CN114340262B - Shell, shell assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a shell, which comprises a substrate, a heat dissipation membrane and a flexible membrane layer. The heat dissipation diaphragm comprises an evaporation cavity, a heat dissipation runner, a first pipeline and a second pipeline, a plurality of air bags are formed between the flexible film layer and the substrate, and the air bags are communicated with the first pipeline through a piston pipe. The evaporation cavity is filled with a phase change medium in a first phase, and when the phase change medium is changed into a second phase due to heated phase change and enters the first pipeline from the evaporation cavity, the piston is driven to move so as to change the air pressure in the air bag, and the flexible film layer is deformed. When the air pressure in the air bag is increased, the flexible film layer can deform and bulge to form concave-convex touch feeling, so that the anti-skid function is achieved. In addition, the embodiment of the application also provides a shell component and electronic equipment.

Description

Shell, shell assembly and electronic equipment

Technical Field

The application relates to the field of consumer electronic products, in particular to a shell, a shell assembly and electronic equipment.

Background

With the development of communication technology, electronic devices such as mobile phones and tablet computers have become an indispensable tool. The power supply of the electronic equipment or other electronic devices can generate a large amount of heat during working, so that the overall temperature of the electronic equipment is increased, and the use experience of a user is affected. Even when the temperature rises sharply, there is a risk of spontaneous combustion. Some existing electronic devices automatically take partial measures for reducing power consumption after the temperature rises, which causes the operation efficiency of the electronic devices to be reduced and causes the electronic devices to become stuck; meanwhile, the user can get hands hot when holding the electronic equipment.

Disclosure of Invention

The application aims to provide a shell, a shell assembly and electronic equipment, so as to at least partially solve the technical problems.

In a first aspect, an embodiment of the present application provides a housing, including a substrate, a heat dissipation membrane, and a flexible membrane layer, where the heat dissipation membrane includes an evaporation cavity, a heat dissipation flow channel, a first pipe and a second pipe, the evaporation cavity is communicated with an inlet of the heat dissipation flow channel through the first pipe, and is communicated with an outlet of the heat dissipation flow channel through the second pipe, a plurality of air bags are formed between the flexible membrane layer and the substrate, the plurality of air bags are communicated with the first pipe through a piston pipe, and a piston capable of freely moving and in airtight contact with an inner wall of the piston pipe is disposed in the piston pipe. The evaporation cavity is filled with a phase change medium in a first phase, and when the phase change medium is changed into a second phase due to heated phase change and enters the first pipeline from the evaporation cavity, the piston is driven to move so as to change the air pressure in the air bag, and the flexible film layer is deformed.

In a second aspect, an embodiment of the present application provides a housing assembly including a middle frame, a front shell and the above-mentioned housing, where the front shell and the housing are assembled on the middle frame and located on opposite sides of the middle frame, and a flexible membrane layer in the housing is located on a side far from the middle frame.

In a third aspect, an embodiment of the present application further provides an electronic device, including the above-mentioned housing assembly and a heat generating assembly, where the heat generating assembly is disposed in the housing assembly, and the evaporation cavity is disposed corresponding to the heat generating assembly.

According to the shell, the preparation method thereof, the shell assembly and the electronic equipment, the evaporation cavity can be arranged corresponding to the heating element of the electronic equipment, when the heating element heats, the phase change medium of the first phase in the evaporation cavity changes into the second phase, heat is brought from the heating element area to the area where the heat dissipation flow channel is located to be diffused, meanwhile, the phase change medium enters the first pipeline and the piston tube to drive the piston to do work, so that the air pressure in the air bag is increased, and as the flexible film layer is flexible, when the air pressure in the air bag is increased, the flexible film layer deforms and bulges to form concave-convex touch feeling, and the anti-skid function is achieved. In the process, the phase change medium of the second phase does work on the piston, so that a part of heat energy is converted into mechanical energy to be consumed, the heat can be rapidly dissipated, the temperature of the electronic equipment is reduced, and the anti-skid effect of the shell can be realized. Meanwhile, the phase change medium of the second phase enters the heat dissipation flow channel, heat dissipation and condensation are changed into the first phase again, and the first phase flows back into the evaporation cavity through the second pipeline to complete heat dissipation circulation, and heat is transferred from the heating element area to other areas of the electronic equipment, so that heat dissipation efficiency can be accelerated.

These and other aspects of the application will be more readily apparent from the following description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view taken along line A-A in fig. 1.

Fig. 3 is an exploded view of a housing assembly according to an embodiment of the present application.

Fig. 4 is a cross-sectional view of a housing provided by an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a heat dissipation membrane in a housing according to an embodiment of the present application.

Fig. 6 is a schematic view of a partial sectional structure of the housing shown in fig. 5.

Fig. 7 is a schematic view of a partial cross-sectional structure of another housing according to an embodiment of the present application.

Fig. 8 is a schematic view of a partial cross-sectional structure of still another housing according to an embodiment of the present application.

Fig. 9 is a schematic view of the case shown in fig. 8 in a state where the concave-convex variation process occurs in the flexible film layer.

Fig. 10 is a schematic structural diagram of a heat dissipation membrane in another housing according to an embodiment of the present application.

Fig. 11 is a schematic view of a partial sectional structure of the case shown in fig. 10.

Fig. 12 is a flowchart of a method for manufacturing a housing according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become an indispensable tool. When facing to mobile terminal products of the full-scale of the tourmaline, consumers not only need to consider whether the functions of the products meet the requirements of themselves, but also the appearance of the products is one of important factors for controlling whether the consumers purchase the products or not. However, as mobile terminals iterate, the appearance of mobile terminals of various brands gradually tends to be homogenous, and the appearance recognition degree is poor. In the related art, the casing of the electronic device is often made of metal, glass, ceramic, etc., and is usually designed to have a smooth shape for uniform color, but has a risk of easily slipping when being held.

In the related art, heat dissipation of electronic equipment is generally realized by attaching a graphite heat conducting fin in a middle frame, so that the heat dissipation efficiency of the heat dissipation mode is lower, and although the graphite heat conducting fin can take away the heat of a heating area, the heat cannot be quickly dissipated, and the overall temperature of the electronic equipment can be quickly increased.

Based on this, the inventors of the present application have proposed a housing, a housing assembly, and an electronic device of various embodiments of the present application to at least partially solve the above-mentioned drawbacks. Embodiments of the present application are specifically described below with reference to the accompanying drawings.

As shown in fig. 1 and 2, the present embodiment provides an electronic device 10, which includes a housing assembly 110 and a heat generating assembly (not shown), wherein the heat generating assembly is located in the housing assembly 110, and the electronic device 10 further includes a display screen 120, a motherboard, a battery 140, a front camera 130, and the like. The heat generating component may be, for example, one or more of a chip, a battery 140, a motherboard, etc., which is not limited herein. The main board and the battery 140 are disposed in the housing assembly 110, and the front camera 130 is disposed on the display 120 side of the electronic device 10. The electronic device 10 provided in the present embodiment is described by taking a mobile phone as an example, but is not limited thereto. The display screen 120 may employ an LCD (Liquid Crystal Display ) screen for displaying information, which may be a TFT (ThinFilm Transistor ) screen or an IPS (In-Plane Switching) screen or an SLCD (Splice Liquid Crystal Display, split-dedicated liquid crystal display) screen. In other embodiments, the display screen 120 may employ an OLED (Organic Light-Emitting Diode) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light Emitting Diode ) screen or a Super AMOLED (Super Active Matrix Organic Light Emitting Diode, super active driving Organic Light Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus, magic screen) screen.

Referring to fig. 2 and 3, the housing assembly 110 includes a middle frame 111, a front shell 112 and a housing 200, the middle frame 111 includes a middle plate 1111 and a frame 1112, the frame 1112 is disposed around an edge of the middle plate 1111 and protrudes from the middle plate 1111, and the frame 1112 protrudes from the middle plate 1111 on two opposite sides of the middle plate 1111. The display 120 is mounted to the front case 112. The front shell 112 and the shell 200 are respectively assembled on two opposite sides of the middle plate 1111, and the front shell 112 and the shell 200 are assembled and fixed with the frame 1112; the housing 200, the middle frame 111 and the front shell 112 together form a housing cavity, and various components such as a motherboard, a camera 130, an antenna, a processor and the like can be arranged in the housing cavity.

In this embodiment, referring to fig. 4, the housing 200 includes a substrate 210, a heat dissipation film 230 and a flexible film 240, the substrate 210 has a first surface 201 and a second surface 202 opposite to each other, the first surface 201 faces the accommodating cavity 102, and the first surface 201 and the second surface 202 are substantially parallel to each other. The substrate 210 may have a transparent structure or a non-transparent structure. To increase the overall rigidity of the housing 200, the substrate 210 may be made of a hard material, such as hard plastic, ceramic, glass, metal, or the like. Preferably, in order to make the housing have a better heat conduction effect, the substrate 210 may be made of a material with a higher heat conduction coefficient, for example, metal.

The substrate 210 may be a substantially rectangular plate, and the edge of the substrate 210 may be provided with a certain arc, so that the electronic device 10 has a better holding feel. The substrate 210 may include opposite first and second edges, and opposite third and fourth edges, wherein the first and second edges are connected between the third and fourth edges, and the first, third, second, and fourth edges are connected end-to-end to form an outer edge of the substrate 210. The first and second edges may be disposed along a length direction of the substrate 210, and the third and fourth edges may be disposed along a width direction of the substrate 210.

The substrate 210 may further be provided with a camera mounting hole 201 for mounting a rear camera of the electronic device 10, the camera mounting hole 201 may penetrate through the substrate 210, and the camera mounting hole 201 may be a rectangular hole or a circular hole, etc., which is not limited herein.

The substrate 210 may include a first region 211 and a second region 212, wherein the first region 211 and/or the second region 212 may be continuous or discontinuous, and is not limited herein. As an embodiment, the first region 211 may be located at a substantially middle position of the substrate 210, and the second region 212 may be located near an edge of the substrate 210.

The heat dissipation film 230 is disposed in the first region 211 of the substrate 210, specifically, the heat dissipation film 230 is disposed on the second surface 202 of the substrate 210, that is, on a side of the substrate 210 away from the accommodating cavity, and may be disposed corresponding to the heat generating components such as the battery 140, the chip, the motherboard, etc., so as to achieve heat conduction through the substrate 210. In addition, a heat conducting material may be disposed between the substrate 210 and the heat generating component, and the heat conducting material may be, for example, a heat conducting silica gel, a graphite sheet, a heat pipe, or the like. In the use process of the electronic device 10, the heat generating component generates more heat, so that the temperature of the area where the heat generating component is located rises faster, especially in the long-term use process of the electronic device 10, the temperature of the area where the heat generating component is located is very high, and the situation of scalding hands occurs.

Referring to fig. 5 and 6, the heat dissipation diaphragm 230 includes an evaporation chamber 231, a heat dissipation flow channel 232, a first pipe 233, a second pipe 234, a piston pipe 235, and a piston 236. The evaporation cavity 231 may be disposed corresponding to one or more heat generating components in the electronic device 10, that is, the evaporation cavity 231 is located in a region where the heat generating components are located, and the heat generating components may include at least one of a battery 140, a chip, and a motherboard, for example. The heat dissipation runner 232 may be disposed corresponding to a non-heat generating component within the electronic device 10, which refers to a component that generates less heat or does not generate heat during operation, such as the middle frame 111. I.e., the heat dissipation runner 232 is located in the area of the electronic device 10 where the non-heat generating components are located, and serves as a condensation chamber.

The heat dissipation flow channel 232 has an inlet (not shown) and an outlet (not shown), the evaporation chamber 231 communicates with the inlet through a first pipe 233 and the outlet through a second pipe 234, forming a loop through which the phase change medium circulates. The piston tube 235 is communicated with the first pipeline 233 and the air bag 241, the piston 236 is arranged in the piston tube 235, and when the air pressure in the piston tube 235 changes, the piston 236 can freely move in the piston tube 235 and is connected with the wall of the piston tube 235 in an airtight manner, so that the air at two sides of the piston 236 cannot be communicated with each other, and the piston 236 can be made of materials such as silica gel, sponge, rubber and the like. The bladder 2414 may comprise a plurality of discretely-distributed bladders, each in communication with the piston tube 235, the plurality of discretely-distributed bladders having the same internal air pressure.

The evaporation chamber 231 is filled with a phase change medium (not shown) in a first phase, which is a liquid phase at normal temperature, and a second phase, which is a gas phase, which is a phase change medium after heating, such as water, ethanol, etc. In this embodiment, the phase-change medium may be a fluorinated liquid, the boiling point of which may be between 40 and 45 ℃, and the advantage of the fluorinated liquid as the phase-change medium is that the boiling point of the fluorinated liquid is low, and the phase-change medium can be gasified at a temperature of 40 to 45 ℃, so when the fluorinated liquid is applied to the electronic device 10, the phase-change medium can be transformed at a lower temperature, which is beneficial to rapidly taking away heat and improving the heat dissipation effect. Note that, the heat dissipation flow channel 232 may be filled with a part of the phase change medium, which is not limited herein.

The flexible film layer 240 is disposed at least in the second area 212, and the flexible film layer 240 is located on a side of the housing 200 away from the middle frame 111 and can be used as a part of the external appearance surface of the electronic device 10. Specifically, the flexible film layer 240 is disposed on the second surface side of the substrate 210 and may be disposed adjacent to the heat dissipation film 230, so that the housing is smoother and suitable for being held. In a more specific embodiment, as shown in fig. 6, the flexible film layer 240 may be disposed on both the first region 211 and the second region 212, and the flexible film layer 240 directly serves as a part of the exterior surface of the electronic device 10. At this time, the flexible film 240 covers the heat dissipation membrane 230, and a plurality of air bags 241 are formed between the flexible film 240 and the second region 212 of the substrate 210, and the air bags 241 are filled with a gas, which may be air. As a more preferable oneIn particular, balloon 241 may be filled with an inert gas such as helium (He), argon (Ar), nitrogen (N) ₂ ) Etc. The advantage of filling inert gas is that the gas is relatively stable and is not easy to change chemically during heating.

Each of the air bags 241 is communicated with the piston tube 235, and when the air pressure in the air bag 241 is the same as the air pressure in the first pipe 233, the piston 236 is in an equilibrium state in the piston tube 235, and is kept stationary. When the air pressure in the first pipe 233 is greater than the air pressure in the air bag 241, the piston 236 moves in the piston tube 235 toward the direction approaching the air bag 241, the air pressure in the air bag 241 increases and eventually reaches equilibrium with the air pressure in the piston tube 235 until the piston 236 stops moving. When the air pressure in the first conduit 233 is less than the air pressure in the air bladder 241, the piston 236 moves in a direction away from the air bladder 241, the air pressure in the air bladder 241 decreases and eventually reaches equilibrium with the air pressure in the piston tube 235 until the piston 236 stops moving.

The plurality of air bags 241 may be directly formed by the flexible film 240 and the substrate 210, and in this case, the flexible film 240 may be configured to have a structure with a plurality of cavities, be fixed to the second area 212 of the substrate 210 by bonding, and define the plurality of air bags 241 together with the second area 212.

Alternatively, referring to fig. 7, the housing may further include a spacer 250, the spacer 250 being connected between the flexible membrane layer 240 and the substrate 210. In this arrangement, the flexible film 240 is bonded to the spacer 250 and the heat dissipation film 230 directly after the spacer 250 is disposed on the substrate 210, so that the air bag 241 is defined between the flexible film 240, the spacer 250 and the substrate 210.

Alternatively, referring to fig. 8, the housing may further include a substrate layer 260 and a spacer 250, the substrate layer 260 being disposed in the second region 212, the flexible membrane layer 240 being disposed opposite the substrate layer 260, the spacer 250 being connected between the flexible membrane layer 240 and the substrate layer 260 such that the flexible membrane layer 240 is disposed opposite the substrate layer 260, the flexible membrane layer 240 and the substrate layer 260 defining a plurality of air cells 241 therebetween. In this arrangement, the spacer 250 is directly disposed on the base layer 260 without excessive processing of the flexible film 240, and then the flexible film 240 is bonded to the spacer 250 and the heat dissipation film 230. Meanwhile, the flexible film 240, the substrate 260 and the spacer 250 may be prefabricated and then disposed on the polar plate 210, thereby simplifying the manufacturing process.

As a more specific embodiment, the spacer 250 may be a frame glue, the substrate layer 260 may be made of polyethylene terephthalate (polyethylene terephthalate, PET), and the flexible film layer 240 may be made of a polymer film, for example, polypropylene, polycarbonate, or the like. By providing the base layer 260, the base layer 260 and the flexible film 240 may be formed into an airbag structure through the spacer 250, and then directly disposed on the substrate 210 together with the heat dissipation film 230, thereby reducing the manufacturing process steps.

In this embodiment, the air passages 242 are formed on the spacer 250, and the plurality of air bags 241 are communicated with each other through the air passages 242, so that a larger number of air bags 241 can be formed in the second area 212, which is beneficial to playing a better anti-slip role when the air bags 241 are inflated later, and the air pressure balance among the plurality of air bags 241 can be better ensured, so that the air in the plurality of air bags can flow through each other rapidly. In another embodiment, the plurality of air bags 241 may also communicate with the piston tube 235 independently of each other.

As shown in fig. 9, when the evaporation chamber 231 is heated, the phase-change medium in the first phase changes into the second phase, and enters the first pipe 233, and at this time, the air pressure in the first pipe 233 increases, and the air pressure in the piston pipe 235 increases, so that the piston 236 moves in a direction approaching the air bag 241, and works on the air in the air bag 241, resulting in an increase in the air pressure in the air bag 241. Since the flexible film 240 is flexible and may be deformed, the position of the flexible film 240 corresponding to the balloon 241 may be raised due to the increase of pressure. Since the positions of the plurality of air bags 241 are discrete, the flexible film layer 240 may form a plurality of concave-convex structures at the discrete positions, and a user may play a role in preventing slipping when holding.

At the same time, the phase change medium in the second phase entering the first pipe 233 enters the heat dissipation flow channel 232, and the temperature of the phase change medium in the second phase is higher. Since the area corresponding to the heat dissipation flow channel 232 is a non-heat-generating area, the temperature is lower than that of the area where the evaporation cavity 231 is located, which corresponds to the condensation cavity, so that the heat of the phase change medium in the second phase gradually diffuses, the temperature is reduced, and the phase change medium in the second phase at least partially re-condenses and changes into the first phase. In this process, part of the heat generated by the heat generating component is carried from the area where the heat generating component corresponding to the evaporation cavity 231 is located to the area where the heat dissipating flow channel 232 is not the heat generating component, so that the heat dissipating efficiency is improved, and the temperature of the area where the heat generating component is located is reduced more rapidly.

In order to improve the heat dissipation efficiency of the heat dissipation runner 232, the heat dissipation runner 232 may include a plurality of capillaries that are mutually communicated, and each capillary may be independently extended, so that the heat dissipation area of the phase-change medium may be increased, and the purpose of rapid condensation is achieved. When the phase-change medium of the second phase enters the heat dissipation flow channel 232, a small amount of the phase-change medium of the second phase may not be condensed and phase-changed into the first phase, and the phase-change medium of the first phase may enter the subsequent second pipeline 234 along with the phase-change medium of the first phase and flow back to the evaporation cavity 231.

In order to control the phase change medium in the evaporation chamber 231 to enter the heat dissipation flow channel 232 only after being gasified, the heat dissipation diaphragm 230 may further include a one-way pressure valve 238, and the one-way pressure valve 238 may control the phase change medium phase-changed into the second phase to flow in one direction. Specifically, the one-way pressure valve 238 controls the phase-change medium to flow only in one direction from the evaporation chamber 231 side to the heat dissipation flow path 232 side, preventing the phase-change medium in the first pipe 233 from flowing back to the evaporation chamber 231. Meanwhile, the one-way pressure valve 238 may be configured to be automatically opened when the external pressure is greater than a preset threshold value, and to be automatically closed when the external pressure is less than the preset threshold value, so as to realize self-opening or closing without providing an additional control device to control the one-way pressure valve 238 to be opened or closed.

The one-way pressure valve 238 is located between the communication port 2331 of the first conduit 233 and the evaporation chamber 231 and the communication port 2332 of the first conduit 233 and the piston tube 235. The one-way pressure valve 238 may be opened only after the phase-change medium in the evaporation chamber 231 is gasified, so that frequent flow of the phase-change medium can be prevented, and sound is generated. When the one-way pressure valve 238 is in the closed state, the phase change medium cannot enter the first conduit 233. The one-way pressure valve 238 may be a solenoid valve and may be electrically connected to a motherboard of the electronic device 10, and may be controlled to open or close by a processor integrated on the motherboard.

Due to uneven heating of the evaporation cavity 231 and the heat dissipation flow channel 232, the vapor pressure of the phase change medium in the evaporation cavity 231 gradually increases, when the vapor pressure in the evaporation cavity 231 is greater than or equal to a preset threshold value, the one-way pressure valve 238 is automatically opened, and the vaporized phase change medium enters the first pipeline 233 and is condensed and liquefied in the heat dissipation flow channel 232 to reform the liquid phase change medium.

In order to prevent the phase change medium entering the evaporation chamber 231 from entering the heat dissipation channel 232 through the second pipe 234, referring to fig. 5, the heat dissipation membrane 230 of the present embodiment may further include a check valve 239. Specifically, a check valve 239 may be disposed at a communication port 2341 between the heat dissipation flow channel 232 and the second pipe 234, for preventing the phase change medium in the second pipe 234 from flowing back to the heat dissipation flow channel 232. The check valve 239 may be configured to open only when the phase change medium of the first phase reaches the second conduit 234, avoiding backflow of the phase change medium into the second conduit 234 into the heat dissipation flow channel 232. In a more specific embodiment, the check valve 239 may be a solenoid valve and may be electrically connected to the motherboard of the electronic device 10, and may be turned on or off by a processor integrated on the motherboard.

The working principle of the housing 200 provided in this embodiment is:

when the heating component area where the evaporation cavity 231 is located generates more heat, the phase-change medium of the first phase in the evaporation cavity 231 absorbs heat and changes phase into the second phase, the vapor pressure in the evaporation cavity 231 is gradually increased, so that the one-way pressure valve 238 is opened, the phase-change medium of the second phase enters the first pipeline 233, part of the phase-change medium enters the piston tube 235, the vapor pressure in the piston tube 235 is increased, the piston 236 is pushed to do work, the air pressure in the air bag 241 is increased, the position of the flexible film 240 corresponding to the air bag 241 is deformed and swelled, concave-convex touch feeling is formed, an anti-slip effect is achieved, the heat carried by the phase-change medium is converted into mechanical energy of the piston 236, and the temperature of the phase-change medium is reduced.

When the phase-change medium of the second phase enters the first pipe 233, the temperature of the area where the heat dissipation flow channel 232 is located is relatively low, so that the phase-change medium of the second phase is at least partially condensed and re-phase-changed into the first phase, and then the phase-change medium flows back to the evaporation cavity 231 through the second pipe 234, so as to complete the heat dissipation cycle, and the heat generated by the heat generating component is dissipated through the heat dissipation membrane 230, so that a good heat dissipation effect is achieved.

When the heat generation amount of the heating element region where the evaporation cavity 231 is located is reduced, the phase change medium of the first phase in the evaporation cavity 231 does not continue to change phase, at this time, the vapor pressure in the first pipe 233 is gradually reduced, the vapor pressure in the air bag 241 is greater than the vapor pressure in the piston tube 235, and the gas in the air bag 241 pushes the piston 236 to move away from the air bag 241 until the vapor pressure in the air bag 241 is gradually balanced with the vapor pressure in the first pipe 233, and the raised air bag 241 gradually returns to the initial state by the elastic restoring force of the flexible film 240.

In the case 200 provided in this embodiment, the heat dissipation membrane 230 not only can conduct heat from a high temperature region to a low temperature region in the electronic device 10, but also can apply work to the piston 236 during the conduction process, so that the flexible membrane layer 240 generates concave-convex touch, and the anti-slip effect of the electronic device 10 is improved. Because a portion of the heat is consumed during the work done by the piston 236, the heat is dissipated more quickly, facilitating heat dissipation.

In an application scenario such as watching a video or playing a game, the heat generated by the electronic device 10 is large, and at this time, the user usually holds the electronic device 10 with both hands, especially holds both ends of the electronic device 10 in the length direction. At this time, in order to provide the electronic device 10 with a better anti-slip effect, in another embodiment, referring to fig. 10, the first region 211 is located at a substantially middle position of the electronic device 10, and the second region 212 includes two discrete regions, which are located at two sides of the first region 211 along the length direction of the housing.

The plurality of air bags 241 are distributed on two sides of the first area 211, so that when the phase change medium is changed into the second phase due to the heated phase change and enters the first pipeline 233 from the evaporation cavity 231, the piston 236 is driven to move, the pressure in the air bags 241 is increased, the flexible film layers 240 are deformed and swelled, at this time, the flexible film layers 240 on two sides of the first area 211 can form concave-convex structures, and the anti-slip effect of a user during holding can be improved. In this embodiment, the number of the air bags 241 can be larger, so that more heat can be consumed when the piston 236 moves to do work, and the heat dissipation effect is improved.

In this embodiment, the piston tube 235 includes a first piston tube 2351 and a second piston tube 2352, the first piston tube 2351 and the second piston tube 2352 are all communicated with the first pipe 233 and are respectively communicated with the air bags 241 at two sides of the first area 211, the first piston tube 2351 and the second piston tube 2352 are each provided with a piston 236, and when the phase change medium changes into the second phase due to the heated phase and enters the first pipe 233 from the evaporation cavity 231, the pistons 236 in the first piston tube 2351 and the second piston tube 2352 are driven to move, so that the pressure in the air bags 241 at two sides of the first area 211 is increased, and the flexible film layers 240 at two sides of the first area 211 are all in a concave-convex structure.

Of course, in other embodiments, the first piston tube 2351 and the second piston tube 2352 may not be provided, and the air bags 241 on both sides of the first region 211 may be connected by the air passage 242 as described above, which is not limited herein.

Although not shown in the present embodiment, the person skilled in the art may also arrange the second region 212 and the first region 211 in other arrangements, for example, the second region 212 is arranged around the first region 211, or other arrangements, which are not limited to the arrangement of the first region 211 and the second region 212 in the present application.

In order to increase the holding feel of the housing, in one embodiment, as shown in fig. 11, the housing may further include a flexible leather layer 220, where the flexible leather layer 220 is disposed on the surface of the heat dissipation film 230 and the flexible film 240 away from the substrate 210. At this time, the flexible film layer 240 may cover only the second region 212 of the substrate 210, and of course, the flexible film layer 240 may cover the heat dissipation film 230 of the first region 211 and the second region 212 at the same time, which is not limited herein. The flexible leather layer 220 can be made of artificial leather, leather and other materials, so that the whole touch feeling of the electronic device 10 is better, and because the flexible leather layer 220 is flexible and deformable, when the air pressure in the air bag 241 is increased and the flexible film layer 240 is raised, the flexible leather layer 220 also forms a concave-convex structure, and the anti-skid function can be also achieved.

The flexible leather layer 220 may completely cover the substrate 210, and may be directly connected and fixed to the edge of the substrate 210 by bonding, sewing, or the like.

The embodiment also provides a preparation method of the shell, as shown in fig. 12, comprising the following steps:

step S110: a substrate 210 is provided.

Step S120: a heat dissipation membrane 230 is formed in the first region 211 of the substrate.

The heat dissipation membrane 230 may be a planar membrane structure, for example, the heat dissipation membrane 230 may be formed by two opposite planar membranes, and edges of the two planar membranes are connected to form various structures such as an internal evaporation cavity 231, a heat dissipation runner 232, a first pipeline 233, a second pipeline 234, a piston tube 235, and the like. The heat dissipation film 230 may also be formed by welding two metal plates through edge sealing, which is not limited herein. The heat dissipation film 230 may be prepared in advance and then formed in the first region 211 by bonding, welding, etc., which is not limited herein. After the heat dissipation membrane 230 is disposed in the first region 211, the piston tube 235 may be reserved with an opening for communication with the subsequent air bag 241.

Step S130: a flexible membrane layer 240 is disposed in the second region 212 of the substrate such that a plurality of air pockets 241 are formed between the flexible membrane layer 240 and the substrate 210, communicating the air pockets 241 with the piston tubes 235 in the heat dissipating membrane 230.

In one embodiment, the flexible membrane 240 is prefabricated in the form of a plurality of bladder structures, then is directly attached to the second area 212, the bladder structures are sealed by the substrate 210 to form the bladder 241, and then the bladder 241 is communicated with and sealed from the opening of the piston tube 235 by edge sealing, welding, or the like. The air may be naturally filled into the air bag 241 during the formation of the air bag 241, or the inert gas may be filled into the air bag 241 after the formation of the air bag 241, and the air therein may be substituted and discharged and then communicated with the piston tube 235.

In another embodiment, a base layer 260 is disposed in the second region 212, a spacer 250 is disposed on the base layer 260 to form a partitioned cavity structure, a flexible film 240 is connected to the side of the spacer 250 away from the substrate 210, and the cavity is closed to form a balloon 241. When it is necessary to communicate the plurality of air bags 241, the air passages 242 may be opened in advance on the spacers 250 so that the chambers formed by the separation communicate with each other.

In order to improve the touch feel of the shell, the method may further include step S140: a flexible leather layer 220 is disposed on the heat dissipation membrane 230 and the surface of the flexible film layer 240 away from the substrate 210. The flexible leather layer 220 may be directly attached to the edge of the substrate 210 by bonding, sewing, or the like.

The step S120 and the step S130 may be performed simultaneously, or the step S120 may be performed before the step S130 is performed, or the step S130 may be performed before the step S120 is performed, which is not limited herein.

The casing 200, the casing assembly 110 and the electronic device 10 provided in this embodiment can improve the anti-slip effect of the casing, and meanwhile, since the heat dissipation membrane 230 converts part of heat energy into mechanical energy of the piston 236 in the process of heat dissipation circulation, heat can be dissipated more rapidly, and heat dissipation efficiency can be improved.

The electronic device 10 of the present application may be a mobile phone or a smart phone (e.g., an iPhone-based (TM) -based phone), a Portable game device (e.g., nintendo DS (TM) -PlayStation Portable (TM) -Gameboy Advance TM, iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices such as watches, headphones, pendants, headphones, and the like. The electronic device 10 may also be other wearable devices such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices or smart watches, head Mounted Devices (HMDs).

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (14)

1. A shell is characterized by comprising a substrate, a heat dissipation membrane and a flexible membrane layer,

the heat dissipation membrane is arranged on the substrate and comprises an evaporation cavity, a heat dissipation flow channel, a first pipeline and a second pipeline, wherein the evaporation cavity is communicated with an inlet of the heat dissipation flow channel through the first pipeline and is communicated with an outlet of the heat dissipation flow channel through the second pipeline;

a plurality of air bags are formed between the flexible film layer and the base plate, the air bags are communicated with the first pipeline through a piston pipe, and a piston capable of freely moving and in airtight contact with the inner wall of the piston pipe is arranged in the piston pipe;

the evaporation cavity is filled with a phase change medium in a first phase, and when the phase change medium is changed into a second phase due to heated phase change and enters the first pipeline from the evaporation cavity, the piston is driven to move so as to change the air pressure in the air bag, and the flexible film layer is deformed.

2. The housing of claim 1, wherein the substrate comprises a first region and a second region, the heat dissipation membrane is disposed in the first region, and the flexible membrane layer is disposed in the second region and covers the heat dissipation membrane.

3. The housing of claim 1, further comprising a flexible leather layer disposed on the heat dissipation membrane and a surface of the flexible film layer remote from the substrate.

4. The housing of claim 1, wherein the substrate includes a first region, and a second region located on both sides of the first region along a length direction of the substrate, the heat dissipation membrane is disposed in the first region, and the plurality of air bags are disposed in the second region.

5. The housing of claim 4, wherein the piston tube comprises a first piston tube and a second piston tube, wherein the first piston tube and the second piston tube are both in communication with the first conduit and are each in communication with the air pockets on both sides of the first region, and wherein the pistons are disposed in the first piston tube and the second piston tube.

6. The housing of any one of claims 1-5, wherein the flexible membrane layer is directly connected to the substrate to define the plurality of air cells.

7. The housing of any one of claims 1-5, further comprising a base layer and a spacer, the flexible film layer disposed opposite the base layer, the spacer coupled between the flexible film layer and the base layer to define the plurality of air cells.

8. The housing of claim 7, wherein the spacer defines a plurality of air passages through which the plurality of air cells communicate with one another.

9. The housing of any one of claims 1-5, wherein the heat-dissipating diaphragm further comprises a one-way pressure valve disposed on the first conduit between the communication port of the first conduit with the evaporation chamber and the communication port of the first conduit with the piston tube for restricting reverse flow of the phase change medium in the first conduit back to the evaporation chamber.

10. The housing of any one of claims 1-5, wherein the heat-dissipating diaphragm further comprises a one-way valve disposed on the second conduit for restricting a phase change medium in the second conduit from flowing back into the heat-dissipating flow path.

11. The housing of any one of claims 1-5, wherein the first phase is a liquid phase, the second phase is a gas phase, and the phase change medium is a fluorinated liquid.

12. A housing assembly comprising a central frame, a front shell and a shell according to any one of claims 1 to 11, the shell and the front shell being mounted to the central frame on opposite sides of the central frame, the flexible membrane layer in the shell being located on a side remote from the central frame.

13. An electronic device, comprising:

the housing assembly of claim 12; and

the heating component is arranged in the shell component, and the evaporation cavity and the heating component are correspondingly arranged.

14. The electronic device of claim 13, wherein the heat generating component comprises at least one of a chip, a motherboard, and a battery.