CN212163691U - Miniaturized high-power amplifier integrated circuit - Google Patents
Miniaturized high-power amplifier integrated circuit Download PDFInfo
- Publication number
- CN212163691U CN212163691U CN202020790098.6U CN202020790098U CN212163691U CN 212163691 U CN212163691 U CN 212163691U CN 202020790098 U CN202020790098 U CN 202020790098U CN 212163691 U CN212163691 U CN 212163691U
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- CN
- China
- Prior art keywords
- fixing bolt
- circuit board
- power amplifier
- integrated circuit
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000035939 shock Effects 0.000 claims abstract description 19
- 239000003990 capacitor Substances 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 13
- 229920000742 Cotton Polymers 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a miniaturized high-power amplifier integrated circuit, which comprises a circuit board, the upper end of circuit board is installed with the spring shock pad, the spring shock pad includes the base, the upper end of base is installed with rubber pad and two bracing pieces, the rubber pad is located between two bracing pieces, the upper end of rubber pad is installed with the spring, and the one end of spring is installed with fixing bolt, circular sheet has been cup jointed in the outside of fixing bolt, and fixing bolt's upper end is installed with circular top, the lower extreme of circular sheet is installed with the slide bar, install the acoustic celotex board around the circuit board, and the lower extreme of acoustic celotex board is installed with the sheetmetal; the utility model discloses can play absorbing effect, the protection circuit component can also keep apart the noise simultaneously, improves the audio.
Description
Technical Field
The utility model belongs to power amplifier integrated circuit field specifically is a miniaturized high-power amplifier integrated circuit.
Background
With the continuous development of modern electronic technology, integrated circuits are widely used in various electronic circuits, and with the rapid development and application of power amplification circuits due to the progress of semiconductor technology, audio power amplification circuits are the most basic and most widely used amplification circuits in principle.
The existing miniaturized high-power amplifier integrated circuit has certain disadvantages when in use, and the structure of a circuit board can be damaged due to the large vibration of a sound box when in use, so that electronic elements are damaged, and the cost of equipment is increased; the existing miniaturized high-power amplifier integrated circuit can increase redundant noise due to external factors in the process of signal conduction, cannot obtain the original tone quality, and brings certain influence on practical use.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a miniaturized high-power amplifier integrated circuit, which effectively solves the problems that the existing miniaturized high-power amplifier integrated circuit can damage the structure of a circuit board due to the large-amplitude vibration of a sound device when in use, causes damage to an electronic element and increases the cost of equipment; the prior miniaturized high-power amplifier integrated circuit can increase redundant noise due to external factors in the process of signal transmission, and cannot obtain the original tone quality.
The purpose of the utility model can be realized by the following technical scheme:
a miniaturized high-power amplifier integrated circuit comprises a circuit board and is characterized in that: the circuit board is characterized in that a spring shock pad, a first sensor, a second sensor, a first resistor, a second resistor, a first capacitor, a second capacitor and a triode are mounted at the upper end of the circuit board, the first capacitor is arranged on one side of the first sensor, the second capacitor is arranged on the other side of the first capacitor, the spring shock pad is arranged on one side of the first resistor, the second sensor is arranged on the other side of the first resistor, the triode is arranged on the other side of the spring shock pad, and the second resistor is arranged on the other side of the triode;
the spring shock pad comprises a base, a rubber pad and two support rods are mounted at the upper end of the base, the rubber pad is positioned between the two support rods, a spring is mounted at the upper end of the rubber pad, a fixing bolt is mounted at one end of the spring, a round piece is sleeved on the outer side of the fixing bolt, a round top is mounted at the upper end of the fixing bolt, and a sliding rod is mounted at the lower end of the round piece;
the circuit board is provided with acoustic baffle plates around, and the lower end of the acoustic baffle plate is provided with a metal sheet.
As a further scheme of the utility model, the acoustic celotex board passes through screw and circuit board fixed connection, runs through the screw has been seted up in the outside of sheetmetal.
As a further aspect of the utility model, the parcel has soundproof cotton around the acoustic celotex board, soundproof cotton cup joints with the acoustic celotex board.
As a further proposal of the utility model, the base passes through screw and circuit board fixed connection, and the inside recess of seting up of bracing piece.
As a further aspect of the utility model, the pulley is installed to one side of slide bar, and the pulley joint is inside the recess, and the slide bar passes through pulley and bracing piece sliding connection.
As a further aspect of the utility model, rotate between fixing bolt and the circular sheet and be connected, and the circular top on fixing bolt top is the setting of circle form, and the bottom on circular top and fixing bolt's top fixed connection.
The utility model has the advantages that:
the utility model discloses a set up the spring shock pad on the circuit board, when passing through the screwed connection base on the circuit board, if the circular top meets large amplitude vibrations, can compress fixing bolt downwards, fixing bolt moves down compression spring, makes the pulley of slide bar both sides glide in the recess of bracing piece inside, can move up when the spring is compressed to the critical value, drives slide bar and pulley and moves up, then repeated action, until the spring tends to steadily, protects electronic component, prevents that the circuit board from being broken, reduces equipment cost;
through set up the acoustic celotex board around the circuit board, at the signal conduction in-process, external environment can produce a large amount of noises, destroys former sound quality and so parcel soundproof cotton around the acoustic celotex board, and outside noise that can effectual reduction makes the tone quality of conducting out purer.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a front view of the spring shock pad of the present invention.
Fig. 3 is a structural view of the baffle of the present invention.
In the figure: 1. a first capacitor; 2. a sound insulating board; 3. a first sensor; 4. a spring cushion; 5. a second sensor; 6. a first resistor; 7. a second capacitor; 8. a circuit board; 9. a triode; 10. a second resistor; 11. fixing the bolt; 12. a support bar; 13. a pulley; 14. a base; 15. a circular top; 16. a circular sheet; 17. a slide bar; 18. a spring; 19. a rubber pad; 20. sound insulation cotton; 21. a metal sheet; 22. and a screw hole.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1-3, a miniaturized high-power amplifier integrated circuit includes a circuit board 8, a spring shock pad 4, a first sensor 3, a second sensor 5, a first resistor 6, a second resistor 10, a first capacitor 1, a second capacitor 7 and a triode 9 are mounted at the upper end of the circuit board 8, the first capacitor 1 is on one side 3 of the first sensor, the second capacitor 7 is on the other side of the first capacitor 1, the spring shock pad 4 is on one side of the first resistor 6, the second sensor 5 is on the other side of the first resistor 6, the triode 9 is on the other side of the spring shock pad 4, and the second resistor 10 is on the other side of the triode 9;
the spring shock pad 4 comprises a base 14, a rubber pad 19 and two support rods 12 are mounted at the upper end of the base 14, the rubber pad 19 is positioned between the two support rods 12, a spring 18 is mounted at the upper end of the rubber pad 19, a fixing bolt 11 is mounted at one end of the spring 18, a round sheet 16 is sleeved on the outer side of the fixing bolt 11, a round top 15 is mounted at the upper end of the fixing bolt 11, and a sliding rod 17 is mounted at the lower end of the round sheet 16;
the acoustic panel 2 is attached around the circuit board 8, and the metal piece 21 is attached to the lower end of the acoustic panel 2.
The sound insulation board 2 is fixedly connected with the circuit board 8 through screws, a screw hole 22 is formed in the outer side of the metal sheet 21 in a penetrating mode, and the metal sheet 21 can be bent and folded.
The parcel has soundproof cotton 20 around the acoustic celotex board 2, and soundproof cotton 20 cup joints with acoustic celotex board 2, and soundproof cotton 20 can be dismantled and wash.
The base 14 is fixedly connected with the circuit board 8 through screws, and the supporting rod 12 is internally provided with a groove, and the cross-sectional area of the groove is larger than that of the pulley 13.
The pulley 13 is installed to one side of slide bar 17, and the pulley 13 joint is inside the recess, and slide bar 17 passes through pulley 13 and bracing piece 12 sliding connection.
The fixing bolt 11 is rotatably connected with the circular sheet 16, the circular top 15 at the top end of the fixing bolt 11 is arranged in a circular shape, and the bottom of the circular top 15 is fixedly connected with the top of the fixing bolt 11.
A miniaturized high-power amplifier integrated circuit is characterized in that when the miniaturized high-power amplifier integrated circuit is used, a spring shock pad 4 is fixed on a circuit board 8 through screws, then a welding gun is used for fixing a capacitor I1, a capacitor II 7, a resistor I6, a resistor II 10, a sensor I3, a sensor II 5 and a triode 9 on the circuit board 8, then a sound insulation board 2 is fixed on the periphery of the circuit board 8 through screws, then the connected circuit board 8 is installed in a stereo or a vehicle-mounted stereo, if large-amplitude vibration is met, a fixing bolt 11 connected to the lower end of a circular top 15 can downwards compress a spring 18, a pulley 13 installed on a sliding rod 17 can downwards slide in a supporting rod 12, when the spring 18 is compressed to a critical value, a circular sheet 16 can be driven to upwards stretch, at the moment, the sliding rod 17 upwards moves under the driving of the circular sheet 16, the pulley 13 upwards moves, and the reciprocating action is carried out until the spring, reach the shock attenuation effect, protection circuit board 8 and electronic component do not receive the harm, set up acoustic celotex board 2 around circuit board 8 moreover, can effectual reduction external noise, make the sound of conduction come out purer, play the effect of protection tone quality.
The utility model arranges the spring shock pad 4 on the circuit board 8, when the base 14 is connected on the circuit board 8 through the screw, if the circular top 15 is shocked greatly, the fixing bolt 11 will be compressed downwards, the fixing bolt 11 will move downwards to compress the spring 18, so that the pulleys 13 at both sides of the sliding rod 17 will slide downwards in the grooves inside the supporting rod 12, when the spring 18 is compressed to a critical value, it moves upwards, bringing the sliding rod 17 and the pulley 13 upwards, and then repeating the operation until the spring 18 is smoothed to protect the electronic components, prevent the circuit board 8 from being broken, reduce the equipment cost, by disposing the noise insulation plate 2 around the circuit board, in the signal transmission process, the external environment can generate a large amount of noise, and the original sound quality is damaged, so that the sound insulation cotton 20 is wrapped around the sound insulation plate 2, and the external noise can be effectively reduced, so that the transmitted sound quality is purer.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The utility model provides a miniaturized high-power amplifier integrated circuit, includes circuit board (8), its characterized in that: the upper end of the circuit board (8) is provided with a spring shock pad (4), a first sensor (3), a second sensor (5), a first resistor (6), a second resistor (10), a first capacitor (1), a second capacitor (7) and a triode (9), wherein the first capacitor (1) is arranged on one side of the first sensor (3), the second capacitor (7) is arranged on the other side of the first capacitor (1), the spring shock pad (4) is arranged on one side of the first resistor (6), the second sensor (5) is arranged on the other side of the first resistor (6), the triode (9) is arranged on the other side of the spring shock pad (4), and the second resistor (10) is arranged on the other side of the triode (9);
the spring shock pad (4) comprises a base (14), a rubber pad (19) and two support rods (12) are mounted at the upper end of the base (14), the rubber pad (19) is positioned between the two support rods (12), a spring (18) is mounted at the upper end of the rubber pad (19), a fixing bolt (11) is mounted at one end of the spring (18), a round piece (16) is sleeved at the outer side of the fixing bolt (11), a round top (15) is mounted at the upper end of the fixing bolt (11), and a sliding rod (17) is mounted at the lower end of the round piece (16);
the circuit board (8) is provided with the sound insulation board (2) at the periphery, and the lower end of the sound insulation board (2) is provided with the metal sheet (21).
2. The miniaturized high-power amplifier integrated circuit according to claim 1, wherein the sound insulation board (2) is fixedly connected with the circuit board (8) through a screw, and a screw hole (22) is formed through the outer side of the metal sheet (21).
3. The miniaturized high-power amplifier integrated circuit according to claim 1, wherein sound insulation cotton (20) is wrapped around the sound insulation board (2), and the sound insulation cotton (20) is sleeved with the sound insulation board (2).
4. The miniaturized high-power amplifier integrated circuit according to claim 1, wherein the base (14) is fixedly connected with the circuit board (8) through screws, and the support rod (12) is internally provided with a groove.
5. The miniaturized high-power amplifier integrated circuit according to claim 1, wherein a pulley (13) is installed at one side of the sliding rod (17), the pulley (13) is clamped inside the groove, and the sliding rod (17) is slidably connected with the supporting rod (12) through the pulley (13).
6. The miniaturized high-power amplifier integrated circuit according to claim 1, wherein the fixing bolt (11) is rotatably connected with the circular plate (16), the circular top (15) at the top end of the fixing bolt (11) is arranged in a circular shape, and the bottom of the circular top (15) is fixedly connected with the top of the fixing bolt (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020790098.6U CN212163691U (en) | 2020-05-13 | 2020-05-13 | Miniaturized high-power amplifier integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020790098.6U CN212163691U (en) | 2020-05-13 | 2020-05-13 | Miniaturized high-power amplifier integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212163691U true CN212163691U (en) | 2020-12-15 |
Family
ID=73709679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020790098.6U Expired - Fee Related CN212163691U (en) | 2020-05-13 | 2020-05-13 | Miniaturized high-power amplifier integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212163691U (en) |
-
2020
- 2020-05-13 CN CN202020790098.6U patent/CN212163691U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201215 |