CN114323292A

CN114323292A - Pyroelectric infrared sensor

Info

Publication number: CN114323292A
Application number: CN202110112792.1A
Authority: CN
Inventors: 吴华民; 刘财伟
Original assignee: Shenzhen Huasan Sense Technology Co ltd
Current assignee: Shenzhen Huasan Sense Technology Co ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2022-04-12

Abstract

A pyroelectric infrared sensor relates to the technical field of infrared sensors. It includes: the infrared filter comprises a tube cap and a substrate, wherein a window is arranged on the upper surface of the tube cap, and an infrared filter is embedded in the window; the substrate is assembled with the pipe cap, the pipe cap is provided with an accommodating space, and an infrared sensitive element and a signal processing part are packaged in the accommodating space; the infrared sensitive element and the signal processing part are both directly fixed on the substrate; the substrate is further provided with a connector, the connector is electrically connected with the substrate, and the connector is used for achieving external electrical connection and assembly of the pyroelectric infrared sensor. The pyroelectric infrared sensor adopting the technical scheme has the advantages of ingenious design, simple structure and high integration level, is beneficial to simplifying the production procedures of manufacturing and application of the sensor, improves the production and test automation efficiency, reduces the complexity of an application structure and the design difficulty of the application structure, and has obvious advantages in the aspects of thermal stability and anti-electromagnetic interference performance.

Description

Pyroelectric infrared sensor

Technical Field

The invention relates to the technical field of infrared sensors, in particular to a pyroelectric infrared sensor.

Background

A pyroelectric infrared sensor is a sensor for detecting infrared thermal radiation, which is made by using a material with good pyroelectric property as a core, and is mainly applied to detecting infrared rays of people and animals or other objects with thermal radiation so as to judge whether people or other animals exist in a certain space. The method is widely applied to the fields of induction type lighting, intrusion type alarming, security protection, intelligent home and the like.

The packaging type of the pyroelectric infrared sensor with mature technology on the market at present is also mainly a direct-insert type, as shown in fig. 1, the direct-insert type pyroelectric infrared sensor mainly forms a closed space by a pipe cap and a pipe seat, an infrared filter is arranged in a window on the surface of the pipe cap, an infrared sensitive element with pyroelectric characteristics, a supporting part for fixing the infrared sensitive element and a signal processing part JFET or IC are arranged in the closed space, the supporting part and the signal processing part are fixed on a PCB circuit substrate, pins on the pipe seat are electrically connected with through holes of the PCB circuit substrate through pads, and 3 pins extend downwards in the base. The working principle is that an infrared radiation signal received by the infrared sensitive element is converted into a weak voltage signal, and the weak voltage signal is converted and output outwards through a signal circuit on the PCB substrate. Most of the traditional direct-insertion sensors are provided with long pins and are packaged by adopting full metal shells, and the metal shells adopt an energy storage type resistance sealing welding process, so that the manufacturing and testing equipment of the sensors is complex, and the working procedures are complicated; meanwhile, in the application and production process, manual plug-in and welding are required, and pin shearing is also required, so that the process is complex and tedious; the disadvantages of low production efficiency and high cost in application, and complicated structure and high design difficulty in matching with optical lens application are caused, and the improvement is urgently needed from the manufacturing and application end.

Disclosure of Invention

The invention aims to provide a pyroelectric infrared sensor aiming at the defects and shortcomings of the prior art, which is beneficial to simplifying the production process of manufacturing and application of the sensor, improving the production and test automation efficiency, reducing the complexity of an application structure and the design difficulty of the application structure, and simultaneously has obvious advantages in the aspects of thermal stability and anti-electromagnetic interference performance.

In order to achieve the purpose, the invention adopts the technical scheme that: a pyroelectric infrared sensor, comprising: the infrared filter comprises a tube cap and a substrate, wherein a window is arranged on the upper surface of the tube cap, and an infrared filter is embedded in the window; the substrate is assembled with the pipe cap, the pipe cap is provided with an accommodating space, and an infrared sensitive element and a signal processing part are packaged in the accommodating space; the infrared sensitive element and the signal processing part are both directly fixed on the substrate; the substrate is further provided with a connector, the connector is electrically connected with the substrate, and the connector is used for achieving external electrical connection and assembly of the pyroelectric infrared sensor.

Furthermore, the pipe cap and the substrate form a closed space, and the signal processing part and the infrared sensitive element are both packaged in the closed space.

Furthermore, the pyroelectric infrared sensor also comprises a bottom plate, and the bottom plate is fixedly arranged on the lower end face of the substrate.

Furthermore, the pyroelectric infrared sensor also comprises a bottom plate, a closed space is formed by the bottom plate and the pipe cap, and the signal processing part and the infrared sensitive element are both packaged in the closed space.

Furthermore, the pyroelectric infrared sensor also comprises a base, a closed space is formed by the base and the pipe cap, and the signal processing part and the infrared sensitive element are both packaged in the closed space; a sunken mounting groove is formed in one side, close to the pipe cap, of the base, and the substrate is mounted in the sunken mounting groove.

Furthermore, the pyroelectric infrared sensor also comprises a supporting member, wherein the supporting member is arranged between the infrared sensitive element and the substrate, the infrared sensitive element is fixed on the supporting member and is electrically connected, and the supporting member is fixed on the substrate and is electrically connected.

Further, the signal processing part can be a JFET or an intelligent integrated circuit or an MCU or an amplifier or an ADC device; the substrate is an epoxy resin PCB circuit board or a ceramic substrate; the shape of the substrate is any one of a circle, a rectangle and other polygons, and the epoxy resin PCB circuit board is a double-sided board or a multilayer board; the infrared sensitive elements are unit or multi-element sensitive elements, and the number of the infrared sensitive elements is single or multiple; the shape of the pipe cap is round, rectangular or other polygons, the number of the windows on the upper surface of the pipe cap can be one or more, and the shape of the windows on the upper surface of the pipe cap can be round, rectangular or other polygons; the infrared filter is an infrared transmission filter, the filter base material can be silicon, germanium, gallium arsenide or infrared glass, and the filter can be silicon, germanium, gallium arsenide or infrared glass with the light-gathering optical characteristic.

Further, the bottom plate is a metal plate or a non-metal plate with a metal film layer plated on the surface; the bottom plate is circular, rectangular or other polygons in shape; the bottom plate is provided with an opening for accommodating the connector.

Further, the base is a metal plate or a non-metal plate with a metal film layer plated on the surface; the shape of the base is round, rectangular or other polygons; the base is provided with an opening, the opening is located at the bottom of the concave mounting groove, and the connector is accommodated in the opening.

Furthermore, the connector can be vertical or horizontal, male or female, direct-insertion or patch type; the total number of the electrodes on the connector is two or more; the number of the connectors is one or more.

Further, peripheral parts are arranged on the substrate, the peripheral parts are positioned inside and/or outside the pipe cap, and the peripheral parts at least comprise: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device; wherein, output signal control components and parts include at least: any one or more of a triode, a field effect transistor, a thyristor and a relay, wherein the passive device at least comprises: any one or more of a resistor, a capacitor, and an inductor; the peripheral parts are used for forming the high-integration and multifunctional integrated pyroelectric infrared sensor.

Furthermore, the bottom plate is a metal plate and is electrically connected with the bottom plate, the bottom plate is a thickened bottom plate, the thickness of the thickened bottom plate is at least 1-5mm, and the thickened metal bottom plate is used for improving the overall heat capacity of the sensor so as to improve the thermal stability of the sensor; the bottom plate is provided with an opening for accommodating the connector.

Furthermore, the base plate is a PCB circuit board, grounding copper cladding is arranged on the top surface and the bottom surface of the circuit board except for a circuit, the circuit board can also be provided with metalized edge-covering copper cladding and/or metalized open-slot copper cladding, and the edge-covering and open-slot metal copper is grounded, so that the circuit board is prevented or reduced from being exposed in a space electromagnetic environment, and the anti-electromagnetic interference performance of the sensor is improved.

After the technical scheme is adopted, the invention has the beneficial effects that:

1. through the connector arranged on the sensor, firstly, the sensor can be electrically connected and assembled with an external application end by adopting the matching of the connector or the connector, so that the complicated processes of inserting, welding, cutting pins and the like during application are simplified, the assembly efficiency is improved, and the application cost is reduced; secondly, the type or the size parameter of the connector is selected or customized, the matching problem of the installation position of the sensor and the focal length of the optical Fresnel lens and the matching problem of the installation position of the sensor and the product structure can be very conveniently met, and the complex structure and the structural design and a series of costs caused by the complex structure and the structural design are saved.

2. The metal bottom plate is arranged on the substrate, the thick bottom of the metal bottom plate is further increased according to needs, the overall heat capacity of the sensor is improved, and the capacity of the sensor for resisting the temperature change of the environment of the space where the sensor is located is improved, so that the temperature stability of the closed space where the sensitive element inside the sensor is located is improved, and finally the temperature stability of the sensor is improved.

3. In the specific embodiment that the substrate is exposed in the space electromagnetic environment, namely the pipe cap and the substrate form a closed space, the top and the bottom surfaces of the circuit board are both designed to be grounded and copper-clad except for a circuit; and further designing the circuit board into a metallized edge-covered copper-clad layer and a metallized grooved copper-clad layer according to the requirement, wherein the edge-covered and grooved metal copper are both grounded; the circuit board is further designed into a four-layer circuit board according to the requirement, so that the number of grounding layers is increased, and the electrodes electrically connected with the connector assembly are prevented from directly entering the closed space where the sensitive element is located through the conductive holes of the circuit board; the circuit board can be prevented or reduced from being exposed in the space electromagnetic environment, the space electromagnetic wave is reduced from entering the closed space where the sensitive element is located, and the anti-electromagnetic interference performance of the sensor is improved.

4. In the embodiment in which the tube cap and the metal bottom plate or the metal base form a closed space, the sensor can basically achieve all-metal shielding encapsulation, and then the above 2 nd and 3 nd designs or all designs are comprehensively adopted, so that the pyroelectric infrared sensor which simultaneously has high thermal stability and good anti-electromagnetic interference performance can be easily achieved, and all the defects of the traditional direct-insertion type sensor are overcome, and simultaneously all the anti-interference performance of the traditional direct-insertion type sensor is achieved or even surpassed.

5. The pyroelectric infrared sensor has the advantages that peripheral parts are arranged on the sensor substrate, and mainly comprise a power supply voltage stabilizing chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode, a passive device and the like, so that a specific function or a more systematic and complete function required by a customer can be conveniently formed, and the pyroelectric infrared sensor with high integration and multiple functions is integrated, for example, the pyroelectric infrared sensor with power supply voltage stabilization, light control, output signal drive control and analog or digital signal processing chip can be formed to form more intelligent functions, various functional systems and complete high integration integrated pyroelectric infrared sensors.

6. In summary, by adopting the above scheme, aiming at the special requirements of the client application end on the structural problems such as the installation height and the angle, the special requirements of different application environments on anti-interference performance, and the special requirements of different clients on the human body induction function, the requirements can be very conveniently met by flexibly adopting the methods of corresponding connector selection or design, substrate design, special design of a metal bottom plate and a metal base, and the realization of the special human body induction function by selecting different peripheral parts; the design of the pyroelectric infrared sensor field which is basically unchanged for decades is really changed, and the embarrassment that the application end always depends on a complex product structure design to move to a single sensor form to realize the requirement of a client is changed.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of the overall structure of a pyroelectric infrared sensor of the prior art;

FIG. 2 is a schematic view of the entire structure of embodiment 1;

FIG. 3 is an exploded view of example 1;

FIG. 4 is an exploded view of example 2;

FIG. 5 is an exploded view of example 3;

FIG. 6 is a schematic view of the entire structure of embodiment 4;

FIG. 7 is an exploded view of example 5;

FIG. 8 is an exploded view of example 6;

fig. 9 is an exploded view of a thermopile structure.

Description of reference numerals: 101. a window; 102. a recess mounting groove; 103. an installation port; 104. a pin on the tube seat; 105. a pin; 110. a pipe cap; 120. a substrate; 130. an infrared filter; 140. an infrared-sensitive element; 150. a support member; 160. signal processing components; 170. a base; 180. a base plate; 190. a connector assembly; 200. a tube holder; 210. peripheral components; 220. a thermopile chip; 230. a thermistor; 240. copper plating is carried out on the ground; 250. metallization groove copper coating; 260. and (6) coating copper on the metalized edge.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment as necessary without making a contribution thereto after reading the present specification, but all are protected by patent laws within the scope of the claims of the present invention.

Example 1:

the present embodiment relates to a pyroelectric infrared sensor, as shown in fig. 2 and 3, including: a cap 110 and a base plate 120. The upper surface of the cap 110 is provided with a window 101, and an infrared filter 130 is embedded on the window 101. The substrate 120 is assembled with the cap 110, and the cap 110 has a receiving space. The housing space encloses the infrared sensor 140 and the signal processing components 160. The infrared sensitive element 140 and the signal processing component 160 are both directly fixed on the substrate 120. The side of the substrate 120 away from the cap 110 is further provided with a connector 190, and the connector 190 is electrically connected to the substrate 120. The connector 190 is used to electrically connect and assemble the sensor to the outside. In this embodiment, the pyroelectric infrared sensor further includes a supporting member 150, the supporting member 150 is disposed between the infrared sensitive element 140 and the substrate 120, the infrared sensitive element 140 is fixed on the supporting member 150 and is electrically connected thereto, and the supporting member 150 is fixed on the substrate 120 and is electrically connected thereto.

Further, the pyroelectric infrared sensor further comprises a base 170, and the base 170 and the cap 110 form a closed space. The signal processing component 160 and the infrared sensitive element 140 are both packaged in a closed space. The base 170 is provided with a recess mounting groove 102 at a side close to the cap 110, and the substrate 120 is mounted in the recess mounting groove 102.

Preferably, the base 170 is a metal plate or a non-metal plate with a metal film layer plated on the surface; the base 170 is circular, rectangular or other polygonal shape; the base 170 is provided with an opening at the bottom of the recess mounting groove 102.

Preferably, the connector 190 may be of the vertical or horizontal type, male or female, straight or patch, etc. The total number of electrodes on the connector 190 is two or more. The number of connectors 190 is 1 or more than 1. The overall shape of the connector 190 is a rectangular parallelepiped, a square, a cylinder, or a polygonal prism.

Preferably, the cap 110 may have a circular, rectangular or other polygonal shape. The window 101 on the upper surface of the cap 110 may be one or more, and the shape of the window 101 may be circular, rectangular or other polygonal shape.

Preferably, the infrared filter 130 is an infrared-transmitting filter, and the filter substrate may be silicon, germanium, gallium arsenide, or other infrared glass. The filter shape may be circular, rectangular, or other polygonal shape. The filter may have optical characteristics of condensing light.

Preferably, the infrared sensitive element 140 is a single infrared sensitive element 140 or a plurality of infrared sensitive elements 140. The number of the infrared sensitive elements 140 is single, two or more. The signal processing component 160 may be a JFET, an amplifier, a MCU or an intelligent integrated circuit or an ADC device.

Preferably, the substrate 120 is an epoxy PCB or ceramic substrate 120, and the shape of the substrate 120 is any one of a circle, a rectangle and other polygons; the epoxy resin PCB circuit board is a double-sided board or a multilayer board.

In this embodiment, the cap 110 has a cylindrical shape. The window 101 is provided with one and has a rectangular shape. The infrared filter 130 is a rectangular sheet, and the substrate thereof is silicon. The infrared sensitive elements 140 adopt a binary structure, and the number thereof is one. The signal processing component 160 is an intelligent integrated circuit. The base 170 is a metal plate and has a circular shape. The substrate 120 is an epoxy PCB circuit board. The recess mounting groove 102 of the base 170 is a circular groove with a rectangular opening. The number of electrodes of the connector 190 is 6, the connector 190 is rectangular, and the connector 190 is a patch vertical connector 190.

Further, the substrate 120 is a multilayer circuit board, the top and bottom layers of the multilayer circuit board are designed as copper-clad grounding shielding layers, the wiring is conducted on the middle layer through a conductive hole, a metalized edge-clad copper-clad 260 and a metalized slotted copper-clad 250 are arranged on the multilayer circuit board, and the edge-clad and slotted metal copper are grounded.

It should be noted that, in the present embodiment, the substrate 120 is a four-layer circuit board, and the circuit board layers from the bottom to the top are respectively: a bottom one layer, a bottom two layer, a bottom three layer, and a top one layer. The connectors 190 are disposed on the bottom layer. The wiring mode of the electric connecting line arranged on the four-layer plate is as follows: the connector 190 is electrically connected to the external electrodes from the bottom layer directly through the conductive holes to the bottom two layers, the circuit enters the metal base 170 or the space of the grounding copper-clad shield region of the bottom layer at the bottom two layers, and then directly penetrates the bottom three layers through the conductive holes to the top layer from the bottom two layers, and the copper foils outside the electrical connection circuits of the bottom three layers, the bottom one layer, the bottom two layers and the top layer are grounded and shielded; the copper foil circuit introduced to the top is prevented from being exposed to the electromagnetic environment of the space, and is directly introduced into the closed space where the sensitive element is located through the conductive hole. The wiring mode set up in this way can effectively guarantee the shielding effect of the pyroelectric infrared sensor, and prevent external electromagnetic signal crosstalk from entering the enclosed space where the infrared sensitive element 140 and the signal processing part 160 are located to the maximum extent, so that the electromagnetic interference resistance of the pyroelectric infrared sensor can be improved. In addition, the thermal stability of the pyroelectric infrared sensor can be improved by increasing the thickness of the pipe cap 110 or the base 170.

Example 2:

the present embodiment is different from embodiment 1 in that, as shown in fig. 4, in the present embodiment, the base 170 is replaced with a bottom plate 180, and the bottom plate 180 is fixedly mounted on the lower end surface of the substrate 120. The upper end surface of the bottom plate 180 is a plane, and the connector 190 is accommodated in the opening.

Example 3:

the present embodiment is different from embodiment 1 in that, as shown in fig. 5, the base 170 or the bottom plate 180 is not provided on the pyroelectric infrared sensor in the present embodiment. The cap 110 and the substrate 120 form a closed space, and the substrate 120 has a rectangular shape. The signal processing component 160 and the infrared sensitive element 140 are both packaged in a closed space.

Example 4:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 6, in the present embodiment, the cap 110 and the substrate 120 form a closed space, and the signal processing component 160 and the infrared sensitive element 140 are both enclosed in the closed space. The substrate 120 is rectangular, and a bottom plate 180 is fixedly mounted on a lower end surface of the substrate 120, and the shape of the bottom plate 180 is the same as that of the substrate 120.

Example 5:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 7, the base 170 is not provided, the cap 110 and the substrate 120 form a closed space, and the signal processing component 160 and the infrared sensitive element 140 are all enclosed in the closed space. The substrate 120 is further provided with a peripheral component 210, the peripheral component 210 is disposed in the inner and/or outer space of the cap 110, and the peripheral component 210 is used for forming a highly integrated and multifunctional pyroelectric infrared sensor module. Specifically, the peripheral component part 210 includes: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device. Wherein, output signal control components and parts include: any one or more of a triode, a field effect transistor, a thyristor and a relay. The passive device includes: any one or more of a resistor, a capacitor, and an inductor.

In this embodiment, the signal processing component 160 uses JFET, and adopts a structure with a support component 150, a cap 110 and a substrate 120 forming a closed space, the substrate 120 adopts a PCB, a resistance capacitor is added in the closed space of the cap 110, a power regulator, an analog signal processing chip, a photosensitive device and an output signal control device are added on the upper surface of the PCB outside the closed space of the cap 110, the power regulator, the analog signal processing chip, the photosensitive device and the output signal control device are selected from a field effect transistor and a resistance capacitor, and the resistance capacitor is added on the lower surface of the PCB outside the closed space of the cap 110.

Example 6:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 8, in the present embodiment, the base 170 is replaced by a bottom plate 180, and the bottom plate 180 is fixedly mounted on the lower end surface of the substrate 120. The upper end surface of the bottom plate 180 is a plane, and the connector 190 is accommodated in the opening. The bottom plate 180 is a metal plate and is electrically connected to ground. The bottom plate 180 is a thickened plate having a thickness of at least 1-5 mm. The thickened metal plate is used for improving the integral hot melting of the sensor so as to improve the thermal stability of the sensor. The bottom plate 180 is provided with an opening for accommodating the plug-in unit 190.

Further, the substrate 120 is a PCB, and the top and the ground of the PCB are provided with grounding copper plating 240 except for a circuit.

Furthermore, the circuit board can also be provided with a metalized edge copper clad 260 and a metalized groove copper clad 250, and the edge copper and the groove copper are grounded, so that the circuit board is prevented or reduced from being exposed in a space electromagnetic environment, and the anti-electromagnetic interference performance of the sensor is improved; the pyroelectric infrared sensor with high thermal stability and strong anti-electromagnetic interference performance is formed by the design.

Other examples are as follows:

the present embodiment is different from the above embodiments mainly in that, in the present embodiment, the above structure can also be used for other similar sensors such as thermopiles. Here, taking a thermopile as an example, as shown in fig. 9, the thermopile includes: cap 110, substrate 120, base plate 180 or mount 170, infrared filter 130, thermistor 230, thermopile chip 220, and connector assembly 190. Wherein the thermistor 230 and the thermopile chip 220 are mounted on the substrate 120 and electrically connected to the substrate 120.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered by the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A pyroelectric infrared sensor, characterized in that the pyroelectric infrared sensor comprises: the infrared light source comprises a tube cap (110) and a substrate (120), wherein a window (101) is arranged on the upper surface of the tube cap (110), and an infrared filter (130) is embedded in the window (101); the substrate (120) is assembled with the tube cap (110), and the tube cap (110) is provided with a containing space, and an infrared sensitive element (140) and a signal processing part (160) are packaged in the containing space; the infrared sensitive element (140) and the signal processing part (160) are both directly fixed on the substrate (120); the pyroelectric infrared sensor is characterized in that a connector (190) is further arranged on the substrate (120), the connector (190) is electrically connected with the substrate (120), and the connector (190) is used for achieving external electrical connection and assembly of the pyroelectric infrared sensor.

2. The pyroelectric infrared sensor of claim 1, wherein the cap (110) and the substrate (120) form a closed space, and the signal processing component (160) and the infrared sensitive element (140) are both encapsulated in the closed space.

3. The pyroelectric infrared sensor according to claim 2, characterized in that the pyroelectric infrared sensor further comprises a base plate (180), the base plate (180) being fixedly mounted on the lower end face of the substrate (120).

4. The pyroelectric infrared sensor of claim 1, characterized in that the pyroelectric infrared sensor further comprises a bottom plate (180), the bottom plate (180) and the cap (110) form a sealed space, and the signal processing component (160) and the infrared sensitive element (140) are both packaged in the sealed space.

5. The pyroelectric infrared sensor of claim 1, characterized in that the pyroelectric infrared sensor further comprises a base (170), the base (170) and the cap (110) form a closed space, and the signal processing component (160) and the infrared sensitive element (140) are both encapsulated in the closed space; a concave mounting groove (102) is formed in one side, close to the pipe cap (110), of the base (170), and the substrate (120) is mounted in the concave mounting groove (102).

6. The pyroelectric infrared sensor according to any one of claims 1 to 5, characterized in that the pyroelectric infrared sensor further comprises a support member (150), the support member (150) being disposed between the infrared sensitive element (140) and the substrate (120), the infrared sensitive element (140) being fixed to the support member (150) and being electrically connected, the support member (150) being fixed to the substrate (120) and being electrically connected.

7. The pyroelectric infrared sensor according to claim 6, characterized in that the signal processing component (160) can be a JFET or a smart integrated circuit or a MCU or an amplifier or an ADC device; the substrate (120) is an epoxy resin PCB circuit board or a ceramic substrate (120); the shape of the substrate (120) is any one of a circle, a rectangle and other polygons, and the epoxy resin PCB circuit board is a double-sided board or a multilayer board; the infrared sensitive elements (140) are unit or multi-element sensitive elements, and the number of the infrared sensitive elements (140) is single or multiple; the shape of the pipe cap (110) is circular, rectangular or other polygons, the number of the windows (101) on the upper surface of the pipe cap (110) can be one or more, and the shape of the windows (101) on the upper surface of the pipe cap (110) can be circular, rectangular or other polygons; the infrared filter (130) is an infrared transmission filter (130), the filter base material can be silicon, germanium, gallium arsenide or infrared glass, and the filter can be silicon, germanium, gallium arsenide or infrared glass with light-gathering optical characteristics.

8. The pyroelectric infrared sensor according to claim 3 or 4, characterized in that the back plate (180) is a metal plate or a non-metal plate with a metal film layer plated on the surface; the bottom plate (180) is circular, rectangular or other polygonal in shape; the bottom plate (180) is provided with an opening for accommodating the connector (190).

9. The pyroelectric infrared sensor according to claim 5, characterized in that the base (170) is a metal plate or a non-metal plate with a metal film layer plated on the surface; the base (170) is circular, rectangular or other polygonal shape; the base (170) is provided with an opening, and the opening is positioned at the bottom of the concave mounting groove (102).

10. The pyroelectric infrared sensor according to claim 7, characterized in that the connector (190) can be of the vertical or horizontal type, male or female, direct or patch type; the total number of the electrodes on the connector (190) is two or more; the number of the connectors (190) is one or more.

11. The pyroelectric infrared sensor according to claim 7, characterized in that a peripheral component (210) is provided on the substrate (120), the peripheral component (210) being located inside and/or outside the cap (110), the peripheral component (210) comprising at least: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device; wherein, output signal control components and parts include at least: any one or more of a triode, a field effect transistor, a thyristor and a relay, wherein the passive device at least comprises: any one or more of a resistor, a capacitor, and an inductor; the peripheral parts (210) are used for forming a high-integration and multifunctional integrated pyroelectric infrared sensor.

12. The pyroelectric infrared sensor according to claim 3 or 4, characterized in that the base plate (180) is a metal plate and is electrically connected to ground, and the base plate (180) is a thickened base plate (180) having a thickness of at least 1-5mm, the thickened metal base plate (180) being used to increase the overall heat capacity of the sensor to improve the thermal stability of the sensor; the bottom plate (180) is provided with an opening for accommodating the connector (190).

13. The pyroelectric infrared sensor of claim 2, 3 or 4, characterized in that the substrate (120) is a PCB circuit board, and the top and bottom surfaces of the circuit board are provided with grounding copper cladding (240) except for the circuit, the circuit board can be further provided with metalized edge copper cladding (260) and/or metalized open-slot copper cladding (250), and the edge copper cladding and the open-slot copper cladding are grounded, so as to avoid or reduce the exposure of the circuit board to the space electromagnetic environment and improve the anti-electromagnetic interference performance of the sensor.