CN114311452B - Glue injection device for downhole instrument - Google Patents

Abstract

The invention provides a glue injection device for a downhole instrument, which comprises: a glue solution storage tank; a glue injector; a flow guide pipe connecting the glue solution storage tank with the glue injector; and a first mold and a second mold, each having a glue injection port aligned with the glue injector. Wherein the first mold is configured to receive the downhole tool, whereby a first injection of a first cement is performed by injecting a first cement from the cement reservoir into the first mold via the cement injector, forming a first cement comprising the downhole tool. The second mold is configured to receive the first gel, whereby a second injection of a second gel is performed by injecting a second gel from the gel reservoir into the second mold via the gel injector, forming a second gel comprising the first gel.

Description

Glue injection device for downhole instrument

Technical Field

The invention relates to the field of petroleum drilling engineering, in particular to a device for injecting glue into an underground instrument.

Background

Downhole instruments such as measurement while drilling instruments and logging while drilling instruments have found widespread use in drilling engineering. However, downhole operations are affected by the drilling environment, particularly high temperature and pressure, strong shock and vibration, and therefore, place higher demands on measurement while drilling instruments and logging while drilling instruments.

Currently, all such instruments use electronic components (e.g., circuit boards, chips, sensors, etc.) that are required to withstand higher temperatures and pressures. To ensure that the various chips operate stably and reliably at high temperatures, the chips are typically sealed in a relatively thermally insulating space. However, such insulation spaces tend to result in reduced shock and pressure resistance. In addition, since all selected electronic components have not yet completely found high temperature and high pressure alternatives, one expedient is to preserve multiple non-high temperature and high pressure areas in the circuit design. However, these non-high temperature, high pressure zones can occupy excessive instrument space, which can have a significant impact on the otherwise very limited downhole space. In addition, the flexibility and stress intensity of the whole circuit board are seriously reduced due to the adoption of a higher welding process and the intensive use of a large-scale chip.

Therefore, a method of adopting high-temperature high-pressure glue injection protection for a circuit board is proposed in the prior art. Early methods of this type were relatively simple, simply by directly applying the gel to the circuit board. This method does not take into account the effect of the thickness, density, hardness and uniformity of the gel after injection molding. If the gel is too thick, the circuit board does not dissipate heat well. If pores exist in the colloid, the colloid is easy to deform or even collapse under the action of external force. If the hardness of the colloid is low, the colloid cannot resist the extrusion impact of external force, so that the aim of high-temperature high-pressure glue injection protection cannot be fulfilled.

A method of injection protection using an injection mold is then proposed, wherein a downhole tool is placed in the mold and then a glue solution is injected. However, the downhole tool obtained in this way has large performance fluctuation and cannot be stably used in a high-temperature and high-pressure downhole environment.

Disclosure of Invention

The invention aims to provide a glue injection device for an underground instrument.

The glue injection device for a downhole tool according to the present invention comprises: a glue solution storage tank; a glue injector; a flow guide pipe connecting the glue solution storage tank with the glue injector; and a first mold and a second mold, each having a glue injection port aligned with the glue injector. Wherein the first mold is configured to receive the downhole tool, whereby a first injection of a first cement is performed by injecting a first cement from the cement reservoir into the first mold via the cement injector, forming a first cement comprising the downhole tool. The second mold is configured to receive the first gel, whereby a second injection of a second gel is performed by injecting a second gel from the gel reservoir into the second mold via the gel injector, forming a second gel comprising the first gel.

According to one embodiment of the invention, the first glue solution is a glue solution resistant to high temperature and high pressure for absorbing vibration and impact and dispersing stress distribution on the downhole tool, and the second glue solution is a glue solution resistant to impact vibration for resisting deformation of the downhole tool caused by external force.

According to one embodiment of the invention, the first mould comprises two half-moulds used in pairs, which together enclose a closed cavity for glue injection, wherein several ear-grooves are provided on both sides of the cavity.

According to one embodiment of the invention, at least one of the half-moulds further comprises a protrusion provided at a corner of the inner cavity, such that the first gel formed has a notch.

According to one embodiment of the invention, the first mould comprises a mould core in the shape of a half cylinder, the interior of the mould core is divided into a plurality of cavities arranged in layers by a partition plate, and at least one end of the mould core is provided with a port for placing the downhole tool.

According to one embodiment of the invention, the first mould comprises two half-cylinder shaped half-cores, each half-core defining a closed inner cavity and being provided with a port at least at one end for placing the downhole tool.

According to one embodiment of the invention, the second mold comprises an upper mold half and a lower mold half that are capable of being fixedly connected together, together defining an inner cavity for a second injection of the glue, the first glue being capable of being received in the inner cavity.

According to one embodiment of the invention, at least one inner surface of the upper mold half and the lower mold half is provided with a plurality of grooves which are uniformly arranged, so that at least one outer surface of the formed second colloid is provided with a protrusion.

According to one embodiment of the present invention, at least one of the upper mold half and the lower mold half is provided with an insertion hole for a fixing member to pass therethrough to fix the first colloid placed therein, and one of the upper mold half and the lower mold half is provided with a port for placing the first colloid.

According to one embodiment of the invention, the glue injection device further comprises a support frame for mounting the first die or the second die, the glue injector is aligned with the glue injection port by adjusting the height and the angle of the support frame, the first die and the second die are respectively provided with a plurality of air exhaust ports, and the flow guide pipe is further provided with a flow limiting valve and/or a booster.

Drawings

The invention will be described in detail below with reference to the attached drawing figures, wherein:

FIG. 1 schematically shows the overall structure of a glue injection apparatus for a downhole tool according to the invention;

FIG. 2 schematically illustrates, in partial cross-section, a first mold having a multi-cavity mold core structure in an injection apparatus for a downhole tool according to one embodiment of the invention;

FIGS. 3A and 3B schematically illustrate, in partial cross-section, a first mold having a single cavity, dual mold core structure in a glue-injection apparatus for a downhole tool according to another embodiment of the invention;

FIGS. 4A and 4B schematically illustrate the structure of a first mold having half mold bodies used in pairs according to yet another embodiment of the present invention;

FIGS. 5A through 5D schematically illustrate a first gel obtained by a first gel injection using a gel injection apparatus for a downhole tool according to one embodiment of the present invention;

FIGS. 6A and 6B schematically illustrate a first gel obtained by a first gel injection using a gel injection apparatus for a downhole tool according to another embodiment of the present invention;

FIGS. 7 and 8 schematically illustrate upper and lower mold halves, respectively, of a second mold in an injection apparatus for a downhole tool according to one embodiment of the invention; and

Fig. 9 and 10 schematically illustrate a second gel obtained by a second injection using the injection device for a downhole tool according to an embodiment of the invention, respectively.

In the drawings, the drawings are not to scale and certain details of the drawings are shown exaggerated in order to illustrate the required details.

Detailed Description

The invention will be further described with reference to the accompanying drawings.

Fig. 1 schematically shows the overall structure of a glue injection device 100 for a downhole tool according to the invention. As shown in fig. 1, the glue injection apparatus 100 includes a glue reservoir 1-1 mounted on a support stand 1-2, and a mold 1-8 mounted on a support stand 1-9. The glue reservoir 1-1 is a container for holding glue to be injected, wherein a stirrer (not shown) may be provided to stir the glue contained therein.

The colloid from the colloid storage tank 1-1 is supplied to the colloid injection port 1-6 of the die 1-8 through the guide pipe 1-3. For this purpose, an injector 1-5 is provided at the end of the flow guide tube 1-3, which is arranged in alignment with the injection port 1-6 so that the glue solution can be injected into the mold 1-8 accurately. According to a preferred embodiment of the present invention, the alignment of the glue injector 1-5 with the glue injection port 1-6 can be easily achieved by adjusting the angle and height of the support brackets 1-9. In addition, a plurality of vents 1-7 may be provided on the mold 1-8 to allow the gas within the mold 1-8 to be vented during the injection process.

In order to adjust the speed of glue injection, a flow limiting valve 1-4 can be arranged on the flow guiding pipe 1-3. In addition, if the glue solution is thick, a booster (not shown) may be provided on the draft tube 1-3.

The above-mentioned glue reservoir 1-1, draft tube 1-3, restrictor valve 1-4, and glue injector 1-5 are well known to those skilled in the relevant art, and thus detailed descriptions thereof will be omitted herein.

The applicant of the application discovers that the performances of high temperature and high pressure resistance, high vibration resistance and strong impact resistance of the underground instrument can be greatly improved by a two-time glue injection method. Specifically, the first injection of the relatively hard glue solution (i.e., the first glue solution) plays a role in resisting high temperature and high pressure. And then, relatively soft glue solution (namely second glue solution) is injected for the second time, so that the impact resistance and shock absorption effects are achieved. Meanwhile, the circuit board and the corresponding power supply units such as the sensor or the battery are combined together in a glue injection mode, so that the device is easy to install and allocate, and more instrument space can be saved. Through the two glue injection, the obtained underground instrument can stably work in severe drilling measurement environments such as high temperature, high pressure, high vibration, strong impact and the like.

According to the invention, the first glue solution can be selected as a glue solution resistant to high temperature and high pressure, and is used for preventing damage to chip pins, contacts and the like caused by the high temperature and the high pressure. The second glue may be selected as an impact shock resistant glue for balancing the momentary compression and impact of external impact shock to components such as batteries (or battery packs), circuit boards, sensors and other small mechanical structures.

In this regard, the molds 1-8 of the glue injection apparatus 100 for downhole tools according to the present invention include a first mold for a first glue injection and a second mold for a second glue injection. In the actual use process, the first die is firstly arranged on the supporting frames 1-9, and the first glue injection is carried out. And then, mounting a second die on the support frames 1-9, and performing second glue injection. The glue reservoir 1-1 may comprise two separate cavities for holding a first glue for a first glue injection and a second glue for a second glue injection, respectively. Alternatively, the glue reservoir 1-1 has only one interior cavity in which the first glue is first placed. And during the second glue injection, the first glue solution in the glue solution storage tank 1-1 is emptied, and then the second glue solution is contained.

The specific structure of the first mold in the glue injection apparatus 100 for downhole tools according to the present invention will be described in detail. The downhole instrument includes various components, such as a circuit board, a chip, a power supply device, a sensor, and the like. The term "downhole tool" may also be understood herein as any one or more of these components.

Fig. 2 schematically shows the structure of an embodiment of a first mould according to the invention in a partly cut-away manner. As shown, the first mold includes a mold core 2-1 in the shape of a half cylinder. In the preferred embodiment shown in fig. 2, the mould core 2-1 is formed as a semi-elliptical cylinder, the interior of which is divided by a partition into a plurality of cavities, in particular four cavities 2-2, 2-3, 2-4, 2-5, which are arranged in two layers, two each. In addition, the left and right ends of the mold core 2-1 are provided with ports, whereby the parts to be injected can be put into or taken out of the corresponding mold cavities. It will be readily appreciated that the mould core 2-1 is also provided with means (not shown) for closing the above-mentioned ports.

When the device is used, different types of components (such as a battery or a battery pack, a circuit board, a sensor or other mechanical structural components) are inserted into different cavities through corresponding ports according to requirements, so that the first glue injection is performed, and the glue with different shapes and sizes is obtained. It will be readily appreciated that fasteners (not shown) may be provided in each cavity for securing the various components in the respective cavity so that they remain stationary and cannot move relative to one another during injection. Such fixtures are well known to those skilled in the art, and detailed description thereof will be omitted herein.

The first mold having the mold core 2-1 of the multi-cavity multi-layer structure as shown in fig. 2 is suitable for various small-sized parts having a complicated structure. By using such a first mold, it is possible to cure various components together by one shot of glue. Thus being beneficial to assembly and having multiple functions of high temperature and high pressure resistance, corrosion resistance and the like.

Fig. 3A and 3B schematically show the structure of a first mold according to another embodiment of the present invention in a partially cut-away manner. As shown in fig. 3A and 3B, the first mold comprises two separate cores, namely an upper mold core half 3-1 and a lower mold core half 3-9. The upper half mold core 3-1 and the lower half mold core 3-9 are each formed as a half cylinder, for example, a half ellipsoid, which define an upper half single cavity 3-2 and a lower half single cavity 3-8, respectively. At least one end of the upper half mold core 3-1 and the lower half mold core 3-9 is provided with a port 3-5 for putting in or taking out an object needing to be injected with the glue for the first time. For example, as shown in fig. 3A and 3B, the upper half single cavity 3-2 and the lower half single cavity 3-8 of the upper half mold core 3-1 and the lower half mold core 3-9 are respectively placed with the circuit boards 3-3 and 3-7, which are required to be injected for the first time, on which the side on which the components are arranged faces the curved surface of the half cylinder, and the land of the circuit board faces the bottom surface of the half cylinder. In a preferred embodiment, the circuit boards 3-3 and 3-7 include pre-treatments 3-4 and 3-6, respectively, for improving the quality and reliability protection of the downhole tool under high temperature and high pressure conditions.

The first mold according to this embodiment of the present invention has a single-cavity dual-mold core structure, and is suitable for a dual-layer long-strip circuit board. By using the first die, faults such as circuit board deformation, printed wire damage, chip pin unwelding fracture, component damage and the like caused by a severe working environment can be effectively avoided. In addition, the structure of the single-cavity double-half mold core can well correspond to the mechanical framework of the instrument while drilling, so that double-half corresponding assembly is directly carried out after glue injection is completed.

Fig. 4A and 4B schematically show the structure of a first mold according to another embodiment of the present invention. This first mould has upper and lower half-moulds 4-1 for use in pairs, wherein fig. 4A is a plan view of the half-mould and fig. 4B is a perspective view of the upper half-mould.

As shown, the mold half 4-1 has an open elongated cavity 4-2 for injecting the first glue. When the upper and lower mold halves 4-1 are brought together, a closed cavity is formed. A plurality of ear slots 4-3 are provided on opposite sides of the inner cavity 4-2. The ear groove 4-3 can enhance the contact area between the first colloid formed by the first glue injection and the second colloid formed by the second glue injection, and enhance the fusion degree of the whole colloid after the two glue injection. In the embodiment shown in fig. 4A and 4B, 4 ear slots 4-3 are provided, which are arranged on the long sides of the inner cavity 4-2, two on each side. If the upper and lower mold halves 4-1 are completely symmetrical, the ear slots of the upper mold half and the ear slots of the lower mold half are also arranged to be completely symmetrical. However, if the upper and lower mold halves 4-1 are not symmetrical, i.e., the respective cavities 4-2 of the upper and lower mold halves 4-1 are different, e.g., of different depths, the ear slots of the upper mold half are not completely symmetrical with the ear slots of the lower mold half.

According to a preferred embodiment of the invention, the ear groove 4-3 is arranged in a U-shape. For a lumen 4-2 of total length 200mm, two pairs of ear slots may be provided, each ear slot having a length of 8mm. In an embodiment not shown, the ear groove may also be provided with an inverted shape, i.e. with a smaller dimension on the side closer to the inner cavity 4-2 and a larger dimension on the side farther from the inner cavity 4-2. In this way, the degree of bonding between the two shots can be further enhanced.

According to another preferred embodiment of the invention, the half-mould part 4-1 further comprises protrusions 4-4 arranged at the four corners of the inner cavity 4-2. Therefore, after the first glue injection is completed, four notches are formed in four corners of the formed first glue, so that the first glue can be conveniently taken out of the first mould. In addition, the contact area between the first colloid formed by the first glue injection and the second colloid formed by the second glue injection can be enhanced by the protruding part, and the fusion degree of the whole colloid after the two glue injection is enhanced.

The first mold shown in fig. 4A and 4B may be made of a wooden material, or may be made of other materials, such as metal, alloy, rubber, polyester, or plastic, which have good insulation, acid and alkali corrosion resistance, and corrosion resistance. Such a first mold is particularly suited for use with relatively square, small, elongated circuit boards that have no special requirements.

According to the invention, the upper half module and the lower half module can be used for injecting glue to the circuit board respectively in a divided manner, or glue injection holes can be formed in the half modules, and the holding sealing and fixing device is arranged, so that glue injection is carried out on two sides of the circuit board.

The first mold shown in fig. 4A and 4B employs upper and lower mold halves 4-1 that are mated in pairs, so that the first mold has a detachable structure. During glue injection, the upper and lower half-modules 4-1 are assembled and fixed together. After the injection is completed, the upper and lower mold halves 4-1 are disassembled to easily take out the formed gel. In this way, the colloid can be protected to the greatest extent, and the circuit board and the chip are prevented from being damaged by external force when the colloid is taken out of the first die.

The first gel 5-1 formed using the first mold shown in fig. 4A and 4B is schematically shown in fig. 5A and 5B, wherein fig. 5A shows a front view of the first gel 5-1 and fig. 5B shows a top view of the first gel 5-1. The first colloid 5-1 only comprises a circuit board 5-2, and a plurality of chips or electronic components 5-4 are arranged on the circuit board 5-2. Through the first glue injection, the chips or the electronic components 5-4 and the circuit board 5-2 are wrapped by the first glue solution together to form an integral first glue 5-1. Since the first mold has ear grooves 4-3, the first gel 5-1 has side wings 5-10. In fig. 5B, two columns of six wings 5-10 are shown, however it will be appreciated that the number and location of the wings may vary. By enabling the first colloid to have side wings, the degree of fusion between the first colloid and the second colloid after the second glue injection can be enhanced.

Another first gel 5-1' formed using the first mold shown in fig. 4A and 4B is schematically shown in fig. 5C and 5D, wherein fig. 5C shows a front view of the first gel 5-1' and fig. 5D shows a top view of the first gel 5-1'. The first gel 5-1' comprises two circuit boards, namely a first circuit board 5-2 and a second circuit board 5-8. The first circuit board 5-2 is mounted with a chip or electronic component 5-4 and is connected to the first sensor 5-3 by a wiring cable 5-5. The second circuit board 5-8 is mounted with a chip or electronic component 5-6 and is connected to the first sensor 5-7 by a wiring cable 5-9. All the components are wrapped in the first glue solution together through the first glue injection, so that an integral first glue 5-1' is formed.

Thus, by using the first die, a plurality of small-sized circuit boards and corresponding sensors are integrated into a whole body through the first glue injection, so that the whole body has the function of high temperature and high pressure resistance, and the second glue injection is easier to perform. Meanwhile, the formed colloid has vibration resistance and impact resistance, and is more convenient to assemble.

Similarly, since the first mold has ear grooves, the first gel 5-1' also has flanks 5-10, thereby enhancing the degree of fusion between the first gel and the second gel after the second injection.

Still another first gel 6-1 formed using the first mold shown in fig. 4A and 4B is schematically shown in fig. 6A and 6B, wherein fig. 6A shows a front view of the first gel 6-1 and fig. 6B shows a top view of the first gel 6-1. The first gel 6-1 comprises two circuit boards, namely a first circuit board 6-4 and a second circuit board 6-9. The first circuit board 6-4 is mounted with a chip or electronic component 6-4 and is connected to the first power supply unit 6-3 via a wiring cable 6-7. The second circuit board 6-9 is mounted with a chip or electronic component 6-10 and is connected to the second power supply unit 6-2 via a wiring cable 6-8. All the components are wrapped in the first glue solution together through the first glue injection, so that an integral first glue 6-1 is formed.

In one embodiment according to the invention, the first power supply unit 6-3 and the second power supply unit 6-2 may each be a battery or a battery pack.

Similarly, since the first mold has ear grooves, the first gel 6-1 also has flanks 6-5, thereby enhancing the degree of fusion between the first gel and the second gel after the second injection.

According to the present invention, after a first glue is formed by performing a first glue injection using the glue injection apparatus 100 according to the present invention comprising a first mold, a first performance test is performed on the first glue, including temperature and pressure tests. And if the result of the first performance test is qualified, performing secondary glue injection on the first colloid. Details of the first performance test will be described below.

The secondary injection is performed using a second mold. Thus, the first mold is first removed from the injection molding apparatus 100, and then the second mold is installed. By adjusting the support frame 1-9, the glue injector 1-5 of the glue injection device 100 is aligned with the glue injection port of the second mold. Thereafter, a secondary glue injection may be performed.

It will be readily appreciated that in a not shown embodiment according to the invention, the glue injection device 100 comprises two support frames 1-9 on which a first mould and a second mould are mounted, respectively. This saves time for mold replacement.

The second mould according to the invention is described below in connection with fig. 7 and 8. The second mould according to the invention comprises an upper mould half 7-1 and a lower mould half 8-1, which are shown in fig. 7 and 8, respectively.

As shown in fig. 7, the upper mold half 7-1 has a hollow rectangular body including a top plate, four upper side plates, and upper extension edges respectively extending outwardly from the ends of two of the upper side plates in parallel with the top plate. An inner cavity 7-2 is defined in the upper mold half 7-1 for injecting a second glue solution. It will be readily appreciated that although only one cavity 7-2 is shown in fig. 7, the upper mold half 7-1 may also include multiple cavities that are connected to each other or independent of each other. The upper mold half 7-1 further includes a glue injection hole 7-4 that communicates with the cavity 7-2 through the top plate of the upper mold half 7-1. Depending on the nature of the injected glue, one or more glue injection holes may be provided. In addition, an openable/closable port 7-7 is provided in one of the upper side plates having an upper extending edge, whereby a first gel can be put into the cavity 7-2 or a second gel formed by a second mold can be taken out therefrom.

On the inner surface of the top plate of the upper mold half 7-1 (i.e., the surface defining the cavity 7-2), a plurality of grooves 7-3 are provided, which are uniformly arranged on the inner surface of the top plate. By providing the recess 7-3, an absorbing effect against external pressure or impact shock can be provided to resist deformation caused by external stress. In the embodiment shown in fig. 4, the recess 7-3 may be configured in a dome shape.

In a specific embodiment, the lumen 7-2 has a length of 237mm, a width of 28mm and a depth of 7.5mm. In this case, the upper mold half 7-1 may have 36 dome-shaped grooves 7-3 arranged in a 2×18 symmetrical manner, wherein the distance between the two dome-shaped grooves 7-3 is 13mm, the diameter of each dome is 10mm, and the height is 1mm.

A plurality of connecting holes 7-5 are also arranged on the two upper extending edges of the upper half die body 7-1 and are used for connecting the upper half die body 7-1 with the lower half die body 8-1. Furthermore, for ease of connection, the two upper extension edges are provided at different height levels, i.e. the two upper extension edges are not coplanar.

As shown in fig. 8, the lower mold half 8-1 also has a hollow cover shape including a bottom plate, four lower side plates, and lower extending edges extending outwardly parallel to the bottom plate from the ends of two of the lower side plates, respectively. An inner cavity 8-2 is defined in the lower mold half 8-1 for injecting a second glue solution therein. It will be readily appreciated that although only one cavity 8-2 is shown in fig. 8, the lower mold half 8-1 may also include multiple cavities that are connected to each other or independent of each other. The lower mold half 8-1 also includes a glue injection hole 8-4 that extends through the bottom plate of the lower mold half 8-1 and communicates with the cavity 7-2. Depending on the nature of the injected glue, one or more glue injection holes may be provided.

On the inner surface of the bottom plate of the lower mold half 8-1 (i.e., the surface defining the cavity 8-2), a plurality of grooves 8-3 are provided, which are uniformly arranged on the inner surface of the bottom plate. By providing the recess 8-3, an absorbing effect against external pressure or impact shock can be provided to resist deformation caused by external stress. The recess 8-3 may be configured in a dome shape.

In a specific embodiment, lumen 8-2 has a length of 237mm, a width of 28mm, and a depth of 7.5mm. In this case, the upper mold half 7-1 may have 36 dome-shaped grooves 7-3 arranged in a 2×18 symmetrical manner, wherein the distance between the two dome-shaped grooves 7-3 is 13mm, the diameter of each dome is 10mm, and the height is 1mm.

The two lower extending edges of the lower mold half 8-1 are likewise arranged non-coplanar. A plurality of connecting holes 8-5 are also arranged on the two lower extending edges of the lower half die body 8-1 and are used for connecting the upper half die body 7-1 with the lower half die body 8-1. After the coupling holes 8-5 of the lower mold half 8-1 are aligned with the corresponding coupling holes 7-5 of the upper mold half 7-1, the upper mold half 7-1 and the lower mold half 8-1 can be easily and reliably fixedly coupled together by bolts.

In addition, insertion holes 8-6 are provided in both side plates of the lower mold half 8-1, which are not provided with lower extending edges. The fixing member can be inserted into the insertion hole 8-6 so as to fix the first gel loaded into the cavity 8-2 of the lower mold half 8-1 from both sides, thereby preventing it from being displaced during the secondary injection.

In some cases, the upper mold half 7-1 and the lower mold half 8-1 may also be used alone. In an alternative embodiment, the second mold further comprises a platen 8-8 for compacting and flattening the formed second gel.

In the secondary injection, the connecting holes 7-5 of the upper mold half 7-1 and the connecting holes 8-5 of the lower mold half 8-1 are aligned with each other and tightened with bolts. And then, slowly filling the selected second glue solution into the glue injection holes 7-4 and/or the glue injection holes 8-4 for secondary glue injection. The upper die half 7-1 and the lower die half 8-1 can also be used independently for secondary glue injection.

Fig. 9 shows a schematic plan view of a second gel 9-1 formed after the second injection. As shown in fig. 9, the first glue 9-2 formed by the first glue injection includes a circuit board 9-3 encapsulated therein, a chip 9-6 mounted on the circuit board 9-3, and a side wing 9-5 formed on the first glue 9-2. Fig. 10 shows a schematic front view of a second gel 10-1 formed after a second injection. As shown in FIG. 10, a first gel 10-2 formed by the first injection comprises a circuit board 10-3 encapsulated therein and a chip 10-6 mounted on the circuit board 10-3. On the top and bottom surfaces of the second colloid 10-1, a plurality of protrusions 10-5 are formed, which are formed by the grooves 7-3 and grooves 8-3 of the second mold.

Thus, in the formed second colloid, the previously formed first colloid is tightly packed therein. The contact area between the first colloid and the second colloid is increased through the side wings 9-5 on the first colloid, so that the fusion degree of the whole colloid after two glue injection is improved. In addition, the protrusions 10-5 formed on the outer surface of the second gel can effectively absorb external pressure or impact shock to resist deformation caused by external stress.

After the second shot of cement, a second performance test is performed on the second formed gel, including temperature and pressure tests. If the result of the second performance test is acceptable, it indicates that the quality of the second gel, including the downhole tool, is acceptable and can be used in a downhole operation.

The glue injection device provided by the invention is used for carrying out temperature and pressure test experiments on three underground instruments, namely a sensor, a circuit board and a battery. Experimental results prove that the performance test of the three underground instruments at high temperature and high pressure is qualified. In contrast, none of the three downhole tools that were not treated with the injection procedure passed the high temperature, high pressure performance test. For details of the first performance test, the second performance test, and the temperature and pressure test experimental data, reference may be made to the patent application entitled "method of injecting glue for downhole tools" filed on the same day by the same applicant. For the sake of economy, this will not be described in detail.

It will be readily appreciated that although only one glue reservoir, one draft tube, and one support frame are shown in fig. 1, the glue injection apparatus according to the present invention also includes two glue reservoirs, and two support frames. The two glue solution storage tanks are respectively provided with a first glue solution and a second glue solution, and the two support frames are respectively provided with a first mould and a second mould. The glue solution storage tank filled with the first glue solution is connected with the first die through one guide pipe, and the glue solution storage tank filled with the second glue solution is connected with the second die through the other guide pipe. Through the mode, the first die on the support frame can be prevented from being replaced by the second die after the first glue injection, and the time for glue injection is saved.

While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (4)

1. A glue injection device for curing a plurality of downhole tools together, comprising:

A glue solution storage tank;

a glue injector;

a flow guide pipe connecting the glue solution storage tank with the glue injector; and

A first mold and a second mold, each having a glue injection port aligned with the glue injector,

Wherein the first mold is configured to receive the downhole tool, whereby a first injection of a first glue is performed by injecting a first glue from the glue reservoir through the glue injector into the first mold, forming a first glue comprising the downhole tool,

The second mold is configured to receive the first gel, whereby a second injection of a second gel is performed by injecting a second gel from the gel reservoir into the second mold via the gel injector, forming a second gel comprising the first gel,

The first die comprises a half-cylinder-shaped die core, the interior of the die core is divided into a plurality of cavities which are arranged in layers through a partition board, at least one end of the die core is provided with a port for placing the downhole instrument,

The second mold comprises an upper mold half body and a lower mold half body which can be fixedly connected together to jointly define an inner cavity for secondary glue injection, and the first glue body can be accommodated in the inner cavity, wherein at least one inner surface of the upper mold half body and the lower mold half body is provided with a plurality of uniformly arranged grooves, so that at least one outer surface of the formed second glue body is provided with bulges,

The first glue solution is high-temperature and high-pressure resistant glue solution, and the second glue solution is shock-vibration resistant glue solution.

2. The glue injection apparatus for a downhole tool according to claim 1, wherein the first mold comprises two half-cylinder shaped half cores, each half-core defining a closed inner cavity and being provided with a port at least one end for placing the downhole tool.

3. A glue injection device for a downhole tool according to claim 1 or 2, wherein at least one of the upper and lower mould halves is provided with an insertion hole for a fixing member to pass therethrough for fixing a first glue placed therein, and wherein one of the upper and lower mould halves is provided with a port for placing the first glue.

4. The apparatus according to claim 1 or 2, further comprising a support frame for mounting the first or second mold, wherein the injector is aligned with the injection port by adjusting the height and angle of the support frame,

The first mold and the second mold are each provided with a plurality of exhaust ports,

And the flow guide pipe is also provided with a flow limiting valve and/or a booster.