CN111883466A - Semiconductor packaging equipment and packaging process thereof - Google Patents
Semiconductor packaging equipment and packaging process thereof Download PDFInfo
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- CN111883466A CN111883466A CN202010783711.6A CN202010783711A CN111883466A CN 111883466 A CN111883466 A CN 111883466A CN 202010783711 A CN202010783711 A CN 202010783711A CN 111883466 A CN111883466 A CN 111883466A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000012858 packaging process Methods 0.000 title claims abstract description 11
- 239000000428 dust Substances 0.000 claims abstract description 39
- 238000013016 damping Methods 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims description 37
- 238000009825 accumulation Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 230000003068 static effect Effects 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000000295 complement effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C3/00—Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
- B03C3/28—Plant or installations without electricity supply, e.g. using electrets
- B03C3/30—Plant or installations without electricity supply, e.g. using electrets in which electrostatic charge is generated by passage of the gases, i.e. tribo-electricity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Buffer Packaging (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses semiconductor packaging equipment and a packaging process thereof, and the semiconductor packaging equipment comprises a bottom plate and a shell, wherein a damping mechanism is arranged between the bottom plate and the shell, a working chamber is arranged in the shell, an air inlet is formed in the inner top of the working chamber, a dust filter screen is arranged in the air inlet, a folding air bag is arranged between the shell and the bottom plate, the upper end and the lower end of the folding air bag are respectively fixedly connected with the lower end of the shell and the upper end of the bottom plate, a pressure storage cavity is formed in the shell, the upper end of the folding air bag is communicated with the working chamber through an air inlet pipe, the lower end of the folding air bag is communicated with an air outlet pipe, and one-. This semiconductor package equipment is equipped with damper, can reduce rocking that equipment during operation produced to increase the life of equipment, still be equipped with dust removal mechanism simultaneously, can reduce the dust content in the air of studio, thereby improve the final quality behind the semiconductor package.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to semiconductor packaging equipment and a packaging process thereof.
Background
A semiconductor is a substance having an electrical conductivity between an insulator and a conductor, which is easily controlled, and can be used as a material for an element for information processing, and is very important from the viewpoint of technological or economic development, and the semiconductor is packaged once after being produced, and for the existing packaging equipment and process for the semiconductor, the following problems are involved in use;
1. the existing semiconductor packaging equipment is generally not provided with a damping mechanism, and in the process of packaging a semiconductor, the work of an electric element in the equipment can cause the equipment to shake, and the long-term shaking can influence the service life of the element in the equipment and is not beneficial to the packaging of the semiconductor;
2. in order to ensure the heat dissipation performance of the equipment, generally, the equipment is provided with a vent hole, heat dissipation is performed through passive heat dissipation, external dust is easily sucked into a working chamber during heat dissipation, and the quality of the packaged semiconductor is affected by the accumulated dust in the working chamber.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides semiconductor packaging equipment and a packaging process thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor packaging device comprises a bottom plate and a shell, wherein a damping mechanism is arranged between the bottom plate and the shell, a working chamber is arranged in the shell, an air inlet is formed in the inner top of the working chamber, a dust filter screen is installed in the air inlet, a folding air bag is arranged between the shell and the bottom plate, the upper end and the lower end of the folding air bag are fixedly connected with the lower end of the shell and the upper end of the bottom plate, a pressure storage cavity is formed in the shell, the upper end of the folding air bag is communicated with the working chamber through an air inlet pipe, the lower end of the folding air bag is communicated with an air outlet pipe, check valves are installed in the air inlet pipe and the air outlet pipe, one end, away from the folding air bag, of the air outlet pipe is communicated with a corrugated pipe, the corrugated pipe is positioned between the shell and the bottom plate, one end, the left side of casing is equipped with square groove, square inslot is equipped with the actuating mechanism with pressure accumulation mechanism matched with, be equipped with in the studio and drive mechanism matched with dust removal mechanism.
Preferably, damper includes a plurality of bracing pieces of fixed connection in the bottom plate upper end, a plurality of and bracing piece matched with spouts have been seted up to the lower extreme of casing, every the upper end of bracing piece all extends to in the spout that corresponds to through first connecting spring and the interior top elastic connection who corresponds the spout.
Preferably, the pressure accumulating mechanism comprises a sliding plate which is slidably connected in the pressure accumulating cavity, and the right side of the sliding plate is elastically connected with the side wall of the pressure accumulating cavity through two second connecting springs.
Preferably, actuating mechanism includes that the level sets up the dwang in the studio, the left end of dwang and the left side inner wall of studio rotate to be connected, the left end of dwang extends to square inslot, a plurality of impeller blades of circumference fixedly connected with are postponed in the left end outside of dwang, hold and press the chamber to pass through air-out passageway and square groove intercommunication, install the pressure valve in the air-out passageway.
Preferably, dust removal mechanism includes that the level sets up the glass sleeve in the studio, the right-hand member of glass sleeve and the right side inner wall fixed connection of studio, the right-hand member of dwang extends to the telescopic inside of glass, the dwang is located the fixed fur pad that has cup jointed of the outside portion of glass sleeve inside, the telescopic outside of glass is equipped with the complementary unit who is used for clean dust.
Preferably, the board is wiped to the annular of complementary unit establishing on the glass sleeve including the cover, the board is wiped to the annular and glass sleeve sliding connection, be equipped with the screw thread layer on the dwang, the screw thread layer part threaded connection of dwang has the slider, the slider wipes board fixed connection through connecting rod and annular, the level is equipped with the direction slide bar in the studio, the both sides inner wall fixed connection of direction slide bar and studio, the direction slide bar runs through the slider.
A semiconductor packaging process, comprising the steps of:
s1: starting packaging operation;
s2: when the packaging is carried out, the electric elements in the equipment can work, the whole shell can vibrate up and down, and the vibration can be buffered through the arrangement of the first connecting springs, so that the damage of the elements in the equipment caused by the vibration is reduced;
s3: when the casing shakes, can compress and tensile folding gasbag, when folding gasbag is tensile, can inhale folding gasbag with the air in the studio, when folding gasbag is compressed, can pass through the outlet duct with the gas in the folding gasbag, the bellows, the connecting pipe enters into the pressure storage chamber, the casing is every takes place vibrations from top to bottom and all can make folding gasbag inject the gas in the studio into the pressure storage chamber promptly, the air in the studio that this in-process can increase flows, thereby increase the radiating efficiency.
Preferably, the method further comprises the step S4: when the gas in the pressure accumulation cavity increases, the sliding plate can move rightwards and compress the second connecting spring, when the sliding plate moves rightwards to the limit position, along with the continuous gas injection of the folding airbag, the gas pressure in the pressure accumulation cavity increases until the gas pressure increases to the threshold value of the pressure valve, the pressure valve is opened, the high-pressure gas in the pressure accumulation cavity enters the square groove through the air outlet channel and blows the impeller blade, the rotating rod rotates, after the pressure valve is opened, the gas in the pressure accumulation cavity is released, the sliding plate can be acted under the elastic action of the second connecting spring, and the gas is extruded more quickly.
Preferably, the method further comprises the step S5: the rotation of dwang can make fur pad and glass sleeve produce the friction to make glass sleeve bring static, adsorb the dust in the studio, reduce the dust content in the air in the studio, thereby improve the final quality after the semiconductor package, it is worth noting that the compression and the extension of folding gasbag have increased the air flow in the studio.
Preferably, the method further comprises the step S6: when the dwang rotates, can drive the screw thread layer rotation on it to realize moving about of slider, moving about of slider can drive the annular through the connecting rod and wipe the removal of board, thereby make the annular wipe the board and scrape to both ends with the dust on the glass sleeve, subsequent dust clearance of being convenient for.
Compared with the prior art, the invention has the beneficial effects that:
1. when encapsulating, the electric elements in the equipment can work, and vibrations about this moment whole casing can take place, through a plurality of first connecting spring's setting, can cushion vibrations to the damage that the component in the feasible reduction equipment leads to because of vibrations.
2. When the shell vibrates up and down once, the folding air bag can inject air in the working chamber into the pressure storage chamber, the air flow in the working chamber can be increased in the process, so that the heat dissipation efficiency is increased, meanwhile, when the air in the pressure storage chamber is increased, the sliding plate can move to the right and compress the second connecting spring, when the sliding plate moves to the right to the limit position, along with the continuous air injection of the folding air bag, the air pressure in the pressure storage chamber is increased until the air pressure reaches the threshold value of the pressure valve, the pressure valve is opened, the high-pressure air in the pressure storage chamber enters the square groove through the air outlet channel and blows the impeller blade, so that the rotating rod rotates, after the pressure valve is opened, the air in the pressure storage chamber is released, the sliding plate can be acted under the elastic action of the second connecting spring, and the air is extruded more quickly; the rotation of dwang can make fur pad and glass sleeve produce the friction to make glass sleeve bring static, adsorb the dust of during operation, reduce the dust content in the air of studio, thereby improve the final quality behind the semiconductor package, it is worth noting that the compression of folding gasbag has increased the air flow in the studio with the extension, thereby makes the dust better by absorbent effect.
3. When the dwang rotates, can drive the screw thread layer on it and rotate to realize moving about of slider, gliding is moved about and can be passed through the connecting rod and drive the annular and wipe the removal of board, thereby makes the annular wipe the board and scrape the dust on the glass sleeve to both ends, subsequent dust clearance of being convenient for.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor packaging apparatus according to the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A;
FIG. 3 is an enlarged view of FIG. 1 at B;
fig. 4 is a cross-sectional view taken along line C-C of fig. 1.
In the figure: the device comprises a base plate 1, a support rod 2, a shell 3, a working chamber 4, a sliding chute 5, a first connecting spring 6, a folding air bag 7, an air inlet pipe 8, an air outlet pipe 9, a corrugated pipe 10, a connecting pipe 11, an impeller blade 12, a sliding block 13, a guide sliding rod 14, a rotating rod 15, a connecting rod 16, an annular wiping plate 17, a glass sleeve 18, an air inlet 19, a dust filtering net 20, a pressure accumulation cavity 21, a sliding plate 22, a second connecting spring 23, an air outlet channel 24, a fur pad 25 and a square groove 26.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a semiconductor packaging device comprises a bottom plate 1 and a housing 3, a damping mechanism is arranged between the bottom plate 1 and the housing 3, a working chamber 4 is arranged in the housing 3, an air inlet 19 is arranged at the inner top of the working chamber 4, a dust filter 20 is arranged in the air inlet 19, a folding airbag 7 is arranged between the housing 3 and the bottom plate 1, the upper end and the lower end of the folding airbag 7 are fixedly connected with the lower end of the housing 3 and the upper end of the bottom plate 1, a pressure storage cavity 21 is arranged in the housing 3, the upper end of the folding airbag 7 is communicated with the working chamber 4 through an air inlet pipe 8, the lower end of the folding airbag 7 is communicated with an air outlet pipe 9, check valves are arranged in the air inlet pipe 8 and the air outlet pipe 9 to ensure the one-way circulation of the air inlet pipe 8 and the air outlet pipe 9, one end of the air outlet pipe 9 far away from the folding airbag 7 is communicated with a corrugated pipe, the pressure storage cavity 21 is internally provided with a pressure storage mechanism, the left side of the shell 3 is provided with a square groove 26, the square groove 26 is internally provided with a driving mechanism matched with the pressure storage mechanism, and the working chamber 4 is internally provided with a dust removal mechanism matched with the driving mechanism.
Wherein, damper includes a plurality of bracing pieces 2 of fixed connection in bottom plate 1 upper end, and a plurality of and bracing piece 2 matched with spout 5 have been seted up to the lower extreme of casing 3, and the upper end of every bracing piece 2 all extends to in the spout 5 that corresponds to through first connecting spring 6 and the interior top elastic connection who corresponds spout 5.
Wherein, the pressure accumulation mechanism comprises a sliding plate 22 which is slidably connected in the pressure accumulation chamber 21, and the right side of the sliding plate 22 is elastically connected with the side wall of the pressure accumulation chamber 21 through two second connecting springs 23.
Wherein, actuating mechanism includes that the level sets up dwang 15 in studio 4, and the left end of dwang 15 rotates with studio 4's left side inner wall to be connected, and the left end of dwang 15 extends to square inslot 26 in, and the left end outside of dwang 15 postpones a plurality of impeller blades 12 of circumference fixedly connected with, and pressure storage cavity 21 is through air-out passageway 24 and square inslot 26 intercommunication, installs the pressure valve in the air-out passageway 24.
Wherein, dust removal mechanism includes that the level sets up the glass sleeve 18 in studio 4, the right-hand member of glass sleeve 18 and studio 4's right side inner wall fixed connection, and the right-hand member of dwang 15 extends to the inside of glass sleeve 18, and the outside portion that dwang 15 is located glass sleeve 18 is fixed to be cup jointed the leather pad 25, and the outside of glass sleeve 18 is equipped with the complementary unit who is used for clean dust.
Wherein, the board 17 is wiped to the annular of complementary unit on glass sleeve 18 including the cover, board 17 is wiped to the annular and glass sleeve 18 sliding connection, be equipped with the screw thread layer on dwang 15, the screw thread layer is the screw thread layer of similar reciprocal lead screw, can guarantee that the unidirectional rotation of dwang 15 drives the removal about slider 13, the screw thread layer part threaded connection of dwang 15 has slider 13, slider 13 wipes board 17 fixed connection through connecting rod 16 and annular, the level is equipped with direction slide bar 14 in the studio 4, direction slide bar 14 and studio 4's both sides inner wall fixed connection, direction slide bar 14 runs through slider 13.
In the invention, because the electric elements in the equipment can work when being packaged, the whole shell 3 can vibrate up and down, and the vibration can be buffered by arranging the first connecting springs 6, thereby reducing the damage of the elements in the equipment caused by vibration;
when the shell 3 vibrates, the folded airbag 7 is compressed and stretched, when the folded airbag 7 is stretched, air in the working chamber 4 is sucked into the folded airbag 7, when the folded airbag 7 is compressed, air in the folded airbag 7 enters the pressure accumulation cavity 21 through the air outlet pipe 9, the corrugated pipe 10 and the connecting pipe 11, namely, when the shell 3 vibrates up and down once, the folded airbag 7 injects the air in the working chamber 4 into the pressure accumulation cavity 21, the air in the working chamber 4 can flow in the process, so that the heat dissipation efficiency is increased, meanwhile, when the air in the pressure accumulation cavity 21 increases, the sliding plate 22 moves to the right, the second connecting spring 23 is compressed, when the sliding plate 22 moves to the right to the limit position, along with the continuous injection of the folded airbag 7, the air pressure in the pressure accumulation cavity 21 increases, and until the threshold value of the pressure valve is increased, the pressure valve is opened, high-pressure gas in the pressure accumulation cavity 21 enters the square groove 26 through the air outlet channel 24 and blows the impeller blades 12 to enable the rotating rod 15 to rotate, and after the pressure valve is opened and the gas in the pressure accumulation cavity 21 is released, the sliding plate 22 can be acted under the elastic action of the second connecting spring 23 to enable the gas to be extruded out more quickly;
the rotating of the rotating rod 15 can make the fur pad 25 generate friction with the glass sleeve 18, so that the glass sleeve 18 is charged with static electricity, dust in the working chamber 4 is adsorbed, the dust content in the air in the working chamber 4 is reduced, and the final quality of the packaged semiconductor is improved;
when dwang 15 rotates, can drive the screw thread layer on it and rotate to realize the removal about slider 13, remove about slider 13 can drive the removal about annular wiping board 17 through connecting rod 16, thereby make annular wiping board 17 scrape the dust on the glass sleeve 18 to both ends, subsequent dust clearance of being convenient for.
The embodiment also discloses a semiconductor packaging process, which comprises the following steps:
s1: starting packaging operation;
s2: when the packaging is carried out, the electric elements in the equipment can work, the whole shell 3 can vibrate up and down, and the vibration can be buffered through the arrangement of the first connecting springs 6, so that the damage of the elements in the equipment caused by the vibration is reduced;
s3: when the shell 3 vibrates, the folding airbag 7 can be compressed and stretched, when the folding airbag 7 is stretched, air in the working chamber 4 can be sucked into the folding airbag 7, when the folding airbag 7 is compressed, the air in the folding airbag 7 can enter the pressure accumulation cavity 21 through the air outlet pipe 9, the corrugated pipe 10 and the connecting pipe 11, namely, when the shell 3 vibrates up and down once, the folding airbag 7 can inject the air in the working chamber 4 into the pressure accumulation cavity 21, and the air in the working chamber 4 can flow in the process, so that the heat dissipation efficiency is increased;
s4: when the gas in the pressure accumulation cavity 21 increases, the sliding plate 22 moves to the right and compresses the second connecting spring 23, when the sliding plate 22 moves to the extreme position to the right, along with the continuous gas injection of the folded airbag 7, the gas pressure in the pressure accumulation cavity 21 increases until the gas pressure increases to the threshold value of the pressure valve, the pressure valve opens, the high-pressure gas in the pressure accumulation cavity 21 enters the square groove 26 through the air outlet channel 24 and blows the impeller blade 12, so that the rotating rod 15 rotates, after the pressure valve opens, and after the gas in the pressure accumulation cavity 21 is released, the sliding plate 22 is acted under the elastic action of the second connecting spring 23, so that the gas is extruded out faster;
s5: the rotating of the rotating rod 15 can cause the fur pad 25 to generate friction with the glass sleeve 18, so that the glass sleeve 18 is charged with static electricity, dust in the working chamber 4 is adsorbed, the dust content in the air in the working chamber 4 is reduced, and the final quality of the packaged semiconductor is improved, and it is noted that the air flow in the working chamber 4 is increased by the compression and expansion of the folding air bag 7;
s6: when dwang 15 rotates, can drive the screw thread layer on it and rotate to realize the removal about slider 13, remove about slider 13 can drive the removal about annular wiping board 17 through connecting rod 16, thereby make annular wiping board 17 scrape the dust on the glass sleeve 18 to both ends, subsequent dust clearance of being convenient for.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor packaging equipment, includes bottom plate (1) and casing (3), its characterized in that, be equipped with damper between bottom plate (1) and casing (3), be equipped with studio (4) in casing (3), the interior top of studio (4) is equipped with air intake (19), install dust filter screen (20) in air intake (19), be equipped with folding gasbag (7) between casing (3) and bottom plate (1), the upper and lower end branch of folding gasbag (7) is by the lower extreme with casing (3) and the upper end fixed connection of bottom plate (1), be equipped with pressure storage chamber (21) in casing (3), the upper end of folding gasbag (7) is through intake pipe (8) and studio (4) intercommunication, the lower extreme intercommunication of folding gasbag (7) has outlet duct (9), all install the check valve in intake pipe (8) and the outlet duct (9), the one end intercommunication that folding gasbag (7) were kept away from in outlet duct (9) has bellows (10), bellows (10) are located between casing (3) and bottom plate (1), connecting pipe (11) and pressure accumulation chamber (21) intercommunication are passed through to the one end that outlet duct (9) were kept away from in bellows (10), it is equipped with pressure accumulation mechanism in chamber (21) to hold, the left side of casing (3) is equipped with square groove (26), be equipped with in square groove (26) with pressure accumulation mechanism matched with actuating mechanism, be equipped with in studio (4) and construct with actuating mechanism matched with dust removal.
2. The semiconductor packaging device according to claim 1, wherein the damping mechanism comprises a plurality of support rods (2) fixedly connected to the upper end of the bottom plate (1), the lower end of the housing (3) is provided with a plurality of sliding grooves (5) matched with the support rods (2), and the upper end of each support rod (2) extends into the corresponding sliding groove (5) and is elastically connected with the inner top of the corresponding sliding groove (5) through a first connecting spring (6).
3. The semiconductor package device according to claim 1, wherein the pressure accumulation mechanism comprises a sliding plate (22) slidably coupled within the pressure accumulation chamber (21), and a right side of the sliding plate (22) is elastically coupled to a side wall of the pressure accumulation chamber (21) by two second coupling springs (23).
4. The semiconductor packaging device according to claim 1, wherein the driving mechanism comprises a rotating rod (15) horizontally arranged in the working chamber (4), the left end of the rotating rod (15) is rotatably connected with the inner wall of the left side of the working chamber (4), the left end of the rotating rod (15) extends into the square groove (26), the outer side of the left end of the rotating rod (15) is circumferentially and fixedly connected with a plurality of impeller blades (12), the pressure storage cavity (21) is communicated with the square groove (26) through an air outlet channel (24), and a pressure valve is installed in the air outlet channel (24).
5. The semiconductor packaging device according to claim 4, wherein the dust removing mechanism comprises a glass sleeve (18) horizontally arranged in the working chamber (4), the right end of the glass sleeve (18) is fixedly connected with the right inner wall of the working chamber (4), the right end of the rotating rod (15) extends to the inside of the glass sleeve (18), the outer part of the rotating rod (15) located in the glass sleeve (18) is fixedly sleeved with a fur pad (25), and the outer side of the glass sleeve (18) is provided with an auxiliary mechanism for cleaning dust.
6. The semiconductor packaging equipment according to claim 5, wherein the auxiliary mechanism comprises an annular wiping plate (17) sleeved on a glass sleeve (18), the annular wiping plate (17) is in sliding connection with the glass sleeve (18), a threaded layer is arranged on the rotating rod (15), a sliding block (13) is in threaded connection with a threaded layer part of the rotating rod (15), the sliding block (13) is fixedly connected with the annular wiping plate (17) through a connecting rod (16), a guide sliding rod (14) is horizontally arranged in the working chamber (4), the guide sliding rod (14) is fixedly connected with inner walls of two sides of the working chamber (4), and the guide sliding rod (14) penetrates through the sliding block (13).
7. A semiconductor packaging process, comprising the steps of:
s1: starting packaging operation;
s2: when the packaging is carried out, the electric elements in the equipment can work, the whole shell (3) can vibrate up and down, and the vibration can be buffered through the arrangement of the first connecting springs (6), so that the damage of the elements in the equipment caused by vibration is reduced;
s3: when casing (3) vibrations take place, can compress and tensile folding gasbag (7), when folding gasbag (7) are tensile, can inhale folding gasbag (7) with the air in studio (4) in, when folding gasbag (7) compress, can pass through outlet duct (9) with the gas in folding gasbag (7), bellows (10), during connecting pipe (11) entered into pressure accumulation chamber (21), vibrations from top to bottom once take place for casing (3) promptly all can make folding gasbag (7) inject into pressure accumulation chamber (21) with the gas in studio (4), the air flow in studio (4) that this in-process can increase to increase radiating efficiency.
8. The semiconductor packaging process according to claim 7, further comprising step S4: when the gas in the pressure storage cavity (21) increases, the sliding plate (22) moves rightwards and compresses the second connecting spring (23), when the sliding plate (22) moves rightwards to the limit position, along with the continuous gas injection of the folding airbag (7), the gas pressure in the pressure storage cavity (21) increases until the gas pressure increases to the threshold value of the pressure valve, the pressure valve is opened, the high-pressure gas in the pressure storage cavity (21) enters the square groove (26) through the air outlet channel (24) and blows the impeller blades (12), so that the rotating rod (15) rotates, after the pressure valve is opened, the gas in the pressure storage cavity (21) is released, and the sliding plate (22) is acted under the elastic action of the second connecting spring (23), so that the gas is extruded out faster.
9. The semiconductor packaging process according to claim 8, further comprising step S5: the rotation of dwang (15) can make fur pad (25) and glass sleeve (18) produce the friction to make glass sleeve (18) take static, adsorb the dust in studio (4), reduce the dust content in studio (4) air, thereby improve the final quality after the semiconductor package, it is worth noting that the air flow in studio (4) has been increased in the compression and the extension of folding gasbag (7).
10. The semiconductor packaging process according to claim 9, further comprising step S6: when dwang (15) rotated, can drive the screw thread layer rotation on it to realize moving about slider (13), moving about slider (13) can drive the removal about of annular wiping board (17) through connecting rod (16), thereby make annular wiping board (17) scrape the dust on with glass sleeve (18) to both ends, be convenient for subsequent dust clearance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783711.6A CN111883466A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging equipment and packaging process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783711.6A CN111883466A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging equipment and packaging process thereof |
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| CN111883466A true CN111883466A (en) | 2020-11-03 |
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| CN202010783711.6A Withdrawn CN111883466A (en) | 2020-08-06 | 2020-08-06 | Semiconductor packaging equipment and packaging process thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112653000A (en) * | 2020-11-23 | 2021-04-13 | 韩井刚 | Temperature-control moisture-proof buried substation |
| CN112742612A (en) * | 2020-12-21 | 2021-05-04 | 宋自球 | Centrifuge is used in oil development with detect function |
| CN113305862A (en) * | 2021-06-18 | 2021-08-27 | 东莞理工学院 | Intelligent service type multifunctional foot type robot |
| CN113405339A (en) * | 2021-08-19 | 2021-09-17 | 江苏景瑞农业科技发展有限公司 | Drying device for agricultural product processing |
| CN114334750A (en) * | 2022-03-09 | 2022-04-12 | 宁波德洲精密电子有限公司 | Packaging structure of lead frame and packaging process thereof |
-
2020
- 2020-08-06 CN CN202010783711.6A patent/CN111883466A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112653000A (en) * | 2020-11-23 | 2021-04-13 | 韩井刚 | Temperature-control moisture-proof buried substation |
| CN112653000B (en) * | 2020-11-23 | 2023-09-22 | 国网安徽省电力有限公司宁国市供电公司 | Temperature-control moisture-proof buried transformer substation |
| CN112742612A (en) * | 2020-12-21 | 2021-05-04 | 宋自球 | Centrifuge is used in oil development with detect function |
| CN113305862A (en) * | 2021-06-18 | 2021-08-27 | 东莞理工学院 | Intelligent service type multifunctional foot type robot |
| CN113405339A (en) * | 2021-08-19 | 2021-09-17 | 江苏景瑞农业科技发展有限公司 | Drying device for agricultural product processing |
| CN114334750A (en) * | 2022-03-09 | 2022-04-12 | 宁波德洲精密电子有限公司 | Packaging structure of lead frame and packaging process thereof |
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