CN114339561B

CN114339561B - High stability silicon microphone

Info

Publication number: CN114339561B
Application number: CN202111654882.XA
Authority: CN
Inventors: 刘宝玉; 刘昊
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2024-05-03
Anticipated expiration: 2041-12-30
Also published as: CN114339561A

Abstract

The invention belongs to the technical field of silicon microphones, and discloses a high-stability silicon microphone which comprises a packaging assembly, wherein the packaging assembly comprises a substrate, a shell, sound holes and a bonding pad, wherein the shell is arranged on the substrate, the sound holes are formed in the shell, and the bonding pad is connected to the substrate; a chip assembly; the chip assembly comprises an MEMS chip, an ASIC chip and a wire, wherein the MEMS chip and the ASIC chip are both arranged on the substrate, and the wire is connected between the MEMS chip and the ASIC chip; a limit component; the limiting component comprises the cavity grooves symmetrically formed in the inner side of the shell, and the two clamping plates which are oppositely arranged can be gradually close to each other through the matching of the structures such as the fixed block, the screw rod, the movable sleeve and the clamping plates, so that the MEMS chip and the ASIC chip can be clamped and limited respectively, the loosening and separation of the chips are effectively prevented, the failure and damage of the device are avoided, and the stability is greatly improved.

Description

High stability silicon microphone

Technical Field

The invention belongs to the technical field of silicon microphones, and particularly relates to a high-stability silicon microphone.

Background

The silicon microphone, i.e. the MEMS microphone, is a microphone manufactured based on MEMS technology, simply referred to as a capacitor integrated on a micro silicon wafer, can be manufactured by a surface mount technology, can withstand very high reflow soldering temperatures, is easy to integrate with CMOS technology and other audio circuits, and has improved noise cancellation performance.

However, the silicon microphone in the current market still has many defects in practical application, for example, the stability of a chip inside the device is poor, and when the silicon microphone is impacted by external force or collides with the silicon microphone, the silicon microphone is very easy to loose and separate, so that the device is damaged by failure, the service life of the device is greatly influenced, and the safety coefficient is poor.

Disclosure of Invention

The invention aims to provide a high-stability silicon microphone to solve the problems of poor stability and easy loosening and separation of chips in the background technology.

In order to achieve the above purpose, the present invention provides the following technical solutions: the high-stability silicon microphone comprises a packaging assembly, wherein the packaging assembly comprises a substrate, a shell, a sound hole and a bonding pad, wherein the shell is arranged on the substrate, the sound hole is formed in the shell, and the bonding pad is connected to the substrate; a chip assembly; the chip assembly comprises an MEMS chip, an ASIC chip and a wire, wherein the MEMS chip and the ASIC chip are both arranged on the substrate, and the wire is connected between the MEMS chip and the ASIC chip; a limit component; the limiting assembly comprises a cavity groove symmetrically arranged on the inner side of the shell, a screw rod rotatably arranged in the cavity groove, a movable sleeve symmetrically connected to two ends of the screw rod, a fixed block and a clamping plate, wherein one end of the screw rod extending to the outer portion of the shell is fixedly connected with the fixed block, the clamping plate is fixedly connected with the movable sleeve, and the clamping plate is arranged in the shell.

Preferably, a hold down assembly is included; the pressing assembly comprises a telescopic cylinder arranged in the shell, a spring sleeved on the telescopic cylinder, a pressing plate and a rubber pad, wherein the pressing plate is fixedly connected with the telescopic cylinder, and the rubber pad is arranged on the pressing plate.

Preferably, the device comprises a reinforcing component, wherein the reinforcing component comprises a first positioning hole, a first positioning block, a second positioning block and a second positioning hole, wherein the first positioning hole and the first positioning block are arranged on a substrate, the second positioning block and the second positioning hole are arranged on a shell, the first positioning hole is matched with the second positioning block, the second positioning hole is matched with the first positioning block, and the first positioning hole and the second positioning hole are distributed alternately.

Preferably, a support assembly is included; the support assembly comprises a limit groove and a limit block, wherein the limit block is arranged on the clamping plate, the limit groove is formed in the shell, and the limit groove is in sliding connection with the limit block.

Preferably, a filter screen is mounted on the inner side of the housing, and the filter screen is located below the sound hole.

Preferably, an insulating pad is mounted on the inner side of the clamping plate, and an anti-slip relief is arranged on the outer wall of the insulating pad.

Preferably, spiral lines are symmetrically arranged at two ends of the outer wall of the screw rod, and the directions of the two spiral lines are opposite.

Preferably, one end of the spring is connected with the pressing plate, and the other end of the spring is fixedly connected with the shell.

Preferably, a groove is formed in the outer side of the shell, and an arc chamfer is arranged on the inner wall of the groove.

Preferably, the first positioning block and the second positioning block are of raised semi-cylindrical structures, and the adjacent first positioning block and the adjacent second positioning block are equally spaced.

Compared with the prior art, the invention has the beneficial effects that:

(1) According to the invention, through the cooperation of the structures such as the fixed block, the screw rod, the movable sleeve, the clamping plates and the like, the two clamping plates which are oppositely arranged can be slowly close to each other, so that the MEMS chip and the ASIC chip can be clamped respectively, the clamping limit can be further carried out on the MEMS chip and the ASIC chip, the loosening and the separation of the chips are effectively prevented, the failure and the damage of the device are avoided, and the stability is greatly improved.

(2) According to the invention, through the cooperation of the pressing plate, the telescopic cylinder, the rubber pad and the spring, the pressing plate always has the pushing force for downwards pressing the chip, so that the MEMS chip and the ASIC chip can be tightly pressed against the substrate, the stability of the chip is further enhanced, and the safety coefficient is greatly improved.

(3) According to the invention, the first positioning hole, the second positioning hole and the first positioning block are matched, so that the shell and the substrate are tightly meshed together, the connection strength between the shell and the substrate is greatly enhanced, the structure is simple, and the packaging effect is improved.

(4) According to the invention, through the cooperation of the limiting groove and the limiting block, when the movable sleeve drives the clamping plate to move, the other end of the clamping plate can be supported and guided, so that the clamping plate can move more stably, the clamping plate is effectively prevented from shaking, and the stability of the structure is greatly improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is a schematic view of the structure of the substrate and the housing of the present invention;

FIG. 4 is a schematic view of the internal structure of the housing of the present invention;

in the figure: 1. a substrate; 2. a housing; 31. an acoustic aperture; 32. a bonding pad; 41. a MEMS chip; 42. an ASIC chip; 43. a wire; 51. a cavity groove; 52. a screw; 53. a movable sleeve; 54. a fixed block; 55. a clamping plate; 61. a telescopic cylinder; 62. a spring; 63. a pressing plate; 64. a rubber pad; 71. a first positioning hole; 72. a first positioning block; 73. a second positioning block; 74. a second positioning hole; 81. a limit groove; 82. a limiting block; 9. and (5) a filter screen.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1-4, the present invention provides the following technical solutions: the high-stability silicon microphone comprises a packaging assembly, wherein the packaging assembly comprises a substrate 1, a shell 2, an acoustic hole 31 and a bonding pad 32, wherein the shell 2 is arranged on the substrate 1, the acoustic hole 31 is arranged on the shell 2, and the bonding pad 32 is connected to the substrate 1; a chip assembly; the chip assembly comprises a MEMS chip 41, an ASIC chip 42 and a wire 43, wherein the MEMS chip 41 and the ASIC chip 42 are both arranged on the substrate 1, and the wire 43 is connected between the MEMS chip 41 and the ASIC chip 42; a limit component; the limiting component comprises a cavity groove 51 symmetrically arranged on the inner side of the shell 2, a screw rod 52 rotatably arranged in the cavity groove 51, a movable sleeve 53 symmetrically connected to two ends of the screw rod 52, a fixed block 54 and a clamping plate 55, wherein one end of the screw rod 52 extending to the outer portion of the shell 2 is fixedly connected with the fixed block 54, the clamping plate 55 is fixedly connected with the movable sleeve 53, and the clamping plate 55 is arranged in the shell 2.

Specifically, after the chip is packaged, the two fixed blocks 54 can be respectively rotated, so that the fixed blocks 54 drive the screw 52 to rotate, then under the action of threads, the two movable sleeves 53 on the screw 52 can be simultaneously moved, and then the movable sleeves 53 drive the clamping plates 55 to move, so that the two clamping plates 55 are slowly close to each other, the MEMS chip 41 and the ASIC chip 42 can be respectively clamped, further the MEMS chip 41 and the ASIC chip 42 can be clamped and limited, the chip loosening and separation are effectively prevented, the device failure damage is avoided, and the stability is greatly improved;

the sound signal can be converted into an electrical signal through the MEMS chip 41, and the MEMS chip 41 is electrically connected with the ASIC chip 42, so that the electrical signal output by the MEMS chip 41 can be transmitted to the ASIC chip 42, and thus processed and output by the ASIC chip 42.

Comprises a compacting component; the compressing assembly comprises a telescopic cylinder 61 arranged in the shell 2, a spring 62 sleeved on the telescopic cylinder 61, a pressing plate 63 and a rubber pad 64, wherein the pressing plate 63 is fixedly connected with the telescopic cylinder 61, and the rubber pad 64 is arranged on the pressing plate 63.

Specifically, after the casing 2 is connected with the substrate 1, the two pressing plates 63 in the casing 2 can respectively press against the MEMS chip 41 and the ASIC chip 42, and under the resilience of the rubber pad 64 and the spring 62, the pressing plates 63 can always have a pushing force for pressing the chip downwards, so that the MEMS chip 41 and the ASIC chip 42 can be tightly pressed against the substrate 1, further the stability of the chip is further enhanced, and the safety coefficient is greatly improved.

Including the reinforcement subassembly, the reinforcement subassembly includes first locating hole 71, first locating piece 72, second locating piece 73 and second locating hole 74, wherein first locating hole 71 and first locating piece 72 all set up on base plate 1, and second locating piece 73 and second locating hole 74 all set up on shell 2, and first locating hole 71 and second locating piece 73 assorted, second locating hole 74 and first locating piece 72 assorted, and first locating hole 71 and second locating hole 74 alternate distribution.

Specifically, when the housing 2 and the substrate 1 are packaged, the first positioning hole 71 and the second positioning block 73 can be mutually clamped, the second positioning hole 74 and the first positioning block 72 can be mutually matched, and the first positioning hole 71 and the second positioning hole 74, the second positioning block 73 and the first positioning block 72 are mutually crossed and arranged, so that the housing 2 and the substrate 1 can be tightly meshed together, the connection strength between the housing 2 and the substrate 1 is greatly enhanced, the structure is simple, and the packaging effect is improved.

Comprises a supporting component; the support component comprises a limit groove 81 and a limit block 82, wherein the limit block 82 is arranged on the clamping plate 55, the limit groove 81 is arranged in the shell 2, and the limit groove 81 and the limit block 82 are in sliding connection.

Specifically, through addding spacing groove 81 and stopper 82, can be when movable sleeve 53 drives splint 55 and remove, can support the guide to the other end of splint 55 to can make splint 55 more steady when removing, effectually prevent splint 55 to rock, improved the stability of structure greatly.

The filter screen 9 is installed to the inboard of shell 2, and filter screen 9 is located the below of sound hole 31, insulating pad is installed to splint 55's inboard, and insulating pad's outer wall is provided with anti-skidding burr, screw 52's outer wall both ends symmetry is provided with the spiral line, and the opposite direction of two spiral lines, the one end and the clamp plate 63 of spring 62 are connected, and the other end and the shell 2 fixed connection of spring 62, the groove of digging has been seted up in the outside of shell 2, and the inner wall of digging the groove is provided with the circular arc chamfer, first locating piece 72 and second locating piece 73 are bellied semi-cylindrical structure, and the interval of two adjacent first locating pieces 72 and second locating piece 73 equals.

Specifically, dust can be prevented from entering the shell 2 from the sound hole 31 through the filter screen 9, the tightness of the clamping plates 55 when clamping chips can be further enhanced through the insulating pad, two clamping plates 55 can be simultaneously controlled to move through the screw rods 52, the shell 2 is conveniently held through the groove, and the use effect is good.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high stability silicon microphone, comprising:

the packaging assembly comprises a substrate (1), a shell (2) arranged on the substrate (1), sound holes (31) and bonding pads (32), wherein the sound holes (31) are formed in the shell (2), and the bonding pads (32) are connected to the substrate (1);

A chip assembly; the chip assembly comprises an MEMS chip (41), an ASIC chip (42) and a wire (43), wherein the MEMS chip (41) and the ASIC chip (42) are both arranged on the substrate (1), and the wire (43) is connected between the MEMS chip (41) and the ASIC chip (42);

A limit component; the limiting component comprises a cavity groove (51) symmetrically arranged on the inner side of the shell (2), a screw rod (52) rotatably arranged in the cavity groove (51), movable sleeves (53) symmetrically connected to two ends of the screw rod (52), a fixed block (54) and a clamping plate (55), wherein one end of the screw rod (52) extending to the outer part of the shell (2) is fixedly connected with the fixed block (54), the clamping plate (55) is fixedly connected with the movable sleeve (53), and the clamping plate (55) is arranged in the shell (2);

Comprises a compacting component;

the compression assembly comprises a telescopic cylinder (61) arranged in the shell (2), a spring (62) sleeved on the telescopic cylinder (61), a pressing plate (63) and a rubber pad (64), wherein the pressing plate (63) is fixedly connected with the telescopic cylinder (61), and the rubber pad (64) is arranged on the pressing plate (63);

two clamping plates (55) which are oppositely arranged are close to each other through the matching of the fixed block (54), the screw rod (52), the movable sleeve (53) and the clamping plates (55), so that the MEMS chip (41) and the ASIC chip (42) are clamped respectively, and further the MEMS chip (41) and the ASIC chip (42) are clamped and limited;

The pressing plate (63) always has a pushing force for pressing down the chip through the cooperation of the pressing plate (63), the telescopic cylinder (61), the rubber pad (64) and the spring (62), so that the MEMS chip (41) and the ASIC chip (42) are pressed against the substrate.

2. A high stability silicon microphone as defined in claim 1 wherein: including reinforcement subassembly, reinforcement subassembly includes first locating hole (71), first locating piece (72), second locating piece (73) and second locating hole (74), wherein first locating hole (71) and first locating piece (72) all set up on base plate (1), second locating piece (73) and second locating hole (74) all set up on shell (2), first locating hole (71) and second locating piece (73) assorted, second locating hole (74) are with first locating piece (72) looks, and first locating hole (71) and second locating hole (74) alternate distribution.

3. A high stability silicon microphone as defined in claim 2 wherein: comprises a supporting component;

The supporting component comprises a limiting groove (81) and a limiting block (82), wherein the limiting block (82) is installed on the clamping plate (55), the limiting groove (81) is formed in the shell (2), and the limiting groove (81) is in sliding connection with the limiting block (82).

4. A high stability silicon microphone according to claim 3, wherein: a filter screen (9) is arranged on the inner side of the shell (2), and the filter screen (9) is positioned below the sound hole (31).

5. The high stability silicon microphone of claim 4 wherein: an insulating pad is arranged on the inner side of the clamping plate (55), and an anti-slip convex line is arranged on the outer wall of the insulating pad.

6. The high stability silicon microphone of claim 5 wherein: spiral lines are symmetrically arranged at two ends of the outer wall of the screw (52), and the directions of the two spiral lines are opposite.

7. The high stability silicon microphone of claim 6 wherein: one end of the spring (62) is connected with the pressing plate (63), and the other end of the spring (62) is fixedly connected with the shell (2).

8. The high stability silicon microphone of claim 7 wherein: the outer side of the shell (2) is provided with a groove, and the inner wall of the groove is provided with an arc chamfer.

9. The high stability silicon microphone of claim 8 wherein: the first positioning blocks (72) and the second positioning blocks (73) are of raised semi-cylindrical structures, and the intervals between two adjacent first positioning blocks (72) and second positioning blocks (73) are equal.