorbing function Download PDFInfo
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- CN114346673B CN114346673B CN202111664480.8A CN202111664480A CN114346673B CN 114346673 B CN114346673 B CN 114346673B CN 202111664480 A CN202111664480 A CN 202111664480A CN 114346673 B CN114346673 B CN 114346673B
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Abstract
The invention relates to the technical field of field effect transistor processing, in particular to automatic processing equipment of a field effect transistor with a damping function, which comprises a base, a guide rail, a placing block, a processing mechanism and a heating mechanism, wherein the base is provided with a plurality of guide rails; the rotary driver is fixedly arranged at the upper part of the base, and the output end of the rotary driver points to one end far away from the base; the first top plate is fixedly arranged on the output end of the rotary driver; the first linear driver is fixedly arranged at the lower part of the first top plate, and the output end of the first linear driver points to the base; the first electromagnet is fixedly arranged on the output end of the first linear driver; the groove is arranged at the upper part of the placing block. This application has realized the technical requirement that can come out field effect transistor automatic production with taking shock-absorbing function through setting up positioning mechanism, rotary actuator, first roof, first linear actuator, first electro-magnet and recess.
Description
Technical Field
The invention relates to the technical field of field effect transistor processing, in particular to automatic processing equipment of a field effect transistor with a damping function.
Background
Traditional field effect transistor processing is comparatively simple, but along with the demand of using, has shock-absorbing function's field effect transistor suitable for fortune, and chinese patent CN201921277202.5 discloses a field effect transistor with shock-absorbing structure, comprising a base plate, the field effect transistor body is installed at the top of bottom plate, the lateral wall of field effect transistor body is fixed with the connecting block, one side that the field effect transistor body was kept away from to the connecting block is connected with the pin, the outer wall cover of field effect transistor body is equipped with rubber housing, and rubber housing's bottom is connected with the bottom of bottom plate, this field effect transistor with shock-absorbing structure, the impact force is cushioned to the mode that rubber housing accessible warp, and the buffer layer simultaneously with the impact force to sharing all around, has reduced the dynamics when impact force transmits to the field effect transistor body, effectual cushioning effect has been played to the field effect transistor body. However, the structure is complex, and if the assembly is carried out manually, the time and the labor are consumed, so that the technical problem of how to automatically produce the field effect transistor with the damping function is solved.
Disclosure of Invention
Based on this, it is necessary to provide an automatic processing device of a field effect transistor with a damping function for solving the problems in the prior art, which comprises a base, a guide rail, a placing block, a processing mechanism and a heating mechanism; the processing mechanism comprises a back plate placing assembly, a gluing assembly, a body placing assembly, a shell placing assembly, a heat radiating piece placing assembly, a heat conducting wire placing assembly, a filling assembly and a cover plate placing assembly; the device also comprises a positioning mechanism; the backboard placing component comprises a rotary driver, a first top board, a first linear driver, a first electromagnet and a groove; the rotary driver is fixedly arranged at the upper part of the base, and the output end of the rotary driver points to one end far away from the base; the first top plate is fixedly arranged on the output end of the rotary driver; the first linear driver is fixedly arranged at the lower part of the first top plate, and the output end of the first linear driver points to the base; the first electromagnet is fixedly arranged on the output end of the first linear driver; the groove is arranged at the upper part of the placing block.
Preferably, the gluing component comprises a glue tank, a hose, a switch valve, a first fixing rod, a first extending plate, a second linear driver and a gluing piece; the first fixed rod is fixedly arranged on the base at one side of the guide rail; the first extending plate is fixedly arranged at the upper part of the first fixing rod; the second linear driver is fixedly arranged on the first extension plate, and the output end of the second linear driver points to the base; the glue applying piece is fixedly arranged on the output end of the second linear driver; the glue box is fixedly arranged on one side of the first fixing rod, which is far away from the base; two ends of the hose are respectively and fixedly arranged on the glue tank and the glue beating part; the switch valve is arranged on the hose.
Preferably, the body placing assembly comprises a second fixing rod, a first sliding rail, a first sliding block, a third linear driver and a first finger cylinder; the second fixed rods are respectively and fixedly arranged on the bases at the two sides of the guide rail along the width direction of the bases; the first sliding rail is fixedly arranged at the top of the second fixing rod along the width direction of the base; the first sliding block is arranged on the first sliding rail in a sliding manner along the length direction of the first sliding rail; the third linear driver is fixedly arranged at the top of the first sliding block, and the output end of the third linear driver points to the base; the first finger cylinder is fixedly arranged on the output end of the third linear driver.
Preferably, the housing placing assembly comprises a third fixing rod, a second sliding rail, a second sliding block, a fourth linear driver and a second finger cylinder; the third fixed rods are respectively and fixedly arranged on the bases at the two sides of the guide rail along the width direction of the bases; the second slide rail is fixedly arranged at the top of the third fixed rod along the width direction of the base; the second sliding block is arranged on the second sliding rail in a sliding manner along the length direction of the second sliding rail; the fourth linear driver is fixedly arranged at the bottom of the second sliding block, and the output end of the fourth linear driver points to the base; the second finger cylinder is fixedly arranged at the output end of the fourth linear driver, and the output end of the second finger cylinder points to the base.
Preferably, the heat sink placing assembly comprises a fourth fixing rod, a third slide rail, a third slide block, a fifth linear driver and a third finger cylinder; the fourth fixed rods are respectively and fixedly arranged on the bases at the two sides of the guide rail along the width direction of the bases; the third slide rail is fixedly arranged at the top of the fourth fixed rod along the width direction of the base; the third sliding block is arranged on the third sliding rail in a sliding manner along the length direction of the third sliding rail; the fifth linear driver is fixedly arranged at the bottom of the third sliding block, and the output end of the fifth linear driver points to the base; and the third finger cylinder is fixedly arranged on the output end of the fifth linear driver.
Preferably, the heat conducting wire placing assembly comprises a fifth fixing rod, a fourth sliding rail, a fourth sliding block, a sixth linear driver, a second electromagnet and a clamping groove; the fifth fixed rods are respectively and fixedly arranged on the bases at the two sides of the guide rail along the width direction of the bases; the fourth sliding rail is fixedly arranged at the top of the fifth fixing rod along the width direction of the base; the fourth sliding block is arranged on the fourth sliding rail in a sliding manner along the length direction of the fourth sliding rail; the sixth linear driver is fixedly arranged at the bottom of the fourth sliding block, and the output end of the sixth linear driver points to the base; the second electromagnet is fixedly arranged on the output end of the sixth linear driver; the joint groove is opened in the bottom of second magnet along the direction of height of base.
Preferably, the filling assembly comprises a sixth fixing rod, a material box and a discharge hole; the sixth fixing rod is fixedly arranged on the base at one side of the guide rail; the material box is fixedly arranged at the top of the sixth fixing rod; the discharge port is arranged at the bottom of the material box.
Preferably, the cover plate placing assembly comprises a seventh fixing rod, a fifth sliding rail, a fifth sliding block, a seventh linear driver and a fourth finger cylinder; the seventh fixed rod is respectively fixedly arranged on the bases at the two sides of the guide rail along the width direction of the base; the fifth slide rail is fixedly arranged at the top of the seventh fixed rod along the width direction of the base; the fifth sliding block is arranged on the fifth sliding rail in a sliding manner along the length direction of the fifth sliding rail; the seventh linear driver is fixedly arranged at the bottom of the fifth sliding block, and the output end of the seventh linear driver points to the base; the fourth finger cylinder is fixedly arranged at the output end of the seventh linear driver, and the output end of the fourth finger cylinder points to the base.
Preferably, the positioning mechanism comprises a through hole, a laser emitter and a laser receiver; the through hole is formed in the side wall of the placing block; the laser emitter is fixedly arranged on the base in the length extending direction of the through hole, and the output end of the laser emitter points to the guide rail; the laser receiver is arranged on the side wall of the guide rail.
Preferably, the heating mechanism comprises a heating shell and a heat dissipation hole; the heating shell is fixedly arranged on the upper part of the base around the guide rail; the heat dissipation holes penetrate through one end, close to the guide rail, of the heating shell.
Compared with the prior art, the beneficial effect of this application is:
1. this application has realized the technical requirement that can come out field effect transistor automatic production with shock-absorbing function through setting up positioning mechanism, rotary actuator, first roof, first linear actuator, first electro-magnet and recess.
2. This application is through setting up gluey water tank, hose, ooff valve, first dead lever, first extension board, the straight line driver of second and beating the gluey piece, has realized beating the gluey function of beating of gluing the subassembly.
3. This application is through setting up second dead lever, first slide rail, first slider, third linear actuator and first finger cylinder, has realized that the body is placed the subassembly and is placed the technical requirement on treating the machined part with the body.
4. This application has realized that the shell is placed the subassembly and can be placed the technical requirement on treating the machined part with the shell through setting up third dead lever, second slide rail, second slider, fourth linear actuator and second finger cylinder.
5. This application is through setting up fourth dead lever, third slide rail, third slider, fifth linear actuator and third finger cylinder, has realized that the radiating piece places the subassembly and can place the technical requirement on treating the machined part with the radiating hole spare.
Drawings
FIG. 1 is a first perspective view of the present application;
FIG. 2 is a second perspective view of the present application;
FIG. 3 is a perspective view of the present application;
FIG. 4 is a perspective view of the present application with portions of the machining mechanism removed;
FIG. 5 is a perspective view of the back plate placement assembly and the glue applicator assembly of the present application;
FIG. 6 is a perspective view of the body placement assembly and the housing placement assembly of the present application;
FIG. 7 is a perspective view of the heating mechanism of the present application;
FIG. 8 is a perspective view of a partial machine tool component assembly of the present application;
FIG. 9 is a second perspective view of the present application illustrating the assembly of parts of the machining mechanism;
fig. 10 is a perspective view of the positioning mechanism of the present application.
The reference numbers in the figures are:
1-a base;
2-a guide rail;
3-placing the block;
4-a processing mechanism; 4 a-a back plate placement component; 4a1 — rotational drive; 4a 2-first top panel; 4a3 — first linear driver; 4a4 — a first electromagnet; 4a 5-groove; 4 b-gluing component; 4b 1-glue tank; 4b 2-hose; 4b3 — switching valve; 4b 4-first fixation bar; 4b 5-a first extension panel; 4b6 — second linear drive; 4b 7-glue part; 4 c-body placement component; 4c 1-a second fixation bar; 4c2 — first slide rail; 4c3 — first slider; 4c4 — third linear drive; 4c 5-first finger cylinder; 4 d-housing placement assembly; 4d 1-third fixation bar; 4d2 — second slide; 4d3 — second slider; 4d4 — fourth linear drive; 4d 5-second finger cylinder; 4 e-heat sink placement component; 4e 1-fourth fixing bar; 4e2 — third slide; 4e 3-drop three slide; 4e 4-fifth linear drive; 4e 5-third finger cylinder; 4 f-heat conducting wire placing component; 4f 1-fifth fixing bar; 4f 2-fourth slide rail; 4f 3-fourth slider; 4f 4-sixth linear drive; 4f5 — second electromagnet; 4f 6-snap groove; 4 g-a fill assembly; 4g 1-sixth fixation bar; 4g 2-Material hopper; 4g 3-discharge port; 4 h-cover plate placing component; 4h 1-seventh fixed bar; 4h 2-fifth sled; 4h 3-fifth slider; 4h 4-seventh linear drive; 4h 5-fourth finger cylinder;
5-a positioning mechanism; 5 a-a through hole; 5 b-a laser emitter; 5 c-a laser receiver;
6-a heating mechanism; 6 a-heating the shell; 6 b-heat dissipation holes.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-2, 4-5, the present application provides:
an automatic processing device of a field effect tube with a damping function comprises a base 1, a guide rail 2, a placing block 3, a processing mechanism 4 and a heating mechanism 6; the processing mechanism 4 comprises a back plate placing component 4a, a gluing component 4b, a body placing component 4c, a shell placing component 4d, a heat radiating piece placing component 4e, a heat conducting wire placing component 4f, a filling component 4g and a cover plate placing component 4 h; also comprises a positioning mechanism 5; the backboard placing assembly 4a comprises a rotary driver 4a1, a first top board 4a2, a first linear driver 4a3, a first electromagnet 4a4 and a groove 4a 5; the rotary driver 4a1 is fixedly arranged on the upper part of the base 1, and the output end of the rotary driver 4a1 points to the end far away from the base 1; the first top board 4a2 is fixedly provided on the output end of the rotary driver 4a 1; the first linear driver 4a3 is fixedly arranged at the lower part of the first top plate 4a2, and the output end of the first linear driver 4a3 points to the base 1; the first electromagnet 4a4 is fixedly arranged at the output end of the first linear driver 4a 3; a groove 4a5 is opened in the upper portion of the placement block 3.
Based on the above embodiments, the technical problem that the present application intends to solve is how to automatically produce a fet with a shock absorbing function. For this purpose, the rotary actuator 4a1 is preferably a servomotor, and the first linear actuator 4a3 is preferably a linear cylinder. Guide rail 2 is fixed the setting on the upper portion of base 1 along the length direction of base 1, places piece 3 slidable and sets up on guide rail 2, places piece 3 and evenly sets up on guide rail 2 along the length direction of guide rail 2. According to the processing flow, the base 1 is sequentially provided with a backboard placing component 4a, a body placing component 4c, a shell placing component 4d, a radiating piece placing component 4e, a heat conducting wire placing component 4f, a filling component 4g and a cover plate placing component 4 h. It is provided with a plurality ofly to beat gluey subassembly 4b, is provided with to beat gluey subassembly 4b between subassembly 4a and the body is placed the subassembly 4c at the backplate, places subassembly 4c and the shell and place the setting between the subassembly 4d and also be provided with to beat gluey subassembly 4b at the body, beats gluey subassembly 4b simultaneously and sets up and place between subassembly 4d and the radiating piece is placed to the shell, beats gluey subassembly 4b and is used for beating glue in advance when assembling for field effect tube. The overall flow is generally such that the placement block 3 will move along the rail 2, will stop when passing the backplane placement assembly 4a, the backplane placement assembly 4a will mount the backplane on the placement block 3, then the placing block 3 will enter the gluing assembly 4b, the gluing assembly 4b will glue the upper part of the back plate, then the placing block 3 will continue to move, when the body placing component 4c is reached, the body placing component 4c can place the body of the field effect transistor on the back plate, and the body and the back plate can be tightly bonded by glue, then the glue passes through the gluing component 4b once again, the gluing component 4b glues the periphery of the body, then, the shell placing component 4d can pass through the shell, the shell placing component 4d can clamp the shell on the periphery of the body, and the shell can be tightly adhered to the back plate under the adhesion of glue. Then place piece 3 and can reach the third below of beating gluey subassembly 4b here, the third is beaten gluey subassembly 4b and can will be owing to place the whole glue of heat dissipation hole spare and heat conduction silk and beat, then place subassembly 4e and heat conduction silk by the radiating piece and place subassembly 4f with the heat dissipation hole spare, the heat conduction spare is placed on the glue, just so make heat dissipation hole spare and heat conduction spare tightly be connected with the body, because the upper portion of shell is open-ended, after placing piece 3 and reaching the below of filling subassembly 4g, fill subassembly 4g just can put into the shell with the stopping, it can with the apron lid and on the shell to place subassembly 4h through the apron again at last. The specific process of the backboard placing component 4a is as follows, when the placing block 3 reaches the position of the backboard placing component 4a, the first linear driver 4a3 can drive the first electromagnet 4a4 arranged at the output end of the backboard to extend, the backboard is adsorbed on the first electromagnet 4a4, after the backboard is completely butted with the placing block 3, the first electromagnet 4a4 can be powered off, then the backboard can be placed on the backboard, then the first linear driver 4a3 can drive the first electromagnet 4a4 to lift up, and then the rotary driver 4a1 drives the first top board 4a2 to rotate, so that the first linear driver 4a3 can suck a new backboard on the raw material conveying line again through the first electromagnet 4a 4. Therefore, the technical requirement that the field effect tube with the damping function can be automatically produced is met.
Further, as shown in fig. 5:
the glue beating assembly 4b comprises a glue tank 4b1, a hose 4b2, a switch valve 4b3, a first fixing rod 4b4, a first extension plate 4b5, a second linear driver 4b6 and a glue beating piece 4b 7; the first fixing rod 4b4 is fixedly arranged on the base 1 at one side of the guide rail 2; the first extension board 4b5 is fixedly provided on the upper portion of the first fixing lever 4b 4; the second linear driver 4b6 is fixedly arranged on the first extension plate 4b5, and the output end of the second linear driver 4b6 points to the base 1; the gluing piece 4b7 is fixedly arranged on the output end of the second linear driver 4b 6; the glue tank 4b1 is fixedly arranged on one side of the first fixing rod 4b4 far away from the base 1; two ends of the hose 4b2 are respectively and fixedly arranged on the glue tank 4b1 and the glue applying piece 4b 7; the on-off valve 4b3 is provided on the hose 4b 2.
Based on the above embodiments, the technical problem to be solved by the present application is how to perform the gluing by the gluing component 4 b. For this reason, the second linear actuator 4b6 is preferably a linear cylinder, the gluing member 4b7 needs to be adapted to the shape of the object to be glued, for example, when the housing placing assembly 4d is used for gluing, since the fet has a rectangular structure, the gluing member 4b7 needs to have a rectangular structure, and the gluing is performed in a rectangular frame structure, so that the gluing member 4b7 can exactly glue on the periphery of the housing. When the placing block 3 drives the workpiece to be processed to reach the position below the gluing component 4b, the second linear driver 4b6 drives the gluing part 4b7 arranged at the output end of the placing block to extend out, so that the gluing part 4b7 moves towards the base 1, and after the gluing part 4b7 is contacted with the upper part of the bottom plate, the switch valve 4b3 arranged on the hose 4b2 is opened, so that the glue in the glue tank 4b1 flows into the gluing part from the hose 4b2 and finally flows onto the upper surface of the bottom plate. After the glue is applied, the on-off valve 4b3 is closed, so that the glue can not flow out from the hose 4b2, and the glue applying function of the glue applying assembly 4b is realized.
Further, as shown in fig. 6:
the body placing component 4c comprises a second fixed rod 4c1, a first slide rail 4c2, a first slide block 4c3, a third linear driver 4c4 and a first finger cylinder 4c 5; the second fixing rods 4c1 are respectively fixedly arranged on the bases 1 at two sides of the guide rail 2 along the width direction of the base 1; the first slide rail 4c2 is fixedly arranged at the top of the second fixed rod 4c1 along the width direction of the base 1; the first slide block 4c3 is slidably arranged on the first slide rail 4c2 along the length direction of the first slide rail 4c 2; the third linear driver 4c4 is fixedly arranged on the top of the first sliding block 4c3, and the output end of the third linear driver 4c4 points to the base 1; the first finger cylinder 4c5 is fixedly provided at the output end of the third linear actuator 4c 4.
Based on the above-mentioned embodiments, the technical problem that the present application intends to solve is how to place the body on the member to be processed by the body placement component 4 c. For this purpose, the third linear actuator 4c4 is preferably a linear cylinder, the body placement module 4c is located in the next step of the gluing module 4b, so that when the body placement module 4c is operated, glue is applied to the back plate, so that when the placement block 3 brings the back plate under the body placement module 4c, the output end of the third linear actuator 4c4 extends, which in turn causes the first finger cylinder 4c5 provided at the output end to move together with the output end of the third linear actuator 4c4, which grips the body of a fet on the first finger cylinder 4c5, and after the body of the fet and the back plate are in contact with each other, the output end of the third linear actuator 4c4 does not extend any more, and after a certain period of time, the first finger cylinder 4c5 is released, which in turn causes the third linear actuator 4c4 to lift the first finger cylinder 4c5, then the first slider 4c3 will drive the third linear actuator 4c4 to move along the length direction of the first slide rail 4c2, a raw material conveying line is arranged on one side of the guide rail 2, and after the third linear actuator 4c4 drives the first finger cylinder 4c5 to clamp a new field effect transistor body, the new field effect transistor body will move above the guide rail 2 again, so as to reciprocate, and the technical requirement that the body placing component 4c places the body on a workpiece to be machined is met.
Further, as shown in fig. 6:
the housing placing assembly 4d comprises a third fixing rod 4d1, a second slide rail 4d2, a second slide block 4d3, a fourth linear driver 4d4 and a second finger cylinder 4d 5; the third fixing rods 4d1 are respectively fixedly arranged on the bases 1 at two sides of the guide rail 2 along the width direction of the base 1; the second slide rail 4d2 is fixedly arranged at the top of the third fixing rod 4d1 along the width direction of the base 1; the second slide block 4d3 is slidably arranged on the second slide rail 4d2 along the length direction of the second slide rail 4d 2; the fourth linear driver 4d4 is fixedly arranged at the bottom of the second sliding block 4d3, and the output end of the fourth linear driver 4d4 points to the base 1; the second finger cylinder 4d5 is fixedly arranged at the output end of the fourth linear actuator 4d4, and the output end of the second finger cylinder 4d5 is directed to the base 1.
Based on the above embodiments, the technical problem that the present application intends to solve is how to realize the placement of the housing on the member to be assembled by the housing placement component 4 d. For this purpose, the fourth linear actuator 4d4 is preferably a linear air cylinder, and after the glued back plate passes through the position of the housing placement component 4d, the glued back plate is positioned by the positioning mechanism 5, so that the placement block 3 stops moving, and then the output end of the fourth linear actuator 4d4 extends out, so that the second finger air cylinder 4d5 arranged at the output end of the fourth linear actuator moves along with the output end of the fourth linear actuator 4d4, and at this time, the second finger air cylinder 4d5 clamps the housing, so that the housing is sleeved on the periphery of the fet body, and after a certain period of time, the second finger air cylinder 4d5 is released, and then the fourth linear actuator 4d4 is gradually retracted, and then the second slider 4d3 drives the fourth linear actuator 4d4 to move along the length direction of the second slide rail 4d2, and after moving to the designated position, the second slider 4d3 stops moving, then the fourth linear actuator 4d4 is extended slowly, so that after the second finger cylinder 4d5 picks up the housing, the fourth linear actuator 4d4 drives the second finger cylinder 4d5 to lift up, and the cycle is repeated. This achieves the technical requirement that the housing placement component 4d can place the housing on the workpiece to be machined.
Further, as shown in fig. 8:
the heat sink placement module 4e includes a fourth fixing bar 4e1, a third slide rail 4e2, a third slider, a fifth linear actuator 4e4, and a third finger cylinder 4e 5; the fourth fixing bars 4e1 are respectively fixedly arranged on the bases 1 at both sides of the guide rail 2 along the width direction of the base 1; the third slide rail 4e2 is fixedly arranged at the top of the fourth fixed rod 4e1 along the width direction of the base 1; the third slide block is arranged on the third slide rail 4e2 in a slidable manner along the length direction of the third slide rail 4e 2; the fifth linear driver 4e4 is fixedly arranged at the bottom of the third sliding block, and the output end of the fifth linear driver 4e4 points to the base 1; a third finger cylinder 4e5 is fixedly provided at the output end of the fifth linear actuator 4e 4.
Based on the above-described embodiment, the technical problem that the present application intends to solve is how to place the heat sink placing component 4e on the member to be processed. For this purpose, the fifth linear actuator 4e4 is preferably a linear cylinder, and has a heat sink formed at the upper portion of the fet body, the heat sink being used for the heat sink placement module 4e to place a heat sink member, before this, glue is applied in the heat sink by the glue application element 4b, and after reaching the heat sink placement element 4e, the fifth linear actuator 4e4 drives the third finger cylinder 4e5 to slowly extend, the third finger cylinder 4e5 puts the heat dissipation hole member into the heat dissipation slot, then the fifth linear actuator 4e4 will drive the third finger cylinder 4e5 to slowly lift up, and then the third slider will drive the fifth linear actuator 4e4 and the third finger cylinder 4e5 along the length direction of the third slide rail 4e2 to get a new heat dissipation hole, this meets the technical requirement that the heat sink placement module 4e can place the heat sink hole member on the member to be processed.
Further, as shown in fig. 9:
the heat conducting wire placing assembly 4f comprises a fifth fixing rod 4f1, a fourth sliding rail 4f2, a fourth sliding block 4f3, a sixth linear driver 4f4, a second electromagnet 4f5 and a clamping groove 4f 6; the fifth fixing rods 4f1 are respectively fixedly arranged on the bases 1 at two sides of the guide rail 2 along the width direction of the base 1; the fourth slide rail 4f2 is fixedly arranged at the top of the fifth fixed rod 4f1 along the width direction of the base 1; the fourth slide block 4f3 is slidably arranged on the fourth slide rail 4f2 along the length direction of the fourth slide rail 4f 2; the sixth linear driver 4f4 is fixedly arranged at the bottom of the fourth sliding block 4f3, and the output end of the sixth linear driver 4f4 points to the base 1; the second electromagnet 4f5 is fixedly arranged at the output end of the sixth linear driver 4f 4; the engaging groove 4f6 is formed in the bottom of the second electromagnet 4f5 in the height direction of the base 1.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how to mount the heat conduction wires on the member to be processed by the heat conduction wire placement assembly 4 f. For this reason, the sixth linear actuator 4f4 is preferably a linear cylinder, when the workpiece reaches the lower part of the thermal wire placing assembly 4f, the sixth linear actuator 4f4 will drive the second electromagnet 4f5 to descend, the second electromagnet 4f5 is powered on, since the thermal wire is metal, the second electromagnet 4f5 will attract the thermal wire, and in order to ensure the stability during installation, the thermal wire will be disposed in the snap-in groove 4f6 at the bottom of the second electromagnet 4f5, a thermal groove for placing the thermal wire is disposed on the workpiece, the thermal groove will be glued by the gluing assembly 4b in advance, so that after the second electromagnet 4f5 drives the thermal wire and inserts the thermal wire into the thermal groove, the second electromagnet 4f5 will be powered off, and due to the connection of the glue, the second electromagnet 4f5 will be driven by the sixth linear actuator 4f4 to ascend, the heat-conducting wire is gradually separated from the second electromagnet 4f5, so that the technical requirement that the heat-conducting wire placing assembly 4f can mount the heat-conducting wire placing assembly 4f on the member to be processed is met.
Further, as shown in fig. 8-9:
the filling assembly 4g comprises a sixth fixing rod 4g1, a material box 4g2 and a material outlet 4g 3; the sixth fixing rod 4g1 is fixedly arranged on the base 1 at one side of the guide rail 2; the material box 4g2 is fixedly arranged at the top of the sixth fixed rod 4g 1; the discharge port 4g3 is arranged at the bottom of the material box 4g 2.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how to fill the filler into the member to be processed by the filling assembly 4 g. Therefore, after the workpiece to be machined reaches the lower part of the filling assembly 4g, the material tank 4g2 is opened, the filler flows out of the discharge port 4g3 below the workpiece to enable the filler to fall into the workpiece to be machined, and after the filler is added, the material tank 4g2 stops feeding. The technical requirement of the filling assembly 4g for filling the filling material into the workpiece to be machined is thus fulfilled.
Further, as shown in fig. 8-9:
the cover plate placing assembly 4h comprises a seventh fixing rod 4h1, a fifth slide rail 4h2, a fifth slide block 4h3, a seventh linear driver 4h4 and a fourth finger cylinder 4h 5; the seventh fixing rods 4h1 are respectively fixedly arranged on the bases 1 at two sides of the guide rail 2 along the width direction of the base 1; the fifth slide rail 4h2 is fixedly arranged at the top of the seventh fixed bar 4h1 along the width direction of the base 1; the fifth slide block 4h3 is slidably arranged on the fifth slide rail 4h2 along the length direction of the fifth slide rail 4h 2; the seventh linear driver 4h4 is fixedly arranged at the bottom of the fifth sliding block 4h3, and the output end of the seventh linear driver 4h4 points to the base 1; the fourth finger cylinder 4h5 is fixedly arranged at the output end of the seventh linear actuator 4h4, and the output end of the fourth finger cylinder 4h5 is directed to the base 1.
Based on the above-mentioned embodiments, the technical problem that the present application intends to solve is how to place the cover plate on the workpiece to be processed by the cover plate placing assembly 4 h. For this reason, the seventh linear actuator 4h4 is preferably a linear cylinder, and when the workpiece reaches the lower part of the cover plate placing assembly 4h, the seventh linear actuator 4h4 will drive the fourth finger cylinder 4h5 with the cover plate to slowly descend, and make the cover plate finally cover the box on the workpiece. The fifth slider 4h3 can drive the seventh linear actuator 4h4 and the fourth finger cylinder 4h5 to move along the fifth slide rail 4h2, so that the fourth finger cylinder 4h5 can take a new cover plate after the cover plate is placed.
Further, as shown in fig. 6 and 10:
the positioning mechanism 5 comprises a through hole 5a, a laser emitter 5b and a laser receiver 5 c; the through hole 5a is arranged on the side wall of the placing block 3; the laser emitter 5b is fixedly arranged on the base 1 in the length extending direction of the through hole 5a, and the output end of the laser emitter 5b points to the guide rail 2; the laser receiver 5c is provided on the side wall of the guide rail 2.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how the positioning mechanism 5 realizes the positioning function for the placement block 3. For this reason, after the placing block 3 reaches the designated position, the through hole 5a on the placing block 3 coincides with the laser receiver 5c, so that the signal emitted by the laser emitter 5b is received by the laser receiver 5c, and after receiving the signal, the placing block 3 stops moving.
Further, as shown in fig. 3 and 7:
the heating mechanism 6 comprises a heating shell 6a and a heat radiation hole 6 b; the heating shell 6a is fixedly arranged on the upper part of the base 1 around the guide rail 2; the heat radiation holes 6b are formed through one end of the heating case 6a close to the guide rail 2.
Based on the above embodiments, the technical problem that the present application intends to solve is how to rapidly dry the bonded components. For this reason, the heating case 6a of the present application is disposed behind the components to be mounted by gluing, so that it can be dried immediately after mounting.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. An automatic processing device of a field effect transistor with a damping function comprises a base (1), a guide rail (2), a placing block (3), a processing mechanism (4) and a heating mechanism (6); the processing mechanism (4) comprises a back plate placing assembly (4a), a gluing assembly (4b), a body placing assembly (4c), a shell placing assembly (4d), a heat radiating piece placing assembly (4e), a heat conducting wire placing assembly (4f), a filling assembly (4g) and a cover plate placing assembly (4 h);
it is characterized by also comprising a positioning mechanism (5); the backboard placing assembly (4a) comprises a rotary driver (4a1), a first top board (4a2), a first linear driver (4a3), a first electromagnet (4a4) and a groove (4a 5);
the rotary driver (4a1) is fixedly arranged at the upper part of the base (1), and the output end of the rotary driver (4a1) points to one end far away from the base (1);
the first top plate (4a2) is fixedly arranged on the output end of the rotary driver (4a 1);
the first linear driver (4a3) is fixedly arranged at the lower part of the first top plate (4a2), and the output end of the first linear driver (4a3) points to the base (1);
the first electromagnet (4a4) is fixedly arranged on the output end of the first linear driver (4a 3);
the groove (4a5) is arranged at the upper part of the placing block (3);
the heat-conducting wire placing assembly (4f) comprises a fifth fixing rod (4f1), a fourth sliding rail (4f2), a fourth sliding block (4f3), a sixth linear driver (4f4), a second electromagnet (4f5) and a clamping groove (4f 6);
the fifth fixing rods (4f1) are respectively fixedly arranged on the bases (1) at two sides of the guide rail (2) along the width direction of the bases (1);
the fourth slide rail (4f2) is fixedly arranged at the top of the fifth fixed rod (4f1) along the width direction of the base (1);
the fourth sliding block (4f3) is arranged on the fourth sliding rail (4f2) in a sliding way along the length direction of the fourth sliding rail (4f 2);
the sixth linear driver (4f4) is fixedly arranged at the bottom of the fourth sliding block (4f3), and the output end of the sixth linear driver (4f4) points to the base (1);
the second electromagnet (4f5) is fixedly arranged at the output end of the sixth linear driver (4f 4);
the clamping groove (4f6) is arranged at the bottom of the second magnet along the height direction of the base (1).
2. The automatic processing apparatus of a field effect transistor with a shock-absorbing function according to claim 1, wherein the glue dispensing assembly (4b) comprises a glue tank (4b1), a hose (4b2), a switching valve (4b3), a first fixing rod (4b4), a first extension plate (4b5), a second linear actuator (4b6), and a glue dispensing member (4b 7);
the first fixed rod (4b4) is fixedly arranged on the base (1) at one side of the guide rail (2);
the first extension board (4b5) is fixedly arranged at the upper part of the first fixed rod (4b 4);
the second linear driver (4b6) is fixedly arranged on the first extension plate (4b5), and the output end of the second linear driver (4b6) points to the base (1);
the gluing piece (4b7) is fixedly arranged on the output end of the second linear driver (4b 6);
the glue tank (4b1) is fixedly arranged on one side of the first fixing rod (4b4) far away from the base (1);
two ends of the hose (4b2) are respectively and fixedly arranged on the glue tank (4b1) and the glue beating piece (4b 7);
the on-off valve (4b3) is provided on the hose (4b 2).
3. The automatic processing equipment of a fet with a shock-absorbing function as claimed in claim 1, wherein the body placing module (4c) comprises a second fixing bar (4c1), a first slide rail (4c2), a first slider (4c3), a third linear actuator (4c4) and a first finger cylinder (4c 5);
the second fixing rods (4c1) are respectively fixedly arranged on the bases (1) at two sides of the guide rail (2) along the width direction of the bases (1);
the first slide rail (4c2) is fixedly arranged at the top of the second fixed rod (4c1) along the width direction of the base (1);
the first sliding block (4c3) is arranged on the first sliding rail (4c2) in a sliding way along the length direction of the first sliding rail (4c 2);
the third linear driver (4c4) is fixedly arranged at the top of the first sliding block (4c3), and the output end of the third linear driver (4c4) points to the base (1);
the first finger cylinder (4c5) is fixedly arranged at the output end of the third linear actuator (4c 4).
4. The automatic processing equipment of a field effect transistor with a shock absorbing function according to claim 1, wherein the housing placing assembly (4d) comprises a third fixing rod (4d1), a second slide rail (4d2), a second slider (4d3), a fourth linear actuator (4d4) and a second finger cylinder (4d 5);
the third fixing rods (4d1) are respectively fixedly arranged on the bases (1) at two sides of the guide rail (2) along the width direction of the bases (1);
the second slide rail (4d2) is fixedly arranged at the top of the third fixed rod (4d1) along the width direction of the base (1);
the second sliding block (4d3) is arranged on the second sliding rail (4d2) in a sliding way along the length direction of the second sliding rail (4d 2);
the fourth linear driver (4d4) is fixedly arranged at the bottom of the second sliding block (4d3), and the output end of the fourth linear driver (4d4) points to the base (1);
the second finger cylinder (4d5) is fixedly arranged on the output end of the fourth linear driver (4d4), and the output end of the second finger cylinder (4d5) points to the base (1).
5. The automatic processing apparatus of a fet with a shock-absorbing function as claimed in claim 1, wherein the heat sink placement module (4e) comprises a fourth fixing bar (4e1), a third slide rail (4e2), a third slider, a fifth linear actuator (4e4) and a third finger cylinder (4e 5);
the fourth fixing rods (4e1) are respectively fixedly arranged on the bases (1) at two sides of the guide rail (2) along the width direction of the bases (1);
the third slide rail (4e2) is fixedly arranged at the top of the fourth fixed rod (4e1) along the width direction of the base (1);
the third sliding block is arranged on the third sliding rail (4e2) in a sliding way along the length direction of the third sliding rail (4e 2);
the fifth linear driver (4e4) is fixedly arranged at the bottom of the third sliding block, and the output end of the fifth linear driver (4e4) points to the base (1);
a third finger cylinder (4e5) is fixedly arranged at the output end of the fifth linear actuator (4e 4).
6. The automatic processing equipment of the field effect transistor with the shock absorption function is characterized in that the filling assembly (4g) comprises a sixth fixing rod (4g1), a material box (4g2) and a discharge hole (4g 3);
the sixth fixing rod (4g1) is fixedly arranged on the base (1) at one side of the guide rail (2);
the material box (4g2) is fixedly arranged at the top of the sixth fixed rod (4g 1);
the discharge port (4g3) is arranged at the bottom of the material box (4g 2).
7. The automatic processing equipment of a field effect transistor with a shock absorption function according to claim 1, wherein the cover plate placing assembly (4h) comprises a seventh fixing rod (4h1), a fifth slide rail (4h2), a fifth slide block (4h3), a seventh linear actuator (4h4) and a fourth finger cylinder (4h 5);
the seventh fixing rods (4h1) are respectively fixedly arranged on the bases (1) at two sides of the guide rail (2) along the width direction of the bases (1);
the fifth slide rail (4h2) is fixedly arranged at the top of the seventh fixed rod (4h1) along the width direction of the base (1);
the fifth sliding block (4h3) is arranged on the fifth sliding rail (4h2) in a sliding way along the length direction of the fifth sliding rail (4h 2);
the seventh linear driver (4h4) is fixedly arranged at the bottom of the fifth sliding block (4h3), and the output end of the seventh linear driver (4h4) points to the base (1);
the fourth finger cylinder (4h5) is fixedly arranged at the output end of the seventh linear driver (4h4), and the output end of the fourth finger cylinder (4h5) points to the base (1).
8. The automatic processing equipment of a field effect transistor with a shock absorption function according to claim 1, wherein the positioning mechanism (5) comprises a through hole (5a), a laser transmitter (5b) and a laser receiver (5 c);
the through hole (5a) is formed in the side wall of the placing block (3);
the laser emitter (5b) is fixedly arranged on the base (1) in the length extending direction of the through hole (5a), and the output end of the laser emitter (5b) points to the guide rail (2);
the laser receiver (5c) is arranged on the side wall of the guide rail (2).
9. The automatic processing equipment of a field effect transistor with a shock absorption function according to claim 1, wherein the heating mechanism (6) comprises a heating shell (6a) and a heat dissipation hole (6 b);
the heating shell (6a) is fixedly arranged on the upper part of the base (1) around the guide rail (2);
the heat dissipation hole (6b) penetrates through one end of the heating shell (6a) close to the guide rail (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111664480.8A CN114346673B (en) | 2021-12-31 | 2021-12-31 | Automatic processing equipment of field effect transistor with shock-absorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111664480.8A CN114346673B (en) | 2021-12-31 | 2021-12-31 | Automatic processing equipment of field effect transistor with shock-absorbing function |
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| Publication Number | Publication Date |
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| CN114346673A CN114346673A (en) | 2022-04-15 |
| CN114346673B true CN114346673B (en) | 2022-09-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108655725B (en) * | 2018-05-17 | 2019-12-20 | 江门市云聚照明科技有限公司 | Automatic assembling system for LED bulb lamp |
| CN108857375A (en) * | 2018-05-31 | 2018-11-23 | 海盐普源电力科技有限公司 | A kind of manufacture craft of the transmitter of install convenient |
| CN210649421U (en) * | 2019-07-19 | 2020-06-02 | 深圳市智能机器人研究院 | Mechanical arm module and equipment for assembling transistor radiating fins |
| CN111230473B (en) * | 2019-08-06 | 2021-06-22 | 浙江铭仕兴新暖通科技有限公司 | Water knockout drum assembly machine |
| CN111468931A (en) * | 2020-04-07 | 2020-07-31 | 宁波韦尔德斯凯勒智能科技有限公司 | S-shaped spring assembling equipment for seat |
| CN113070681B (en) * | 2021-04-09 | 2022-06-07 | 瑞纳智能设备股份有限公司 | Automatic assembly line of ultrasonic flowmeter and assembly method thereof |
| CN113020977A (en) * | 2021-04-30 | 2021-06-25 | 铜陵百墩实业有限公司 | Automatic assembling equipment for capacitor production |
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