CN114334750B - Packaging structure of lead frame and packaging process thereof - Google Patents
Packaging structure of lead frame and packaging process thereof Download PDFInfo
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- CN114334750B CN114334750B CN202210224875.4A CN202210224875A CN114334750B CN 114334750 B CN114334750 B CN 114334750B CN 202210224875 A CN202210224875 A CN 202210224875A CN 114334750 B CN114334750 B CN 114334750B
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Abstract
The invention belongs to the technical field of lead frame packaging structures, and particularly relates to a lead frame packaging structure and a packaging process thereof. The invention can greatly optimize the packaging link, can effectively buffer the collision stress on the chip on the lead frame in the packaging and using process, can effectively utilize waste energy to assist in improving the heat dissipation property in the packaging structure in the working process, can effectively remove dust on the dust screen, and can eliminate static on the brush hair to prevent the brush hair from adsorbing the dust.
Description
Technical Field
The invention belongs to the technical field of lead frame packaging structures, and particularly relates to a packaging structure of a lead frame and a packaging process thereof.
Background
The lead frame is used as a chip carrier of an integrated circuit, and is a key structural member for realizing the electrical connection between a circuit leading-out end inside a chip and an outer lead by means of bonding materials to form an electrical circuit. The lead frame is used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
Nowadays, the lead frame is at the in-process of encapsulation, often need seal outward through the casing, in order to provide the protection to the lead frame and the chip on it, a casing for sealing outward generally comprises epitheca and inferior valve, at the in-process of encapsulation, need the user to fix each tie point of epitheca and inferior valve in proper order through a plurality of bolts, it is comparatively loaded down with trivial details, and traditional packaging structure, generally only set up the thermovent on the casing and be used for the heat dissipation, the radiating effect is poor, in addition, because the chip is fixed in on the lead frame through the glue solution, make the glue solution be heated the inflation easily and produce stress, influence the stability of chip tie point.
Therefore, we propose a lead frame package structure and a packaging process thereof to solve the above problems.
Disclosure of Invention
The present invention is directed to solve the above problems and provides a lead frame package structure and a package process thereof.
In order to achieve the purpose, the invention adopts the following technical scheme: a packaging structure of a lead frame comprises an upper sealing cover and a lower sealing seat, wherein a placing groove is arranged on the lower sealing seat, and both sides of the lower sealing seat are provided with a plurality of pin grooves matched with the placing grooves, the upper sealing cover is fixedly connected with a pressing block matched with the pin grooves, the lower sealing seat is provided with two lifting mechanisms, the output ends of the two lifting mechanisms are fixedly connected with the upper sealing cover, a linkage mechanism is arranged between the two lifting mechanisms, and the lower sealing seat is provided with a driving mechanism matched with one of the lifting mechanisms, the upper sealing cover is fixedly provided with a plurality of heat conducting rods, the lower end of the heat conducting rod penetrates through the upper sealing cover and is fixedly sleeved with the buffering heat conducting seat, the heat conducting rod is provided with a gas conducting cavity, and the two sides of the air guide cavity are fixedly communicated with air pipes, the top end of the air guide cavity is provided with a dust screen, and the heat conducting rod is internally provided with an air guide dust removal mechanism matched with the dust screen.
In the above-mentioned packaging structure of lead frame, elevating system comprises cavity, nut seat and screw rod, the cavity is seted up on lower seal receptacle, and the nut seat rotates and sets up in the cavity, screw rod and nut seat threaded connection, and the upper end of screw rod run through the cavity and with upper cover fixed connection.
In the above-mentioned package structure of a lead frame, the link gear is composed of two synchronizing wheels and a synchronous belt, the two synchronizing wheels are respectively and fixedly sleeved on the corresponding nut seats, and the two synchronizing wheels are connected through the synchronous belt.
In the above-mentioned packaging structure of a lead frame, actuating mechanism comprises worm and worm wheel, the worm rotates and sets up in one of them cavity, and the one end of worm runs through the cavity and fixed the cup joint has the knob, the worm wheel is fixed the cup joint on one of them nut seat, and worm wheel and worm mesh mutually, the expansion helix angle of worm is less than the friction angle between worm and the worm wheel.
In the above-mentioned package structure of a lead frame, the buffer heat-conducting seat is composed of a heat-conducting rubber seat and a cooling liquid, the heat-conducting rubber seat is fixedly sleeved on the heat-conducting rod, and the cooling liquid is injected into the heat-conducting rubber seat.
In the above-mentioned packaging structure of the lead frame, the air guide dust removal mechanism is composed of an air guide fan, a bevel gear set, a micro motor, a fixing rod, a brush rod, and a plurality of thermoelectric generation pieces, the air guide fan is rotatably arranged in the air guide cavity, the front and back surfaces of the air guide fan are completely antisymmetric, the micro motor is arranged on the inner wall of one side of the air guide cavity, the micro motor is in transmission connection with a transmission shaft of the air guide fan through a bevel gear set, the fixed rod is fixedly arranged at the upper end of the transmission shaft of the air guide fan, the upper end of the fixed rod penetrates through the dust screen and is fixedly connected with the brush rod, the brush of the brush rod is in contact connection with the dust screen, a conductive cavity is arranged at the lower side of the heat conducting rod, each thermoelectric generation piece is fixedly arranged in the conductive cavity, the hot junction of each thermoelectric generation piece all extends to and sets up in the coolant liquid, and each thermoelectric generation piece and micro motor electric connection.
In the above-mentioned packaging structure of a lead frame, fur balls are fixedly connected to the transmission shaft of the air guide fan, and glass rods capable of contacting the fur balls are fixedly arranged on two sides of the air guide fan, and conductive pointed blocks are fixedly arranged on the glass rods.
A packaging process of a packaging structure of a lead frame comprises the following steps:
s1, firstly, placing the lead frame carrying the chip into a placing groove, and enabling the pins on the lead frame to penetrate through the pin grooves;
s2, rotating a knob, wherein the knob drives a worm to rotate, the worm drives one of the nut seats to rotate through a worm wheel, the two nut seats synchronously rotate under the transmission coordination of two synchronous wheels and a synchronous belt, and then the two screw rods pull the upper sealing cover to descend until the upper sealing cover is in butt joint with the lower sealing seat;
s3, along with the butt joint of the upper sealing cover and the lower sealing seat, each pressing block can be in butt joint with the pin groove, so that pins of each lead frame are pressed and fixed, and meanwhile, each heat conduction rubber seat can be in butt joint with a corresponding chip on the lead frame.
Compared with the prior art, the invention has the beneficial effects that: the upper sealing cover can be in quick butt joint with the lower sealing cover by controlling the synchronous action of the two lifting mechanisms through the matching of the driving mechanism and the linkage mechanism, so that the sealing of a lead frame is realized, the sealing process is convenient, the corresponding chip can be automatically pressed in a matching way through the arranged buffering heat conducting seat in the sealing process, when glue solution on the chip collides to generate stress, the stress can be counteracted by utilizing the elastic deformation of the buffering heat conducting seat, the stability of a chip connecting point is ensured, the buffering heat conducting seat can be matched with the heat conducting rod to guide the heat generated by the chip to the outside in the working process of the chip to realize heat exchange, so that the heat dissipation of the chip is realized, meanwhile, the air guide dust removal mechanism can be used for acting by utilizing the heat energy generated by the chip when the chip generates heat, so that the hot air flow generated in the sealing structure can be quickly guided to the outside, simultaneously, when discharging steam, air guide dust removal mechanism can remove dust to the dust screen automatically, in order to avoid the dust screen to block up, influence the flow of air current, and simultaneously, cooperation through the fur ball that sets up and each glass stick, can make the glass stick produce the positive charge at the frictional in-process, the electrically conductive sharp piece of cooperation can release the positive charge of gathering, and under the guide effect of air guide fan, can blow the positive charge of release to the brush pole on, in order to with the negative charge of gathering on the brush hair of brush pole, and then can reach the purpose of eliminating brush hair static, avoid the brush hair to adsorb the dust, influence dust removal effect.
In summary, the following steps: through the design of the invention, the packaging link can be greatly optimized, and simultaneously, the collision stress on the chip on the lead frame can be effectively buffered in the packaging use process, and the invention can effectively utilize waste energy to assist in improving the heat dissipation property in the packaging structure in the working process, and can effectively remove dust on the dust screen and eliminate static electricity on the bristles to prevent the bristles from adsorbing the dust.
Drawings
Fig. 1 is a schematic overall structure diagram of a lead frame packaging structure and a packaging process thereof according to the present invention;
FIG. 2 is a schematic cross-sectional view of a lower sealing seat of the lead frame package structure and the packaging process thereof provided by the present invention;
FIG. 3 is a schematic structural diagram of a heat-conducting bar and a heat-conducting buffer base of the package structure of the lead frame and the packaging process thereof according to the present invention;
FIG. 4 is a schematic cross-sectional view of a heat-conducting bar and a heat-conducting buffer base of the lead frame package structure and the packaging process thereof according to the present invention;
FIG. 5 is a schematic view of a structure of a lead frame package structure and a dust screen and a brush rod of the package process of the lead frame package structure cooperating with each other;
fig. 6 is an enlarged schematic view of a portion a in fig. 4.
In the figure: 1 upper sealing cover, 2 lower sealing seat, 3 pin grooves, 4 pressing blocks, 5 lifting mechanisms, 51 cavities, 52 nut seats, 53 screw rods, 6 linkage mechanisms, 61 synchronizing wheels, 62 synchronizing belts, 7 driving mechanisms, 71 worms, 72 worm wheels, 8 heat conducting rods, 9 buffer heat conducting seats, 91 heat conducting rubber seats, 10 air conducting cavities, 11 air pipes, 12 dust screens, 13 air conducting and dust removing mechanisms, 131 air conducting fans, 132 bevel gear sets, 133 micro motors, 134 fixing rods, 135 hairbrush rods, 136 thermoelectric power generation sheets, 14 knobs, 15 electric conducting cavities, 16 fur balls, 17 glass rods, 18 electric conducting sharp blocks and 19 placing grooves.
Detailed Description
The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
As shown in fig. 1-6, a lead frame package structure comprises an upper sealing cover 1 and a lower sealing base 2, a placing groove 19 is formed on the lower sealing base 2, a plurality of pin grooves 3 matched with the placing groove 19 are formed on both sides of the lower sealing base 2, a press block 4 matched with the pin grooves 3 is fixedly connected to the upper sealing cover 1, two lifting mechanisms 5 are arranged on the lower sealing base 2, output ends of the two lifting mechanisms 5 are fixedly connected to the upper sealing cover 1, each lifting mechanism 5 comprises a cavity 51, a nut base 52 and a screw 53, the cavity 51 is formed on the lower sealing base 2, the nut base 52 is rotatably arranged in the cavity 51, the screw 53 is in threaded connection with the nut base 52, an upper end of the screw 53 penetrates through the cavity 51 and is fixedly connected to the upper sealing cover 1, the nut base 52 and the screw 53 are matched, the screw characteristics between the two can be utilized to match the rotation of the nut base 52, the lifting of the screw 53 is realized, and then the screw 53 drives the upper sealing cover 1 to lift, so that the butt joint encapsulation of the upper sealing cover 1 and the lower sealing seat 2 is realized.
A linkage mechanism 6 is arranged between the two lifting mechanisms 5, a driving mechanism 7 matched with one lifting mechanism 5 is arranged on the lower seal seat 2, the linkage mechanism 6 consists of two synchronizing wheels 61 and a synchronous belt 62, the two synchronizing wheels 61 are respectively fixedly sleeved on the corresponding nut seats 52, the two synchronizing wheels 61 are in transmission connection through the synchronous belt 62, the linkage between the two nut seats 52 can be realized through the transmission matching of the two synchronizing wheels 61 and the synchronous belt 62, the operation of the device is greatly convenient, the driving mechanism 7 consists of a worm 71 and a worm wheel 72, the worm 71 is rotatably arranged in one cavity 51, one end of the worm 71 penetrates through the cavity 51 and is fixedly sleeved with a knob 14, the worm wheel 72 is fixedly sleeved on one nut seat 52, the worm wheel 72 is meshed with the worm 71, the expansion helix angle of the worm 71 is smaller than the friction angle between the worm 71 and the worm wheel 72, the worm 71 and the worm wheel 72 are in transmission fit, so that a user can conveniently control one of the nut seats 52 to rotate through the knob 14, and the spiral angle of the worm 71 is designed, so that self-locking between the worm 71 and the worm wheel 72 can be realized, and the trouble of manual locking is avoided.
Go up fixed a plurality of heat conduction sticks 8 that are provided with on the closing cap 1, and the lower extreme of heat conduction stick 8 runs through closing cap 1 and fixed cover has connect buffering heat conduction seat 9, buffering heat conduction seat 9 comprises heat conduction rubber seat 91 and coolant liquid, heat conduction rubber seat 91 is fixed to be cup jointed on heat conduction stick 8, and the coolant liquid pours into in heat conduction rubber seat 91, heat conduction rubber seat 91 through setting up, can utilize self elasticity, give chip buffer protection, and simultaneously, heat conduction rubber seat 91 has good heat-conduction characteristic, be convenient for with the heat conduction that produces, realize the heat dissipation of chip, the setting of coolant liquid, can utilize the characteristic of self liquid, accelerate the heat dissipation of chip, and simultaneously, can utilize self resistance to offset the thermal energy stress that the chip received.
An air guide cavity 10 is formed on a heat conduction rod 8, air pipes 11 are fixedly communicated with two sides of the air guide cavity 10, a dustproof net 12 is arranged at the top end of the air guide cavity 10, an air guide dust removing mechanism 13 matched with the dustproof net 12 is arranged in the heat conduction rod 8, the air guide dust removing mechanism 13 is composed of an air guide fan 131, a bevel gear set 132, a micro motor 133, a fixed rod 134, a brush rod 135 and a plurality of temperature difference power generation sheets 136, the air guide fan 131 is rotatably arranged in the air guide cavity 10, the front side and the back side of the air guide fan 131 are completely in an anti-symmetric design, the micro motor 133 is arranged on the inner wall of one side of the air guide cavity 10, the micro motor 133 is in transmission connection with a transmission shaft of the air guide fan 131 through the bevel gear set 132, the fixed rod 134 is fixedly arranged at the upper end of the transmission shaft of the air guide fan 131, the upper end of the fixed rod 134 penetrates through the dustproof net 12 and is fixedly connected with the brush rod 135, and bristles of the brush rod 135 are in contact connection with the dustproof net 12, conductive cavity 15 has been seted up to the downside of conducting rod 8, each thermoelectric generation piece 136 is all fixed to be set up in conductive cavity 15, the hot junction of each thermoelectric generation piece 136 all extends to and sets up in the coolant liquid, and each thermoelectric generation piece 136 and micro motor 133 electric connection, thermoelectric generation piece 136 through setting up, can utilize the temperature variation of coolant liquid, make thermoelectric generation piece 136 from electricity generation, start micro motor 133, in order to avoid external power supply's loaded down with trivial details, and simultaneously, use cost can be reduced, under the transmission of bevel gear set 132, can reduce the number of teeth of complex driven bevel gear, realize the acceleration rate to air guide fan 131, and make air guide fan 131 can rotate fast, the hot gas flow direction external in the packaging structure, in order to improve packaging structure's thermal diffusivity.
The fur ball 16 is fixedly connected to the transmission shaft of the air guide fan 131, the two sides of the air guide fan 131 are fixedly provided with the glass rod 17 which can be contacted with the fur ball 16, the glass rod 17 is fixedly provided with the conductive pointed block 18, the fur ball 16 can be matched with the rotation of the air guide fan 131 through the arrangement, friction is generated between the fur ball and the glass rod 17, positive charges can be generated on the glass rod 17, the discharge principle of the conductive pointed block 18 is utilized to be matched with the diversion of the air guide fan 131, and static electricity can be neutralized in contact between the generated positive charges and the bristles on the brush rod 135.
The operating principle of the present invention will now be described as follows:
when the packaging structure is used, firstly, a lead frame bearing a chip is placed into the placing groove 19, pins on the lead frame penetrate through the pin grooves 3, then, the knob 14 is rotated, the knob 14 can drive the worm 71 to rotate, the worm 71 can drive one of the nut seats 52 to rotate through the worm wheel 72, under the transmission fit of the two synchronous wheels 61 and the synchronous belt 62, the two nut seats 52 can synchronously rotate, then the two screw rods 53 can pull the upper sealing cover 1 to descend until the upper sealing cover 1 is in butt joint with the lower sealing seat 2, the packaging of the lead frame is realized, at the moment, each pressing block 4 can be in butt joint with the pin grooves 3, the pins of each lead frame are pressed and fixed, meanwhile, each heat-conducting rubber seat 91 can be in butt joint with a corresponding chip on the lead frame, and the bonding stability of the chip is ensured.
When in the course of the work, the glue solution that the chip bonded is when the thermal expansion produces the expansion stress, under the dual function of the elasticity of heat conduction rubber seat 91 and the resistance of coolant liquid, can offset the expansion stress that produces, simultaneously, the heat that the chip produced can be transmitted to the coolant liquid by heat conduction rubber seat 91, the coolant liquid can be with heat conduction to heat conduction stick 8 on, make heat conduction stick 8 carry out the heat exchange with the external world, the realization is to the heat dissipation of chip, and simultaneously, the coolant liquid can improve self temperature at endothermic in-process, and then make the hot junction temperature of thermoelectric generation piece 136 rise, and then the hot junction and the cold junction of thermoelectric generation piece 136 can form the temperature difference, make each thermoelectric generation piece 136 automatic generate current, start micro motor 133.
After the micro motor 133 is started, the air guide fan 131 is driven to rotate under the transmission coordination of the bevel gear set 132, in the rotating process of the air guide fan 131, hot air in the packaging structure can be guided out from the air guide cavity 10, meanwhile, the air guide fan 131 can drive the brush rod 135 to synchronously rotate, so that the brush rod 135 continuously scrapes and brushes the surface of the dust screen 12 to ensure the cleanness of the surface of the dust screen 12 and further ensure the smoothness of air flow, meanwhile, the air guide fan 131 can continuously drive the fur ball 16 to rotate in the rotating process, so that the fur ball 16 can generate friction with the glass rod 17, according to the principle of triboelectrification, positive charges can be generated on the glass rod 17 and can be continuously gathered to the tip under the guide of the conductive tip block 18 to release the positive charges, the dissipated positive charges can be contacted with bristles on the brush rod 135 under the flow guide effect of the air guide fan 131, and further can neutralize the negative charges generated in the bristle friction process, reach the negative charge that produces in the brush friction process on eliminating brush pole 135, and then can eliminate brush pole 135's static to avoid brush pole 135 to produce static and make the dust adsorb to the brush hair on, influence the clearance effect.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A packaging structure of a lead frame comprises an upper sealing cover (1) and a lower sealing seat (2), and is characterized in that a placing groove (19) is formed in the lower sealing seat (2), a plurality of pin grooves (3) matched with the placing groove (19) are formed in the two sides of the lower sealing seat (2), a pressing block (4) matched with the pin grooves (3) is fixedly connected to the upper sealing cover (1), two lifting mechanisms (5) are arranged on the lower sealing seat (2), the output ends of the two lifting mechanisms (5) are fixedly connected with the upper sealing cover (1), a linkage mechanism (6) is arranged between the two lifting mechanisms (5), a driving mechanism (7) matched with one lifting mechanism (5) is arranged on the lower sealing seat (2), a plurality of heat conducting rods (8) are fixedly arranged on the upper sealing cover (1), and the lower ends of the heat conducting rods (8) penetrate through the upper sealing cover (1) and are fixedly sleeved with a heat conducting buffer seat (9), the heat conducting rod (8) is provided with an air conducting cavity (10), air pipes (11) are fixedly communicated with the two sides of the air conducting cavity (10), a dust screen (12) is arranged at the top end of the air conducting cavity (10), and an air conducting and dust removing mechanism (13) matched with the dust screen (12) is arranged in the heat conducting rod (8).
2. The lead frame package structure according to claim 1, wherein the lifting mechanism (5) comprises a cavity (51), a nut seat (52) and a screw (53), the cavity (51) is opened on the lower cover (2), the nut seat (52) is rotatably disposed in the cavity (51), the screw (53) is in threaded connection with the nut seat (52), and the upper end of the screw (53) penetrates through the cavity (51) and is fixedly connected with the upper cover (1).
3. The lead frame packaging structure according to claim 2, wherein the linkage mechanism (6) comprises two synchronizing wheels (61) and a synchronous belt (62), the two synchronizing wheels (61) are respectively and fixedly sleeved on the corresponding nut seat (52), and the two synchronizing wheels (61) are in transmission connection through the synchronous belt (62).
4. The lead frame package structure according to claim 2, wherein the driving mechanism (7) comprises a worm (71) and a worm wheel (72), the worm (71) is rotatably disposed in one of the cavities (51), one end of the worm (71) penetrates through the cavity (51) and is fixedly sleeved with the knob (14), the worm wheel (72) is fixedly sleeved on one of the nut seats (52), the worm wheel (72) is meshed with the worm (71), and a spreading helix angle of the worm (71) is smaller than a friction angle between the worm (71) and the worm wheel (72).
5. The lead frame package structure according to claim 1, wherein the buffer heat conducting seat (9) is composed of a heat conducting rubber seat (91) and a cooling liquid, the heat conducting rubber seat (91) is fixedly sleeved on the heat conducting rod (8), and the cooling liquid is injected into the heat conducting rubber seat (91).
6. The lead frame packaging structure according to claim 1, wherein the air guide dust removal mechanism (13) comprises an air guide fan (131), a bevel gear set (132), a micro motor (133), a fixing rod (134), a brush rod (135) and a plurality of thermoelectric generation pieces (136), the air guide fan (131) is rotatably disposed in the air guide cavity (10), the front and back surfaces of the air guide fan (131) are completely antisymmetric, the micro motor (133) is disposed on the inner wall of one side of the air guide cavity (10), the micro motor (133) is in transmission connection with the transmission shaft of the air guide fan (131) through the bevel gear set (132), the fixing rod (134) is fixedly disposed at the upper end of the transmission shaft of the air guide fan (131), the upper end of the fixing rod (134) penetrates through the dust screen (12) and is fixedly connected with the brush rod (135), bristles of the brush rod (135) are in contact connection with the dust screen (12), conductive cavity (15) have been seted up to the downside of heat conduction stick (8), each thermoelectric generation piece (136) all fixed set up in conductive cavity (15), each the hot junction of thermoelectric generation piece (136) all extends to and sets up in the coolant liquid, and each thermoelectric generation piece (136) and micro motor (133) electric connection.
7. The lead frame package structure according to claim 6, wherein fur balls (16) are fixedly connected to the transmission shaft of the air guiding fan (131), and glass rods (17) capable of contacting the fur balls (16) are fixedly arranged on both sides of the air guiding fan (131), and the conductive pointed blocks (18) are fixedly arranged on the glass rods (17).
8. The process for encapsulating the package structure of the lead frame according to any one of claims 1 to 7, wherein the process comprises the steps of:
s1, firstly, placing the lead frame carrying the chip into a placing groove (19), and enabling the pins on the lead frame to penetrate through the pin grooves (3);
s2, rotating the knob (14), wherein the knob (14) drives the worm (71) to rotate, the worm (71) drives one of the nut seats (52) to rotate through the worm wheel (72), the two nut seats (52) synchronously rotate under the transmission fit of the two synchronous wheels (61) and the synchronous belt (62), and then the two screws (53) pull the upper sealing cover (1) to descend until the upper sealing cover (1) is butted with the lower sealing seat (2);
s3, along with the butt joint of the upper sealing cover (1) and the lower sealing seat (2), each pressing block (4) can be in butt joint with the pin groove (3), so that pins of each lead frame are pressed and fixed, and meanwhile, each heat conduction rubber seat (91) can be in butt joint with a corresponding chip on the lead frame.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210224875.4A CN114334750B (en) | 2022-03-09 | 2022-03-09 | Packaging structure of lead frame and packaging process thereof |
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| CN202210224875.4A CN114334750B (en) | 2022-03-09 | 2022-03-09 | Packaging structure of lead frame and packaging process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2522524B2 (en) * | 1988-08-06 | 1996-08-07 | 株式会社東芝 | Method for manufacturing semiconductor device |
| JP6385258B2 (en) * | 2014-11-28 | 2018-09-05 | 三菱電機株式会社 | Resin beam removing device and method for manufacturing resin-encapsulated semiconductor device |
| CN109449089A (en) * | 2018-11-13 | 2019-03-08 | 江苏康芯微电子科技有限公司 | A kind of SMA removes useless machine |
| CN111199943B (en) * | 2018-11-16 | 2021-11-12 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
| CN211792186U (en) * | 2020-01-20 | 2020-10-27 | 齐河县职业中等专业学校(齐河县技工学校) | Electromechanical device static-removing device |
| CN111584409B (en) * | 2020-06-02 | 2020-11-17 | 温州华邦安全封条股份有限公司 | Device for automatically coating silicon grease on chip |
| CN111640726A (en) * | 2020-07-24 | 2020-09-08 | 山东新恒汇电子科技有限公司 | Laser exposure process for lead frame |
| CN111883466A (en) * | 2020-08-06 | 2020-11-03 | 胡满 | Semiconductor packaging equipment and packaging process thereof |
| CN213033068U (en) * | 2020-09-02 | 2021-04-23 | 江西亚中电子科技股份有限公司 | Guiding mechanism for electroplating processing of LED lead frame |
| CN112291636B (en) * | 2020-09-08 | 2023-05-12 | 广东瑞信网络通信有限公司 | High temperature prevention type switch |
| CN213124403U (en) * | 2020-11-25 | 2021-05-04 | 四川金湾电子有限责任公司 | Lead frame pushing equipment |
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