CN114311695A - Hot pressing mechanism of gluing equipment - Google Patents
Hot pressing mechanism of gluing equipment Download PDFInfo
- Publication number
- CN114311695A CN114311695A CN202111562126.4A CN202111562126A CN114311695A CN 114311695 A CN114311695 A CN 114311695A CN 202111562126 A CN202111562126 A CN 202111562126A CN 114311695 A CN114311695 A CN 114311695A
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- CN
- China
- Prior art keywords
- boss
- pressing mechanism
- hot pressing
- hole
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007731 hot pressing Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 title claims abstract description 18
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 17
- 229920000297 Rayon Polymers 0.000 claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 description 7
- 239000004831 Hot glue Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a hot-pressing mechanism of a viscose device, comprising: the hot pressing mechanism of the gluing device, the driving device, the upper pressing plate and the supporting plate according to some embodiments of the invention. The upper pressing plate is connected with the output end of the driving device, and a plurality of first avoidance holes are formed in the lower surface of the upper pressing plate; the backup pad is fixed in the below of top board, and the upper surface of backup pad is equipped with first boss and second boss, all is equipped with a plurality of seconds on first boss and the second boss and dodges the hole, is equipped with between first boss and the second boss and dodges the groove. The top board pushes down under drive of the driving device, the module on the supporting board is subjected to viscose processing, the first avoidance hole of the top board and the second avoidance hole on the first boss and the second boss of the supporting board avoid the hole and avoid the groove, so that the situation of glue overflow in the viscose process is solved, the quality problem of glue overflow on the surface of the module is solved, the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of gluing equipment, in particular to a hot-pressing mechanism of gluing equipment.
Background
The module is a production material used as a carrier in the gluing process, the module is in a form that 50 pieces of a section are glued together by high-temperature glue, and the joint of the high-temperature glue is 0.07-0.1MM higher than the surface of the module. Gluing refers to a process of completely adhering the hot melt adhesive and the back of the module by the pressure and temperature of a hot-pressing head of the equipment.
The module is in the production process of viscose, because the module is cut one section by one and is got up, and has four holes in joint department, when current viscose equipment hot pressing head goes up the viscose, the hot melt adhesive that frequently goes out the module of both sides about the joint department frequently does not glue tightly with the module back, easily goes out when the die-cut module of encapsulation and has the module and inhale the serious quality hidden danger that leads to the module to drop. The quality hidden trouble of module surface glue overflow appears in ordinary module production. At the same time, these two quality problems also cause the module losses to rise significantly.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the hot pressing mechanism of the gluing equipment, which can solve the quality problem of glue overflow on the surface of the module, improve the production efficiency and reduce the production cost.
The hot pressing mechanism of the gluing device, the driving device, the upper pressing plate and the supporting plate according to some embodiments of the invention. The upper pressing plate is connected with the output end of the driving device, and a plurality of first avoidance holes are formed in the lower surface of the upper pressing plate; the backup pad is fixed the below of top board, be equipped with first boss and second boss on the upper surface of backup pad, first boss with all be equipped with a plurality of seconds on the second boss and dodge the hole, first boss with be equipped with between the second boss and dodge the groove.
The method has the following beneficial effects: the top board compresses tightly downwards under drive arrangement's drive, carries out the viscose and handles to the module in the backup pad, and the first of top board dodges the hole and dodges the hole with dodge the groove and solved the viscose in-process and appeared the condition of overflowing glue with dodging the groove with the first boss of backup pad and the second on the second boss, has solved the excessive quality problem of gluing in module surface, improves production efficiency, reduction in production cost.
According to some embodiments of the invention, the upper press plate is made of a gold stamping silicone plate.
According to some embodiments of the invention, the first avoidance holes are arranged in two rows. The advantage that sets up the hole of dodging lies in, avoids the module surface to appear the quality problem of excessive glue, improves production efficiency, has reduced the module loss.
According to some embodiments of the invention, the first avoidance hole has a hole size of 6 mm.
According to some embodiments of the invention, the first boss and the second boss are arranged in parallel left and right.
According to some embodiments of the invention, the second avoidance holes are arranged side-to-side uniformly.
According to some embodiments of the invention, the second relief holes are distributed along a leading edge of the first boss and a trailing edge of the second boss.
According to some embodiments of the invention, the upper surfaces of the first boss and the second boss are provided with third avoidance holes.
According to some embodiments of the invention, the third avoidance holes are arranged side-to-side and are distributed with the second avoidance holes in a staggered manner.
According to some embodiments of the invention, the left end and the right end of the supporting plate are both provided with a U-shaped groove, and the U-shaped groove is internally provided with a threaded hole.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic structural view of an upper platen according to some embodiments of the present invention;
fig. 2 is a schematic structural view of a support plate according to some embodiments of the present invention.
Reference numerals: the upper platen 100, the first avoidance hole 110, the support plate 200, the first boss 210, the second boss 220, the second avoidance hole 230, the avoidance groove 240, the third avoidance hole 250, and the U-shaped groove 260.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, if there are first, second and third described only for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 and 2, in some embodiments of the present invention, the hot pressing mechanism of the gluing apparatus includes: a driving means, an upper platen 100, and a support plate 200. The upper pressing plate 100 is connected with the output end of the driving device, and the lower surface of the upper pressing plate 100 is provided with a plurality of first avoidance holes 110; the supporting plate 200 is fixed below the upper pressing plate 100, the upper surface of the supporting plate 200 is provided with a first boss 210 and a second boss 220, the first boss 210 and the second boss 220 are both provided with a plurality of second avoiding holes 230, and an avoiding groove 240 is arranged between the first boss 210 and the second boss 220.
Specifically, the upper platen 100 is driven by the driving device to press down to glue the module on the supporting plate 200, and the first avoiding hole 110 of the upper platen 100, the second avoiding hole 230 and the avoiding groove 240 on the first boss 210 and the second boss 220 of the supporting plate 200 solve the problem of glue overflow in the gluing process, thereby solving the quality problem of glue overflow on the surface of the module, improving the production efficiency and reducing the production cost.
In some embodiments of the present invention, the upper platen 100 is made of a gold stamping silicone plate. Specifically, the gold stamping silica gel plate is elastic and resistant to high temperature. The hardness of the gold stamping silica gel plate can be determined according to the printing requirements of users, and the general hardness is 40 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees and the like. According to the invention, a gold stamping silica gel plate with the hardness of 65 degrees is selected according to the property of the module. In addition, hot-pressing viscose is carried out to gold stamping silica gel board heat transfer piece, and when hot-pressing viscose, can make the hot melt adhesive melt fast, glue on the module, improve work efficiency, and the long service life of gold stamping silica gel board practices thrift manufacturing cost.
Referring to fig. 1, in some embodiments of the invention, the first avoidance holes 110 are arranged in two rows, i.e., left and right. The advantage of setting up first dodging hole 110 lies in, avoids the module surface to appear the quality problem of excessive glue, improves production efficiency, has reduced the module loss.
In some embodiments of the present invention, the aperture size of the first avoidance hole 110 is 6 mm. Specifically, the advantage of setting the aperture size of the first avoiding hole 110 to be 6mm is to avoid module loss caused by loose adhesion between modules, and to save production cost.
In some embodiments of the present invention, the first boss 210 and the second boss 220 are disposed in parallel left and right. Specifically, when the upper pressure plate 100 is pressed downward by the driving device, in order to ensure that the module and the hot melt adhesive are pressed, the first boss 210 and the second boss 220 are disposed on the first support plate 200, so as to prevent the upper pressure plate 100 from being interfered. First boss 210 and second boss 220 parallel arrangement and centre are equipped with dodges groove 240, dodge the effect in groove 240 and lie in avoiding the excessive glue in module surface, promote production efficiency.
In some embodiments of the present invention, the second avoiding holes 230 are uniformly arranged left and right. Specifically, when the module is subjected to the glue treatment, the hole locations on the two sides of the module correspond to the second avoiding hole 230, so that when the glue is avoided, heat overflows to the surface of the module, and the quality problem of glue overflow on the surface of the module is solved.
In some embodiments of the present invention, the second avoidance holes 230 are distributed along the leading edge of the first boss 210 and the trailing edge of the second boss 220.
In some embodiments of the present invention, the upper surfaces of the first boss 210 and the second boss 220 are further provided with a third avoidance hole 250.
In some embodiments of the present invention, the third avoiding holes 250 are uniformly arranged right and left and are distributed with being staggered from the second avoiding holes 230.
Specifically, when the module is subjected to the gluing process, the rib breaking hole of the module corresponds to the third avoiding hole 250 and the avoiding groove 240 of the lower support part, and the hot melt adhesive of the module is in contact with the third avoiding hole 250 and the avoiding groove 240 of the lower support plate 200 during the gluing process, so that the adhesive on the surface of the rib breaking hole of the module is not melted and overflows onto the surface of the module. The problem of quality hidden danger of excessive glue on the surface of the module is solved, and the loss of the module is reduced.
Referring to fig. 2, in some embodiments of the present invention, U-shaped grooves 260 are formed at both left and right ends of the support plate 200, and screw holes are formed in the U-shaped grooves 260.
Specifically, the supporting plate 200 is in threaded connection with the device through a connecting member, the connecting member includes a screw, a bolt and other fasteners, in order to ensure that the lower surface of the upper pressure plate 100 is tightly pressed on the first boss 210 and the second boss 220, U-shaped grooves 260 are formed at the left and right ends of the supporting plate 200, and threaded holes are formed in the U-shaped grooves 260. The U-shaped groove 260 avoids the interference between the upper pressure plate 100 and the connecting piece, and prevents the problem that the hot melt adhesive is not firmly bonded with the surface of the module.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present invention is not limited to the above-described embodiments, and those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope defined by the claims of the present application.
Claims (10)
1. Hot pressing mechanism of viscose equipment, its characterized in that includes:
a drive device;
the upper pressing plate is connected with the output end of the driving device, and a plurality of first avoidance holes are formed in the lower surface of the upper pressing plate;
the backup pad, the backup pad is fixed the below of top board, be equipped with first boss and second boss on the upper surface of backup pad, first boss with all be equipped with a plurality of seconds on the second boss and dodge the hole, first boss with be equipped with between the second boss and dodge the groove.
2. The hot pressing mechanism of the gluing device as claimed in claim 1, wherein the upper press plate is made of a gold stamping silicone plate.
3. The hot pressing mechanism of viscose equipment of claim 1, wherein, the first dodging hole is arranged in two rows of left and right.
4. The hot pressing mechanism of viscose equipment of claim 3, wherein the aperture size of first dodge hole is 6 mm.
5. The hot pressing mechanism of the gluing device as claimed in claim 1, wherein the first boss and the second boss are arranged in parallel left and right.
6. The hot pressing mechanism of the viscose apparatus according to claim 1, wherein the second avoiding holes are arranged in a left-right uniform manner.
7. The hot pressing mechanism of viscose equipment of claim 6, wherein, the second dodge hole distributes along the left end of first boss and the right end of second boss respectively.
8. The hot pressing mechanism of viscose equipment of claim 7, wherein the upper surface of first boss and the second boss still all is equipped with the third hole of dodging.
9. The hot pressing mechanism of viscose equipment of claim 8, wherein the third avoidance holes are arranged evenly from side to side and are distributed with the second avoidance holes in a staggered manner.
10. The hot pressing mechanism of the gluing device as claimed in claim 9, wherein the supporting plate has U-shaped grooves at both left and right ends, and the U-shaped grooves have threaded holes therein.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111562126.4A CN114311695B (en) | 2021-12-20 | 2021-12-20 | Hot pressing mechanism of viscose equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111562126.4A CN114311695B (en) | 2021-12-20 | 2021-12-20 | Hot pressing mechanism of viscose equipment |
Publications (2)
Publication Number | Publication Date |
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CN114311695A true CN114311695A (en) | 2022-04-12 |
CN114311695B CN114311695B (en) | 2024-02-06 |
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CN202111562126.4A Active CN114311695B (en) | 2021-12-20 | 2021-12-20 | Hot pressing mechanism of viscose equipment |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1857906A (en) * | 2005-05-08 | 2006-11-08 | 华硕电脑股份有限公司 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
TW200940325A (en) * | 2008-03-21 | 2009-10-01 | Hon Hai Prec Ind Co Ltd | Agglutinate assembly and method of agglutination |
CN205086109U (en) * | 2015-10-12 | 2016-03-16 | 福建省武平县云河木业有限公司 | Plywood hot press |
CN209512285U (en) * | 2018-11-05 | 2019-10-18 | 华帝股份有限公司 | Novel structure and water heater that anti-overflow was glued |
CN212386043U (en) * | 2020-04-14 | 2021-01-22 | 江门市拓域玩具有限公司 | Hot press |
-
2021
- 2021-12-20 CN CN202111562126.4A patent/CN114311695B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1857906A (en) * | 2005-05-08 | 2006-11-08 | 华硕电脑股份有限公司 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
TW200940325A (en) * | 2008-03-21 | 2009-10-01 | Hon Hai Prec Ind Co Ltd | Agglutinate assembly and method of agglutination |
CN205086109U (en) * | 2015-10-12 | 2016-03-16 | 福建省武平县云河木业有限公司 | Plywood hot press |
CN209512285U (en) * | 2018-11-05 | 2019-10-18 | 华帝股份有限公司 | Novel structure and water heater that anti-overflow was glued |
CN212386043U (en) * | 2020-04-14 | 2021-01-22 | 江门市拓域玩具有限公司 | Hot press |
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CN114311695B (en) | 2024-02-06 |
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