CN114318278A

CN114318278A - Silicon chip bearing device with adjustable flatness

Info

Publication number: CN114318278A
Application number: CN202111594598.8A
Authority: CN
Inventors: 高晗; 吴明贵; 刘小明; 张清清; 龚汉亮
Original assignee: Nantong Jiufang New Material Technology Co ltd
Current assignee: Nantong Jiufang New Material Technology Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-04-12

Abstract

The invention discloses a silicon wafer bearing device with adjustable flatness.A beam comprises edge beams positioned at two sides of an outer frame and a middle beam positioned in the middle of the outer frame; the vertical beam comprises a vertical beam guide rail bar and a vertical beam clamping groove fixedly connected with the vertical beam guide rail bar, and the vertical beam clamping groove is connected with the cross beam through a flange; the side cross beam consists of a main cross beam and an auxiliary cross beam; the tie bar is fixed on the auxiliary cross beam through a processing hole on the auxiliary cross beam and a processing hole on the middle cross beam by nuts; the tray is placed on the lacing wire, a cylinder is welded on the lacing wire, threads are machined on the cylinder, and the nut is screwed on the cylinder. The flatness of the silicon wafer bearing device is improved, and the film coating effect is improved; the flatness of the tray can be adjusted; the two trays are fixed together by the lacing wires, so that the yield of the silicon wafer coating is improved.

Description

Silicon chip bearing device with adjustable flatness

Technical Field

The invention relates to a silicon wafer bearing device.

Background

The heterojunction cell takes an n-type monocrystalline silicon wafer as a substrate, and intrinsic amorphous silicon thin films i-a-Si and p-type amorphous silicon thin films p-a-Si with the thicknesses of 3-5nm are deposited on the front surface of the heterojunction cell through a PECVD method after texturing and cleaning, so that pn heterojunction is formed. And depositing an intrinsic amorphous silicon thin film i-a-Si and an n-type amorphous silicon thin film n-a-Si on the back surface by a PECVD method, thereby forming a back surface field. Depositing transparent conductive oxide films on two sides of the doped amorphous silicon film in a sputtering mode, and finally forming metal electrodes on the surfaces of the transparent conductive films by a screen printing technology. The invention relates to a bearing device when a silicon chip is plated with a transparent conductive film, wherein the plated transparent conductive film has higher requirements on the form and position tolerance of the bearing device, so that the bearing device with adjustable flatness is designed, and the tray can be prevented from sinking due to gravity or other external forces. The existing silicon wafer bearing device influences the film coating effect due to reasons such as flatness and the like.

Disclosure of Invention

The invention aims to provide a silicon wafer bearing device with adjustable flatness, which improves the flatness of the silicon wafer bearing device and improves the film coating effect.

The technical solution of the invention is as follows:

a silicon chip bearing device with adjustable flatness is characterized in that: the frame comprises vertical beams and cross beams, wherein the cross beams comprise edge cross beams positioned on two sides of the frame and a middle cross beam positioned in the middle of the frame; the vertical beam comprises a vertical beam guide rail bar and a vertical beam clamping groove fixedly connected with the vertical beam guide rail bar, and the vertical beam clamping groove is connected with the cross beam through a flange; the side cross beam consists of a main cross beam and an auxiliary cross beam; the tie bar is fixed on the auxiliary cross beam through a processing hole on the auxiliary cross beam and a processing hole on the middle cross beam by nuts; the tray is placed on the lacing wire, the cylinder is welded on the lacing wire, the thread is processed on the cylinder, the nut is screwed on the lacing wire, the tensioning force of the lacing wire is adjusted through the nuts at the two ends, and the tray is resisted from sinking due to gravity or other external forces.

The main beam is internally provided with a step surface, and the auxiliary beam is matched with the step surface on the main beam.

The flatness of the silicon wafer bearing device is improved, and the film coating effect is improved; the flatness of the tray can be adjusted; the two trays are fixed together by the lacing wires, so that the yield of the silicon wafer coating is improved.

Drawings

The invention is further illustrated by the following figures and examples.

FIG. 1 is a schematic diagram of the structure of one embodiment of the present invention.

Fig. 2 is a schematic structural view of a lacing wire.

Fig. 3 is a schematic structural view of the middle cross beam.

Fig. 4 is a cross-sectional view taken along line a-a of fig. 3.

Fig. 5 is a schematic structural view of the edge beam.

Fig. 6 is a sectional view taken along line B-B of fig. 5.

Fig. 7 is a schematic view of the structure of a vertical beam.

Fig. 8 is a J-J sectional view of fig. 1.

Detailed Description

A silicon chip bearing device with adjustable flatness comprises an outer frame consisting of vertical beams and cross beams, wherein the cross beams comprise edge cross beams positioned at two sides of the outer frame and a middle cross beam positioned in the middle of the outer frame; the vertical beam comprises a vertical beam guide rail bar and a vertical beam clamping groove fixedly connected with the vertical beam guide rail bar, and the vertical beam clamping groove is connected with the cross beam through a flange; the side cross beam consists of a main cross beam and an auxiliary cross beam; the tie bar is fixed on the auxiliary cross beam through a processing hole on the auxiliary cross beam and a processing hole on the middle cross beam by nuts; the tray is placed on the lacing wire, the cylinder is welded on the lacing wire, the thread is processed on the cylinder, the nut is screwed on the lacing wire, the tensioning force of the lacing wire is adjusted through the nuts at the two ends, and the tray is resisted from sinking due to gravity or other external forces.

Referring to fig. 1, 4 and 6, the vertical beam guide rail bar 16 is connected with the cross beam through the flange 11, the cross beam comprises a middle cross beam 14 and an edge cross beam 15, and the edge cross beam 15 comprises a main cross beam 8 and an auxiliary cross beam 9. The vertical beam 16 comprises a vertical beam clamping groove 2 and a vertical beam guide rail bar 7, and the tray 17 is clamped on the vertical beam 16, the side cross beam 15 and the middle cross beam 14.

Referring to fig. 1 and 6, a flange 11 is installed at a position 1 above a

vertical beam

16, 4 small columns 3 with internal threads are machined at the position 1, a position 5 is in contact with the end face of a cross beam, and the cross beam and the vertical beam are locked together through the flange 11. The component 4 is a screw, and the component 2 and the component 7 are assembled together by the screw 4.

Referring to fig. 1 and 6, a member 2 is provided with 10 holes, and the member 2 and a member 7 are assembled together by screws 4 to form a vertical beam 16.

Referring to fig. 1, 3, 4 and 5, the side beam 15 is composed of a main beam 8 and an auxiliary beam 9, and a hole 10 is processed on the auxiliary beam. Holes 18 are processed on the middle cross beam 14, and the tie bars 13 are fixed on the auxiliary cross beam through the holes 10 and the holes 18 by nuts 13.

The figure also shows a bayonet 12 for fixing the vertical beam, the cross beam and the tray.

Claims

1. A silicon chip bearing device with adjustable flatness is characterized in that: the frame comprises vertical beams and cross beams, wherein the cross beams comprise edge cross beams positioned on two sides of the frame and a middle cross beam positioned in the middle of the frame; the vertical beam comprises a vertical beam guide rail bar and a vertical beam clamping groove fixedly connected with the vertical beam guide rail bar, and the vertical beam clamping groove is connected with the cross beam through a flange; the side cross beam consists of a main cross beam and an auxiliary cross beam; the tie bar is fixed on the auxiliary cross beam through a processing hole on the auxiliary cross beam and a processing hole on the middle cross beam by nuts; the tray is placed on the lacing wire, the cylinder is welded on the lacing wire, the thread is processed on the cylinder, the nut is screwed on the cylinder, and the tensioning force of the lacing wire is adjusted through the nuts at the two ends.

2. The adjustable flatness silicon wafer carrier as claimed in claim 1, wherein: the main beam is internally provided with a step surface, and the auxiliary beam is matched with the step surface on the main beam.