CN110734626A - epoxy resin material for circuit board - Google Patents
epoxy resin material for circuit board Download PDFInfo
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- CN110734626A CN110734626A CN201911109332.2A CN201911109332A CN110734626A CN 110734626 A CN110734626 A CN 110734626A CN 201911109332 A CN201911109332 A CN 201911109332A CN 110734626 A CN110734626 A CN 110734626A
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2413/00—Characterised by the use of rubbers containing carboxyl groups
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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Abstract
The invention discloses epoxy resin materials for circuit boards, which are composed of the following components, by weight, 100 parts of epoxy resin, 270 parts of glass fiber, 200 parts of epoxy curing agent, 150 parts of epoxy polyester adhesive, 220 parts of toughening agent, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.
Description
Technical Field
The invention relates to the technical field of electronic composite materials, in particular to epoxy resin materials for circuit boards.
Background
The name of the circuit board is circuit board, PCB board, aluminum base board, etc., the circuit board makes the circuit miniaturized, visualized, play an important role in the batch production of the fixed circuit and optimizing the electric appliance layout, the epoxy resin is the general name of kinds of polymers containing more than two epoxy groups in the molecule, it is the polycondensation product of epichlorohydrin and bisphenol A or polyol, it is kinds of thermosetting resin, not only the output is the biggest, the variety is the most complete, but also the new modified variety is increasing continuously, because the preparation of the epoxy resin material is convenient, the physical property of the epoxy resin material is excellent, the circuit board has been prepared more and more by using the epoxy resin material;
however, when the existing epoxy resin material in the market is used, the flame retardance and the ignition point of the prepared circuit board are difficult to guarantee, and the epoxy resin material is not completely insulated, so that the insulativity cannot meet the requirements of the prior art.
Disclosure of Invention
The technical scheme provided by the invention can effectively solve the problems that the flame retardance and the ignition point of the prepared circuit board in the background technology are difficult to guarantee, and the epoxy resin material is not completely insulated, so that the insulativity cannot meet the requirements of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme that epoxy resin materials for circuit boards are composed of the following components in parts by weight:
100-150 parts of epoxy resin, 270 parts of glass fiber, 180-200 parts of epoxy curing agent, 150-220 parts of epoxy polyester adhesive, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.
According to the technical characteristics, the length-diameter ratio of the glass fiber is 25:1-5:1, the epoxy curing agent is specifically T-99 multifunctional epoxy curing agent produced by chemical Limited of Likun, , and the toughening agent is specifically of carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber and liquid silicone rubber.
According to the technical characteristics, the preparation method of the epoxy resin materials for the circuit board comprises the following steps:
s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;
s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;
s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:
s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;
s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;
s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;
s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.
According to the technical characteristics, in the step S1, epoxy resin, glass fiber and a toughening agent are selected and fully mixed to obtain a raw material mixture, wherein the added epoxy resin accounts for 150 parts by weight, the added glass fiber accounts for 270 parts by weight, the added toughening agent accounts for 40-120 parts by weight, and the stirring and mixing time of the epoxy resin, the glass fiber and the toughening agent is 20-30 min.
According to the technical characteristics, in the step S2, nano SiO2 is selected and added into xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, then an organic silicon resin material is added for uniform dispersion to obtain the organic silicon coating, the selected nano SiO2 accounts for 30-50 parts by weight, the xylene accounts for 10-15 parts by weight, the dispersing agent accounts for 20-30 parts by weight, the butyl acetate accounts for 5-12 parts by weight, the organic silicon resin material accounts for 60-80 parts by weight, and the ultrasonic dispersion time is 10-15 min.
According to the technical characteristics, in the step S3, epoxy polyester glue is selected and added into a mixed solution of a dispersing agent and acetone, oscillation dispersion is carried out, and uniform dispersion is carried out to obtain an epoxy resin immersion liquid, the added dispersing agent is 50-60 parts by weight, the added acetone is 40-50 parts by weight, the weight ratio of the added epoxy polyester glue to the mixed solution of the dispersing agent and the acetone is 1: 3-1:5, and the dispersing agent is specifically of triethylhexylphosphoric acid, sodium dodecyl sulfate, methylpentanol and polyacrylamide.
According to the technical characteristics, in the step S4, the epoxy curing agent is added into the raw material mixture obtained in the step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a compression mold, and the epoxy resin substrate is obtained by molding, wherein the epoxy curing agent is added into each 100 parts by weight of the raw material mixture in an amount of 80-90 parts by weight, and the stirring time of the raw material mixture and the epoxy curing agent is 5-10 min.
According to the technical characteristics, in the step S5, the epoxy resin substrate which is formed by pressing is placed in the epoxy resin soaking liquid and taken out for air drying, the time for soaking the epoxy resin substrate in the epoxy resin soaking liquid is 20-30S, the temperature for taking out and air drying the epoxy resin substrate is 70-85 ℃, and the times for soaking and air drying the epoxy resin substrate in the epoxy resin soaking liquid are 1-3 times.
According to the technical characteristics, in the step S6, after the air-dried epoxy resin substrate is cleaned, corners of the epoxy resin substrate are trimmed, and the cleaning solution for cleaning the epoxy resin substrate comprises the following specific components: 30-50 parts of water and 1-3 parts of nitric acid, wherein the trimming ambient temperature of the epoxy resin substrate is 60-70 ℃ when the corners of the epoxy resin substrate are trimmed.
According to the technical characteristics, in the step S7, the organosilicon paint is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, the sprayed epoxy resin substrate is air-dried, the thickness of the organosilicon paint sprayed once is kept at 0.2-0.5mm, the air-drying temperature of the sprayed epoxy resin substrate is kept at 50-60 ℃, and the times of spraying the organosilicon paint on the epoxy resin substrate and air-drying are 1-3 times.
Compared with the prior art, the invention has the beneficial effects that:
in the preparation process of the epoxy resin material for the circuit board, the epoxy resin, the glass fiber and the toughening agent are selected and mixed to obtain a raw material mixture, and an epoxy curing agent is added into the raw material mixture to cure the raw material mixture, so that the prepared epoxy resin material has better toughness;
the preparation method comprises the steps of adding nano SiO2 into a mixed solution of xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, adding an organic silicon resin material for ultrasonic dispersion to obtain an organic silicon coating, and uniformly spraying the organic silicon coating on the surface of an epoxy resin substrate, so that the ignition point of the prepared epoxy resin is improved, and the surface flame retardant property is better;
mixing a dispersing agent and acetone, adding epoxy polyester glue to obtain epoxy resin impregnation liquid, and immersing the epoxy resin substrate formed by pressing into the epoxy resin impregnation liquid to improve the insulating property of the prepared epoxy resin material;
the cleaning liquid is prepared from the water and the nitric acid, the epoxy resin substrate is cleaned, and corners of the epoxy resin substrate are trimmed, so that the surface flatness of the prepared epoxy resin material is better.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification , illustrate embodiment of the invention and do not constitute a limitation on the invention.
In the drawings:
FIG. 1 is a schematic flow diagram of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Embodiment 1 as shown in fig. 1, the invention provides a technical scheme that epoxy resin materials for circuit boards are composed of the following components in parts by weight:
120 parts of epoxy resin, 250 parts of glass fiber, 190 parts of epoxy curing agent, 180 parts of epoxy polyester adhesive, 40 parts of toughening agent and 70 parts of organic silicon resin material.
According to the technical characteristics, the length-diameter ratio of the glass fiber is 15:1, the epoxy curing agent is a T-99 multifunctional epoxy curing agent, and the toughening agent is carboxyl liquid nitrile rubber.
According to the technical characteristics, the preparation method of the epoxy resin materials for the circuit board comprises the following steps:
s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;
s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;
s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:
s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;
s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;
s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;
s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.
According to the technical characteristics, in the step S1, epoxy resin, glass fiber and a toughening agent are selected and fully mixed to obtain a raw material mixture, the added epoxy resin accounts for 120 parts by weight, the glass fiber accounts for 250 parts by weight, the toughening agent accounts for 40 parts by weight, and the epoxy resin, the glass fiber and the toughening agent are stirred and mixed for 25 min.
According to the technical characteristics, in the step S2, nano SiO2 is selected and added into xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, then an organic silicon resin material is added, and the organic silicon coating is obtained through uniform dispersion, wherein the selected nano SiO2 accounts for 40 parts by weight, the xylene accounts for 13 parts by weight, the dispersing agent accounts for 25 parts by weight, the butyl acetate accounts for 8 parts by weight, the organic silicon resin material accounts for 70 parts by weight, and the ultrasonic dispersion time is 13 min.
According to the technical characteristics, in the step S3, epoxy polyester adhesive is selected and added into a mixed solution of a dispersing agent and acetone, oscillation dispersion is carried out, the epoxy resin impregnation solution is obtained after uniform dispersion, the weight ratio of the added dispersing agent to the mixed solution of the dispersing agent and acetone is 1:4, and the dispersing agent is specifically triethylhexylphosphoric acid.
According to the technical characteristics, in step S4, an epoxy curing agent is added to the raw material mixture obtained in step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a compression mold, an epoxy resin substrate is obtained by molding, 85 parts by weight of the epoxy curing agent is added to each 100 parts by weight of the raw material mixture, and the stirring time of the raw material mixture and the epoxy curing agent is 8 min.
According to the technical characteristics, in step S5, the epoxy resin substrate which is formed by pressing is placed in the epoxy resin soaking liquid and taken out for air drying, the time for soaking the epoxy resin substrate in the epoxy resin soaking liquid is 25S, the temperature for taking out the epoxy resin substrate for air drying is 75 ℃, and the times for soaking and air drying the epoxy resin substrate in the epoxy resin soaking liquid are 2 times.
According to the technical characteristics, in step S6, after the air-dried epoxy resin substrate is cleaned, corners of the epoxy resin substrate are trimmed, and the cleaning solution for cleaning the epoxy resin substrate specifically comprises the following components: 40 parts by weight of water and 2 parts by weight of nitric acid, and when corners of the epoxy resin substrate are trimmed, the temperature of the environment for trimming the epoxy resin substrate is 65 ℃.
According to the technical characteristics, in step S7, the silicone coating is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, and the sprayed epoxy resin substrate is air-dried, wherein the thickness of the silicone coating sprayed once is kept at 0.35mm, the air-drying temperature of the sprayed epoxy resin substrate is kept at 55 ℃, and the number of times of spraying the silicone coating on the epoxy resin substrate and air-drying is 2.
Embodiment 2 as shown in fig. 1, the invention provides a technical scheme that epoxy resin materials for circuit boards are composed of the following components in parts by weight:
100 parts of epoxy resin, 230 parts of glass fiber, 180 parts of epoxy curing agent, 150 parts of epoxy polyester adhesive, 20 parts of toughening agent and 40 parts of organic silicon resin material.
According to the technical characteristics, the length-diameter ratio of the glass fiber is 25:1, the epoxy curing agent is specifically T-99 multifunctional epoxy curing agent, and the toughening agent is specifically kinds of liquid silicone rubber.
According to the technical characteristics, the preparation method of the epoxy resin materials for the circuit board comprises the following steps:
s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;
s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;
s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:
s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;
s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;
s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;
s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.
According to the technical characteristics, in the step S1, epoxy resin, glass fiber and a toughening agent are selected and fully mixed to obtain a raw material mixture, 100 parts by weight of the added epoxy resin, 230 parts by weight of the added glass fiber and 20 parts by weight of the added toughening agent are added, and the time for stirring and mixing the epoxy resin, the glass fiber and the toughening agent is 20 min.
According to the technical characteristics, in the step S2, nano SiO2 is selected and added into xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, then an organic silicon resin material is added for uniform dispersion to obtain the organic silicon coating, the selected nano SiO2 accounts for 30 parts by weight, the xylene accounts for 10 parts by weight, the dispersing agent accounts for 20 parts by weight, the butyl acetate accounts for 5 parts by weight, the organic silicon resin material accounts for 60 parts by weight, and the ultrasonic dispersion time is 10 min.
According to the technical characteristics, in the step S3, the epoxy polyester adhesive is selected and added into the mixed solution of the dispersing agent and the acetone, oscillation dispersion is carried out, the epoxy resin impregnation solution is obtained after uniform dispersion, the added dispersing agent is 50 parts by weight, the added acetone is 40 parts by weight, the weight ratio of the added epoxy polyester adhesive to the mixed solution of the dispersing agent and the acetone is 1:5, and the dispersing agent is specifically sodium dodecyl sulfate.
According to the technical characteristics, in step S4, an epoxy curing agent is added to the raw material mixture obtained in step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a compression mold, and an epoxy resin substrate is obtained by molding, wherein 80 parts by weight of the epoxy curing agent is added to 100 parts by weight of the raw material mixture, and the stirring time of the raw material mixture and the epoxy curing agent is 5 min.
According to the technical characteristics, in step S5, the epoxy resin substrate which is formed by pressing is placed in the epoxy resin soaking liquid and taken out for air drying, the time for soaking the epoxy resin substrate in the epoxy resin soaking liquid is 20-30S, the temperature for taking out the epoxy resin substrate for air drying is 70 ℃, and the times for soaking and air drying the epoxy resin substrate in the epoxy resin soaking liquid are 1 time.
According to the technical characteristics, in step S6, after the air-dried epoxy resin substrate is cleaned, corners of the epoxy resin substrate are trimmed, and the cleaning solution for cleaning the epoxy resin substrate specifically comprises the following components: 50 parts by weight of water and 1 part by weight of nitric acid, and when corners of the epoxy resin substrate are trimmed, the temperature of the environment for trimming the epoxy resin substrate is 60 ℃.
According to the technical characteristics, in step S7, the organosilicon paint is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, and the sprayed epoxy resin substrate is air-dried, wherein the thickness of the organosilicon paint sprayed once is kept at 0.2mm, the air-drying temperature of the sprayed epoxy resin substrate is kept at 50 ℃, and the times of spraying the organosilicon paint on the epoxy resin substrate and air-drying are 1 time.
Embodiment 3 as shown in fig. 1, the invention provides a technical scheme that epoxy resin materials for circuit boards are composed of the following components in parts by weight:
150 parts of epoxy resin, 270 parts of glass fiber, 200 parts of epoxy curing agent, 220 parts of epoxy polyester adhesive, 60 parts of toughening agent and 120 parts of organic silicon resin material.
According to the technical characteristics, the length-diameter ratio of the glass fiber is 25:1, the epoxy curing agent is a T-99 multifunctional epoxy curing agent, and the toughening agent is carboxyl-terminated liquid nitrile rubber.
According to the technical characteristics, the preparation method of the epoxy resin materials for the circuit board comprises the following steps:
s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;
s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;
s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:
s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;
s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;
s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;
s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.
According to the technical characteristics, in the step S1, epoxy resin, glass fiber and a toughening agent are selected and fully mixed to obtain a raw material mixture, the added epoxy resin is 150 parts by weight, the added glass fiber is 270 parts by weight, the added toughening agent is 60 parts by weight, and the stirring and mixing time of the epoxy resin, the glass fiber and the toughening agent is 30 min.
According to the technical characteristics, in the step S2, nano SiO2 is selected and added into xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, then an organic silicon resin material is added for uniform dispersion to obtain the organic silicon coating, the selected nano SiO2 accounts for 50 parts by weight, the xylene accounts for 15 parts by weight, the dispersing agent accounts for 30 parts by weight, the butyl acetate accounts for 12 parts by weight, the organic silicon resin material accounts for 80 parts by weight, and the ultrasonic dispersion time is 15 min.
According to the technical characteristics, in the step S3, the epoxy polyester adhesive is selected and added into the mixed solution of the dispersing agent and the acetone, the oscillation dispersion is carried out, the epoxy resin impregnation solution is obtained by uniform dispersion, the added dispersing agent is 60 parts by weight, the added acetone is 50 parts by weight, and the weight ratio of the added epoxy polyester adhesive to the mixed solution of the dispersing agent and the acetone is 1: 3, the dispersant is polyacrylamide specifically.
According to the technical characteristics, in step S4, an epoxy curing agent is added to the raw material mixture obtained in step S1, the mixture is uniformly stirred, and the uniformly stirred mixture is injected into a stamper to mold an epoxy resin substrate, wherein 90 parts by weight of the epoxy curing agent is added to 100 parts by weight of the raw material mixture, and the stirring time of the raw material mixture and the epoxy curing agent is 10 min.
According to the technical characteristics, in step S5, the epoxy resin substrate formed by pressing is placed in the epoxy resin impregnation liquid and taken out to be air-dried, the time for immersing the epoxy resin substrate in the epoxy resin impregnation liquid is 30S, the temperature for taking out the epoxy resin substrate to be air-dried is 85 ℃, and the times for immersing and air-drying the epoxy resin substrate in the epoxy resin impregnation liquid are 3 times.
According to the technical characteristics, in step S6, after the air-dried epoxy resin substrate is cleaned, corners of the epoxy resin substrate are trimmed, and the cleaning solution for cleaning the epoxy resin substrate specifically comprises the following components: 50 parts by weight of water and 3 parts by weight of nitric acid, wherein the environmental temperature for trimming the epoxy resin substrate is 70 ℃ when trimming corners of the epoxy resin substrate.
According to the technical characteristics, in step S7, the silicone coating is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, and the sprayed epoxy resin substrate is air-dried, wherein the thickness of the silicone coating sprayed once is kept at 0.5mm, the air-drying temperature of the sprayed epoxy resin substrate is kept at 60 ℃, and the number of times of spraying the silicone coating on the epoxy resin substrate and air-drying is 3.
The results of testing the epoxy resin materials of the present invention made according to examples 1-3 are shown in the following table:
according to the detection results in the table above, the coating is prepared by selecting 120 parts by weight of epoxy resin, 250 parts by weight of glass fiber, 190 parts by weight of epoxy curing agent and 40 parts by weight of toughening agent, 40 parts by weight of nano-SiO 2, 13 parts by weight of xylene, 25 parts by weight of dispersing agent and 8 parts by weight of butyl acetate, 55 parts by weight of dispersing agent and 45 parts by weight of acetone are added, and the weight ratio of the epoxy polyester adhesive to the mixed solution of the dispersing agent and the acetone is 1: 4.
The working principle and the using process of the invention are as follows: the preparation method of the epoxy resin material for the circuit board comprises the steps of firstly selecting 120 parts by weight of epoxy resin, 250 parts by weight of glass fiber and 40 parts by weight of toughening agent to mix for 25 minutes to obtain a raw material mixture, then selecting 40 parts by weight of nano SiO2, adding the nano SiO2 into a mixed solution prepared from 13 parts by weight of xylene, 25 parts by weight of dispersing agent and 8 parts by weight of butyl acetate to perform ultrasonic dispersion, then adding 70 parts by weight of organic silicon resin material to perform ultrasonic dispersion for 13 minutes to obtain an organic silicon coating, simultaneously mixing 55 parts by weight of dispersing agent and 45 parts by weight of acetone, adding epoxy polyester adhesive mixed with the mixed solution of the dispersing agent and the acetone in a weight ratio of 4:1, performing oscillation dispersion to obtain epoxy resin impregnation liquid, then adding 85 parts by weight of epoxy curing agent into each 100 parts by weight of the raw material mixture, uniformly stirring for 8 minutes, injecting the uniformly stirred mixture into a pressing die, forming to obtain an epoxy resin substrate, putting the formed epoxy resin substrate into an epoxy resin immersion liquid, immersing for 25 seconds, taking out, and air-drying in an environment at 75 ℃, wherein the times of immersing and air-drying the epoxy resin substrate in the epoxy resin immersion liquid are 2 times, then selecting 40 parts by weight of water and 2 parts by weight of nitric acid to prepare a cleaning solution, cleaning the epoxy resin substrate, trimming corners of the epoxy resin substrate in an environment at 65 ℃, finally uniformly spraying the silicone coating with the thickness of 0.35mm on the surface of the cleaned and trimmed epoxy resin substrate, air-drying the epoxy resin substrate in an environment at 55 ℃, and spraying the silicone coating on the epoxy resin substrate and air-drying for 2 times.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1, kinds of epoxy resin material for circuit board, which is characterized by comprising the following components by weight:
100-150 parts of epoxy resin, 270 parts of glass fiber, 180-200 parts of epoxy curing agent, 150-220 parts of epoxy polyester adhesive, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.
2. The kinds of epoxy resin materials for circuit boards, according to claim 1, wherein the length-diameter ratio of the glass fiber is 25:1-5:1, the epoxy curing agent is specifically a T-99 multifunctional epoxy curing agent, and the toughening agent is specifically kinds of carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber and liquid silicone rubber.
3. The method of preparing kinds of epoxy resin material for circuit board as claimed in any of claim 1-2, comprising the steps of:
s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;
s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;
s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:
s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;
s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;
s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;
s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.
4. The method for preparing epoxy resin materials for circuit boards as claimed in claim 3, wherein in the step S1, epoxy resin, glass fiber and toughening agent are selected and fully mixed to obtain a raw material mixture, the added epoxy resin is 150 parts by weight, the glass fiber is 230-270 parts by weight, the toughening agent is 40-120 parts by weight, and the time for mixing the epoxy resin, the glass fiber and the toughening agent by stirring is 20-30 min.
5. The method as claimed in claim 3, wherein in step S2, the selected nano SiO2 is added to xylene, a dispersant and butyl acetate for ultrasonic dispersion, and then the silicone resin material is added for uniform dispersion to obtain the silicone coating, wherein the selected nano SiO2 is 30-50 parts by weight, the xylene is 10-15 parts by weight, the dispersant is 20-30 parts by weight, the butyl acetate is 5-12 parts by weight, the silicone resin material is 60-80 parts by weight, the ultrasonic dispersion time is 10-15min, and the dispersant is of triethylhexylphosphoric acid, sodium dodecyl sulfate, methylpentanol and polyacrylamide.
6. The method for preparing epoxy resin materials for circuit boards, according to claim 3, wherein in the step S3, epoxy polyester glue is selected and added into a mixed solution of a dispersing agent and acetone, the mixture is subjected to oscillation dispersion, and the epoxy resin is uniformly dispersed to obtain an epoxy resin immersion solution, wherein the added dispersing agent is 50-60 parts by weight, the added acetone is 40-50 parts by weight, and the weight ratio of the added epoxy polyester glue to the mixed solution of the dispersing agent and the acetone is 1: 3-1: 5.
7. The kinds of epoxy resin material for circuit boards, according to claim 3, wherein in step S4, the epoxy hardener is added to the raw material mixture obtained in step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a stamper, and an epoxy resin substrate is obtained by molding, the epoxy hardener is added in an amount of 80 to 90 parts by weight per 100 parts by weight of the raw material mixture, and the stirring time of the raw material mixture and the epoxy hardener is 5 to 10 min.
8. The method for preparing the epoxy resin material for circuit boards according to claim 3, wherein the step S5 comprises the steps of placing the compression-molded epoxy resin substrate into an epoxy resin impregnation solution, taking out the epoxy resin substrate, and air-drying the epoxy resin substrate, wherein the time for immersing the epoxy resin substrate in the epoxy resin impregnation solution is 20-30S, the temperature for taking out the epoxy resin substrate and air-drying the epoxy resin substrate is 70-85 ℃, and the times for immersing the epoxy resin substrate in the epoxy resin impregnation solution and air-drying the epoxy resin substrate are 1-3 times.
9. The method for preparing the epoxy resin material for circuit boards, according to the step S6, wherein the edges and corners of the epoxy resin substrate are trimmed after the epoxy resin substrate is cleaned, the cleaning solution for cleaning the epoxy resin substrate comprises 30-50 parts by weight of water and 1-3 parts by weight of nitric acid, and the temperature of the environment for trimming the epoxy resin substrate is 60-70 ℃ when the edges and corners of the epoxy resin substrate are trimmed.
10. The method for preparing the epoxy resin material for circuit boards, according to the step S7, wherein the silicone coating is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, the sprayed epoxy resin substrate is air-dried, the thickness of the silicone coating sprayed in one time is kept between 0.2mm and 0.5mm, the air-drying temperature of the sprayed epoxy resin substrate is kept between 50 ℃ and 60 ℃, and the times of spraying the silicone coating on the epoxy resin substrate and air-drying are 1 to 3.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113088122A (en) * | 2021-03-31 | 2021-07-09 | 成都高斯电子技术有限公司 | Coating reinforcing agent and preparation method and use method thereof |
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