CN114311451B - Glue injection method for downhole instrument - Google Patents
Glue injection method for downhole instrument Download PDFInfo
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- CN114311451B CN114311451B CN202111106463.2A CN202111106463A CN114311451B CN 114311451 B CN114311451 B CN 114311451B CN 202111106463 A CN202111106463 A CN 202111106463A CN 114311451 B CN114311451 B CN 114311451B
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- 239000003292 glue Substances 0.000 title claims abstract description 165
- 238000002347 injection Methods 0.000 title claims abstract description 96
- 239000007924 injection Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000084 colloidal system Substances 0.000 claims abstract description 97
- 239000000243 solution Substances 0.000 claims abstract description 42
- 238000011056 performance test Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims description 89
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 18
- 238000012544 monitoring process Methods 0.000 description 18
- 238000001816 cooling Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 238000001035 drying Methods 0.000 description 9
- 238000005553 drilling Methods 0.000 description 8
- 230000035939 shock Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000006355 external stress Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a glue injection method for an underground instrument, which comprises the following steps: placing the downhole instrument into a first mould, and injecting a first glue solution to form a first glue body for coating the downhole instrument; taking out the first colloid from the first die, and performing a first performance test on the first colloid; placing the first colloid into a second mold, and injecting a second glue solution to form a second colloid coating the first colloid; and taking out the second colloid from the second die, and performing a second performance test on the second colloid.
Description
Technical Field
The invention relates to the field of petroleum drilling engineering, in particular to a method for injecting glue into an underground instrument.
Background
Downhole instruments such as measurement while drilling instruments and logging while drilling instruments have found widespread use in drilling engineering. However, downhole operations are affected by the drilling environment, particularly high temperature and pressure, strong shock and vibration, and therefore, place higher demands on measurement while drilling instruments and logging while drilling instruments.
Currently, all such instruments use electronic components (e.g., circuit boards, chips, sensors, battery cells, etc.) that are required to withstand higher temperatures and pressures. To ensure that the various chips operate stably and reliably at high temperatures, the chips are typically sealed in a relatively thermally insulating space. However, such insulation spaces tend to result in reduced shock and pressure resistance. In addition, since all selected electronic components have not yet completely found high temperature and high pressure alternatives, one expedient is to preserve multiple non-high temperature and high pressure areas in the circuit design. However, these non-high temperature, high pressure zones can occupy excessive instrument space, which can have a significant impact on the otherwise very limited downhole space. In addition, the flexibility and stress intensity of the whole circuit board are seriously reduced due to the adoption of a higher welding process and the intensive use of a large-scale chip.
Therefore, a method of adopting high-temperature high-pressure glue injection protection for a circuit board is proposed in the prior art. The method is simpler, and only the colloid is directly smeared on the circuit board. This method does not take into account the effect of the thickness, density, hardness and uniformity of the gel after injection molding. If the gel is too thick, the circuit board does not dissipate heat well. If pores exist in the colloid, the colloid is easy to deform or even collapse under the action of external force. If the hardness of the colloid is low, the colloid cannot resist the extrusion impact of external force, so that the aim of high-temperature high-pressure glue injection protection cannot be fulfilled.
A method of injection protection using an injection mold is then proposed, wherein a downhole tool is placed in the mold and then a glue solution is injected. However, the downhole tool obtained in this way has large performance fluctuation and cannot be stably used in a high-temperature and high-pressure downhole environment.
Disclosure of Invention
The invention aims to provide a glue injection method for a downhole instrument.
The glue injection method for the downhole instrument comprises the following steps of: placing the downhole instrument into a first die, and injecting a first glue solution to form a first glue body for coating the downhole instrument; taking out the first colloid from the first die, and performing a first performance test on the first colloid; placing the first colloid into a second mold, and injecting a second glue solution to form a second colloid coating the first colloid; and taking out the second colloid from the second die, and performing a second performance test on the second colloid.
According to one embodiment of the invention, the first glue solution is a glue solution resistant to high temperature and high pressure for absorbing vibration and impact and dispersing stress distribution on the downhole tool, and the second glue solution is a glue solution resistant to impact vibration for resisting deformation of the downhole tool caused by external force.
According to one embodiment of the invention, the downhole tool is pre-treated prior to being placed in the first mold, comprising at least one of: cleaning the outer surface, removing dust and impurities, spraying waterproof liquid, dustproof liquid or anticorrosive liquid, and coating a PCB nano waterproof film.
According to one embodiment of the invention, the first performance test and the second performance test each comprise a temperature test and a pressure test.
According to one embodiment of the invention, the signal amplitude variation of the downhole tool is recorded during the temperature test and the pressure test.
According to one embodiment of the invention, the following conditions occur to qualify the test results of the downhole tool: the downhole instrument is a sensor, and the signal amplitude variation is lower than 0.1%; the downhole instrument is a circuit board, and the signal amplitude variation is lower than 0.2%; the downhole instrument is other components, and the variation of the signal amplitude is less than 1%.
According to one embodiment of the invention, the temperature test is performed first, then the pressure test is performed, and the pressure-resistant protection is performed on the interface of the first colloid or the second colloid between the temperature test and the pressure test.
According to one embodiment of the invention, the first mould comprises two half-moulds used in pairs, which together enclose a closed cavity for injection of glue. Wherein, both sides of the inner cavity are provided with a plurality of ear grooves. At least one of the mold halves further includes a protrusion disposed at a corner of the cavity such that the first gel formed has a notch.
According to one embodiment of the invention, the second mold comprises an upper mold half and a lower mold half that are capable of being fixedly connected together, together defining an inner cavity for a second injection of the glue, the first glue being capable of being received in the inner cavity.
According to one embodiment of the invention, at least one inner surface of the upper mold half and the lower mold half is provided with a plurality of grooves which are uniformly arranged, so that at least one surface of the formed second colloid is provided with protrusions. At least one of the upper mold half and the lower mold half is provided with an insertion hole for a fixing member to pass therethrough to fix the first colloid placed therein.
Drawings
The invention will be described in detail below with reference to the attached drawing figures, wherein:
FIG. 1 schematically shows the overall structure of a glue injection apparatus for a downhole tool according to the invention;
FIGS. 2A and 2B schematically illustrate the structure of a first mold for forming a first gel in accordance with one embodiment of the present invention;
FIG. 3 schematically illustrates a first gel obtained by a first injection using the first mold shown in FIGS. 2A and 2B;
FIGS. 4 and 5 schematically illustrate upper and lower mold halves, respectively, of a second mold in an injection apparatus for a downhole tool according to one embodiment of the invention;
fig. 6 and 7 schematically illustrate a second gel obtained by a second injection using the second mold shown in fig. 4 and 5, respectively;
FIGS. 8 and 9 show curves of temperature and pressure tests performed for the first gel, respectively;
FIGS. 10 and 11 show curves of temperature and pressure tests performed for the second gel, respectively;
FIGS. 12 and 13 show data comparison curves for a first temperature test and a second temperature test, respectively, for different downhole tools; and
Figures 14 and 15 show data versus curves for a first pressure test and a second pressure test, respectively, for different downhole tools.
The figures are not drawn to scale and certain details of the figures have been purposely exaggerated to show details of interest.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
Fig. 1 schematically shows the overall structure of a glue injection device 100 for a downhole tool according to the invention. As shown in fig. 1, the glue injection apparatus 100 includes a glue reservoir 1-1 mounted on a support stand 1-2, and a mold 1-8 mounted on a support stand 1-9. The glue reservoir 1-1 is a container for holding glue to be injected, wherein a stirrer (not shown) may be provided to stir the glue contained therein.
The colloid from the colloid storage tank 1-1 is supplied to the colloid injection port 1-6 of the die 1-8 through the guide pipe 1-3. For this purpose, an injector 1-5 is provided at the end of the flow guide tube 1-3, which is arranged in alignment with the injection port 1-6 so that the glue solution can be injected into the mold 1-8 accurately. According to a preferred embodiment of the present invention, the alignment of the glue injector 1-5 with the glue injection port 1-6 can be easily achieved by adjusting the angle and height of the support brackets 1-9. In addition, a plurality of vents 1-7 may be provided on the mold 1-8 to allow the gas within the mold 1-8 to be vented during the injection process.
In order to adjust the speed of glue injection, a flow limiting valve 1-4 can be arranged on the flow guiding pipe 1-3. In addition, if the glue solution is thick, a booster (not shown) may be provided on the draft tube 1-3.
The above-mentioned glue reservoir 1-1, draft tube 1-3, restrictor valve 1-4, and glue injector 1-5 are well known to those skilled in the relevant art, and thus detailed descriptions thereof will be omitted herein.
The applicant of the application discovers that the performances of high temperature and high pressure resistance, high vibration resistance and strong impact resistance of the underground instrument can be greatly improved by a two-time glue injection method. Specifically, the first injection of the relatively hard glue solution (i.e., the first glue solution) plays a role in resisting high temperature and high pressure. And then, relatively soft glue solution (namely second glue solution) is injected for the second time, so that the impact resistance and shock absorption effects are achieved. Meanwhile, the circuit board and the corresponding power supply units such as the sensor or the battery are combined together in a glue injection mode, so that the device is easy to install and allocate, and more instrument space can be saved. Through the two glue injection, the obtained underground instrument can stably work in severe drilling measurement environments such as high temperature, high pressure, high vibration, strong impact and the like.
According to the invention, the first glue solution can be selected as a glue solution resistant to high temperature and high pressure, and is used for preventing damage to chip pins, contacts and the like caused by the high temperature and the high pressure. The second glue may be selected as an impact shock resistant glue for balancing the momentary compression and impact of external impact shock to components such as batteries (or battery packs), circuit boards, sensors and other small mechanical structures.
In this regard, the molds 1-8 of the glue injection apparatus 100 for downhole tools according to the present invention include a first mold for a first glue injection and a second mold for a second glue injection. In the actual use process, the first die is firstly arranged on the supporting frames 1-9, and the first glue injection is carried out. And then, mounting a second die on the support frames 1-9, and performing second glue injection. The glue reservoir 1-1 may comprise two separate cavities for holding a first glue for a first glue injection and a second glue for a second glue injection, respectively. Alternatively, the glue reservoir 1-1 has only one interior cavity in which the first glue is first placed. And during the second glue injection, the first glue solution in the glue solution storage tank 1-1 is emptied, and then the second glue solution is contained.
The specific structure of the first mold in the glue injection apparatus 100 for downhole tools according to the present invention will be described in detail. The downhole instrument includes various components, such as a circuit board, a chip, a power supply device, a sensor, and the like. The term "downhole tool" may also be understood herein as any one or more of these components.
Fig. 2A and 2B schematically show the structure of a first mold according to an embodiment of the present invention. This first mould has upper and lower half-moulds 4-1 for use in pairs, wherein figure 2A is a plan view of the half-mould and figure 2B is a perspective view of the upper half-mould.
As shown, the mold half 4-1 has an open elongated cavity 4-2 for injecting the first glue. When the upper and lower mold halves 4-1 are brought together, a closed cavity is formed. A plurality of ear slots 4-3 are provided on opposite sides of the inner cavity 4-2. The ear groove 4-3 can enhance the contact area between the first colloid formed by the first glue injection and the second colloid formed by the second glue injection, and enhance the fusion degree of the whole colloid after the two glue injection. In the embodiment shown in fig. 2A and 2B, 4 ear slots 4-3 are provided, which are arranged on the long sides of the inner cavity 4-2, two on each side. If the upper and lower mold halves 4-1 are completely symmetrical, the ear slots of the upper mold half and the ear slots of the lower mold half are also arranged to be completely symmetrical. However, if the upper and lower mold halves 4-1 are not symmetrical, i.e., the respective cavities 4-2 of the upper and lower mold halves 4-1 are different, e.g., of different depths, the ear slots of the upper mold half are not completely symmetrical with the ear slots of the lower mold half.
According to a preferred embodiment of the invention, the ear groove 4-3 is arranged in a U-shape. For a lumen 4-2 of total length 200mm, two pairs of ear slots may be provided, each ear slot having a length of 8mm. In an embodiment not shown, the ear groove may also be provided with an inverted shape, i.e. with a smaller dimension on the side closer to the inner cavity 4-2 and a larger dimension on the side farther from the inner cavity 4-2. In this way, the degree of bonding between the two shots can be further enhanced.
According to another preferred embodiment of the invention, the half-mould part 4-1 further comprises protrusions 4-4 arranged at the four corners of the inner cavity 4-2. Therefore, after the first glue injection is completed, four notches are formed in four corners of the formed first glue, so that the first glue can be conveniently taken out of the first mould. In addition, the contact area between the first colloid formed by the first glue injection and the second colloid formed by the second glue injection can be enhanced by the protruding part, and the fusion degree of the whole colloid after the two glue injection is enhanced.
The first mold shown in fig. 2A and 2B may be made of a wooden material, or may be made of other materials, such as metal, alloy, rubber, polyester, or plastic, which have good insulation, acid and alkali corrosion resistance, and corrosion resistance. Such a first mold is particularly suited for use with relatively square, small, elongated circuit boards that have no special requirements.
According to the invention, the upper half module and the lower half module can be used for injecting glue to the circuit board respectively in a divided manner, or glue injection holes can be formed in the half modules, and the holding sealing and fixing device is arranged, so that glue injection is carried out on two sides of the circuit board.
The first mold shown in fig. 2A and 2B employs upper and lower mold halves 4-1 that are mated in pairs, so that the first mold has a detachable structure. During glue injection, the upper and lower half-modules 4-1 are assembled and fixed together. After the injection is completed, the upper and lower mold halves 4-1 are disassembled to easily take out the formed gel. In this way, the colloid can be protected to the greatest extent, and the circuit board and the chip are prevented from being damaged by external force when the colloid is taken out of the first die.
In fig. 3, a first gel 5-1 formed using a first mold is schematically shown. The first colloid 5-1 comprises a circuit board 5-2, and a plurality of chips or electronic components 5-4 are arranged on the circuit board 5-2. Through the first glue injection, the chips or the electronic components 5-4 and the circuit board 5-2 are wrapped by the first glue solution together to form an integral first glue 5-1. Since the first mold has ear grooves 4-3, the first gel 5-1 has side wings 5-10. In fig. 3, two columns of six wings 5-10 are shown, however it will be appreciated that the number and location of the wings may vary. By enabling the first colloid to have side wings, the degree of fusion between the first colloid and the second colloid after the second glue injection can be enhanced.
It is easy to understand that the first glue formed has a similar structure also in case of a circuit board comprising a plurality of circuit boards, or a chip on a circuit board connected to a sensor or a power supply unit by connecting wires.
According to the present invention, after a first glue is formed by performing a first glue injection using the glue injection apparatus 100 according to the present invention including a first mold, a first performance test is performed on the first glue. And if the result of the first performance test is qualified, performing secondary glue injection on the first colloid. Details of the first performance test will be described below.
The secondary injection is performed using a second mold. Thus, the first mold is first removed from the injection molding apparatus 100, and then the second mold is installed. By adjusting the support frame 1-9, the glue injector 1-5 of the glue injection device 100 is aligned with the glue injection port of the second mold. Thereafter, a secondary glue injection may be performed.
It will be readily appreciated that in a not shown embodiment according to the invention, the glue injection device 100 comprises two support frames 1-9 on which a first mould and a second mould are mounted, respectively. This saves time for mold replacement.
The second mould according to the invention is described below in connection with fig. 4 and 5. The second mould according to the invention comprises an upper mould half 7-1 and a lower mould half 8-1, which are shown in fig. 4 and 5, respectively.
As shown in fig. 4, the upper mold half 7-1 has a hollow rectangular body including a top plate, four upper side plates, and upper extension edges respectively extending outwardly from the ends of two of the upper side plates in parallel with the top plate. An inner cavity 7-2 is defined in the upper mold half 7-1 for injecting a second glue solution. It will be readily appreciated that although only one cavity 7-2 is shown in fig. 7, the upper mold half 7-1 may also include multiple cavities that are connected to each other or independent of each other. The upper mold half 7-1 further includes a glue injection hole 7-4 that communicates with the cavity 7-2 through the top plate of the upper mold half 7-1. Depending on the nature of the injected glue, one or more glue injection holes may be provided. In addition, an openable/closable port 7-7 is provided in one of the upper side plates having an upper extending edge, whereby a first gel can be put into the cavity 7-2 or a second gel formed by a second mold can be taken out therefrom.
On the inner surface of the top plate of the upper mold half 7-1 (i.e., the surface defining the cavity 7-2), a plurality of grooves 7-3 are provided, which are uniformly arranged on the inner surface of the top plate. By providing the recess 7-3, an absorbing effect against external pressure or impact shock can be provided to resist deformation caused by external stress. In the embodiment shown in fig. 4, the recess 7-3 may be configured in a dome shape.
In a specific embodiment, the lumen 7-2 has a length of 237mm, a width of 28mm and a depth of 7.5mm. In this case, the upper mold half 7-1 may have 36 dome-shaped grooves 7-3 arranged in a 2×18 symmetrical manner, wherein the distance between the two dome-shaped grooves 7-3 is 13mm, the diameter of each dome is 10mm, and the height is 1mm.
A plurality of connecting holes 7-5 are also arranged on the two upper extending edges of the upper half die body 7-1 and are used for connecting the upper half die body 7-1 with the lower half die body 8-1. Furthermore, for ease of connection, the two upper extension edges are provided at different height levels, i.e. the two upper extension edges are not coplanar.
As shown in fig. 8, the lower mold half 8-1 also has a hollow cover shape including a bottom plate, four lower side plates, and lower extending edges extending outwardly parallel to the bottom plate from the ends of two of the lower side plates, respectively. An inner cavity 8-2 is defined in the lower mold half 8-1 for injecting a second glue solution therein. It will be readily appreciated that although only one cavity 8-2 is shown in fig. 8, the lower mold half 8-1 may also include multiple cavities that are connected to each other or independent of each other. The lower mold half 8-1 also includes a glue injection hole 8-4 that extends through the bottom plate of the lower mold half 8-1 and communicates with the cavity 7-2. Depending on the nature of the injected glue, one or more glue injection holes may be provided.
On the inner surface of the bottom plate of the lower mold half 8-1 (i.e., the surface defining the cavity 8-2), a plurality of grooves 8-3 are provided, which are uniformly arranged on the inner surface of the bottom plate. By providing the recess 8-3, an absorbing effect against external pressure or impact shock can be provided to resist deformation caused by external stress. The recess 8-3 may be configured in a dome shape.
In a specific embodiment, lumen 8-2 has a length of 237mm, a width of 28mm, and a depth of 7.5mm. In this case, the upper mold half 7-1 may have 36 dome-shaped grooves 7-3 arranged in a 2×18 symmetrical manner, wherein the distance between the two dome-shaped grooves 7-3 is 13mm, the diameter of each dome is 10mm, and the height is 1mm.
The two lower extending edges of the lower mold half 8-1 are likewise arranged non-coplanar. A plurality of connecting holes 8-5 are also arranged on the two lower extending edges of the lower half die body 8-1 and are used for connecting the upper half die body 7-1 with the lower half die body 8-1. After the coupling holes 8-5 of the lower mold half 8-1 are aligned with the corresponding coupling holes 7-5 of the upper mold half 7-1, the upper mold half 7-1 and the lower mold half 8-1 can be easily and reliably fixedly coupled together by bolts.
In addition, insertion holes 8-6 are provided in both side plates of the lower mold half 8-1, which are not provided with lower extending edges. The fixing member can be inserted into the insertion hole 8-6 so as to fix the first gel loaded into the cavity 8-2 of the lower mold half 8-1 from both sides, thereby preventing it from being displaced during the secondary injection.
In some cases, the upper mold half 7-1 and the lower mold half 8-1 may also be used alone. In an alternative embodiment, the second mold further comprises a platen 8-8 for compacting and flattening the formed second gel.
In the secondary injection, the connecting holes 7-5 of the upper mold half 7-1 and the connecting holes 8-5 of the lower mold half 8-1 are aligned with each other and tightened with bolts. And then, slowly filling the selected second glue solution into the glue injection holes 7-4 and/or the glue injection holes 8-4 for secondary glue injection. The upper die half 7-1 and the lower die half 8-1 can also be used independently for secondary glue injection.
Fig. 6 shows a schematic plan view of a second gel 9-1 formed after the second injection. As shown in fig. 6, the first glue 9-2 formed by the first glue injection includes a circuit board 9-3 encapsulated therein, a chip 9-6 mounted on the circuit board 9-3, and a side wing 9-5 formed on the first glue 9-2. Fig. 7 shows a schematic front view of a second gel 10-1 formed after a second injection. As shown in FIG. 7, the first glue 10-2 formed by the first glue injection includes a circuit board 10-3 encapsulated therein and a chip 10-6 mounted on the circuit board 10-3. On the top and bottom surfaces of the second colloid 10-1, a plurality of protrusions 10-5 are formed, which are formed by the grooves 7-3 and grooves 8-3 of the second mold.
Thus, in the formed second colloid, the previously formed first colloid is tightly packed therein. The contact area between the first colloid and the second colloid is increased through the side wings 9-5 on the first colloid, so that the fusion degree of the whole colloid after two glue injection is improved. In addition, the protrusions 10-5 formed on the outer surface of the second gel can effectively absorb external pressure or impact shock to resist deformation caused by external stress.
The method of injecting the glue into the downhole tool will be described.
First, the glue injection device 100 is installed as shown in fig. 1. Wherein, the glue solution storage tank 1-1 is filled with a first glue solution, and the support frame 1-9 is provided with a first mould.
According to the invention, the first glue solution can be organosilicon or polyurethane, the temperature resistant range is-40 ℃ to 200 ℃, and the pressure resistant range is 70MPa to 150MPa. The first glue solution has good heat conductivity, heat resistance, hydrophobicity and electrical insulation, can rapidly disperse heat generated by electrical elements, avoids liquid infiltration, and ensures electrical insulation among elements. Meanwhile, the first glue solution has stronger tensile strength and tearing strength, larger relative elongation and lower thermal expansion coefficient, and is used for absorbing vibration and impact and dispersing stress distribution on components. Suitable additives may also be added to the first glue solution as required by the particular application.
The downhole instruments (batteries or battery packs, circuit boards, sensors and mechanical structural components, etc.) that require glue injection are then subjected to a pre-treatment operation. The pretreatment operation comprises cleaning the outer surface of the component, removing dust and impurities, and spraying corresponding waterproof, dustproof and anticorrosive liquid. In addition, for the circuit board, a layer of PCB nano waterproof film can be uniformly coated on the circuit board, and the thickness of the coating is preferably less than 10 microns. The nano waterproof film can provide waterproof and strong acid salt corrosion resistance. The nano waterproof film should not affect the conductive performance of the connector on the circuit board and resist temperatures above 100 ℃.
And then performing first glue injection. Wherein, the first glue solution is injected into the first mould. The rate of injection of the first cement may be suitably selected for different downhole tools. After filling, the first mold was placed in a high temperature drying oven and allowed to stand at 20℃for 12 hours.
Then, the first colloid is taken out from the first die, and a first performance test is performed on the first colloid.
And if the result of the first performance test is qualified, performing second glue injection. The glue solution storage tank 1-1 is filled with a second glue solution, a second die is arranged on the support frame 1-9, and the first glue is placed in the second die.
According to the invention, the second glue solution can be an organosilicon, polyurethane or epoxy system, the temperature resistant range is-100 ℃ to 350 ℃, and the pressure resistant range is 100MPa to 250MPa. The second glue solution has low viscosity, naturally eliminates bubbles, and can resist deformation caused by external stress.
And then starting the second glue injection. After filling, the second mold was placed in a high temperature oven and allowed to stand at 20℃for 12 hours.
And then, taking out the second colloid from the second die, and performing a second performance test on the second colloid.
And if the result of the second performance test is qualified, the quality of the second colloid containing the downhole instrument is qualified, and the second colloid can be used for downhole operation. The whole method ends.
The first performance test is described below in connection with fig. 8 and 9.
The first gel taken out of the first mold was placed in a high temperature drying oven, and a temperature resistance test was performed according to a temperature test curve shown in fig. 8.
First, a low temperature test is performed. The high temperature drying box filled with the first colloid is kept at normal temperature and kept stand for 1 hour. Slowly cooling, reducing the temperature to-10 ℃ after 20 minutes, and standing for 20 minutes. Continuing to cool, and reducing the temperature to-20 ℃ after 20 minutes. In the cooling process, the signal variation of each component in the first colloid is monitored in real time through an external interface, and the maximum variation is recorded. The high temperature drying oven is kept at the constant temperature of-20 ℃ for 1 hour, the signal variation of each component in the first colloid is monitored in real time, and the maximum variation is recorded. Then slowly heating, heating to-10 ℃ after 20 minutes, and standing for 20 minutes. And continuously heating, heating to 0 ℃ after 20 minutes, monitoring the signal variation of each part in the first colloid in real time in the heating process, and recording the maximum variation.
After the low-temperature test is completed, the high-temperature drying oven is kept at 0-20 ℃ and kept stand for 1 hour.
Then the high temperature test is started. Slowly heating, heating to 100deg.C after 30 min, and standing for 15 min. Heating is continued, the temperature is increased to 120 ℃ after 30 minutes, and the mixture is kept stand for 15 minutes. The temperature was continued to rise to 140℃after 30 minutes. And monitoring the signal variation of each component in the first colloid in real time in the heating process, and recording the maximum variation. And then keeping the temperature at 140 ℃, standing for 1 hour, monitoring the signal variation of the component in the first colloid in real time, and recording the maximum variation. Slowly cooling, cooling to 120 ℃ after 30 minutes, and standing for 15 minutes. Continuously cooling, cooling to 100 ℃ after 30 minutes, and standing for 15 minutes. Continuing to cool, and cooling to 0 ℃ after 30 minutes. And monitoring the signal variation of each part in the first colloid in real time in the cooling process, and recording the maximum variation. Thereby, the temperature test ends.
Throughout the temperature test period, if the component to be tested is a sensor, the signal amplitude variation should be less than 0.1%; if the measured component is a circuit board, the signal amplitude variation should be lower than 0.2%; the signal amplitude variation of the remaining components (i.e., other downhole tools besides the sensor and circuit board, as is well known to those skilled in the art) should be less than 1%. If the signal amplitude variation during the temperature test meets the above requirement, the temperature test is considered to be acceptable. Otherwise, the temperature test is not qualified, and the first colloid is treated according to waste products.
After the temperature test is finished, the interface of the first colloid is subjected to pressure-resistant protection, and then the interface is placed in a high-pressure water tank with adjustable temperature.
First, the temperature of the high-pressure tank was set to 20 ℃, and the pressure test was performed according to the high-pressure test curve shown in fig. 9.
First, the high-pressure water tank was kept at normal pressure and left to stand for 20 minutes. The pressure is slowly increased to 70MPa after 5 minutes, and the mixture is kept stand for 5 minutes. And continuously boosting the pressure to 100MPa after 5 minutes, and standing for 5 minutes. The pressure is continuously increased to 150MPa after 5 minutes. And monitoring the signal variation of each component in the first colloid in real time in the boosting process, and recording the maximum variation. And maintaining the high pressure of 150MPa for 20 minutes, monitoring the signal variation of the component in the first colloid in real time, and recording the maximum variation. Slowly reducing the pressure to 100MPa after 5 minutes, and standing for 5 minutes. Continuously reducing the pressure to 70MPa after 5 minutes, and standing for 5 minutes. The pressure is reduced continuously, and the normal pressure is reached after 5 minutes. And monitoring the signal variation of each component in the first colloid in real time in the depressurization process, and recording the maximum variation.
And (3) adjusting the temperature of the high-pressure water tank to 100 ℃, repeating the pressure test, monitoring the signal variation of each component in the first colloid in real time in the test process, and recording the maximum variation.
And adjusting the temperature of the high-pressure water tank to 140 ℃, repeating the pressure test, monitoring the signal variation of each component in the first colloid in real time in the test process, and recording the maximum variation.
After 20 minutes of rest, the first colloid was removed.
Throughout the pressure test period, if the component to be tested is a sensor, the signal amplitude variation should be lower than 0.1%; if the measured component is a circuit board, the signal amplitude variation should be lower than 0.2%; the signal amplitude variation of the remaining components should be less than 1%. If the signal amplitude variation during the pressure test meets the above requirement, the pressure test is considered to be acceptable. Otherwise, the pressure test is disqualified, and the first colloid is treated according to waste products.
After the second colloid was formed, it was subjected to a second performance test. The second performance test is described below in conjunction with fig. 10 and 11.
The second gel taken out of the second mold was placed in a high temperature drying oven and subjected to a temperature resistance test according to the temperature test curve shown in fig. 10.
First, a low temperature test is performed. The high temperature drying box filled with the first colloid is kept at normal temperature and kept stand for 1 hour. Slowly cooling, cooling to-20deg.C after 20 min, and standing for 20 min. Continuing to cool, and reducing the temperature to-40 ℃ after 20 minutes. In the cooling process, the signal variation of each component in the second colloid is monitored in real time through an external interface, and the maximum variation is recorded. The high temperature drying oven is kept at the constant temperature of-40 ℃ for 1 hour, the signal variation of each component in the second colloid is monitored in real time, and the maximum variation is recorded. Then slowly heating, heating to-20 ℃ after 20 minutes, and standing for 20 minutes. And continuously heating, heating to 0 ℃ after 20 minutes, monitoring the signal variation of each part in the second colloid in real time in the heating process, and recording the maximum variation.
After the low-temperature test is completed, the high-temperature drying oven is kept at 0-20 ℃ and kept stand for 1 hour.
Then the high temperature test is started. Slowly heating, heating to 100deg.C after 30min, and standing for 15 min. Heating is continued, the temperature is increased to 150 ℃ after 30 minutes, and the mixture is kept stand for 15 minutes. The temperature was continued to rise to 200℃after 30 minutes. And monitoring the signal variation of each component in the second colloid in real time in the heating process, and recording the maximum variation. And then keeping the temperature at 200 ℃, standing for 1 hour, monitoring the signal variation of each component in the second colloid in real time, and recording the maximum variation. Slowly cooling, cooling to 150 ℃ after 30 minutes, and standing for 15 minutes. Continuously cooling, cooling to 100 ℃ after 30 minutes, and standing for 15 minutes. Continuing to cool, and cooling to 0 ℃ after 30 minutes. And monitoring the signal variation of each part in the second colloid in real time in the cooling process, and recording the maximum variation. Thereby, the temperature test ends.
Throughout the temperature test period, if the component to be tested is a sensor, the signal amplitude variation should be less than 0.1%; if the measured component is a circuit board, the signal amplitude variation should be lower than 0.2%; the signal amplitude variation of the remaining components should be less than 1%. If the signal amplitude variation during the temperature test meets the above requirement, the temperature test is considered to be acceptable. Otherwise, the temperature test is not qualified, and the second colloid is treated according to waste products.
After the temperature test is finished, the interface of the second colloid is subjected to pressure-resistant protection, and then the interface is placed in a high-pressure water tank with adjustable temperature. The pressure test was performed according to the high pressure test curve shown in fig. 11, with the temperature of the high pressure tank set to 20 ℃.
First, the high-pressure water tank was kept at normal pressure and left to stand for 20 minutes. The pressure is slowly increased to 100MPa after 5 minutes, and the mixture is kept stand for 5 minutes. Continuously boosting pressure to 150MPa after 5 minutes, and standing for 5 minutes. The pressure is continuously increased to 200MPa after 5 minutes. And monitoring the signal variation of each component in the second colloid in real time in the boosting process, and recording the maximum variation. And maintaining the high pressure of 200MPa for 20 minutes, monitoring the signal variation of each component in the second colloid in real time, and recording the maximum variation. Slowly reducing the pressure to 150MPa after 5 minutes, and standing for 5 minutes. Continuously reducing the pressure to 100MPa after 5 minutes, and standing for 5 minutes. The pressure is reduced continuously, and the normal pressure is reached after 5 minutes. And monitoring the signal variation of each component in the second colloid in real time in the depressurization process, and recording the maximum variation.
And adjusting the temperature of the high-pressure water tank to 150 ℃, repeating the pressure test, monitoring the signal variation of each component in the first colloid in real time in the test process, and recording the maximum variation.
And adjusting the temperature to 200 ℃, repeating the pressure test, monitoring the signal variation of each component in the first colloid in real time in the test process, and recording the maximum variation.
After 20 minutes of rest, the second colloid was removed.
Throughout the pressure test period, if the component to be tested is a sensor, the signal amplitude variation should be lower than 0.1%; if the measured component is a circuit board, the signal amplitude variation should be lower than 0.2%; the signal amplitude variation of the remaining components should be less than 1%. If the signal amplitude variation during the pressure test meets the above requirement, the pressure test is considered to be acceptable. Otherwise, the pressure test is disqualified, and the second colloid is treated according to waste products.
And when the result of the second performance test is qualified, the obtained second colloid is regarded as a qualified product and can be used for underground work.
According to the temperature and pressure testing process, temperature and pressure testing experiments are carried out on three downhole instruments of a sensor, a circuit board and a battery in the states of no glue injection, first glue injection and second glue injection, and the change of signals is recorded. The results are shown in fig. 12 to 15.
Fig. 12 shows the results of testing according to the first temperature test in a state where no glue is injected and the first glue is injected for three downhole instruments, a sensor, a circuit board and a battery. As can be seen from fig. 12, in the temperature test range of-20 to 140 ℃, the temperature changes of the sensor without glue injection, the circuit board and the battery are all within the threshold range, which are 0.1%, 0.2% and 1%, respectively. However, as the temperature increases, the battery and the circuit board both exhibit the characteristic of large fluctuation of the amount of change, and the change of the sensor is not obvious. The temperature changes of the sensor, the circuit board and the battery after the first glue injection are all within the threshold range.
Fig. 13 shows the results of testing according to the second temperature test without and with the second shot for the sensor, circuit board and battery three downhole tools. As can be seen from fig. 13, the non-injected sensor, circuit board and battery tests exceeded the threshold values to varying degrees throughout the temperature test at-40 deg.c to 200 deg.c. In particular, the signal changes very strongly after exceeding 160 ℃. In contrast, the change amounts of the sensor, the circuit board and the battery after the second glue injection are all in the threshold range, and the change is gentle.
Fig. 14 shows the results of testing according to the first pressure test in a state where no glue is injected and the first glue is injected for three downhole instruments, a sensor, a circuit board and a battery. As can be seen from fig. 14, the amounts of change of the adhesive-free sensor and the battery are severely beyond the threshold range in the entire pressure test range (70 MPa to 150 MPa). In order to avoid an overvoltage explosion of the battery, the sensor is ensured not to be permanently damaged due to high temperature and high pressure, and the test has to be terminated. While the non-adhesive circuit board, although it completes the high voltage test, is also severely beyond the threshold range. In contrast, the sensor, the circuit board and the battery after the first glue injection are in the whole test range, the respective variation amounts of the sensor, the circuit board and the battery are smooth in overall variation, and the threshold value is not exceeded, so that the effect of high temperature and high pressure resistance is achieved.
Fig. 15 shows the results of testing according to the second pressure test (150 c) without and with the second shot for the sensor, circuit board and battery three downhole tools. As can be seen from fig. 15, the amounts of change of the adhesive-free sensor and the battery are severely beyond the threshold range in the entire pressure test range (70 MPa to 200 MPa). In order to avoid an overvoltage explosion of the battery, the sensor is ensured not to be permanently damaged due to high temperature and high pressure, and the test has to be terminated. For a circuit board without glue, the test is terminated prematurely because the test data severely exceeds the threshold. After taking out, the circuit board is seriously bent and deformed, the chip bursts, and pins fall off after inspection. In contrast, the sensor, the circuit board and the battery after the second glue injection are in the whole test range, the respective variation amounts of the sensor, the circuit board and the battery are smooth in overall variation, and the threshold value is not exceeded, so that the effect of high temperature and high pressure resistance is achieved.
From the results of the above experiments, it can be seen that by adopting the glue injection method of the invention, various downhole instruments such as sensors, circuit boards, batteries and the like can be tested to be qualified under high temperature and high pressure. In contrast, the corresponding components without glue injection cannot pass the high-temperature and high-pressure test.
By adopting the glue injection method, various electromechanical elements can be protected to the maximum extent, vibration and impact are prevented, and high temperature, collision and corrosion are prevented. The glue injection method not only can ensure the glue injection quality, but also can simplify the glue injection flow, reduce the glue injection cost and glue injection damage, and is suitable for high-temperature glue injection protection products of various underground instruments.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (3)
1. A method of injecting glue for a downhole tool, comprising:
placing the downhole instrument into a first mould, and injecting a first glue solution to form a first glue body for coating the downhole instrument, wherein the first glue solution is a glue solution resistant to high temperature and high pressure;
taking out the first colloid from the first die, and performing a first performance test on the first colloid;
placing the first colloid into a second mold, and injecting a second glue solution to form a second colloid coating the first colloid, wherein the second glue solution is an anti-impact vibration glue solution;
taking out the second colloid from the second die, performing a second performance test on the second colloid,
The first mold comprises two mold halves used in pairs, the two mold halves together enclose a closed inner cavity for glue injection, a plurality of ear grooves are formed on two sides of the inner cavity, and at least one mold half further comprises a protruding part arranged at the corner of the inner cavity, so that the formed first glue is provided with a notch;
The second mold comprises an upper mold half and a lower mold half which can be fixedly connected together to jointly define an inner cavity for the second glue injection, the first glue can be accommodated in the inner cavity,
A plurality of evenly arranged grooves are arranged on at least one inner surface of the upper die half body and the lower die half body, so that at least one surface of the formed second colloid is provided with a bulge, at least one of the upper die half body and the lower die half body is provided with an inserting hole for a fixing piece to pass through to fix the first colloid placed therein,
The first performance test and the second performance test both comprise a temperature test and a pressure test, in the temperature test and the pressure test, the signal amplitude variation of the underground instrument is recorded, wherein the temperature test is firstly carried out, then the pressure test is carried out, and the pressure-resistant protection is carried out on the interface of the first colloid or the second colloid between the temperature test and the pressure test.
2. The method of injecting glue for a downhole tool of claim 1, wherein the downhole tool is pre-treated prior to being placed in a first mold, comprising at least one of: cleaning the outer surface, and spraying waterproof liquid, dustproof liquid or anticorrosive liquid.
3. The method of claim 1 or 2, wherein the following conditions occur to determine that the test result of the downhole tool is acceptable:
the downhole instrument is a sensor, and the signal amplitude variation is lower than 0.1%;
the downhole instrument is a circuit board, and the signal amplitude variation is lower than 0.2%;
the downhole instrument is other components, and the variation of the signal amplitude is less than 1%.
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| CN208109181U (en) * | 2018-05-10 | 2018-11-16 | 四川鸿进达卫生技术服务有限公司 | A kind of hand-held Hygrothermograph |
| CN111883440A (en) * | 2020-07-30 | 2020-11-03 | 青岛歌尔微电子研究院有限公司 | Glue filling method, module packaging structure and electronic equipment |
| CN112911872A (en) * | 2021-02-05 | 2021-06-04 | 刘克 | Intelligent driver of LED lamp and manufacturing method thereof |
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| US5971046A (en) * | 1997-09-17 | 1999-10-26 | Bridgestone/Firestone, Inc. | Method and apparatus for bonding an active tag to a patch and a tire |
| CN203198125U (en) * | 2012-12-27 | 2013-09-18 | 中国海洋石油总公司 | Circuit board mold |
| CN108838026B (en) * | 2018-09-19 | 2023-08-15 | 河北科技大学 | Ring glue filling solidifying device and glue filling process method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN208109181U (en) * | 2018-05-10 | 2018-11-16 | 四川鸿进达卫生技术服务有限公司 | A kind of hand-held Hygrothermograph |
| CN111883440A (en) * | 2020-07-30 | 2020-11-03 | 青岛歌尔微电子研究院有限公司 | Glue filling method, module packaging structure and electronic equipment |
| CN112911872A (en) * | 2021-02-05 | 2021-06-04 | 刘克 | Intelligent driver of LED lamp and manufacturing method thereof |
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