CN114340259A - Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof - Google Patents
Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof Download PDFInfo
- Publication number
- CN114340259A CN114340259A CN202111640011.2A CN202111640011A CN114340259A CN 114340259 A CN114340259 A CN 114340259A CN 202111640011 A CN202111640011 A CN 202111640011A CN 114340259 A CN114340259 A CN 114340259A
- Authority
- CN
- China
- Prior art keywords
- glue
- pcba
- pouring
- shell
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides a power adapter with an outer shell PCBA filled with glue and a preparation method and application thereof. The preparation method comprises the following steps: placing PCBA in a glue pouring mold, and curing after glue pouring to obtain a semi-finished product; welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell; the PCBA comprises a data line interface; the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold; the height of the data line interface is higher than that of the glue filling port. The invention avoids the influence on the electrical property of the power adapter caused by the filling of the pouring sealant at the bottom or two sides of the shell after the PCBA is arranged in the shell of the power adapter by selecting the technical method of pouring the PCBA outside the shell.
Description
Technical Field
The invention belongs to the technical field of power supply production, and particularly relates to an out-of-shell PCBA glue-filled power adapter and a preparation method and application thereof.
Background
In the prior art, a glue pouring production process for preparing various chargers or power adapters by using PCBA mostly carries out glue pouring in a shell after the PCBA is assembled with the shell of the charger or the adapter.
CN104684324A discloses a glue-pouring sealing production process of a power adapter. The glue pouring sealing production process comprises the following steps: pouring a proper amount of pouring sealant into the lower shell of the power adapter; connecting an upper shell and a lower shell of the power adapter; and (3) carrying out rotary whirl coating operation by taking a vertical central line of a plane where a seam between the upper shell and the lower shell of the power adapter as a rotating center, wherein the rotating speed is higher than 60 revolutions per minute, and the rotating time is at least 3 minutes, so that a uniform sealing glue layer is formed on the inner side surface of the seam after the pouring glue is dried. The glue pouring sealing process provided by the technical scheme can achieve a good sealing effect, and the appearance of the power adapter cannot be influenced.
CN110911286A discloses a preparation method of a waterproof power supply based on a priming coating process. The preparation method comprises the following steps: assembling, namely assembling all the prepared functional components, the circuit board and the power supply shell; testing, namely testing each assembled functional component, circuit board and power supply shell; spraying, namely spraying the surfaces of the tested functional components and circuit boards and the inner side of the power supply shell; airing, namely placing all the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line for natural airing; glue pouring, namely performing quantitative glue pouring on the dried product by using a glue pouring machine; curing, namely placing the product subjected to glue pouring in a room for natural curing or placing the product in a tunnel furnace for heating and curing; and (5) finishing the product, and outputting the finished product of the waterproof power supply after the manufacturing process is finished. According to the technical scheme, the solvent-free base coat is adopted, so that the harm to the environment is reduced, and the problem of potential safety hazard is also reduced.
CN109622323A discloses a glue filling production method of a new energy automobile wireless charger. The glue pouring production method comprises the following steps: step 1, first glue pouring: glue is poured between the coil panel and a bottom shell of the shell, wherein the shell comprises the bottom shell and an upper cover, and a fixed plate, a magnetic core and the coil panel are sequentially arranged in the bottom shell from top to bottom; step 2, glue pouring for the second time: the encapsulating is between magnetic core and coil panel, and between magnetic core and the fixed plate: step 3, third glue pouring: and after the upper cover of the shell is assembled, glue is filled into the shell. According to the technical scheme, the glue can be fully permeated into the small-gap area through the three-time glue pouring process, and the problems that the glue is not uniformly distributed and the heat dissipation is seriously influenced are avoided.
CN110246672A discloses a potting process of a potting transformer. The glue pouring process comprises the following steps: (1) arranging a plurality of transformer shells in order in the basin for batch production and turnover; (2) injecting quantitative glue adapted to the product into the transformer shell; (3) the transformer is placed into the transformer housing and pressed down until the transformer is completely immersed by the glue. This technical scheme adopts earlier to pour into glue into the product shell, then puts into the transformer and pushes down, and the transformer sinks the in-process, and glue in the shell rises, because the transformer bottom contacts with glue earlier, the air of transformer bottom can be got rid of completely, can not produce the bubble, and the transformer that does not have air to remain is also wrapped up by glue completely, has not only reached insulating nature, and need not the glue residue on post processing shell and the pin.
As can be seen from the above, in the prior art, no matter the charger, the power adapter or the transformer is prepared, the electronic component and the housing are assembled together, and then the housing is filled with glue. However, with the development of society and the improvement of requirements for electronic devices, in the process of preparing power chargers for some electronic products, after the PCBA is installed in the housing, the bottom or both sides of the PCBA are not allowed to be filled with potting adhesive, so as to avoid affecting the electrical performance of the PCBA.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a power adapter with an outer shell PCBA glue filled, and a preparation method and application thereof. According to the invention, by selecting the technique of pouring the PCBA outside the shell, the problem that the electrical property of the power adapter is influenced due to the fact that the pouring sealant is filled at the bottom or two sides of the PCBA when pouring the PCBA into the shell of the power adapter is carried out is avoided; meanwhile, the height of the data line interface in the PCBA is higher than that of the glue pouring opening in the glue pouring mold, so that the problem that the power adapter cannot be used due to the fact that pouring glue enters the data line interface in the glue pouring process is avoided, and the reject ratio of the power adapter is reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a method for preparing a power adapter with an outer shell PCBA filled with glue, which comprises the following steps:
step (1): placing the PCBA in a glue pouring mold, and curing after glue pouring to obtain a semi-finished product;
step (2): welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
In the invention, the shell PCBA potting adhesive is a novel potting adhesive process designed aiming at the problem that after the PCBA is arranged in the shell of the power adapter, the potting adhesive is not allowed to be filled from the bottom (the direction of the data wire interface position) to the top (the direction opposite to the data wire interface), so that the PCBA is arranged in a potting adhesive mold according to the design requirement direction (the direction opposite to the data wire interface) as the bottom, and then the potting adhesive is filled. The invention avoids the problem that the electrical property of the power adapter is influenced because the pouring sealant is filled at the bottom or two sides of the shell when the PCBA is filled into the shell of the power adapter for pouring the glue by selecting the technique of pouring the PCBA outside the shell.
Meanwhile, according to the invention, the height of the data line interface in the PCBA is higher than that of the glue pouring opening in the glue pouring mold, so that the problem that the power adapter cannot be used due to the fact that pouring glue enters the data line interface in the glue pouring process is avoided, and the reject ratio of the power adapter is reduced.
It should be noted that, in the invention, no special limitation is made on the position of the glue filling opening in the glue filling mold, and the height of the glue filling opening is only required to be lower than that of the data line interface.
The following is a preferred technical solution of the present invention, but not a limitation to the technical solution provided by the present invention, and the object and advantageous effects of the present invention can be better achieved and achieved by the following preferred technical solution.
In a preferred embodiment of the present invention, the viscosity of the potting adhesive used in the potting process is 2000 to 4500 mPas, and may be, for example, 2000 mPas, 2500 mPas, 3000 mPas, 3500 mPas, 4000 mPas, or 4500 mPas.
It should be noted that, in the present invention, there is no particular limitation on the type of the potting adhesive, and examples include but are not limited to: UB-5203A/B two-component pouring sealant produced by Youbang materials science and technology Limited. The UB-5203A/B two-component pouring sealant needs to be stirred for 30min in advance before use, so that the component A and the component B are fully and uniformly mixed.
As the preferable technical scheme of the invention, the glue pouring method is to use a glue pouring machine to pour glue.
As a preferable technical scheme of the invention, the glue discharging speed of the glue-pouring machine is 0.5-1.5 g/s, for example, 0.5g/s, 0.6g/s, 0.7g/s, 0.8g/s, 0.9g/s, 1g/s, 1.1g/s, 1.2g/s, 1.3g/s, 1.4g/s or 1.5 g/s.
Preferably, the glue-pouring weight of the glue-pouring machine to each PCBA is 25-30 g, for example, 25g, 26g, 27g, 28g, 29g or 30 g.
The invention can achieve better glue pouring effect by controlling the glue discharging speed and the glue pouring weight of the glue pouring machine within a specific range, can avoid the problem that the bottom or two sides of the PCBA are filled with the pouring glue due to too high glue discharging speed or too much glue pouring weight, and also meets the requirement of industrial production.
As a preferred technical scheme of the invention, the curing method is to place the PCBA after glue pouring into baking equipment for curing.
Preferably, the curing time is 15-20 min, such as 15min, 16min, 17min, 18min, 19min or 20 min.
As a preferable technical scheme of the invention, the length of the baking equipment is 4-6 m, for example, 4m, 4.2m, 4.4m, 4.6m, 4.8m, 5m, 5.2m, 5.4m, 5.6m, 5.8m or 6m, etc.
Preferably, the toasting device comprises at least 2 temperature zones, which may for example be 2, 3, 4 or 5.
According to the invention, through the arrangement of the plurality of temperature zones, the pouring sealant is cured for multiple times in the curing process, and the pouring sealant has higher curing degree after multiple curing, so that the prepared pouring sealant has better service performance and electrical property.
Preferably, the temperature of each temperature zone is 115-125 ℃, and can be 115 ℃, 116 ℃, 117 ℃, 118 ℃, 119 ℃, 120 ℃, 121 ℃, 122 ℃, 123 ℃, 124 ℃ or 125 ℃ and the like.
As a preferred embodiment of the present invention, the PCBA further includes a power supply lead interface.
Preferably, the method for welding the semi-finished product and the power supply lead on the power supply shell in the step (2) comprises the following steps: and inserting the power lead of the power shell into the outer lead interface and then welding.
As a preferred technical scheme of the invention, the preparation method specifically comprises the following steps:
step (1): placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 15-20 min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 0.5-1.5 g/s, the glue pouring weight is 25-30 g, the baking equipment at least comprises 2 temperature zones, and the temperature of each temperature zone is respectively and independently selected from 115-125 ℃;
step (2): welding the semi-finished product obtained in the step (1) with a power supply lead on a power supply shell, and then assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the mold;
the height of the data line interface is higher than that of the glue filling port.
In a second aspect, the present invention provides a power adapter prepared by the preparation method of the first aspect.
In a third aspect, the invention provides a use of the power adapter of the second aspect in a terminal device charger.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, by selecting the technique of pouring the PCBA outside the shell, the problem that the electrical property of the power adapter is influenced due to the fact that the pouring sealant is filled at the bottom or two sides of the PCBA when pouring the PCBA into the shell of the power adapter is carried out is avoided; meanwhile, the height of the data line interface in the PCBA is higher than that of the glue pouring opening in the glue pouring mold, so that the problem that the power adapter cannot be used due to the fact that pouring glue enters the data line interface in the glue pouring process is avoided, and the reject ratio of the power adapter is reduced;
(2) the hardness, electrical property and reliability test of the power adapter prepared by the process method of the shell PCBA potting adhesive provided by the invention all meet the use standard, the hardness is 67-69 HA, the test value of PD20V Vbus @4.5 is 19.741-19.867V, the test value of PD20V EFF4 is 90.36-90.91%, the PF value is 0.9761-0.9794, and the reliability test value is-7.1-4.4 dB.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Some of the component sources in the following examples and comparative examples are as follows:
pouring sealant: UB-5203A/B two-component pouring sealant from Youbao Youbang materials science and technology GmbH.
Example 1
The embodiment provides a power adapter with an outer shell PCBA filled with glue and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 15min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 1g/s, the glue pouring weight is 28g, the baking equipment comprises 5 temperature areas which are connected in sequence, and the temperature of each temperature area is 120 ℃;
(2) welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
Example 2
The embodiment provides a power adapter with an outer shell PCBA filled with glue and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 20min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 0.5g/s, the glue pouring weight is 25g, the baking equipment comprises 3 temperature areas which are sequentially connected, and the temperature of each temperature area is 115 ℃;
(2) welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
Example 3
The embodiment provides a power adapter with an outer shell PCBA filled with glue and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 18min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 1.5g/s, the glue pouring weight is 30g, the baking equipment comprises 2 connected temperature areas, and the temperature of each temperature area is 115 ℃;
(2) welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
Example 4
The embodiment provides a power adapter with an outer shell PCBA filled with glue and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 18min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 1.2g/s, the glue pouring weight is 27g, the baking equipment comprises 4 temperature areas which are sequentially connected, and the temperature of each temperature area is respectively and independently selected from 118 ℃;
(2) welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
Example 5
The embodiment provides a power adapter with an outer shell PCBA filled with glue and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, placing the PCBA in baking equipment, and curing for 15min at 120 ℃ to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 1g/s, and the glue pouring weight is 28 g;
(2) welding the semi-finished product obtained in the step (1) with a power supply lead of a power supply shell, and assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
Comparative example 1
The present comparative example provides a power adapter with PCBA potted in the case and a method for manufacturing the same, and the difference from example 1 is that the PCBA is placed in the case of the power adapter for potting, and the other conditions are the same as example 1.
The performance of the power adapters provided in the above examples and comparative examples was tested by the following method:
1. and (3) hardness testing: the cured potting adhesive of the power adapters provided in the above examples and comparative examples was tested using a GS-709N shore durometer (type a);
2. and (3) testing electrical properties: performing electrical test by using a Chroma63600-5 electronic load, a Chroma66204 power meter, a Chroma61604 Ac source, an MDO3014 oscilloscope, a test child jig and a test mother jig;
wherein PD20V Vbus @4.5 is: the PD protocol 20V 4.5A outputs current;
PD20V EFF 4: PD protocol 20V efficiency;
3. reliability test (conduction test): the power adapters provided in the above examples and comparative examples were tested using an EMI receiver/FFT 3010 in accordance with the EN55032 standard.
The performance test results of the power adapters provided in the above examples and comparative examples are shown in table 1 below:
TABLE 1
As can be seen from the content in Table 1, the invention avoids the influence on the electrical property of the power adapter due to the filling of the potting adhesive at the bottom or two sides when the PCBA is filled into the shell of the power adapter after being filled into the shell by selecting the process method of potting the PCBA outside the shell; meanwhile, the height of the data line interface in the PCBA is higher than that of the glue pouring opening in the glue pouring mold, so that the problem that the power adapter cannot be used due to the fact that pouring glue enters the data line interface in the glue pouring process is avoided, and the reject ratio of the power adapter is reduced. The hardness, electrical property and reliability test of the power adapter prepared by the process method of the shell PCBA potting adhesive provided by the invention all meet the use standard, the hardness is 67-69 HA, the test value of PD20V Vbus @4.5 is 19.741-19.867V, the test value of PD20V EFF4 is 90.36-90.91%, the PF value is 0.9761-0.9794, and the reliability test value is-7.1-4.4 dB.
Compared with the embodiment 1, if the curing process of the pouring sealant is one-time curing (embodiment 5), the curing of the pouring sealant is not easy to control, and the reject ratio of the prepared power adapter is high; if the pouring glue is located in the shell of the power adapter (comparative example 1), the pouring glue is located at the bottom of the shell under the action of gravity, elements located at the bottom of the shell cannot be selected and are not filled with the pouring glue, and in the pouring glue process, the pouring glue can easily block a data line interface, so that the power adapter cannot be used, and the reliability test result does not meet the standard.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A preparation method of a power adapter with an outer shell PCBA filled with glue is characterized by comprising the following steps:
step (1): placing the PCBA in a glue pouring mold, and curing after glue pouring to obtain a semi-finished product;
step (2): welding the semi-finished product obtained in the step (1) with a power supply lead on a power supply shell, and then assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the glue pouring mold;
the height of the data line interface is higher than that of the glue filling port.
2. The preparation method of claim 1, wherein the viscosity of the pouring sealant used in the pouring process is 2000-4500 mPa.
3. The preparation method according to claim 1 or 2, characterized in that the glue pouring method is to use a glue pouring machine to perform glue pouring.
4. The preparation method according to claim 3, wherein the glue-pouring speed of the glue-pouring machine is 0.5-1.5 g/s;
preferably, the glue pouring weight of the glue pouring machine to each PCBA is 25-30 g.
5. The method for preparing the PCBA as claimed in any one of claims 1-3, wherein the curing is carried out by placing the PCBA after glue pouring into a baking device for curing;
preferably, the curing time is 15-20 min.
6. The method of claim 5, wherein the baking apparatus comprises at least 2 temperature zones;
preferably, the temperature of each temperature zone is selected from 115-125 ℃ independently.
7. The manufacturing process of any one of claims 1-6, wherein the PCBA further comprises a power lead interface;
preferably, the method for welding the semi-finished product and the power supply lead on the power supply shell in the step (2) comprises the following steps: and inserting the power lead of the power shell into the outer lead interface and then welding.
8. The method according to any one of claims 1 to 7, comprising in particular the steps of:
step (1): placing PCBA in a glue pouring mold, pouring glue by using a glue pouring machine, and then placing the PCBA in baking equipment for curing for 15-20 min to obtain a semi-finished product, wherein the glue discharging speed of the glue pouring machine is 0.5-1.5 g/s, the glue pouring weight is 25-30 g, the baking equipment at least comprises 2 temperature zones, and the temperature of each temperature zone is respectively and independently selected from 115-125 ℃;
step (2): welding the semi-finished product obtained in the step (1) with a power supply lead on a power supply shell, and then assembling the semi-finished product with a power supply adapter shell to obtain the PCBA glue-filled power supply adapter outside the shell;
the PCBA comprises a data line interface;
the glue pouring mold comprises a glue pouring opening, and the glue pouring opening is positioned at the top of the mold;
the height of the data line interface is higher than that of the glue filling port.
9. A power adapter produced by the production method according to any one of claims 1 to 8.
10. Use of a power adapter according to claim 9 in a terminal device charger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111640011.2A CN114340259A (en) | 2021-12-29 | 2021-12-29 | Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111640011.2A CN114340259A (en) | 2021-12-29 | 2021-12-29 | Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114340259A true CN114340259A (en) | 2022-04-12 |
Family
ID=81016588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111640011.2A Pending CN114340259A (en) | 2021-12-29 | 2021-12-29 | Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114340259A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040002235A1 (en) * | 2002-06-27 | 2004-01-01 | Weimin Shi | High performance microprocessor power delivery solution using flex connections |
| US20130221566A1 (en) * | 2012-02-28 | 2013-08-29 | Kenneth Jenkins | Method and apparatus for sky-line potting |
| US20160141808A1 (en) * | 2013-09-25 | 2016-05-19 | Virginia Panel Corporation | High Speed Data Contact Set With Right Angle Termination Insert |
| CN110252599A (en) * | 2019-07-11 | 2019-09-20 | 东莞市奥海科技股份有限公司 | Encapsulating charger and its manufacturing method |
| CN209562392U (en) * | 2019-04-03 | 2019-10-29 | 佛山市顺德区扬威电器有限公司 | A kind of waterproof power supply adaptor |
| CN110708917A (en) * | 2019-11-20 | 2020-01-17 | 上海奉天电子股份有限公司 | Power converter and manufacturing method thereof |
| CN113242670A (en) * | 2021-04-16 | 2021-08-10 | 华为技术有限公司 | Power adapter and manufacturing method thereof |
-
2021
- 2021-12-29 CN CN202111640011.2A patent/CN114340259A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040002235A1 (en) * | 2002-06-27 | 2004-01-01 | Weimin Shi | High performance microprocessor power delivery solution using flex connections |
| US20130221566A1 (en) * | 2012-02-28 | 2013-08-29 | Kenneth Jenkins | Method and apparatus for sky-line potting |
| US20160141808A1 (en) * | 2013-09-25 | 2016-05-19 | Virginia Panel Corporation | High Speed Data Contact Set With Right Angle Termination Insert |
| CN209562392U (en) * | 2019-04-03 | 2019-10-29 | 佛山市顺德区扬威电器有限公司 | A kind of waterproof power supply adaptor |
| CN110252599A (en) * | 2019-07-11 | 2019-09-20 | 东莞市奥海科技股份有限公司 | Encapsulating charger and its manufacturing method |
| CN110708917A (en) * | 2019-11-20 | 2020-01-17 | 上海奉天电子股份有限公司 | Power converter and manufacturing method thereof |
| CN113242670A (en) * | 2021-04-16 | 2021-08-10 | 华为技术有限公司 | Power adapter and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104036876B (en) | A kind of preparation method of high temperature copper electric slurry | |
| CN104768347B (en) | A kind of electronic product casing with wireless charging function and preparation method thereof | |
| CN107316743B (en) | A kind of pouring technology of dry-type power electronic capacitor | |
| US10522724B2 (en) | LED packaging material and manufacturing method of the same | |
| CN104900390A (en) | Novel high density integrated electric inductance manufacturing method | |
| CN104193340A (en) | Method for preparing AlN raw ceramic chip for multi-layer wiring substrate by virtue of tape casting process and prepared AlN ceramic chip | |
| CN101567258A (en) | Vacuum encapsulation technology for transformer | |
| CN103325515A (en) | Magnetic epoxy resin powder solvent and method for packaging inductor by utilization of same | |
| CN114340259A (en) | Power adapter with shell-outside PCBA glue-pouring function and preparation method and application thereof | |
| CN102081989A (en) | Epoxy glass powder mica belt and preparation method thereof | |
| CN102290356B (en) | Method suitable for packaging protection of BGA (ball grid array) chip after attachment and welding | |
| CN113488330B (en) | Preparation method of functional magnetic slurry and magnetic device | |
| CN103811177A (en) | Novel ceramic capacitor | |
| CN108401367A (en) | Plastic packaging electronic module and preparation method thereof | |
| CN106921268A (en) | A kind of process for filling colloid and its equipment for servomotor | |
| CN204010890U (en) | Inductor | |
| CN207730818U (en) | A kind of optical fiber current mutual inductor | |
| CN112574531A (en) | Synthesis and application of epoxy resin nano modifier | |
| CN205847735U (en) | Anti-deformation crosses furnace carrier | |
| CN106409471A (en) | Inductor encapsulation solution and inductor encapsulation method | |
| CN102306525A (en) | Fe-Si alloy soft magnetic material with magnetic permeability mu of 26 and manufacturing method for Fe-Si alloy soft magnetic material | |
| CN105590708A (en) | High-power resin-package wire-wound surface-mounted resistor | |
| CN110734626A (en) | epoxy resin material for circuit board | |
| CN116313459A (en) | Filling and sealing method of polyurethane resin of zero sequence transformer | |
| CN106209005A (en) | A kind of production technology of quartz-crystal resonator base of ceramic |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |