CN1857906A - Adhesive method for metal piece and plastic piece and adhered machine casing thereof - Google Patents
Adhesive method for metal piece and plastic piece and adhered machine casing thereof Download PDFInfo
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- CN1857906A CN1857906A CN 200510071418 CN200510071418A CN1857906A CN 1857906 A CN1857906 A CN 1857906A CN 200510071418 CN200510071418 CN 200510071418 CN 200510071418 A CN200510071418 A CN 200510071418A CN 1857906 A CN1857906 A CN 1857906A
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- adhesive agent
- metalwork
- plastic parts
- plastic
- metal covering
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200510071418 CN1857906A (en) | 2005-05-08 | 2005-05-08 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
Applications Claiming Priority (1)
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CN 200510071418 CN1857906A (en) | 2005-05-08 | 2005-05-08 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
Publications (1)
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CN1857906A true CN1857906A (en) | 2006-11-08 |
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CN 200510071418 Pending CN1857906A (en) | 2005-05-08 | 2005-05-08 | Adhesive method for metal piece and plastic piece and adhered machine casing thereof |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294825A (en) * | 2010-06-28 | 2011-12-28 | 比亚迪股份有限公司 | Method and device for bonding metal shell and plastic component |
CN102501376A (en) * | 2011-11-02 | 2012-06-20 | 深圳创维-Rgb电子有限公司 | Manufacturing method for large-size, ultra-thin and ultra-narrow shell |
CN103085278A (en) * | 2011-11-07 | 2013-05-08 | 英业达股份有限公司 | Gluing module and manufacturing method thereof |
CN103802229A (en) * | 2012-11-15 | 2014-05-21 | 苏州滕艺科技有限公司 | Method for preparing electronic device shell with connected structure and structure |
WO2018018468A1 (en) * | 2016-07-27 | 2018-02-01 | 华为技术有限公司 | Method for bonding shell and display screen, shell assembly and mobile terminal |
CN107899871A (en) * | 2017-12-12 | 2018-04-13 | 东莞宜安科技股份有限公司 | A kind of AB glue bonder and AB glue adhesion technique |
CN114311695A (en) * | 2021-12-20 | 2022-04-12 | 东信和平科技股份有限公司 | Hot pressing mechanism of gluing equipment |
-
2005
- 2005-05-08 CN CN 200510071418 patent/CN1857906A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294825A (en) * | 2010-06-28 | 2011-12-28 | 比亚迪股份有限公司 | Method and device for bonding metal shell and plastic component |
CN102294825B (en) * | 2010-06-28 | 2014-09-17 | 比亚迪股份有限公司 | Method and device for bonding metal shell and plastic component |
CN102501376A (en) * | 2011-11-02 | 2012-06-20 | 深圳创维-Rgb电子有限公司 | Manufacturing method for large-size, ultra-thin and ultra-narrow shell |
CN102501376B (en) * | 2011-11-02 | 2015-04-29 | 深圳创维-Rgb电子有限公司 | Manufacturing method for large-size, ultra-thin and ultra-narrow shell |
CN103085278A (en) * | 2011-11-07 | 2013-05-08 | 英业达股份有限公司 | Gluing module and manufacturing method thereof |
CN103802229A (en) * | 2012-11-15 | 2014-05-21 | 苏州滕艺科技有限公司 | Method for preparing electronic device shell with connected structure and structure |
CN103802229B (en) * | 2012-11-15 | 2017-02-08 | 苏州滕艺科技有限公司 | Method for preparing electronic device shell with connected structure and structure |
WO2018018468A1 (en) * | 2016-07-27 | 2018-02-01 | 华为技术有限公司 | Method for bonding shell and display screen, shell assembly and mobile terminal |
CN107899871A (en) * | 2017-12-12 | 2018-04-13 | 东莞宜安科技股份有限公司 | A kind of AB glue bonder and AB glue adhesion technique |
CN114311695A (en) * | 2021-12-20 | 2022-04-12 | 东信和平科技股份有限公司 | Hot pressing mechanism of gluing equipment |
CN114311695B (en) * | 2021-12-20 | 2024-02-06 | 东信和平科技股份有限公司 | Hot pressing mechanism of viscose equipment |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HESHUO JOINT SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HUASHUO COMPUTER CO LTD Effective date: 20100511 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 4/F, NO.150, LIDE ROAD, BEITOU DISTRICT, TAIPEI CITY, TAIWAN PROVINCE TO: 5/F, NO.76 LIGONG STREET, BEITOU DISTRICT, TAIPEI CITY, TAIWAN PROVINCE, CHINA |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20100511 Address after: Taiwan Taipei City Beitou District China meritorious Street No. 76 5 floor Applicant after: Pegatron Corporation Address before: Beitou District of Taiwan city of Taipei Province Li Road No. 150 4 floor Applicant before: Huashuo Computer Co., Ltd. |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20061108 |