CN115466509B - Polyimide composite material with low dielectric and high toughness and preparation method thereof - Google Patents
Polyimide composite material with low dielectric and high toughness and preparation method thereof Download PDFInfo
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- CN115466509B CN115466509B CN202211026941.3A CN202211026941A CN115466509B CN 115466509 B CN115466509 B CN 115466509B CN 202211026941 A CN202211026941 A CN 202211026941A CN 115466509 B CN115466509 B CN 115466509B
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- phenylethynyl
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 74
- 239000004642 Polyimide Substances 0.000 title claims abstract description 46
- 239000002131 composite material Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000009719 polyimide resin Substances 0.000 claims abstract description 37
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000004744 fabric Substances 0.000 claims abstract description 29
- -1 phenylethynyl Chemical group 0.000 claims abstract description 19
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 239000010453 quartz Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 9
- 239000011737 fluorine Substances 0.000 claims abstract description 9
- 239000003607 modifier Substances 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000002904 solvent Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 7
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 7
- 230000001680 brushing effect Effects 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000011043 treated quartz Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 238000004513 sizing Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 4
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- CNKHSLKYRMDDNQ-UHFFFAOYSA-N halofenozide Chemical compound C=1C=CC=CC=1C(=O)N(C(C)(C)C)NC(=O)C1=CC=C(Cl)C=C1 CNKHSLKYRMDDNQ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
Abstract
The invention provides a low dielectric high toughness polyimide composite material and a preparation method thereof, wherein third-generation thermosetting polyimide (phenylethynyl-terminated thermosetting polyimide) is adopted as a matrix, quartz fiber cloth is adopted as a reinforcement, phenylethynyl-modified thermoplastic polyimide is adopted as a modifier, a wet method is adopted to prepare prepreg of mixed resin and quartz fiber cloth, and then a high-temperature mould pressing method is adopted to prepare the composite material. Based on the high molecular chain segment group consideration, the matrix resin and the modified resin adopted by the invention both contain fluorine elements, so that the low-dielectric composite material is facilitated to be obtained, meanwhile, the two polyimide resins both contain phenylethynyl, have excellent molecular compatibility, can obtain uniform resin phase, and the large steric hindrance groups in the phenylethynyl modified thermoplastic polyimide can reduce the crosslinking density of the resin, so that the high-toughness composite material is facilitated to be obtained.
Description
Technical Field
The invention belongs to the technical field of composite materials, relates to a polyimide composite material, and in particular relates to a low-dielectric high-toughness polyimide composite material and a preparation method thereof.
Background
With the rapid development of aerospace technology and the development trend of high-speed weaponry, the speed of an aircraft is continuously increased, for example, F-22 reports that the maximum sailing speed is Mach 2, and the pneumatic heating problem caused by the high-speed operation of the aircraft brings a severe working environment to the aircraft. The radome is positioned at the front side of the aircraft structure, and high requirements are put on the service temperature, high-temperature structural strength and wave transmission performance of the radome, namely the radome material is not decomposed at high temperature, can be used for a long time at high temperature, and keeps high mechanical strength and wave transmission performance.
The fiber reinforced polyimide composite material has been increasingly applied in the fields of aerospace and weaponry in recent years due to the excellent high temperature resistance and mechanical properties. The high temperature resistant polyimide composite material is generally prepared by taking thermosetting polyimide resin as a matrix, preparing prepreg by impregnating continuous fibers with the resin, and preparing the composite material by layering and curing by a certain method. Because the thermosetting polyimide resin has a rigid structure with high crosslinking degree, microcracks are easy to generate under the action of external force and thermal shock, and the reliability of a composite material part is greatly reduced, the toughness of the composite material prepared by the thermosetting polyimide resin has a lifting space, and generally, the dielectric constant of the polyimide resin is higher than that of a common radome material (such as cyanate), and when the polyimide resin is used as the radome material, how to reduce the dielectric constant to improve the wave-transmitting performance of the radome without affecting the inherent excellent performance of the radome material is a worth discussing problem.
A common method for reducing the dielectric constant of thermosetting polyimide to improve the wave-transmitting performance is to introduce fluorine atoms into a chain segment or to make nano micropores containing air in a resin matrix, and in order to obtain a uniform and stable resin matrix, a method of introducing fluorine-containing groups into the resin matrix is generally adopted.
A common method for toughening thermosetting polyimide resin is to introduce a flexible chain segment, but the heat resistance of the resin is drastically reduced; the second phase particles are toughened by introducing the second phase particles, but the second phase particles are difficult to uniformly disperse by conventional means, so that the mechanical strength is unstable or is reduced due to agglomeration. In addition, there are reports of toughening thermosetting polyimide by introducing thermoplastic resin, but compatibility of the selected resin with thermosetting polyimide is a core problem. When the compatibility is good, the thermosetting polyimide segment and the thermoplastic resin segment can interpenetrate the network, and even some groups of the thermoplastic resin can react with the terminal groups of the thermosetting polyimide to form a homogeneous structure, but the heat resistance of the thermoplastic resin (such as polyethersulfone, polyetheretherketone, etc.) is low (the glass transition temperature is generally lower than 300 ℃), and the introduction thereof can greatly reduce the heat resistance of the polyimide. When the compatibility is poor, the thermoplastic resin may precipitate as a second phase in the thermosetting polyimide matrix, and such microphase separation may improve the toughness of the thermosetting polyimide, but certain requirements are imposed on the process operation method in blending, and the addition amount is not high (phase inversion is easily caused when the addition amount is high).
Disclosure of Invention
In view of the above problems, the present invention provides a low dielectric high toughness polyimide composite material and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides a method for preparing a low dielectric high toughness polyimide composite material, comprising the following steps:
preparing a mixed resin solution by taking phenylethynyl-terminated thermosetting polyimide resin as a matrix and phenylethynyl-modified thermoplastic polyimide resin as a modifier;
preparing prepreg by using the mixed resin solution and quartz fiber cloth;
the prepreg is prepared into polyimide composite material by adopting a high-temperature mould pressing method.
Further, the method for preparing a mixed resin solution by using phenylethynyl terminated thermosetting polyimide resin as a matrix and phenylethynyl modified thermoplastic polyimide resin as a modifier comprises the following steps:
the solution is prepared by mixing dioxane and dimethylacetamide in a mass ratio of 1.5:1-3:1, and corresponding polyimide resin powder (comprising the total amount of phenylethynyl modified thermoplastic polyimide and phenylethynyl terminated thermosetting polyimide) is weighed and added thereto, wherein the mass fraction of the polyimide resin in the solution is 20-35%, and the mixture is stirred at a temperature of 80-120 ℃ for 1-3 hours (preferably at a temperature of 100 ℃ for 2 hours) to obtain a uniform and clear resin solution.
Further, the preparation of the prepreg by using the mixed resin solution and the quartz fiber cloth comprises the following steps:
placing the quartz fiber cloth in an acetone tank to remove surface sizing agent and impurities, and drying for later use;
brushing the mixed resin solution on the treated quartz fiber cloth uniformly, controlling the glue content to be 35-43wt% (namely, the mass of the mixed resin solution is 35-43% of the mass of the quartz fiber cloth), and standing for more than 12 hours in a ventilation environment to primarily remove the solvent to prepare prepreg cloth;
the preliminary solvent removal prepreg cloth is vacuumized in a vacuum oven at 180-220 ℃ for 8-15 hours, then heated in a blast oven at 220-260 ℃ for 2-6 hours (preferably vacuumized in a vacuum oven at 200 ℃ for 12 hours, and then heated in a blast oven at 240 ℃ for 4 hours) to thoroughly remove the solvent in the prepreg cloth.
Further, the method for preparing the polyimide composite material from the prepreg by adopting a high-temperature mould pressing method comprises the following steps:
and (3) cutting the prepreg cloth in the step four into pieces with uniform size, for example 300mm, laying 9 layers in a die, pushing the pieces into a press, preserving heat at 240 ℃ for 1 hour, and preserving heat at 380 ℃ for 2 hours to cure the pieces to obtain the polyimide composite material.
Further, the structural formula of the adopted phenylethynyl-terminated thermosetting polyimide and phenylethynyl-modified thermoplastic polyimide based on the high molecular chain segment group is as follows:
phenylethynyl-terminated fluorine-containing thermosetting polyimide resin has a structural formula:
wherein:
phenylethynyl modified fluorothermoplastic polyimide resin has the structural formula:
the thermosetting polyimide resin and the thermoplastic polyimide resin both contain fluorine (fluorine has low polarizability under an electromagnetic field, and a large amount of fluorine is introduced to be helpful for obtaining a polyimide composite material with low dielectric constant), meanwhile, the two polyimide resins are both blocked by phenylacetylene and can be crosslinked with each other, the thermosetting polyimide resin and the thermoplastic polyimide resin have excellent molecular compatibility, and the large steric hindrance groups in the thermoplastic polyimide modified by the phenylethynyl can reduce the crosslinking density and strengthen the toughness of the thermosetting polyimide when being copolymerized with the thermosetting polyimide.
Further, the quartz cloth is adopted as a reinforcement body, has better heat resistance than organic fibers, and has wave-transmitting performance superior to that of glass fibers.
In a second aspect, the present invention provides a low dielectric high toughness polyimide composite material prepared by the above method.
The invention has the beneficial effects that:
(1) the glass transition temperature of the adopted phenylethynyl modified thermoplastic polyimide resin is higher than 300 ℃, so that the long-term use temperature of a binary resin system blended with thermosetting polyimide is higher than 300 ℃ and is far higher than that of polyimide composite materials toughened by other thermoplastic resins.
(2) The adopted phenylethynyl modified thermoplastic polyimide and thermosetting polyimide are both phenylethynyl terminated, and can be copolymerized with the thermosetting polyimide to form a uniform phase in the curing process, which is an advantage which is not possessed by the common thermoplastic polyimide toughened thermosetting polyimide composite material.
(3) The adopted phenylethynyl modified thermoplastic polyimide and thermosetting polyimide both contain fluorine-containing groups, so that the prepared composite material has excellent wave-transmitting performance.
(4) The adopted phenylethynyl modified thermoplastic polyimide contains a group with larger steric hindrance, and the introduction of the group is beneficial to reducing the crosslinking density of the thermosetting polyimide and improving the toughness of the thermosetting polyimide.
Detailed description of the preferred embodiments
The present invention will be further described in detail with reference to the following examples, in order to make the above objects, features and advantages of the present invention more apparent.
Embodiment one:
333 parts of phenylethynyl-terminated fluorine-containing thermosetting polyimide was put into a mixed solution of 544 parts of dioxane and 233 parts of dimethylacetamide, and stirred at 100 ℃ for 2 hours to a uniform clear resin solution. And brushing the prepared resin solution on the treated quartz cloth to prepare prepreg, controlling the glue content to be 43%, drying the prepreg in a vacuum oven and a blast oven to remove the solvent, cutting the prepreg into small blocks, paving 9 layers in a die, pushing the die into a press, and preserving heat at 240 ℃ for 1 hour and 380 ℃ for 2 hours to cure the composite material. The dielectric constant of the prepared composite material is 3.49 (17 GHz), the room-temperature compressive strength is 428MPa, the 300-DEG C compressive strength is 195MPa, the room-temperature bending strength is 714MPa, and the 300-DEG C bending strength is 466MPa.
Embodiment two:
17 parts of phenylethynyl-modified fluorothermoplastic polyimide resin and 283 parts of phenylethynyl-terminated fluorothermosetting polyimide were put into a mixed solution of 544 parts of dioxane and 233 parts of dimethylacetamide, and stirred at 100 ℃ for 2 hours to a uniform clear resin solution. And brushing the prepared resin solution on the treated quartz cloth to prepare prepreg, controlling the glue content to be 43%, drying the prepreg in a vacuum oven and a blast oven to remove the solvent, cutting the prepreg into small blocks, paving 9 layers in a die, pushing the die into a press, and preserving heat at 240 ℃ for 1 hour and 380 ℃ for 2 hours to cure the composite material. The dielectric constant of the prepared composite material is 3.50 (17 GHz), the bending strength at room temperature is 763MPa, and the bending strength at 300 ℃ is 499MPa.
Embodiment III:
33 parts of phenylethynyl-modified fluorothermoplastic polyimide resin and 283 parts of phenylethynyl-terminated fluorothermosetting polyimide were put into a mixed solution of 544 parts of dioxane and 233 parts of dimethylacetamide, and stirred at 100 ℃ for 2 hours to a uniform clear resin solution. And brushing the prepared resin solution on the treated quartz cloth to prepare prepreg, controlling the glue content to be 43%, drying the prepreg in a vacuum oven and a blast oven to remove the solvent, cutting the prepreg into small blocks, paving 9 layers in a die, pushing the die into a press, and preserving heat at 240 ℃ for 1 hour and 380 ℃ for 2 hours to cure the composite material. The dielectric constant of the prepared composite material is 3.45 (17 GHz), the bending strength at room temperature is 790MPa, and the bending strength at 300 ℃ is 534MPa.
Embodiment four:
50 parts of phenylethynyl-modified fluorothermoplastic polyimide resin and 283 parts of phenylethynyl-terminated fluorothermosetting polyimide were put into a mixed solution of 544 parts of dioxane and 233 parts of dimethylacetamide and stirred at 100 ℃ for 2 hours to a uniform clear resin solution. And brushing the prepared resin solution on the treated quartz cloth to prepare prepreg, controlling the glue content to be 43%, drying the prepreg in a vacuum oven and a blast oven to remove the solvent, cutting the prepreg into small blocks, paving 9 layers in a die, pushing the die into a press, and preserving heat at 240 ℃ for 1 hour and 380 ℃ for 2 hours to cure the composite material. The dielectric constant of the prepared composite material is 3.39 (17 GHz), the room-temperature compressive strength is 470MPa, the 300-DEG C compressive strength is 197MPa, the room-temperature bending strength is 853MPa, and the 300-DEG C bending strength is 595MPa.
The above-disclosed embodiments of the present invention are intended to aid in understanding the contents of the present invention and to enable the same to be carried into practice, and it will be understood by those of ordinary skill in the art that various alternatives, variations and modifications are possible without departing from the spirit and scope of the invention. The invention should not be limited to what has been disclosed in the examples of the specification, but rather by the scope of the invention as defined in the claims.
Claims (8)
1. The preparation method of the low-dielectric high-toughness polyimide composite material is characterized by comprising the following steps of:
preparing a mixed resin solution by taking phenylethynyl-terminated thermosetting polyimide resin as a matrix and phenylethynyl-modified thermoplastic polyimide resin as a modifier;
preparing prepreg by using the mixed resin solution and quartz fiber cloth;
preparing the prepreg into a polyimide composite material by adopting a high-temperature mould pressing method;
the phenylethynyl-terminated thermosetting polyimide resin is phenylethynyl-terminated fluorine-containing thermosetting polyimide resin, and has the structural formula:
wherein:
the phenylethynyl modified thermoplastic polyimide resin is phenylethynyl modified fluorine-containing thermoplastic polyimide resin, and has the structural formula:
2. the method of claim 1, wherein the preparing a mixed resin solution using a phenylethynyl terminated thermosetting polyimide resin as a matrix and a phenylethynyl modified thermoplastic polyimide resin as a modifier comprises:
preparing a solution by dioxane and dimethylacetamide according to a mass ratio of 1.5:1-3:1, weighing corresponding polyimide resin powder, adding the polyimide resin powder into the solution, wherein the polyimide resin powder comprises phenylethynyl modified thermoplastic polyimide and phenylethynyl terminated thermosetting polyimide, the mass fraction of polyimide resin in the solution is 20-35%, and stirring the solution at 80-120 ℃ for 1-3 hours to obtain a uniform and clear resin solution.
3. The method according to claim 2, wherein after preparing the solution of dioxane and dimethylacetamide and adding the polyimide resin powder, stirring is performed at 100 ℃ for 2 hours to obtain a uniform and clear resin solution.
4. The method of claim 1, wherein the preparing a prepreg using a mixed resin solution and a quartz fiber cloth comprises:
placing the quartz fiber cloth in an acetone tank to remove surface sizing agent and impurities, and drying for later use;
brushing the mixed resin solution on the treated quartz fiber cloth uniformly, controlling the glue content to be 35-43wt%, and standing for more than 12 hours in a ventilation environment to primarily remove the solvent to obtain prepreg cloth;
and vacuumizing the preliminary solvent-removed prepreg cloth in a vacuum oven at 180-220 ℃ for 8-15 hours, and then heating the preliminary solvent-removed prepreg cloth in a blast oven at 220-260 ℃ for 2-6 hours to thoroughly remove the solvent in the prepreg cloth.
5. The method according to claim 4, wherein the preliminary solvent-removed prepreg cloth is vacuumized in a vacuum oven at 200 ℃ for 12 hours and then heated in a blast oven at 240 ℃ for 4 hours to completely remove the solvent from the prepreg cloth.
6. The method of claim 1, wherein the high temperature molding of the prepreg to form the polyimide composite comprises:
cutting prepreg cloth into uniform size, laying 9 layers layer by layer in a die, pushing the prepreg cloth into a press, preserving heat for 1 hour at 240 ℃ and preserving heat for 2 hours at 380 ℃ to cure the prepreg cloth, and obtaining the polyimide composite material.
7. The method of claim 6, wherein the cutting the prepreg to a uniform size is cutting the prepreg to 300 x 300mm pieces.
8. A low dielectric high toughness polyimide composite prepared by the method of any one of claims 1 to 7.
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