CN114323516A - Test device and method for testing micro slippage of connection structure - Google Patents
Test device and method for testing micro slippage of connection structure Download PDFInfo
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Abstract
The application discloses a test device and a method for testing micro slippage of a connecting structure, and the test device comprises a test rod piece, a test base, a vibration exciter, a displacement sensor and a reaction force sensor, wherein the test rod piece is fixed on the test base through the connecting structure as a test object with a preset pretightening force; the vibration exciter is used for being connected with the test rod piece and applying an exciting force for driving the test rod piece to twist relative to the test base to the test rod piece at a preset exciting frequency; the displacement sensor is used for measuring the displacement information of the test rod piece; and the reaction force sensor is arranged on the vibration exciter and used for measuring the reaction force information of the test rod piece to the vibration exciter.
Description
Technical Field
The application relates to the field of mechanical engineering and mechanics, in particular to a test device and a method for testing micro slippage of a connecting structure.
Background
Various types of connection structures exist in aerospace structures, such as bolts, wedge rings, rivets, interference fits, and the like, and the connection structure components mainly transmit loads through joint surfaces of the connection areas. After the connecting structure assembly is excited by the outside, the connecting structure joint surface can generate rigidity softening, so that the failure of connection can be caused. When the rigidity softening occurs between the joint surfaces of the connecting structure, the connecting structure is converted from a stable state to a sliding state.
However, most studies only focus on the two working conditions of 'good → slippage' of the joint surface of the connecting structure, and the three working conditions of 'good → microscopic slippage → macroscopic slippage' exist without recognizing the looseness of the joint surface of the connecting structure. Also, in the current research, there is a lack of apparatuses and methods for studying the loosening mechanism of the connection structure. In order to solve the above problems, it is necessary to develop an apparatus and a method for testing the micro-sliding of the connection structure, and to verify the micro-sliding by using corresponding test data.
Aiming at the technical problem that a device and a method for researching the microcosmic slippage of the connecting structure are lacked in the environment that the connecting structure generates torsion micromotion in the prior art, an effective solution is not provided at present.
Disclosure of Invention
The disclosure provides a test device and a test method for testing the micro-slippage of a connecting structure, which at least solve the technical problem that the device and the method for researching the micro-slippage of the connecting structure are lacked in the environment that the connecting structure generates torsion micromotion in the prior art.
According to one aspect of the application, a test device for testing the microscopic slippage of a connecting structure is provided, which comprises a test rod piece, a test base, a vibration exciter, a displacement sensor and a reaction force sensor, wherein the test rod piece is fixed on the test base through the connecting structure as a test object with a preset pretightening force; the vibration exciter is used for being connected with the test rod piece and applying an exciting force for driving the test rod piece to twist relative to the test base to the test rod piece at a preset exciting frequency; the displacement sensor is used for measuring the displacement information of the test rod piece; and the reaction force sensor is arranged on the vibration exciter and used for measuring the reaction force information of the test rod piece to the vibration exciter.
According to another aspect of the present application, there is provided a method of testing a connection structure for micro-slip, comprising: fixing the test rod piece on the test base through the connecting structure by using a preset pretightening force; applying an exciting force for driving the test rod piece to twist relative to the test base to one end of the test rod piece through a vibration exciter at a preset exciting frequency; measuring the displacement information of the test rod piece and/or the reaction force information of the test rod piece to the vibration exciter at different moments; and analyzing the microscopic slip of the connecting structure according to the measured displacement information and/or the reaction force information, and determining the microscopic slip characteristic of the connecting structure relative to the excitation frequency.
Therefore, the technical problems in the prior art are solved through the technical scheme of the embodiment, and the embodiment is suitable for the test device and the method for testing the micro-slippage of the connection structure in the fields of mechanical engineering and mechanics, and has the following advantages:
1. the test device and the method for testing the microscopic slippage of the connecting structure can research the change of the rigidity of the joint surface of the connecting structure when the connecting structure generates torsion micromotion;
2. the test device and the method for testing the microscopic slippage of the connecting structure can research the friction characteristic of the connecting structure joint surface in the process from intact to microscopic slippage to macroscopic slippage;
3. the test device for testing the microscopic slippage of the connecting structure is simple to operate, high in precision and accurate in obtained test data;
4. the test device for testing the microscopic slippage of the connecting structure provided by the invention is simple in structure and meets the technical requirements of test rigidity and the like.
The above and other objects, advantages and features of the present application will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the present application will be described in detail hereinafter by way of illustration and not limitation with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a schematic structural view of an experimental apparatus for testing micro-sliding of a connection structure according to one embodiment of the present application;
FIG. 2 is a longitudinal cross-sectional view of the connecting structure and the test rod of the test device for testing micro-slippage of the connecting structure shown in FIG. 1;
FIG. 3 is a schematic flow chart of a method for testing micro-slippage of a connection structure according to another embodiment of the present application;
FIG. 4 is a schematic flow chart of a method of processing and analyzing test data according to another embodiment of the present application;
FIG. 5 is a hysteresis curve of second displacement information versus reaction force information for a pretension of 3.9kg and an excitation frequency of 5Hz, according to an embodiment of the present application;
FIG. 6 is a hysteresis curve of second displacement information versus reaction force information for a pretension of 1.8kg and an excitation frequency of 5Hz, according to an embodiment of the present application;
FIG. 7 is a hysteresis curve of relative rotation angle and torque for a preload of 3.9kg and a vibration frequency of 5Hz, according to an embodiment of the present application.
Detailed Description
It should be noted that, in the present disclosure, the embodiments and features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solutions of the present disclosure better understood by those skilled in the art, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing the embodiments of the disclosure herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
According to a first aspect of the present application, a test device for testing micro-slippage of a connection structure is provided. FIG. 1 is a schematic diagram of an exemplary embodiment of an experimental apparatus for testing micro-sliding of a connecting structure; fig. 2 shows a longitudinal sectional view of the connection structure and the test rod of the test device for testing micro-slip of the connection structure shown in fig. 1. Referring to fig. 1 and 2, a test apparatus for testing micro slippage of a connection structure includes a test rod 10, a test base 20, a vibration exciter 30, a displacement sensor 40, and a reaction force sensor 50, wherein the test rod 10 is fixed on the test base 20 with a predetermined pre-tightening force by a connection structure 60 as a test object; the vibration exciter 30 is used for being connected with the test rod piece 10 and applying an exciting force for driving the test rod piece 10 to twist relative to the test base 20 to the test rod piece 10 at a preset exciting frequency; the displacement sensor 40 is used for measuring the displacement information of the test rod 10; and a reaction force sensor 50 provided in the exciter 30 for measuring reaction force information of the test rod 10 against the exciter 30.
As described in the background art, most studies only focus on two working conditions of "good → slippage" of the joint surface of the connecting structure, and the three working conditions of "good → microscopic slippage → macroscopic slippage" exist without recognizing the looseness of the joint surface of the connecting structure. Also, in the current research, there is a lack of apparatuses and methods for studying the loosening mechanism of the connection structure. In order to solve the above problems, it is necessary to develop an apparatus and a method for testing the micro-sliding of the connection structure, and to verify the micro-sliding by using corresponding test data.
Aiming at the technical problem, the invention provides a test device for testing the micro-slippage of a connecting structure. The test device mainly comprises a test rod 10, a test base 20, a vibration exciter 30, a displacement sensor 40 and a reaction force sensor 50. The connecting structure 60 mounts the test bar 10 on the test base 20. Here, the connection structure 60 is a test object. And, in order to ensure that the test bar 10 is bilaterally symmetric about the connection structure 60 as a central axis and the first-order natural frequency of the test bar 10 is high when the test bar 10 is mounted on the test base 20, the tester needs to preset the size of the test bar 10 (for example, the length, width and height of the test bar 10). The vibration exciter 30 is installed at one end of the test rod 10, and the vibration exciter 30 is mainly used to provide a constant exciting force to the test rod 10 using a preset exciting frequency. When the test rod 10 is subjected to a constant exciting force, the test rod 10 is twisted, and the displacement sensor 40 can measure displacement information at any position on the test rod 10. A reaction force sensor 50 is mounted on the exciter 30 for measuring reaction force information applied to the exciter 30 when the test rod 10 is subjected to a constant exciting force.
For example, when a tester applies a constant excitation force with an excitation frequency of 5HZ and a pre-tightening force with a force of 3.9N to the test rod 10, the test rod 10 is twisted. The displacement information and the reaction force information of the test rod 10 are changed. The tester measures information on the displacement of the test rod 10 at the end close to the exciter 30 and information on the displacement at the end far from the exciter 30 by using the displacement sensor 40, and measures information on the reaction force applied to the exciter 30 by the test rod 10 by using the reaction force sensor 50. After obtaining the displacement information and the reaction force information, the testing person processes the displacement information and the reaction force information to analyze the microscopic slip of the connection structure 60.
In addition, the tester can also set a plurality of groups of tests under different pretightening forces, and average the obtained data results. And obtaining test conclusions according to a plurality of groups of test results obtained by testing under a plurality of groups of different pretightening forces.
Therefore, in the present embodiment, when the test rod 10 is fixed to the test base 20 by the connection structure 60, the vibration exciter 30 can apply an exciting force to the test rod 10 and simultaneously measure the displacement information and the reaction force information. In addition, the technical solution of the present embodiment can determine data information when the micro slip occurs in the connection structure 60 by processing and analyzing the displacement information and the reaction force information, and study the loosening mechanism of the connection structure 60 according to the data information. Further solves the technical problem that the device and the method for researching the microcosmic slippage of the connecting structure 60 are lacked in the environment that the connecting structure 60 generates torsion micromotion in the prior art.
Further, referring to fig. 1, the connection structure 60 as a test object in the present embodiment is a connection structure 60 composed of a bolt and a nut, but may be another type of connection structure 60. The connecting structure 60 such as a wedge ring, a rivet, and an interference fit can also be subjected to a microscopic slip test by the test apparatus of the present embodiment.
Optionally, the method further comprises: and a pressure sensor 70, wherein the pressure sensor 70 is arranged between the test rod 10 and the connecting structure 60, and is used for measuring the preset pretightening force.
Specifically, referring to FIG. 1, the test device further includes a pressure sensor 70. When the test rod 10 is mounted on the test base 20 by using the connection structure 60, the pressure sensor 70 needs to be installed between the connection structure 60 and the test rod 10. The pressure sensor 70 is used to measure a preset preload. The size of the preset pretightening force can be freely set according to the requirements of testers. Therefore, the technical effect of accurately setting the pretightening force according to the test requirements can be achieved through the product structure.
Optionally, the method further comprises: a slide rail 80, wherein the slide rail 80 is used for mounting the displacement sensor 40, so that the displacement sensor 40 can measure the displacement information of different positions of the test rod 10.
Specifically, referring to fig. 1, the testing device further includes a slide rail 80. The slide rail 80 is disposed obliquely above the test rod 10, and the slide rail 80 is mainly used for mounting the displacement sensor 40. And wherein it is ensured that the displacement sensor 40 is exactly aligned with the test rod 10 when the displacement sensor 40 is mounted on the slide rail 80. The displacement sensor 40 can slide on the slide rail 80 and measure displacement information of any position of the test rod 10. Therefore, the technical effect that the displacement sensor 40 can measure the displacement information of any position of the test rod 10 is achieved through the product structure.
Preferably, the displacement sensor 40 may be a laser displacement sensor.
According to another aspect of the present embodiment, a method for testing micro-sliding of a connection structure is provided, and fig. 3 is a schematic flow chart of the method for testing micro-sliding of the connection structure according to another embodiment of the present application.
Referring to fig. 3, the method includes:
s202: the test rod 10 is fixed on the test base 20 through the connecting structure 60 with a preset pretightening force;
s204: applying an exciting force for driving the test rod piece 10 to twist relative to the test base 20 to one end of the test rod piece 10 through the exciter 30 at a preset exciting frequency;
s206: measuring displacement information of the test rod piece 10 and/or reaction force information of the test rod piece 10 to the vibration exciter 30 at different moments; and
s208: the microscopic slip of the connecting structure 60 is analyzed based on the measured displacement information and/or the reaction force information to determine the microscopic slip characteristics of the connecting structure 60 with respect to the excitation frequency.
Specifically, referring to fig. 1, the testing of the micro-sliding of the connection structure using the above test apparatus mainly includes three steps: 1, mounting a test device; 2, testing by using a testing device; 3, processing and analyzing the test data.
The step of installing the test device comprises: first, the test rod 10 is mounted on the test base 20 with a predetermined pre-load by using the connection structure 60. In addition, when the connection structure 60 and the test rod 10 are installed, the pressure sensor 70 needs to be installed between the connection structure 60 and the test rod 10, and the pressure sensor 70 is used to measure the preset pretightening force. Also, in order to ensure that the test bar 10 is bilaterally symmetrical when the connection structure 60 is installed and the first-order natural frequency of the test bar 10 is high, it is necessary to previously set the size of the test bar 10 (e.g., the length, width and height of the test bar 10) (S202).
Then, the exciter 30 is installed at one end of the test rod 10. The other end of the vibration exciter 30 is electrically connected to the power amplifier. After receiving the frequency signal generated by the computer signal simulation software, the power amplifier transmits the amplified frequency signal to the vibration exciter 30, so that the vibration exciter 30 can generate a preset excitation frequency. Then, the reaction force sensor 50 is provided to the exciter 30. Thereafter, the slide rails 80 are installed at the corresponding positions of the test rod 10, and the displacement sensors 40 are installed on the slide rails 80 such that the displacement sensors 40 can move on the slide rails 80. It is required to ensure that the displacement sensor 40 can accurately measure the displacement information of each position of the test rod 10 when the displacement sensor 40 is mounted on the slide rail 80 (S204).
The step of performing the test by using the test device comprises: firstly, a tester determines the magnitude of a preset pretightening force and the magnitude of a preset excitation frequency. Then, a predetermined pre-tightening force is applied to the connection structure 60, and the magnitude of the pre-tightening force is observed through the pressure sensor 70. Then, the vibration exciter 30 is started, and the vibration exciter 30 applies a constant exciting force to the test rod 10 by using a preset exciting frequency. And the reaction force information of the test rod 10 at different timings is observed by the reaction force sensor 50. Wherein, the reaction force information is the reaction force value generated by the test rod 10 to the vibration exciter 30. Thereafter, the displacement information of the both ends of the test rod 10 at different times is observed by the displacement sensor 40. The displacement information is the displacement variation of the test rod 10 (S206).
FIG. 4 is a schematic flow chart of a method of processing and analyzing test data according to another embodiment of the present application. Referring to fig. 4, the step of processing and analyzing the test data comprises:
s402: determining the displacement time sequence information of the test rod piece 10 according to a plurality of pieces of displacement information of the test rod piece 10 at different moments;
s404: determining reaction force time series information corresponding to the test bar 10 from the plurality of pieces of reaction force information of the test bar 10;
s406: obtaining a hysteresis curve of the first displacement information and the second displacement information at the same moment according to the first displacement time sequence information and the second displacement time sequence information;
s408: obtaining a hysteresis curve of the second displacement information and the reaction force information at the same time according to the second displacement time sequence information and the reaction force time sequence information; and
s500: the relationship between the relative rotation angle of the both ends of the test rod 10 and the reaction torque of the test rod 10 to the exciter 30 at the same timing is calculated by the formula θ ≈ atan [ (S1+ S2)/L ] and the formula M ═ F × L.
First, the displacement timing information of the test rod 10 is determined from a plurality of pieces of displacement information of the test rod 10 at different times (S402). The expression form of the displacement time sequence information may be a displacement-time curve. And wherein the displacement timing information comprises first displacement timing information and second displacement timing information. The displacement information includes first displacement information and second displacement information. The first displacement information is displacement information of the end of the test rod 10 close to the vibration exciter 30, and the second displacement information is displacement information of the end of the test rod 10 far from the vibration exciter 30. The first displacement timing information represents the distribution of the first displacement information of the test bars 10 in time. The second displacement timing information represents the distribution of the second displacement information of the test bar 10 in time.
Then, reaction force time series information corresponding to the test rod 10 is determined from the plurality of pieces of reaction force information of the test rod 10 (S404).
Then, a hysteresis curve of the first displacement information and the second displacement information at the same time is obtained from the first displacement timing information and the second displacement timing information (S406). Wherein, the slope of the hysteresis curve of the first displacement information and the second displacement information represents the change of the energy lost when the micro-slip occurs on the joint surface of the connecting structure 60. When the applied pre-tightening force is large enough, the test rod 10 is not twisted, and the joint surface of the connecting structure 60 has no energy dissipation or only a small energy dissipation. The slope of the hysteresis curve of the first displacement information and the second displacement information is approximately-1.
Then, a hysteresis curve of the second displacement information and the reaction force information at the same time is obtained from the second displacement time series information and the reaction force time series information (S408).
Finally, by the formula
θ≈atan[(S1+S2)/L]
And formula
M＝F*L
A relation curve between the relative rotation angle of both ends of the test rod 10 and the reaction torque of the test rod 10 to the exciter 30 at the same time is calculated (S500). Where S1 is the first displacement information, S2 is the second displacement information, L is half the length of the test rod 10, and F is the reaction force information. And wherein, since the directions of S1 and S2 are opposite, the relative rotation angles of the test rod members 10 are added.
And analyzing the energy lost by the test rod 10 in the process of torsion according to the obtained second displacement information and the hysteresis curve of the reaction force information. Fig. 5 shows a hysteresis curve of the second displacement information and the reaction force information at a pretension of 3.9kg and an excitation frequency of 5HZ according to an embodiment of the present application. Fig. 6 shows a hysteresis curve of the second displacement information and the reaction force information at a pretension of 1.8kg and an excitation frequency of 5 HZ. Referring to fig. 5, the curve of the second displacement information and the reaction force information is a hysteresis curve, and the area of the hysteresis curve represents the energy lost by the bonding surface of the connection structure 60 during the occurrence of the micro slip. And wherein the energy lost by the connecting structure 60 during the occurrence of the micro slip is almost the energy lost by friction. Therefore, the area represents the energy generated by friction during the micro-slip of the connecting structure 60. Comparing fig. 5 and 6, the magnitude of the pretension in fig. 6 is 1.8kg, and the magnitude of the pretension in fig. 5 is 3.9 kg. As the pretension increases, the two ends of the hysteresis curve become elongated. Therefore, the area of the hysteresis curve is smaller and smaller with the continuous increase of the pretightening force. When the pretightening force reaches a certain value, the hysteresis curve becomes a straight line. That is, when the pre-tightening force is large enough, the exciting force applied by the exciter 30 is not enough to make the connecting structure 60 slide microscopically, and the test rod 10 will not twist.
And analyzing the rigidity change of the test rod 10 in the process of torsion according to the obtained hysteresis curves of the relative rotation angle and the moment of the two ends of the test rod 10. Fig. 7 shows hysteresis curves of the relative rotation angle of the two ends of the test rod 10 and the reaction torque of the test rod 10 to the exciter 30 at a pre-tightening force of 3.9kg and an excitation frequency of 5 HZ. The slope of the hysteresis curve represents the stiffness information of the bonding surface of the joint structure 60. Referring to fig. 7, it can be seen that the slope becomes smaller as the moment is increased. That is, the rigidity of the joining surface of the joining structure 60 becomes smaller and smaller, the degree of softening of the rigidity of the joining surface of the joining structure 60 becomes larger and larger, and the degree of failure of the joining structure 60 becomes larger and larger (S208).
Thus, the present embodiment mainly utilizes the above-described test apparatus to test the micro-slip of the connection structure. And by: 1, mounting a test device; 2, testing by using a testing device; and 3, processing and analyzing the test data to obtain displacement time sequence information, reaction force time sequence information, a hysteresis curve of the first displacement information and the second displacement information, a hysteresis curve of the second displacement information and the reaction force information, and a hysteresis curve of the relative rotation angle and the torque. And the rigidity change of the joint surface of the connecting structure 60 and the energy change of the joint surface of the connecting structure 60, which is lost due to friction, are obtained according to the data information and curve analysis. Through the operation, the technical effect of analyzing the working condition of the joint surface of the connecting structure 60 when the micro slip occurs according to the rigidity change and the loss energy change is achieved. Further solves the technical problem that the device and the method for researching the microcosmic slippage of the connecting structure 60 are lacked in the environment that the connecting structure 60 generates torsion micromotion in the prior art.
Preferably, the magnitude of the preset preload force may be 1.8kg or 3.9 kg.
Optionally, the operation of measuring the displacement information of the test bar 10 at different times comprises: measuring displacement information of the test rod piece 10 at different moments, wherein the displacement information comprises first displacement information and second displacement information, and the first displacement information is displacement information of one end, close to the vibration exciter 30, of the test rod piece 10; and the second displacement information is the displacement information of the end of the test rod 10 far from the vibration exciter 30.
Specifically, when the vibration exciter 30 applies a constant exciting force to the test rod 10, both ends of the test rod 10 generate a displacement variation amount. Therefore, it is necessary to collect the displacement information of the test rod 10 at different times. The displacement information of the test rod 10 near the end of the exciter 30 is referred to as first displacement information. The information on the displacement of the test rod 10 at the end away from the exciter 30 is referred to as second displacement information.
Optionally, the operation of analyzing the microscopic slippage of the connecting structure 60 according to the measured displacement information and/or counterforce information includes: determining first displacement timing information of the test rod 10 according to the first displacement information of the test rod 10, wherein the first displacement timing information is used for indicating the distribution of the first displacement information of the test rod 10 in time; determining second displacement timing information of the test rod 10 according to the second displacement information of the test rod 10, wherein the second displacement timing information is used for indicating the distribution of the second displacement information of the test rod 10 in time; and analyzing the microscopic slip of the connection structure 60 based on the first displacement timing information and the second displacement timing information.
Specifically, the relationship between the displacement information and the timing information collected on the test rod 10 is shown by a graph. Wherein, the first displacement time sequence information is generated according to the time sequence information and the first displacement information of the test rod 10 corresponding to the time sequence information. And generating second displacement time sequence information according to the time sequence information and second displacement information of the test rod piece 10 corresponding to the time sequence information. Thus, the operation of generating the first displacement timing information and the second displacement timing information achieves the technical effect of providing data support for studying the microscopic slippage of the connection structure 60.
Alternatively, the operation of measuring the reaction force information of the test rod 10 to the exciter 30 at different times includes: the operation of measuring the counter-force information of the test bar 10 at different moments and analyzing the microscopic slippage of the connection structure 60, comprises: determining reaction force time sequence information of the test bar 10 according to the reaction force information of the test bar 10, wherein the reaction force time sequence information is used for indicating the distribution of the reaction force information of the test bar 10 in time; and analyzing microscopic slip of the connection structure 60 based on the reaction force timing information.
Specifically, since the exciter 30 applies a constant exciting force to the test rod 10, the test rod 10 applies a counter force to the exciter 30. Therefore, it is necessary to measure the reaction force information generated by the test rod 10 to the exciter 30 at different times by the reaction force sensor 50. And the corresponding relation between the collected reaction force information and the time sequence information is displayed by using a diagram. The correspondence relationship between the collected reaction force information and the time series information is referred to as reaction force time series information. Thus, the operation of generating the reaction timing information achieves the technical effect of providing data support for studying the microscopic slip of the connection structure 60.
Optionally, the operation of analyzing the microscopic slippage of the connection structure 60 according to the measured displacement information and/or the counterforce information comprises: and generating a first curve under a preset pretightening force and a preset excitation frequency according to the first displacement time sequence information and the second displacement time sequence information, wherein the first curve is a hysteresis curve of the first displacement information and the second displacement information.
Specifically, the first displacement time sequence information and the second displacement time sequence information are used for collecting the first displacement information and the second displacement information of the test rod 10 at the same moment, and the hysteresis curve under the preset pretightening force and the preset excitation frequency is generated by using the first displacement information and the second displacement information. The hysteresis curves of the first displacement information and the second displacement information provide a basis for generating hysteresis curves of the relative rotation angle and the moment. Thus, the operation of generating the hysteresis curve of the first displacement information and the second displacement information achieves the technical effect of providing data support for researching the microscopic slippage of the connecting structure 60.
Optionally, the operation of analyzing the microscopic slippage of the connection structure 60 according to the measured displacement information and/or the counterforce information comprises: and generating a second curve under the preset pretightening force and the preset excitation frequency according to the second displacement time sequence information and the counterforce time sequence information, wherein the second curve is a hysteresis curve of the second displacement information and the counterforce information, and the area of the second curve represents the energy lost by the connecting structure 60 in the twisting process.
Specifically, the second displacement time sequence information and the reaction force time sequence information are used for collecting the second displacement information and the reaction force information at the same time, and a hysteresis curve under a preset pretightening force and a preset excitation frequency is generated by using the second displacement information and the reaction force information. Fig. 5 shows a graph of second displacement information versus reaction force information for a pretension of 3.9kg and an excitation frequency of 5HZ according to an embodiment of the present application. Fig. 5 shows a graph of second displacement information versus reaction force information for a pretension of 1.8kg and an excitation frequency of 5HZ according to an embodiment of the present application. Referring to fig. 5, the curve of the second displacement information and the reaction force information is a hysteresis curve, and the area of the hysteresis curve represents the energy lost by the bonding surface of the connection structure 60 during the occurrence of the micro slip. And wherein the energy lost by the bonding surface of the joint structure 60 during the occurrence of the micro slip is almost the energy lost by friction. Thus, the area represents the energy generated by friction during the microscopic slippage of the bonding surface of the connecting structure 60. Comparing fig. 5 and 6, the magnitude of the pretension in fig. 6 is 1.8kg, and the magnitude of the pretension in fig. 5 is 3.9 kg. As the preload becomes larger, both ends of the hysteresis curve become slender. Therefore, the area of the hysteresis curve is smaller and smaller with the continuous increase of the pretightening force. When the preset pretightening force reaches a certain value, the hysteresis curve becomes a straight line. That is, when the preload force is sufficiently large, the applied excitation force is insufficient to twist the test rod 10. The test bar 10 also does not produce energy dissipation. Thus, the operation of generating the second displacement information-reaction force information hysteresis curve achieves the technical effect of studying the energy loss of the joint surface of the connecting structure 60 due to friction.
Optionally, the operation of analyzing the microscopic slippage of the connection structure 60 according to the measured displacement information and/or the counterforce information comprises: and generating a third curve by calculating corresponding first displacement information and second displacement information on the first curve, wherein the third curve is a hysteresis curve of a rotation angle and torque obtained when the test rod piece 10 rotates relatively under the action of the preset excitation frequency, and the slope of the third curve represents the rigidity information of the joint surface of the connecting structure 60.
Specifically, a relative rotation angle and a moment at the same moment are collected by using the first displacement time sequence information and the second displacement time sequence information, and a hysteresis curve under a preset pretightening force and a preset excitation frequency is generated by using the relative rotation angle and the moment. FIG. 7 shows a plot of relative rotation angle versus torque for a preload force of 3.9kg and a vibration frequency of 5Hz, according to one embodiment of the present application. Referring to fig. 7, the curve of the relative rotation angle and the torque is a hysteresis curve, and the slope of the hysteresis curve represents the stiffness change of the joint surface of the connecting structure 60 during the micro-slip. Referring to fig. 7, it can be seen that the slope becomes smaller as the moment is increased. That is, the stiffness of the joint surface of the connecting structure 60 is smaller and smaller, the stiffness softening degree of the joint surface of the connecting structure 60 is larger and larger, and the failure degree of the connecting structure 60 is larger and larger. Thus, the operation of generating the relative rotation angle-torque hysteresis curve achieves the technical effect of studying the rigidity change of the joint surface of the joint structure 60.
Therefore, the technical problems in the prior art are solved through the technical scheme of the embodiment, and the embodiment is suitable for the test device and the method for testing the micro-slippage of the connection structure in the fields of mechanical engineering and mechanics, and has the following advantages:
1. the test device and the method for testing the microscopic slippage of the connecting structure can research the change of the rigidity of the joint surface of the connecting structure when the connecting structure generates torsion micromotion;
2. the test device and the method for testing the microscopic slippage of the connecting structure can research the friction characteristic of the joint surface of the connecting structure in the process from intact to microscopic slippage and then to macroscopic slippage;
3. the test device for testing the microscopic slippage of the connecting structure is simple to operate, high in precision and accurate in test data;
4. the test device for testing the microscopic slippage of the connecting structure provided by the invention is simple in structure and meets the technical requirements of test rigidity and the like.
The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In the description of the present disclosure, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are presented only for the convenience of describing and simplifying the disclosure, and in the absence of a contrary indication, these directional terms are not intended to indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the scope of the disclosure; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The test device for testing the microscopic slippage of the connecting structure is characterized by comprising a test rod piece (10), a test base (20), a vibration exciter (30), a displacement sensor (40) and a reaction force sensor (50), wherein the test rod piece, the test base, the vibration exciter (30), the displacement sensor (40) and the reaction force sensor (50) are arranged on the test base, and the test rod piece is connected with the test base
The test rod piece (10) is fixed on the test base (20) through a connecting structure (60) serving as a test object with a preset pretightening force;
the vibration exciter (30) is used for being connected with the test rod piece (10) and applying an exciting force for driving the test rod piece (10) to twist relative to the test base (20) to the test rod piece (10) at a preset exciting frequency;
the displacement sensor (40) is used for measuring the displacement information of the test rod piece (10); and
the reaction force sensor (50) is provided to the vibration exciter (30) and is configured to measure reaction force information of the test rod (10) against the vibration exciter (30).
2. The testing device of claim 1, further comprising: a pressure sensor (70), wherein
The pressure sensor (70) is arranged between the test rod piece (10) and the connecting structure (60) and used for measuring the size of preset pretightening force.
3. The testing device of claim 1, further comprising: a slide rail (80), wherein
The slide rail (80) is used for mounting the displacement sensor (40), so that the displacement sensor (40) can measure the displacement information of different positions of the test rod piece (10).
4. A method of testing a connection for micro-slippage, comprising:
the test rod piece (10) is fixed on the test base (20) through the connecting structure (60) with a preset pretightening force;
applying an exciting force for driving the test rod piece (10) to twist relative to the test base (20) to one end of the test rod piece (10) through an exciter (30) at a preset exciting frequency;
measuring displacement information of the test rod piece (10) at different moments and/or reaction force information of the test rod piece (10) to the vibration exciter (30); and
and analyzing the microscopic slip of the connecting structure (60) according to the measured displacement information and/or the reaction force information, and determining the microscopic slip characteristic of the connecting structure (60) relative to the excitation frequency.
5. Method according to claim 4, characterized in that the operation of measuring the displacement information of the test rod (10) at different moments in time comprises: measuring the displacement information of the test rod (10) at the different moments, wherein
The displacement information includes first displacement information and second displacement information, and wherein
The first displacement information is displacement information of one end, close to the vibration exciter (30), of the test rod piece (10); and
the second displacement information is displacement information of one end, far away from the vibration exciter (30), of the test rod piece (10).
6. Method according to claim 5, characterized in that the operation of analyzing microscopic slippage of the connection structure (60) from the measured displacement information and/or counter force information comprises:
determining first displacement timing information of the test bars (10) according to the first displacement information of the test bars (10), the first displacement timing information being used for indicating the distribution of the first displacement information of the test bars (10) in time;
determining second displacement timing information of the test rod piece (10) according to the second displacement information of the test rod piece (10), wherein the second displacement timing information is used for indicating the distribution of the second displacement information of the test rod piece (10) in time; and
analyzing microscopic slippage of the connection structure (60) based on the first displacement timing information and the second displacement timing information.
7. A method according to claim 4, wherein the operation of measuring the reaction force information of the test rod (10) against the exciter (30) at different moments in time comprises: measuring the counter force information of the test rod (10) at said different moments in time, and
-an operation of analyzing the microscopic slip of the connection structure (60), comprising:
determining reaction force time sequence information of the test rod piece (10) according to the reaction force information of the test rod piece (10), wherein the reaction force time sequence information is used for indicating the distribution of the reaction force information of the test rod piece (10) in time; and
and analyzing the microscopic slippage of the connecting structure (60) according to the reaction time sequence information.
8. Method according to claim 6, characterized in that the operation of analyzing microscopic slippage of the connection structure (60) from the measured displacement information and/or counter force information comprises:
generating a first curve under a preset pretightening force and a preset excitation frequency according to the first displacement time sequence information and the second displacement time sequence information, wherein
The first curve is a hysteresis curve of the first displacement information and the second displacement information, and wherein
The slope of the first curve represents the change in energy lost by the connecting structure (60) during microscopic slippage.
9. Method according to claim 7, characterized in that the operation of analyzing microscopic slippage of the connection structure (60) from the measured displacement information and/or counter force information comprises:
generating a second curve under the preset pretightening force and the preset excitation frequency according to the second displacement time sequence information and the counterforce time sequence information, wherein
The second curve is a hysteresis curve of the second displacement information and the reaction force information, and wherein
The area of the second curve represents the energy lost by the connecting structure (60) during micro-slip.
10. Method according to claim 8, characterized in that the operation of analyzing microscopic slippage of the connection structure (60) from the measured displacement information and/or counter force information comprises:
generating a third curve by calculating the corresponding first displacement information and the second displacement information on the first curve, wherein
The third curve is a hysteresis curve of a corner and a torque obtained when the test rod piece (10) rotates relatively under the action of a preset excitation frequency, and the third curve is a hysteresis curve of the corner and the torque obtained when the test rod piece rotates relatively under the action of a preset excitation frequency, wherein
The slope of the third curve represents stiffness information of the interface of the connection (60).
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