CN114324399A - Defect detection device of semiconductor chip - Google Patents

Defect detection device of semiconductor chip Download PDF

Info

Publication number
CN114324399A
CN114324399A CN202210234698.8A CN202210234698A CN114324399A CN 114324399 A CN114324399 A CN 114324399A CN 202210234698 A CN202210234698 A CN 202210234698A CN 114324399 A CN114324399 A CN 114324399A
Authority
CN
China
Prior art keywords
plate
rotating
bottom plate
fixedly connected
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210234698.8A
Other languages
Chinese (zh)
Other versions
CN114324399B (en
Inventor
向晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xinyugong Semiconductor Co ltd
Original Assignee
Shenzhen Xinyugong Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xinyugong Semiconductor Co ltd filed Critical Shenzhen Xinyugong Semiconductor Co ltd
Priority to CN202210234698.8A priority Critical patent/CN114324399B/en
Publication of CN114324399A publication Critical patent/CN114324399A/en
Application granted granted Critical
Publication of CN114324399B publication Critical patent/CN114324399B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Specific Conveyance Elements (AREA)

Abstract

The invention relates to the technical field of chip detection, and discloses a defect detection device for a semiconductor chip, which comprises a bottom plate, a reversing mechanism and a detection mechanism, wherein first supporting plates are arranged on two sides of the bottom plate, the end part of each first supporting plate is rotatably connected with a conveying roller, and a conveying belt is arranged outside the conveying roller; the reversing mechanism is arranged on one side of the bottom plate and comprises a second supporting plate fixedly connected with the bottom plate, a sliding groove is formed in the middle of the second supporting plate and is connected with a sliding block in a sliding mode, and the middle of the sliding block is rotatably connected with a second rotating shaft; the detection mechanism comprises a third supporting plate fixedly connected with the middle part of the side edge of the bottom plate, a top plate is arranged at the top end of the third supporting plate, and a camera is arranged on one side, close to the bottom plate, of the top plate. The defect detection device is suitable for a semiconductor chip, and the chip can be grabbed and reversed by arranging the reversing mechanism, so that the chip can be placed on the detection mechanism with pins upward for shooting detection.

Description

Defect detection device of semiconductor chip
Technical Field
The invention relates to the technical field of chip detection, in particular to a defect detection device of a semiconductor chip.
Background
The current chip packaging is rapidly developed towards miniaturization, sheet type and high performance, and the requirement for the defect detection of the chip packaging is gradually increased. The defect detection of the chip pins is a necessary prerequisite for correct packaging. The pins of the chip are often detected by a shooting method.
However, in the process of processing and conveying the chip, the chip may sometimes be placed with its pins downward, and when the pins of the chip are detected, the chip usually needs to be turned over, but when the chip is turned over by a conventional manipulator, a mechanism for stopping the whole production line is needed, so that the whole production efficiency is reduced, and therefore, the improvement of the chip is needed.
Disclosure of Invention
The present invention provides a defect detection apparatus for a semiconductor chip, which solves the problems set forth in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a defect detection device for a semiconductor chip comprises a bottom plate, wherein first supporting plates are arranged on two sides of the bottom plate, the end part of each first supporting plate is rotatably connected with a conveying roller, a conveying belt is arranged outside the conveying roller, and the defect detection device also comprises a reversing mechanism and a detection mechanism;
the reversing mechanism is arranged on one side of the bottom plate and comprises a second supporting plate fixedly connected with the bottom plate, a sliding groove is formed in the middle of the second supporting plate and is connected with a sliding block in a sliding mode, the middle of the sliding block is rotatably connected with a second rotating shaft, a rotating seat is arranged at one end, close to the center of the bottom plate, of the second rotating shaft, rotating frames are arranged on two sides of the rotating seat, a suction head used for fixing a chip is arranged at the end of each rotating frame, a driving assembly used for driving the second rotating shaft to rotate is arranged at the end of the second supporting plate, and a guide assembly used for stabilizing the movement of the rotating seat is arranged on one side, opposite to the second supporting plate, of the bottom plate;
detection mechanism, include with bottom plate side middle part fixed connection's third backup pad, the top of third backup pad is equipped with the roof, and one side that the roof is close to the bottom plate is equipped with the camera, the middle part of third backup pad is equipped with first pivot, and the both sides of first pivot are equipped with the support frame, be equipped with on the support frame with rotating seat complex deposit the flitch, be equipped with the dead lever in the second backup pad, the dead lever be close to the device center one end be equipped with deposit flitch complex get the material subassembly.
As a preferred technical scheme of the invention, the bottom plate is provided with an air cylinder, and a piston rod of the air cylinder is fixedly connected with a sliding block.
As a preferred technical scheme of the invention, the material taking assembly comprises a second guide plate fixedly connected with the fixed rod, one end of the second guide plate close to the center of the bottom plate is fixedly connected with one end of the transverse plate, the other end of the transverse plate is fixedly connected with the end part of the first guide plate, the first guide plate and the second guide plate are parallel, and one sides of the first guide plate and the second guide plate close to the center of the device are obliquely arranged towards the direction of the bottom plate.
As a preferred technical scheme of the present invention, the guide assembly includes a support pillar fixedly connected to the base plate, a fixed plate is disposed at an end of the support pillar, a third guide plate is disposed at an end of the fixed plate away from the base plate, a rotating plate is disposed at an end of the rotating seat away from the second rotating shaft, and guide wheels matched with the third guide plate are disposed at two ends of the rotating plate.
As a preferred technical scheme of the present invention, the driving assembly includes a second driving motor disposed at an end of the first supporting plate, an output shaft of the second driving motor is fixedly connected to a driving wheel, and a driven wheel engaged with the driving wheel is disposed on the second rotating shaft.
As a preferable technical solution of the present invention, a reset bearing is disposed between the first rotating shaft and the third supporting plate, when the reset bearing is in an initial state, one end of the stock plate close to the reversing mechanism is inclined toward the direction of the bottom plate, and a stopper is disposed on one side of the stock plate close to the reversing mechanism.
As a preferable technical scheme of the invention, air guide pipelines are arranged inside the second rotating shaft and the rotating seat, the rotating seat is connected with the suction head through an air pipe, and a rotating joint connected with the air pipe is arranged at one end of the second rotating shaft, which is far away from the rotating seat.
As a preferable technical scheme of the invention, the bottom plate is provided with a blocking frame for limiting the chip to move along with the conveyor belt.
As a preferable technical scheme of the invention, a first driving motor is arranged on the first supporting plate, an output shaft of the first driving motor is fixedly connected with a first bevel gear, the first bevel gear is meshed with a second bevel gear, and the second bevel gear is fixedly connected with the end part of the conveying roller.
The invention has the following advantages:
the defect detection device for the semiconductor chip is suitable for the defect detection device for the semiconductor chip, the chip can be grabbed and simultaneously turned over by arranging the reversing mechanism, so that the chip can be placed on the detection mechanism with the pins upward for photographing detection, and the detected chip can slide onto the conveyor belt again for moving, so that the whole device can continuously work, and the detection efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a defect detection apparatus for a semiconductor chip.
Fig. 2 is a schematic view of a conveyor belt in a defect inspection apparatus for semiconductor chips.
FIG. 3 is a schematic diagram of a detecting mechanism of a defect detecting apparatus for semiconductor chips.
Fig. 4 is a front view of a detecting mechanism in a defect detecting apparatus for a semiconductor chip.
Fig. 5 is a schematic structural diagram of a reversing mechanism in the defect detecting apparatus for semiconductor chips.
Fig. 6 is a front view of a reversing mechanism in a defect inspection apparatus for semiconductor chips.
Fig. 7 is a right side view of a reversing mechanism in the defect detecting apparatus for semiconductor chips.
In the figure: 1. a base plate; 2. a first support plate; 3. a conveying roller; 4. a second bevel gear; 5. a first bevel gear; 6. a first drive motor; 7. a second support plate; 8. a third support plate; 9. a top plate; 10. a camera; 11. fixing the rod; 12. a first guide plate; 13. resetting the bearing; 14. a first rotating shaft; 15. a support frame; 16. storing a material plate; 17. a transverse plate; 18. a second guide plate; 19. a material taking assembly; 20. a support pillar; 21. a fixing plate; 22. a guide wheel; 23. a rotating plate; 24. a third guide plate; 25. a cylinder; 26. a chute; 27. a rotating joint; 28. a second rotating shaft; 29. a driven wheel; 30. a slider; 31. a driving wheel; 32. a second drive motor; 33. a rotating seat; 34. a rotating frame; 35. a suction head; 36. a blocking frame; 37. a conveyor belt; 38. a guide assembly; 39. a reversing mechanism; 40. a detection mechanism; 41. a drive assembly; 42. and a stop block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In one embodiment, referring to fig. 1-7, a defect detecting apparatus for semiconductor chips comprises a base plate 1, wherein first supporting plates 2 are disposed on left and right sides of the base plate 1, ends of the first supporting plates 2 are rotatably connected with conveying rollers 3, conveying belts 37 are disposed outside the conveying rollers 3, a first driving motor 6 is disposed on the first supporting plates 2, an output shaft of the first driving motor 6 is fixedly connected with a first bevel gear 5, the first bevel gear 5 is engaged with a second bevel gear 4, the second bevel gear 4 is fixedly connected with ends of the conveying rollers 3, the first supporting plates 2 are disposed on left and right sides of the base plate 1, so that the conveying rollers 3 are disposed on left and right sides of the base plate 1, the two conveying rollers 3 are respectively connected with two sides of the conveying belts 37, and the conveying belts 37 can rotate clockwise when the conveying rollers 3 rotate clockwise under the action of the first driving motor 6, also comprises a reversing mechanism 39 and a detecting mechanism 40;
the reversing mechanism 39 is arranged on one side of the bottom plate 1 and comprises a second supporting plate 7 fixedly connected with the bottom plate 1, the middle part of the second supporting plate 7 is provided with a sliding groove 26, the sliding groove 26 is connected with a sliding block 30 in a sliding way, the middle part of the sliding block 30 is rotatably connected with a second rotating shaft 28, one end of the second rotating shaft 28 close to the center of the bottom plate 1 is provided with a rotating seat 33, two sides of the rotating seat 33 are provided with rotating frames 34, the rotating frames 34 are arranged on the middle parts of the upper side and the lower side of the rotating seat 33, the end part of the rotating frame 34 is provided with a suction head 35 used for fixing a chip, the end part of the second supporting plate 7 is provided with a driving component 41 for driving the second rotating shaft 28 to rotate, one side of the bottom plate 1 opposite to the second supporting plate 7 is provided with a guiding component 38 for stabilizing the movement of the rotating seat 33, the second supporting plate 7 is arranged on the left side of the rear side of the bottom plate 1, the bottom plate 1 is provided with an air cylinder 25, a piston rod of the air cylinder 25 is fixedly connected with the sliding block 30, the air cylinder 25 is disposed close to the second support plate 7 so as to control the up-and-down movement of the slider 30 by the extension or contraction of the piston rod of the air cylinder 25;
detection mechanism 40, including with bottom plate 1 side middle part fixed connection's third backup pad 8, the top of third backup pad 8 is equipped with roof 9, one side that roof 9 is close to bottom plate 1 is equipped with camera 10, the middle part of third backup pad 8 is equipped with first pivot 14, the both sides of first pivot 14 are equipped with support frame 15, be equipped with on the support frame 15 with rotate seat 33 complex deposit flitch 16, be equipped with dead lever 11 in second backup pad 7, the dead lever 11 is close to the one end at the device center and is equipped with the material subassembly 19 of getting with deposit flitch 16 complex, third backup pad 8 sets up in bottom plate 1's back side middle part to deposit flitch 16 is all set up in both sides around first pivot 14, and the interval of two deposit flitchs 16 is less than the width of chip, therefore the chip can be placed on deposit flitch 16.
In one aspect of this embodiment, the material taking assembly 19 includes a first guide plate 12 fixedly connected to the fixing rod 11, one end of the first guide plate 12 near the center of the bottom plate 1 is fixedly connected to one end of a transverse plate 17, the other end of the transverse plate 17 is fixedly connected to the end of a second guide plate 18, the first guide plate 12 and the second guide plate 18 are parallel, and one sides of the first guide plate 12 and the second guide plate 18 near the center of the apparatus are inclined toward the bottom plate 1. A fixing lever 11 is provided at the upper portion of the right side of the second supporting plate 7, the front end of the fixing lever 11 is fixedly connected to the middle portion of the second guide plate 18, the right end of the second guide plate 18 is fixedly connected to the rear end of the cross plate 17, the front end of the cross plate 17 is fixedly connected to the right end of the first guide plate 12, the first guide plate 12 and the second guide plate 18 are both obliquely provided to the lower right, and the left ends of the first guide plate 12 and the second guide plate 18 are lower than the maximum height of the attraction head 35, so that the chip attracted to the attraction head 35 is in contact with the first guide plate 12 and the second guide plate 18 when the attraction head 35 moves downward, so that the chip is pulled out of the attraction head 35 by the first guide plate 12 and the second guide plate 18, the chip slides to the right side along with the first guide plate 12 and the second guide plate 18, and the distance between the first guide plate 12 and the second guide plate 18 is larger than the size of the attraction head 35 and the rotating frame 34, the rotating frame 34 rotates without interfering with the first guide plate 12 and the second guide plate 18.
In one aspect of the present embodiment, the guiding assembly 38 includes a supporting column 20 fixedly connected to the base plate 1, a fixing plate 21 is disposed at an end of the supporting column 20, a third guiding plate 24 is disposed at an end of the fixing plate 21 away from the base plate 1, a rotating plate 23 is disposed at an end of the rotating seat 33 away from the second rotating shaft 28, and guiding wheels 22 engaged with the third guiding plate 24 are disposed at two ends of the rotating plate 23. Support column 20 sets up the position that leans on left at bottom plate 1 front side, support column 20 is the L shape, the long limit of support column 20 is connected with bottom plate 1 is perpendicular, the minor face of support column 20 can stretch out to the right side, position fixed connection fixed plate 21 that stretches out at the minor face, the upper end of fixed plate 21 has set up the third deflector 24 to the left slope, and at the middle part of the front end fixed connection rotor plate 23 that rotates seat 33, the both ends of rotor plate 23 all rotate and connect leading wheel 22, when rotating seat 33 horizontal state and removing the middle part of fixed plate 21, two leading wheels 22 can contact with fixed plate 21 simultaneously this moment, that is to say this moment, it can not rotate to rotate seat 33, thereby make and rotate seat 33 and reciprocate and can keep stable. Meanwhile, when the rotating base 33 is moved downward with a slight inclination, the guide wheel 22 will contact the third guide plate 24, and the rotating base 33 is rotated to a horizontal state again by the contact of the third guide plate 24 and the guide wheel 22, that is, a state in which the suction head 35 is disposed up and down.
In one aspect of the present embodiment, the driving assembly 41 includes a second driving motor 32 disposed at an end portion of the second supporting plate 7, an output shaft of the second driving motor 32 is fixedly connected to the driving wheel 31, and a driven wheel 29 engaged with the driving wheel 31 is disposed on the second rotating shaft 28. The second driving motor 32 is disposed on the top of the second supporting plate 7, and the driving wheel 31 and the driven wheel 29 are elastic wheel sets, so that when the driven wheel 29 moves upwards, the driven wheel 29 is deformed when contacting with the driving wheel 31, so that the driven wheel 29 can rotate along with the driving wheel 31 when moving upwards, and the effect of turning the rotating seat 33 is achieved.
In a case of this embodiment, a reset bearing 13 is disposed between the first rotating shaft 14 and the third supporting plate 8, when the reset bearing 13 is in an initial state, one end of the material storage plate 16 close to the reversing mechanism 39 is inclined toward the bottom plate 1, and a stopper 42 is disposed on one side of the material storage plate 16 close to the reversing mechanism 39, so that in the initial state, after the chip falls on the material storage plate 16, the chip slides to the left along with the material storage plate 16 and is stopped by the stopper 42, and the chip is right under the camera 10, so that the camera 10 photographs the chip, and the image processing software analyzes whether the pins of the chip are normal or not, and is conventional, and therefore how to implement and use the image processing software is not described in detail.
In one aspect of the present embodiment, the second rotating shaft 28 and the rotating base 33 are provided with an air guide channel inside, the rotating base 33 is connected with the suction head 35 through an air pipe, and one end of the second rotating shaft 28 away from the rotating base 33 is provided with a rotating joint 27 connected with the air pipe. Therefore, the pipeline of the air source can be connected with the rotary joint 27, so that the position of the suction head 35 is always kept in a negative pressure state, and the chip is sucked through the suction head 35.
In one case of this embodiment, the base plate 1 is provided with a stopper 36 for restricting the movement of the chip along with the conveyor belt 37. The blocking frame 36 is also L-shaped, the long side of the blocking frame 36 is fixed on the front side of the middle part of the bottom plate 1, the short side of the blocking frame 36 just falls on the conveyor belt 37, so that the chip can only move to the position of the blocking frame 36 when moving to the right along with the conveyor belt 37, and the chip can be just sucked when the suction head 35 moves downwards.
This embodiment is in the implementation, with stable the placing of this device, start first driving motor 6 and second driving motor 32, first driving motor 6 makes conveyer belt 37 can clockwise rotate, second driving motor 32 drives action wheel 31 clockwise simultaneously, thereby make when rotating seat 33 and remove the top after, action wheel 31 and the also clockwise rotation of seat 33 that can make to rotate from the cooperation of driving wheel 29, and through the speed of moving up of seat 33 and the slew velocity of second driving motor 32, make to rotate seat 33 once move up the angle that the back rotated and be close to 180.
The left side of a conveyor belt 37 is placed in a matching way with a related chip processing device, a processed chip just falls on the conveyor belt 37 and moves towards the right side, and after the right side of the chip is contacted with a blocking frame 36, the chip stops moving at the moment, an air cylinder 25 is started, a piston rod of the air cylinder 25 contracts, so that a slide block 30 drives a rotating seat 33 to move downwards, a suction head 35 at the lower part is contacted with the chip, the chip is adsorbed by the suction head 35, the air cylinder 25 is reversely started, the piston rod of the air cylinder 25 extends out, so that the slide block 30 drives the rotating seat 33 to move upwards, after a driving wheel 31 is contacted with a driven wheel 29, the rotating seat 33 rotates by 180 degrees, the chip passes through the left side of a material taking assembly 19 and finally moves to the upper part of the material taking assembly 19 in the rotating process, when the rotating seat 33 descends again, the front side and the rear side of the chip are contacted with the material taking assembly 19, the chip will be disengaged from the suction head 35 at this time, the chip will slide onto the material storage plate 16 along with the material taking assembly 19, and the pin of the chip is upward at this time, so the camera 10 can shoot the pin of the chip, thereby achieving the detection effect, finally when the rotating seat 33 moves upward again, after the rotating seat 33 moves to the middle of the chute 26, the rotating seat 33 will contact with the left end of the material storage plate 16, the rotating seat 33 pushes the left end of the material storage plate 16 to rotate, the material storage plate 16 rotates clockwise, so that the chip will slide down to the right side along with the material storage plate 16 and finally fall onto the conveyor belt 37 to continue moving rightward, and when the rotating seat 33 moves upward, the chip will be disengaged from the material storage plate 16, at this time, the material storage plate 16 will return to the original state under the action of the reset bearing 13, the chip sliding down on the material taking assembly 19 is waited, and at the same time when the rotating seat 33 moves downward, the material storage plate 16 will be driven to rotate counterclockwise, but now the chips do not detach from the deposit plate 16 due to the provision of the stops 42.
The defect detection device for the semiconductor chip is suitable for the defect detection device for the semiconductor chip, the chip can be grabbed and simultaneously turned over by arranging the reversing mechanism 39, so that the chip can be placed on the detection mechanism 40 with the pins upward for photographing detection, and the detected chip can slide onto the conveyor belt 37 again for moving, so that the whole device can continuously work, and the detection efficiency is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (9)

1. A defect detection device of a semiconductor chip comprises a bottom plate, wherein first supporting plates are arranged on two sides of the bottom plate, the end part of each first supporting plate is rotatably connected with a conveying roller, and a conveying belt is arranged outside the conveying roller;
the reversing mechanism is arranged on one side of the bottom plate and comprises a second supporting plate fixedly connected with the bottom plate, a sliding groove is formed in the middle of the second supporting plate and is connected with a sliding block in a sliding mode, the middle of the sliding block is rotatably connected with a second rotating shaft, a rotating seat is arranged at one end, close to the center of the bottom plate, of the second rotating shaft, rotating frames are arranged on two sides of the rotating seat, a suction head used for fixing a chip is arranged at the end of each rotating frame, a driving assembly used for driving the second rotating shaft to rotate is arranged at the end of the second supporting plate, and a guide assembly used for stabilizing the movement of the rotating seat is arranged on one side, opposite to the second supporting plate, of the bottom plate;
detection mechanism, include with bottom plate side middle part fixed connection's third backup pad, the top of third backup pad is equipped with the roof, and one side that the roof is close to the bottom plate is equipped with the camera, the middle part of third backup pad is equipped with first pivot, and the both sides of first pivot are equipped with the support frame, be equipped with on the support frame with rotating seat complex deposit the flitch, be equipped with the dead lever in the second backup pad, the dead lever be close to the device center one end be equipped with deposit flitch complex get the material subassembly.
2. The apparatus of claim 1, wherein the bottom plate has a cylinder, and a piston rod of the cylinder is fixedly connected to the slider.
3. The apparatus of claim 1, wherein the pick-up assembly comprises a second guide plate fixedly connected to the fixing rod, one end of the second guide plate near the center of the base plate is fixedly connected to one end of the transverse plate, the other end of the transverse plate is fixedly connected to the end of the first guide plate, the first guide plate and the second guide plate are parallel, and one sides of the first guide plate and the second guide plate near the center of the apparatus are inclined toward the base plate.
4. The apparatus of claim 1, wherein the guiding assembly comprises a supporting pillar fixedly connected to the base plate, a fixing plate is disposed at an end of the supporting pillar, a third guiding plate is disposed at an end of the fixing plate away from the base plate, a rotating plate is disposed at an end of the rotating base away from the second rotating shaft, and guide wheels engaged with the third guiding plate are disposed at two ends of the rotating plate.
5. The apparatus of claim 1, wherein the driving assembly includes a second driving motor disposed at an end of the first supporting plate, an output shaft of the second driving motor is fixedly connected to the driving wheel, and a driven wheel engaged with the driving wheel is disposed on the second rotating shaft.
6. The apparatus of claim 1, wherein a reset bearing is disposed between the first shaft and the third support plate, when the reset bearing is in an initial state, an end of the stock plate near the reversing mechanism is inclined toward the bottom plate, and a stopper is disposed on a side of the stock plate near the reversing mechanism.
7. The apparatus of claim 1, wherein the second shaft and the rotating base are provided with an air duct therein, the rotating base is connected to the suction head through an air pipe, and a rotating joint is provided at an end of the second shaft remote from the rotating base.
8. The apparatus of claim 1, wherein the base plate is provided with a stopper for limiting the movement of the chip along with the conveyor.
9. The apparatus of claim 1, wherein the first support plate is provided with a first driving motor, an output shaft of the first driving motor is fixedly connected with a first bevel gear, the first bevel gear is engaged with a second bevel gear, and the second bevel gear is fixedly connected with an end of the conveying roller.
CN202210234698.8A 2022-03-11 2022-03-11 Defect detection device of semiconductor chip Active CN114324399B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210234698.8A CN114324399B (en) 2022-03-11 2022-03-11 Defect detection device of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210234698.8A CN114324399B (en) 2022-03-11 2022-03-11 Defect detection device of semiconductor chip

Publications (2)

Publication Number Publication Date
CN114324399A true CN114324399A (en) 2022-04-12
CN114324399B CN114324399B (en) 2022-05-31

Family

ID=81033498

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210234698.8A Active CN114324399B (en) 2022-03-11 2022-03-11 Defect detection device of semiconductor chip

Country Status (1)

Country Link
CN (1) CN114324399B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114646647A (en) * 2022-05-23 2022-06-21 深圳市禾川兴科技有限公司 Chip pin welding defect detector based on reduction performance

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276338A (en) * 2008-04-14 2009-11-26 Ueno Seiki Kk Visual inspecting apparatus
CN206960365U (en) * 2017-06-16 2018-02-02 苏州祥宝机械设备有限公司 Pcb board glue surface covers automatic detection device
CN108593664A (en) * 2018-07-06 2018-09-28 中国科学院自动化研究所(洛阳)机器人与智能装备创新研究院 A kind of appearance detecting device of lithium battery electric core
CN110261381A (en) * 2019-07-04 2019-09-20 浙江理工大学 A kind of swing type automatic sampler of view-based access control model detection
CN214539318U (en) * 2021-04-13 2021-10-29 苏州弘皓光电科技有限公司 Chip pin defect detection device of multi-angle illumination

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276338A (en) * 2008-04-14 2009-11-26 Ueno Seiki Kk Visual inspecting apparatus
CN206960365U (en) * 2017-06-16 2018-02-02 苏州祥宝机械设备有限公司 Pcb board glue surface covers automatic detection device
CN108593664A (en) * 2018-07-06 2018-09-28 中国科学院自动化研究所(洛阳)机器人与智能装备创新研究院 A kind of appearance detecting device of lithium battery electric core
CN110261381A (en) * 2019-07-04 2019-09-20 浙江理工大学 A kind of swing type automatic sampler of view-based access control model detection
CN214539318U (en) * 2021-04-13 2021-10-29 苏州弘皓光电科技有限公司 Chip pin defect detection device of multi-angle illumination

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114646647A (en) * 2022-05-23 2022-06-21 深圳市禾川兴科技有限公司 Chip pin welding defect detector based on reduction performance

Also Published As

Publication number Publication date
CN114324399B (en) 2022-05-31

Similar Documents

Publication Publication Date Title
CN114324399B (en) Defect detection device of semiconductor chip
TWI399285B (en) Folding device and method for folding-gluing machine
JP2005081297A (en) Substrate surface cleaning apparatus
CN211180461U (en) film tearing device, L CD module and backlight source assembling system
JP2006058411A (en) Method and apparatus for bonding polarizing plate to liquid crystal panel
US20120055755A1 (en) Booklet page turning apparatus
CN108541212B (en) Copper foil attaching machine
KR100618918B1 (en) Apparatus for transfering works
CN107096215A (en) Card machine and its card flipper, playing card method for sorting
CN110989227A (en) Film tearing device, LCD module and backlight source assembling system and construction process
CN114054544B (en) Flattening treatment device for copper foil production
JP2001130742A (en) Device inverting front and rear of thin sheet during transportation
CN105836370A (en) Conveying device used for double-sided detection of circuit board
CN1052638A (en) The tubular carton plate is holded up open device
JP2006256744A (en) Container aligning device
CN114011726B (en) Commodity circulation sorting device
CN205890149U (en) Location and dust collector of material processing system
CN218087686U (en) Plate transportation positioning device
CN207908856U (en) A kind of sided exposure machine
JPS5924686B2 (en) Glass plate positioning device
CN218486607U (en) Detection device
US6682064B2 (en) Method and apparatus for dismantling a stack of flat objects piece by piece
JP4524204B2 (en) Electronic component mounting device
CN220836730U (en) Material conveying device with screening function
JP2973068B2 (en) Work extraction device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant