CN114325890A - Optical lighting device and optical modification equipment - Google Patents

Abstract

The invention discloses an optical lighting device and optical modification equipment. The optical lighting device comprises a line light source, a light modulation component and a scanning mirror, the light modulation component is used for modulating the light emitted by the line light source into parallel light, and After homogenization, an optical band with a set length is formed, and the scanning mirror is used for reflecting the optical band to the working surface of the processing part; and a driving part is also included, and the driving part is used for driving the scanning mirror along the working surface. The set direction reciprocates, and the set direction is a direction parallel to the working surface; or, the scanning mirror is a spherical mirror, and the range of light reflected by the scanning mirror to the working surface at least covers the working surface noodle. The structural arrangement of the optical lighting device can improve the local irradiation energy density, so that the total irradiation energy received by different areas of the target working surface is relatively more uniform, and at the same time, the cost can be saved.

Description

Optical lighting device and optical modification equipment

technical field

The present invention relates to the technical field of optical modification treatment, in particular to an optical lighting device and optical modification equipment.

Background technique

The optical modification treatment of thin films in the semiconductor industry, or the optical modification treatment of thin films in the LED and flat panel display industries, is usually carried out using optical modification equipment.

Taking the ultraviolet light modification equipment as an example, the ultraviolet light illumination device generally adopts the plan of the surface light source to assist the rotation of the lighting head. In the engineering design, one or two ultraviolet lamps are used as the light source to cooperate with the optical path design to achieve the effect of the surface light source. The irradiance intensity of such a surface light source varies greatly in different areas of the target working surface. Only by rotating the illuminating head, the local light intensity time integration on the working surface can achieve a certain uniformity, that is, the working surface can achieve a certain uniformity during the entire process. The total irradiance metering in the upper local area is close to uniform, and it is difficult to achieve good uniformity in practice.

Since the surface light source does not rotate the lighting head, the overall irradiance intensity uniformity is poor. For the working surface receiving light treatment, different areas have queue effects of different lengths of time. In the actual setting, the rotation speed of the lighting head is relatively slow. , resulting in a significant queuing effect.

In addition, in practical applications, due to the uniformity adjustment of the surface light source, part of the light emitted by the ultraviolet lamp is discarded. Under normal circumstances, the effective utilization rate of light is about 40% to 50%, and the energy efficiency ratio is poor. For the light processing of the wafer, one wafer needs to be equipped with two lamps, which directly pushes up the cost.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an optical lighting device and optical modification equipment, the structure of the optical lighting device can improve the local irradiation energy density, so that the total irradiation energy received by different areas of the target working surface is relatively more uniform, and at the same time It can also save costs.

In order to solve the above technical problems, the present invention provides an optical lighting device, which includes a line light source, a light modulation component and a scanning mirror, the light modulation component is used to modulate the light emitted by the line light source into parallel light, and is formed after homogenization. a light strip having a set length, the scanning mirror is used to reflect the light strip to the working surface of the processing piece;

It also includes a driving component, which is used to drive the scanning mirror to reciprocate along a set direction, and the set direction is a direction parallel to the working surface; or, the scanning mirror is a spherical mirror, so The range of light reflected by the scanning mirror to the working surface at least covers the working surface.

In the optical lighting device, the light source is set as a line light source, a light modulation component is arranged on the optical path, the light emitted by the line light source is modulated into parallel light by the light modulation component, and a light band with a set length is formed after homogenization, and the scanning is performed by scanning The reflector reflects the light band to the working surface of the processing part to realize the modification treatment of the working surface; after this setting, the effective utilization rate of light and the local irradiation energy density can be improved, and the technical indicators of the light source can be appropriately reduced. It is conducive to the diversification of the supply chain, saving electric energy and reducing equipment costs; the light band formed by the light homogenization treatment with the light modulation component makes the scanning mirror reciprocate in the direction parallel to the working surface, or use a spherical mirror as the light strip. The scanning mirror can scan the entire working surface, so that the total radiation energy received by different areas of the working surface is relatively more uniform, and the queuing effect can be reduced or homogenized.

In the above optical lighting device, the light modulation component includes a parallel light modulator and a light intensity homogenization modulator, and the parallel light modulator is close to the line light source relative to the light intensity homogenization modulator.

In the above-mentioned optical lighting device, the parallel light modulator and the light intensity homogenization modulator are provided as an integral optical component, or the parallel light modulator and the light intensity homogenization modulator are relatively independent optical components.

In the above optical lighting device, the position of the scanning mirror can be adjusted to change the incident angle of the light irradiated to the scanning mirror; and/or the positions of the line light source and the light modulation component are adjustable to change the outgoing direction of the light strip.

In the above optical illumination device, the light band modulated by the light modulation component is directly irradiated to the scanning mirror.

In the above optical lighting device, the optical lighting device further comprises at least one relay mirror, and the light band modulated by the light modulation component is reflected to the scanning mirror through the relay mirror.

In the above-mentioned optical lighting device, the position of the relay mirror can be adjusted to change the incident angle of the light irradiated to the relay mirror.

In the above optical lighting device, a condenser is provided at the line light source.

In the above-mentioned optical lighting device, the set length of the light strip is greater than or equal to the maximum size of the processing element.

In the above-mentioned optical lighting device, among all the reflecting mirrors of the optical lighting device, at least one of the reflecting mirrors is a reflecting module, and the reflecting module includes a plurality of reflecting units arranged in an array. It can be rotated independently to change the incident angle of the light irradiated to the reflecting unit.

The present invention also provides an optical modification equipment, comprising at least one reaction chamber, in which a tray for placing treatment parts is arranged, each of the reaction chambers is configured with at least one optical lighting device, the optical lighting device It is the optical lighting device described in any one of the above.

Since the above-mentioned optical illuminating device has the above-mentioned technical effects, the optical modification equipment including the optical illuminating device also has the same technical effect, and the discussion is not repeated here.

The above optical modification equipment further includes a light shield, a lamp cover and a return device, the linear light source of the optical lighting device is arranged in the lamp cover, and the rest of the components are arranged in the light shield; the linear light source is an ultraviolet light source; the return device includes a radiator, the light shield communicates with the radiator through a return pipeline, the radiator communicates with the lampshade through a ventilation pipeline, and the ventilation pipeline is provided with fan.

The above optical modification equipment, the optical lighting device is provided with at least two, each of the optical lighting devices is correspondingly provided with one of the lampshade and one of the shades, and each lampshade is provided with a fan with the fan Each of the ventilation pipelines communicates with the same radiator.

In the above optical modification equipment, there are at least two optical lighting devices, each of the optical lighting devices shares one of the lampshade, and each of the optical lighting devices shares one of the light shields.

The optical modification device as described above further comprises a light intensity sensor for monitoring the light intensity of the light reflected by the scanning mirror.

In the above optical modification device, at least one through hole is formed on the scanning mirror, and the light irradiated to the scanning mirror can reach the light intensity sensor through the through hole.

In the above optical modification device, the scanning mirror can be deflected to the monitoring position, and in the monitoring position, the light irradiated to the scanning mirror can reach the light intensity sensor.

Description of drawings

FIG. 1 is a schematic structural diagram of a first embodiment of an optical lighting device provided by the present invention;

2 is a schematic structural diagram of a second embodiment of the optical lighting device provided by the present invention;

3 is a schematic structural diagram of a third embodiment of the optical lighting device provided by the present invention;

Figures 4a to 4c show schematic diagrams of the structures of three kinds of reflection modules;

5 is a schematic structural diagram of the first embodiment of the optical modification equipment provided by the present invention;

FIG. 6 is a schematic structural diagram of the second embodiment of the optical modification equipment provided by the present invention.

Description of reference numbers:

Line light source 11, condenser 12, light modulation component 13, scanning mirror 14, relay mirror 15;

reaction chamber 21, tray 22, wafer 23, quartz window 24;

Shading cover 31, lamp cover 32, return line 33, ventilation line 34, fan 35, radiator 36, light intensity sensor 37;

Reflection modules 40a, 40b, 40c, reflection unit 41.

Detailed ways

In order to make those skilled in the art better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

Without loss of generality, the specific structure of the optical lighting device is described below by taking the application of the optical lighting device to the semiconductor wafer deposition film processing as an example. On this basis, the processed object of the optical lighting device is the wafer. In addition to the processing of semiconductor wafer thin films, the optical lighting device can also be applied to other fields with similar requirements, such as thin film optical modification processing in the LED and flat panel display industries.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a first embodiment of an optical lighting device provided by the present invention.

In this embodiment, the optical lighting device includes a line light source 11, a light modulation component 13, a scanning mirror 14 and a relay mirror 15. The light modulation component 13 is used to modulate the light emitted by the line light source 11 into parallel light and after homogenization An optical strip having a set length is formed, and the relay mirror 15 reflects the optical strip modulated by the light modulation member 13 to the scanning mirror 14 , and the scanning mirror 14 reflects the received optical strip to the working surface of the wafer 23 . The dashed arrows in Fig. 1 show the transmission paths of the light rays.

In the optical lighting device, the light source is set as a line light source 11, and a light modulation part 13 is set on the optical path. The light emitted by the line light source 11 is modulated into parallel light by the light modulation part 13 and homogenized to form a light strip with a set length. , the light band is reflected to the working surface of the wafer 23 by the relay mirror 15 and the scanning mirror 14 to realize the modification treatment of the working surface; compared with the surface light source, the local irradiation energy of the line light source 11 The density is high, and the effective utilization rate of light energy is high, so that the technical indicators of the light source can be appropriately reduced, which is beneficial to the diversification of the supply chain, thereby saving electric energy and reducing equipment costs; the light modulation component 13 is used to lighten the light. The light band formed by the homogenization process can make the total irradiation energy received by different regions of the working surface relatively more uniform, thereby ensuring better uniformity of the auxiliary total energy received by the working surface of the wafer 23 .

For the processing of wafers 23 in the semiconductor industry, the line light source 11 usually adopts an ultraviolet light source. Of course, if the working surface of the processing part has other requirements, the line light source 11 can also adopt other lamp structures.

In the actual setting, in order to better utilize the light energy of the line light source 11, a condenser 12 can be set at the line light source 11, and the light emitted by the line light source 11 can be collected by the condenser 12, so as to improve the irradiation energy density per unit area. .

In this embodiment, the optical lighting device further includes a driving component (not shown in the figure), the driving component is used to drive the scanning mirror 14 to reciprocate along a set direction, and the set direction is parallel to the working surface of the wafer 23 direction.

In practical application, the wafer 23 is placed on the tray 22 of the reaction chamber 21 of the semiconductor device, and a quartz window 24 is arranged above the reaction chamber 21, so that the light reflected by the scanning mirror 14 can be scanned to the wafer 23 through the quartz window 24. work surface.

Taking the orientation shown in FIG. 1, the scanning mirror 14 reciprocates in the left-right direction in the figure, and the black solid arrow in the figure indicates the moving direction of the scanning mirror 14. In this way, through the movement of the scanning mirror 14, the wafer is moved. 23 Any area of the working surface can receive the radiation of light.

In practical application, the width of the light band modulated by the light modulation component 13 can be adjusted according to requirements, thereby adjusting the local irradiation energy density and scanning time.

This structural arrangement only needs to move the scanning mirror 14, which is convenient for implementation. Specifically, the driving component can be in the form of a linear motor or a lead screw nut, as long as the driving method can realize linear movement.

For relatively fast scanning, the set length of the light strip modulated by the light modulation part 13 is not less than the diameter of the wafer 23 , that is, the set length of the light strip modulated by the light modulation part 13 is greater than or equal to the diameter of the wafer 23 In this way, the scanning mirror 14 only needs to move the diameter stroke range of the wafer 23 along the set direction, so as to scan all areas of the working surface of the wafer 23 . That is to say, in processing the working surface of one wafer 23, it is only necessary to drive the scanning mirror 14 to move in one direction to complete the scanning of the wafer 23, and there is no need to move back and forth during one process. Compared with the way of rotating the illumination head in the background art, this method can shorten the scanning time of the working surface of the wafer 23, and combined with the improvement of the irradiation energy density per unit area, it can reduce or homogenize different areas of the working surface of the wafer 23. queuing effect. As shown in FIG. 1 , that is, the scanning mirror 14 can be moved from the left end of the wafer 23 to the position of the scanning mirror 14 ′. The dotted scanning mirror 14 ′ in the figure shows the scanning mirror. 14 Limit positions for movement.

It can be understood that for other shapes of processing elements, the set length of the light strip is preferably not less than the maximum size of the processing element.

In other embodiments, the scanning mirror 14 can be a spherical mirror, which is placed at a suitable position on the wafer 23, so that the light reflected by the spherical mirror to the working surface of the wafer 23 can at least cover the working surface of the wafer 23. In this way, no driver is required. Components, the scanning mirror 14 does not need to be moved, and the structure can be simplified.

Of course, in the above-mentioned embodiment in which the scanning mirror 14 is driven by a driving component to move back and forth, the scanning mirror 14 can be in the form of either a plane mirror or a spherical mirror, which is not limited. The specific form of the mirror used depends on the actual situation. Need to be determined.

In this embodiment, the light modulation component 13 specifically includes a parallel light modulator and a light intensity homogenization modulator, wherein the parallel light modulator is close to the line light source 11 relative to the light intensity homogenization modulator.

Specifically, a bar-shaped parallel light modulator may be used to modulate the scattered light emitted by the line light source 11 into parallel light, and a bar-shaped light intensity homogenization modulator may be used to homogenize the light emitted by the bar light and modulate the light band.

In actual setting, the parallel light modulator and the light intensity homogenization modulator can be set as one-piece optical components, of course, they can also be two relatively independent optical components, which are determined according to the requirements.

In the solution shown in FIG. 1, there is only one relay mirror 15 in the optical path setting, that is, the optical band modulated by the light modulation component 13 is reflected to the scanning mirror 14 only once. In application, according to the actual equipment layout requirements, two can be set More than one relay mirror 15 is not described in detail.

In a specific solution, in order to meet the needs of processing wafers 23 of different sizes, or debugging equipment, etc., the position of the scanning mirror 14 can be adjusted to change the incident angle of the light irradiated to the scanning mirror 14, thereby adjusting the reflection to the wafer 23. Irradiation energy density of the working face.

Specifically, the position adjustment of the scanning mirror 14 may include adjusting its angle setting (such as the included angle between the scanning mirror 14 and the working surface of the wafer 23 ) or the vertical distance between the scanning mirror 14 and the wafer 23 .

In a specific solution, the position of the relay mirror 15 can be adjusted to change the incident angle of the light irradiated to the relay mirror 15 , so as to adjust the incident angle of the light reflected to the scanning mirror 14 .

Specifically, the position adjustment of the relay mirror 15 may include adjustment of its angle setting, or the distance from the light modulation part 13 , and the like.

In a specific solution, the positions of the line light source 11 and the light modulation part 13 can also be adjusted to change the exit direction of the light strip. For example, the line light source 11 and the light modulation part 13 can have an angle adjustment range as a whole.

It can be understood that the position adjustment of the above-mentioned optical components does not interfere with each other, and in actual setting, one or several positions of them may be allowed to be adjusted.

Please refer to FIG. 2 , which is a schematic structural diagram of a second embodiment of the optical lighting device provided by the present invention.

Compared with the optical lighting device shown in FIG. 1 , the structural composition and basic structure of the optical lighting device shown in FIG. 2 are the same as those shown in FIG. The light modulation component 13 as a whole is inclined relative to the vertical direction, and the outgoing direction of the light band is inclined relative to the vertical direction. In the embodiment shown in FIG. As a whole, it is basically arranged in the vertical direction, and the outgoing direction of the light strip is the vertical direction.

It can be understood that during application, the positions of the line light source 11 , the condenser 12 and the light modulation component 13 can be set relatively flexibly according to the actual equipment layout requirements, and it is only necessary to adjust the positions of the relay mirror 15 and the scanning mirror 14 adaptively. That's it.

The arrangement of the components in this embodiment can be understood with reference to the foregoing embodiments, and will not be described in detail.

Please refer to FIG. 3 , which is a schematic structural diagram of a third embodiment of the optical lighting device provided by the present invention.

Compared with the previous two embodiments, the optical lighting device shown in FIG. 3 cancels the relay mirror 15, and the light band modulated by the light modulation component 13 is directly irradiated to the scanning mirror 14. In this way, the structure of the device can be simplified, and the The energy loss of light in the optical transmission path. The specific structural settings of this embodiment may also refer to the foregoing embodiments, and will not be described in detail.

In practical applications, the scanning mirror 14 or the relay mirror 15 in the above embodiments may be in the form of a complete lens, or may be in the form of a reflection module, so as to improve the flexibility of adjusting the irradiation energy.

The specific structural form of the reflection module is described below. It can be understood that, in actual setting, any one or several reflection mirrors in the above-mentioned embodiments can be in the form of a reflection module.

The reflection module includes a plurality of reflection units arranged in an array, and each reflection unit can be rotated independently to change the incident angle of the light irradiated to the reflection unit.

Please refer to FIGS. 4 a to 4 c , which are schematic diagrams of structures of three types of reflection modules.

The reflection units 41 of the reflection module 40a shown in FIG. 4a are arranged in a single-row multi-column array, that is, the reflection units 41 are arranged in a row along the x-axis direction; the reflection units 41 of the reflection module 40b shown in FIG. 4b The arrangement is a double-row and multi-column array, that is, a plurality of reflection units 41 are arranged in two rows along the x-axis direction, the number of reflection units 41 in each row is the same, and the positions in the y-axis direction are arranged one-to-one; as shown in Figure 4c The plurality of reflection units 41 of the reflection module 40c are arranged in a three-row multi-column array, that is, the plurality of reflection units 41 are arranged in three rows along the x-axis direction, and the number of reflection units 41 in each row is the same, and in the y-axis direction One-to-one correspondence.

Figures 4a to 4c only exemplarily show the reflection modules in three array forms. It can be understood that, in actual setting, the reflection units 41 of the reflection module can be arranged in other array forms, which are not limited to those shown in the figures. For example, the reflection units 41 in two adjacent rows can be staggered, and the array form also includes a circular array or an array form of other shapes.

As shown in the figure, each reflection unit 41 can be rotated independently in two directions, specifically around the y-axis direction or around the x-axis direction. Of course, each reflection unit 41 may also have only one rotational degree of freedom. , set according to your needs. Specifically, the rotation of each reflection unit 41 can be controlled by a microcomputer, and the rotation can be continuous rotation or rotation at a set angle, that is, rotation from one fixed point position to another fixed point position.

In this way, by adjusting the position of each reflection unit 41 of the reflection module, the light intensity of a specific area can be adjusted, and the flexibility is higher.

It should be noted that the x-axis and y-axis marked in FIG. 4a to FIG. 4c are only for the convenience of description. In actual setting, under the condition that the reflection units 41 do not interfere with each other, the rotation axis of the reflection unit 41 can also be For other directions, the angle of the reflection surface of each reflection unit 41 may be adjusted.

In addition to the above-mentioned optical lighting device, the present invention also provides an optical modification equipment, the optical modification equipment includes at least one reaction chamber 21, and a tray 22 for placing the processing member 23 is arranged in the reaction chamber 21, and each reaction chamber At least one of the aforementioned optical lighting devices is provided.

The specific structure of the optical modification device is still taken as an example of the deposition thin film processing applied to the wafer of the semiconductor device.

Please refer to FIG. 5 , which is a schematic structural diagram of the first embodiment of the optical modification apparatus provided by the present invention.

In this embodiment, the optical modification device is provided with two reaction chambers 21 , and each reaction chamber 21 is configured with an optical lighting device. In the figure, the two optical lighting devices are symmetrically arranged relative to the center between the two reaction chambers 21 , in terms of the orientation shown in the figure, the line light sources 11 and related components of the two optical lighting devices are arranged close to the middle area of the two reaction cavities 21 .

As mentioned above, for wafer processing in the semiconductor industry, ultraviolet light sources are usually used. For this reason, the optical modification equipment is also equipped with a reflow device to only cool down the optical components and avoid the conversion of oxygen into ozone, that is, through the The recirculation device is set up to control the ozone content.

In this embodiment, the optical modification equipment includes two shades 31 and two lamp shades 32, the linear light source 11 of one optical lighting device is arranged in one shade 32, the rest of the components are arranged in one shade 31, and the other optical illumination device is arranged in one shade 31. The line light source 11 of the device is arranged in another lampshade 32 , and the rest of the components are arranged in another shade 31 .

The return device includes a radiator 36. The radiator 36 communicates with the two light shields 31 through two return lines 33, respectively. The radiator 36 also communicates with the two lamp covers 32 through two ventilation lines 34. Each ventilation line Inside 34 is a fan 35 , through which each optical component in the lamp cover 32 and the light shield 31 can be cooled. The thicker dashed solid arrows in FIG. 5 indicate the flow paths of the cooling air.

This structure arrangement can avoid mutual interference between the optical lighting devices corresponding to the two reaction chambers 21 , and ensure the consistency of wafer processing for each reaction chamber 21 .

It can be seen by comparison that the optical lighting device shown in FIG. 5 is the optical lighting device shown in the aforementioned FIG. 1 . It can be understood that, in practice, the optical modification equipment can also use the aforementioned optical lighting device shown in FIG. 2 or FIG. 3 .

Please refer to FIG. 6 , which is a schematic structural diagram of a second embodiment of the optical modification apparatus provided by the present invention.

In this embodiment, the optical modification apparatus also includes two reaction chambers 21 , and each reaction chamber 21 is provided with an optical lighting device correspondingly, and the optical lighting device shown in FIG.

The difference from the optical modification equipment shown in FIG. 5 is that in this embodiment, the two optical lighting devices share a light shield 31 and a lamp cover 32 . As shown in FIG. 6 , the two line light sources 11 of the two optical lighting devices It is arranged in a lamp cover 32, and the rest of the two optical lighting devices are arranged in a light shield 31. The light shield 31 is still communicated with the radiator 36 through the two return lines 33, so as to have a better heat dissipation effect. At this time, the lampshade 32 can be communicated with the radiator 36 through a ventilation line 34 provided with a fan 35. Compared with the solution shown in FIG. 5, the structure of this embodiment is more compact.

The above-mentioned FIGS. 5 and 6 illustrate the structural arrangement of the optical modification equipment by taking the two reaction cavities 21 and the corresponding optical lighting devices as examples. The reflow device can be adapted to the scheme shown in the figure.

In the optical modification equipment of the above-mentioned embodiments, a light intensity sensor 37 can also be set to monitor the light intensity of the light reflected by the scanning mirror 14 of the optical lighting device, so as to adjust the position of each optical component according to the processing requirements, so that It can meet the demand during subsequent process processing.

For the example shown in FIG. 5 and FIG. 6 , the scanning mirror 14 of each light illuminating device is equipped with a light intensity sensor 37. Specifically, the light intensity sensor 37 can be installed on the back side of the corresponding scanning mirror 14, That is, the side opposite to the reflective surface of the scanning mirror 14, so as to prevent the scanning mirror 14 from affecting the normal processing of the wafer working surface.

In a specific solution, at least one through hole can be formed on the scanning mirror 14, and the light irradiated to the scanning mirror 14 can reach the light intensity sensor 37 through the through hole, so that the real-time monitoring of the light intensity can be realized during the process. It can be understood that the diameter of the through hole is relatively small, so as not to affect the normal processing of the working surface of the wafer.

In addition, it is also possible to set the scanning mirror 14 to deflect to the monitoring position. In the monitoring position, the light irradiated to the scanning mirror can reach the light intensity sensor 37 (for example, by means of reflection). At this time, at the beginning of each process Before, the scanning mirror 14 can be deflected to the monitoring position to monitor the light intensity, which can monitor the light intensity intermittently.

The optical lighting device and the optical modification equipment provided by the present invention have been described in detail above. The principles and implementations of the present invention are described herein by using specific examples, and the descriptions of the above embodiments are only used to help understand the method and the core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can also be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims (17)

1. The optical illumination device is characterized by comprising a line light source, a light modulation component and a scanning reflecting mirror, wherein the light modulation component is used for modulating light rays emitted by the line light source into parallel light, homogenizing the parallel light rays to form a light band with a set length, and the scanning reflecting mirror is used for reflecting the light band to a working surface of a processing piece;

the scanning mirror is used for scanning a working surface, and the scanning mirror is driven to reciprocate along a set direction, wherein the set direction is parallel to the working surface; or the scanning reflecting mirror is a spherical mirror, and the light ray range reflected to the working surface by the scanning reflecting mirror at least covers the working surface.

2. The optical illumination device according to claim 1, wherein the light modulation member includes a parallel light modulator and an intensity homogenizing modulator, the parallel light modulator being close to the line light source with respect to the intensity homogenizing modulator.

3. The illumination device as claimed in claim 3, wherein the parallel light modulator and the light intensity homogenizing modulator are integrated optical components or are relatively independent optical components.

4. The optical illumination device as claimed in claim 1, wherein the position of the scanning mirror is adjustable to change an incident angle of the light irradiated to the scanning mirror; and/or the positions of the line light source and the light modulation component are adjustable to change the exit direction of the light band.

5. The optical illumination device of claim 1 wherein the band of light modulated by the light modulation component is directed to the scanning mirror.

6. The optical illumination device of claim 1 further comprising at least one relay mirror, the optical band modulated by the light modulation component being reflected by the relay mirror to the scanning mirror.

7. The optical illumination device as claimed in claim 6, wherein the position of the relay reflector is adjustable to change the incident angle of the light irradiated to the relay reflector.

8. The optical illumination device as claimed in claim 1, wherein a condenser is disposed at the linear light source.

9. An optical lighting device as claimed in any one of claims 1 to 8 wherein said set length of said light strip is greater than or equal to the maximum dimension of said handling member.

10. An optical lighting device as claimed in any one of claims 1 to 8, wherein at least one of the reflectors of the optical lighting device is a reflector module, and the reflector module comprises a plurality of reflector units arranged in an array, and the reflector units can rotate independently to change the incident angle of the light irradiated to the reflector units.

11. Optical modification apparatus, comprising at least one reaction chamber, wherein a tray for placing processing pieces is arranged in the reaction chamber, and each reaction chamber is provided with at least one optical illumination device, characterized in that the optical illumination device is the optical illumination device according to any one of claims 1 to 10.

12. The optical modification apparatus of claim 11, further comprising a light shield, a lamp housing, and a reflow device, wherein the line light source of the optical illumination device is disposed in the lamp housing, and the remaining components are disposed in the light shield; the line light source is an ultraviolet light source; the reflux unit comprises a radiator, the light shield is communicated with the radiator through a reflux pipeline, the radiator is communicated with the lampshade through a ventilation pipeline, and a fan is arranged in the ventilation pipeline.

13. The apparatus of claim 12, wherein there are at least two of the optical illumination devices, each of the optical illumination devices has a corresponding one of the lamp covers and one of the light shields, each lamp cover has a corresponding one of the ventilation pipes with the fan, and each of the ventilation pipes communicates with the same one of the heat sinks.

14. The optical modification apparatus of claim 12, wherein there are at least two of the optical illumination devices, each of the optical illumination devices shares one of the lamp covers, and each of the optical illumination devices shares one of the light shields.

15. The optical modifying apparatus of any one of claims 11 to 14 further including a light intensity sensor for monitoring the light intensity of light reflected from the scanning mirror.

16. The apparatus of claim 15, wherein the scanning mirror has at least one through hole, and the light beam irradiated to the scanning mirror can reach the light intensity sensor through the through hole.

17. The optical modification apparatus of claim 15, wherein the scanning mirror is deflectable to a monitoring position in which light impinging on the scanning mirror can reach the light intensity sensor.

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