CN114310592B - Special intelligent SMD crystal oscillator quality control detection equipment and working method thereof - Google Patents
Special intelligent SMD crystal oscillator quality control detection equipment and working method thereof Download PDFInfo
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- CN114310592B CN114310592B CN202111525363.3A CN202111525363A CN114310592B CN 114310592 B CN114310592 B CN 114310592B CN 202111525363 A CN202111525363 A CN 202111525363A CN 114310592 B CN114310592 B CN 114310592B
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Abstract
The invention discloses a special intelligent SMD crystal oscillator product control detection device and a working method thereof; belongs to the technical field of SMD quartz crystal oscillators; the technical key points are as follows: the X-direction moving device is used for driving the second uncovering assembly to move along the X direction; the Y-direction moving device is used for driving the second cover opening assembly and the X-direction moving device to move along the Y direction; the first uncovering assembly comprises a polishing material fixer, a Z-direction connecting and fixing mechanism, a low-mesh grindstone, a high-mesh grindstone and an adhesive tape; the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged below the polishing material fixer; a second door assembly comprising: an SMD crystal oscillator placing jig; the second uncapping assembly is arranged below the first uncapping assembly. By adopting the intelligent SMD crystal oscillator product control detection special device and the working method thereof, the SMD crystal oscillator product control detection work can be effectively supported.
Description
Technical Field
The invention relates to the technical field of SMD quartz crystal oscillators, in particular to an intelligent device special for SMD quartz crystal oscillator product control detection and a working method thereof.
Background
SMD (Surface Mounted Devices) quartz crystal oscillators are very small in size. In order to solve the problem of quality control detection, the upper cover of the SMD quartz crystal oscillator needs to be opened for detection.
The applicant's prior application: '202111283134.5 a surface mount type quartz crystal oscillator cover opening method' provides a cover grinding method, and solves the problem of opening an upper cover.
However, the foregoing methods have relied on manual operations, and one of the major drawbacks of manual operations is:
1) The manual experience has great influence on the uncapping success rate and the yield; the success rate and the yield of each person are greatly different.
2) The workload of uncapping inspection is very large, and more workers need to be equipped for the uncapping inspection.
3) When a new worker needs to perform the work, the requirements of success rate and yield can be met after a certain time.
How to solve the problems and greatly improve the success rate and the yield of uncapping the SMD crystal oscillator upper cover is a big problem for quartz crystal oscillator production enterprises.
Disclosure of Invention
The invention aims to provide special intelligent SMD crystal oscillator quality control detection equipment and a working method thereof aiming at the defects of the prior art.
The technical scheme of the application is as follows:
the utility model provides an intelligent SMD crystal oscillator quality control detects professional equipment, includes: the device comprises a Z-direction moving device, an X-direction moving device, a Y-direction moving device, a first cover opening assembly, a second cover opening assembly and a lower bearing plate;
the X direction, the Y direction and the Z direction are mutually vertical, the Z direction represents a vertical direction, and the X direction and the Y direction are both horizontal directions; the X direction indicates the sanding direction, and the Y direction indicates the rough grinding-finish grinding-tape direction;
the Z-direction moving device is used for driving the first cover opening assembly to move up and down;
the X-direction moving device is used for driving the second uncovering assembly to move along the X direction;
the Y-direction moving device is used for driving the second cover opening assembly and the X-direction moving device to move along the Y direction;
the first cover opening assembly comprises a polishing material fixer, a Z-direction connecting and fixing mechanism, a low-mesh grinding stone, a high-mesh grinding stone and an adhesive tape; the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged below the polishing material fixer;
a second door assembly comprising: an SMD crystal oscillator placing jig;
the second uncapping assembly is arranged below the first uncapping assembly.
Further, the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged below the polishing material holder in parallel, the polishing material holder is provided with L-shaped receiving steps at two ends in the X direction, and the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are placed between the lower surface of the polishing material holder and the L-shaped receiving steps.
Further, the second door assembly further includes: a jig fixing mechanism; tool fixed establishment includes: the flange plate and the vertical cylinder body; the vertical cylinder is matched with the SMD crystal oscillator placement jig in shape and size;
SMD crystal oscillator places the tool with tool fixed establishment adopts and to dismantle the connection design: the internal surface of the vertical cylinder of the fixture fixing mechanism 501 is provided with threads, the external surface of the SMD crystal oscillator placing fixture is provided with threads, and the SMD crystal oscillator placing fixture is fixedly connected with the fixture fixing mechanism through threads.
Further, the second door assembly further includes: the product fixing piece is provided with a groove for placing an SMD crystal oscillator; the product fixing piece and the SMD crystal oscillator placing jig are detachably connected and fixed together; the product fixing piece is placed and fixed above the SMD crystal oscillator placing jig.
Further, the Z-direction moving device comprises an upright post, a Z-direction moving driving mechanism and a Z-direction track; the Z-direction track is arranged on the upright post, the Z-direction moving driving mechanism is connected with the first uncovering assembly, and the first uncovering assembly is controlled to move along the Z direction through the Z-direction moving driving mechanism.
Further, the X-direction moving device includes: the device comprises an upper bearing plate, an X-direction movement driving mechanism and an X-direction track, wherein the X-direction movement driving mechanism is connected with the upper bearing plate and drives the upper bearing plate to move along the X direction; and a groove matched with the X-direction track is arranged on the upper bearing plate.
Further, the Y-direction moving device includes: the bearing plate moving mechanism is connected with the bearing plate, and the Y-direction moving driving mechanism drives the bearing plate to move along the Y direction; and a groove matched with the Y-direction track is arranged on the middle bearing plate.
Further, the cooperation design that second subassembly, X uncap to mobile device, Y to mobile device, Z to mobile device, lower loading board lies in:
the second cover opening assembly is fixed on the upper surface of an upper bearing plate of the X-direction moving device through a flange plate;
the X-direction track and the X-direction movement driving mechanism are fixedly arranged on the upper surface of the middle bearing plate;
the Y-direction track, the Y-direction movement driving mechanism and the Z-direction movement device are all fixed on the lower bearing plate;
the upper bearing plate is arranged above the middle bearing plate, and the middle bearing plate is arranged above the lower bearing plate.
Furthermore, a Z-direction movement driving mechanism, an X-direction movement driving mechanism and a Y-direction movement driving mechanism adopt telescopic rod structures.
Further, still include: a touch screen and a controller; the touch screen is used for inputting the mesh numbers of the low-mesh grindstone and the high-mesh grindstone; the touch screen is electrically connected with the controller, the controller is electrically connected with the Z-direction movement driving mechanism, the X-direction movement driving mechanism and the Y-direction movement driving mechanism, and the controller is used for controlling the operation of the Z-direction movement driving mechanism, the X-direction movement driving mechanism and the Y-direction movement driving mechanism.
Further, still include: 2 pressure sensors:
1 pressure sensor is arranged between the low-mesh grindstone and the grinding material fixer and is called as a first pressure sensor, and 1 pressure sensor is arranged between the high-mesh grindstone and the grinding material fixer and is called as a second pressure sensor;
the pressure sensor is connected with the controller;
the number of crystal oscillators of the product fixing piece is input into the touch screen, so that the pressure between the low-mesh grindstone and the high-mesh grindstone-SMD crystal oscillators can be monitored.
The beneficial effect of this application lies in:
firstly, the application firstly provides intelligent SMD crystal oscillator product control detection special equipment, and the structural design of the intelligent SMD crystal oscillator product control detection special equipment relates to two invention points:
the problem that is solved first is that is "is crystal oscillator facing up or down during grinding? "sanding should be done manually, facing down.
However, the above method has certain problems in that it is mechanically operated. Because, the placement of the product fixing sheet is inconvenient. Here, the applicant has overcome the prejudice of the prior art that the crystal oscillator of the SMD faces upward when the jig is polished.
In addition, according to the manual method, the XYZ degrees of freedom are all distributed on the SMD crystal oscillator (corresponding to the distribution on the jig), and this design is heavy in structure, that is, during the X-direction polishing, the device with the Z-direction needs to move simultaneously;
in combination with the first problem of "crystal oscillator up", the present application breaks the prejudice of the prior knowledge to distribute the Z degree of freedom onto the abrasive material (corresponding to the first uncapping assembly).
Based on the above two basic requirements, the following design is adopted:
1) The crystal oscillator is arranged on a jig, and the jig is provided with a horizontal X/Y direction movement design mechanism;
2) The low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged in parallel, and the three adopt the same mechanism to control the lifting of the low-mesh grindstone, the high-mesh grindstone and the adhesive tape, so that the contact between the low-mesh grindstone, the high-mesh grindstone and the crystal oscillator is realized.
Secondly, the application provides a working method of the intelligent SMD crystal oscillator product control detection special device, which comprises the following steps:
s1, placing a crystal oscillator on an SMD crystal oscillator placing jig:
s1-1, controlling an X-direction movement driving mechanism and/or a Y-direction movement driving mechanism through a touch screen controller, and moving an SMD crystal oscillator placement jig to a preset mounting position;
s1-2, installing a product fixing piece on a crystal oscillator placing jig, and installing and fixing the product fixing piece and an SMD crystal oscillator placing jig together;
s1-3, placing an SMD crystal oscillator into a groove of a product fixing sheet;
s2, inputting the mesh numbers of a low-mesh grindstone and a high-mesh grindstone into the touch screen, wherein the mesh number of the low-mesh grindstone is expressed as a, and the mesh number of the high-mesh grindstone is expressed as b meshes; inputting the number c of crystal oscillators of a product fixing sheet in a touch screen;
s3, clicking the touch screen, and starting:
s3-1, controlling an X-direction movement driving mechanism and/or a Y-direction movement driving mechanism through a touch screen controller, so that an SMD crystal oscillator placement jig moves to a low-mesh grinding stone polishing initial position, wherein the low-mesh grinding stone polishing initial position of the SMD crystal oscillator placement jig is below the low-mesh grinding stone;
S3-2,Z drives the first uncovering component to descend to the moving driving mechanism until the first pressure sensor monitors that the pressure between the low-mesh grindstone and all crystal oscillators on the product fixing piece is kept at (5.9-6.2N) x c:
S3-3,X driving the SMD crystal oscillator placing jig to move back and forth along the X direction by the movement driving mechanism, and starting coarse grinding:
number of rough grinding: int (a.0.055) + int (a/400). Times.1 + int (b/800). Times.1;
the speed of the X-direction movement is: 11.1-14.2 cm/s;
the single friction distance of coarse grinding is 10cm;
s3-4, after coarse grinding is finished, the Z-direction moving driving mechanism drives the first cover opening assembly to ascend, and a low-mesh grinding stone of the first cover opening assembly is not in contact with the SMD crystal oscillator any more:
s4, after the coarse grinding and polishing are finished, the fine grinding and polishing work is started again:
s4-1, controlling the X-direction movement driving mechanism and the Y-direction movement driving mechanism through a touch screen controller, so that the SMD crystal oscillator placement jig is moved to a high-mesh grinding stone polishing initial position, and the high-mesh grinding stone polishing initial position of the SMD crystal oscillator placement jig is below the high-mesh grinding stone;
S4-2,Z drives the first uncovering component to descend towards the moving driving mechanism until the second pressure sensor monitors that the pressure between the high-mesh grindstone and all crystal oscillators on the product fixing sheet is kept at (2.2-2.6N) x c:
S4-3,X drives the SMD crystal oscillator placing jig to move back and forth along the X direction to start fine grinding:
the number of fine grinding: 8-int (a/360). Times.2 + int [ (0.0525 x b-25) x (280/b). Times.0.2 ]; the speed of the X-direction movement is: 18.18-22.2 cm/s; the single friction distance of fine grinding is 10cm;
s4-4, after fine grinding is finished, the Z-direction moving driving mechanism drives the first cover opening assembly to ascend, and a high-mesh grinding stone of the first cover opening assembly is not in contact with the SMD crystal oscillator any more:
s5, after finish grinding and polishing are finished, opening the cover:
s5-1, controlling the X-direction movement driving mechanism and the Y-direction movement driving mechanism through a touch screen controller to enable the SMD crystal oscillator placement jig to move to an uncovering position, wherein the uncovering position of the SMD crystal oscillator placement jig is below the adhesive tape;
S5-2,Z drives the first uncovering component to descend to the moving driving mechanism until the adhesive tape of the first uncovering component is contacted with the SMD crystal oscillator and bonded together:
S5-3,Z drives the first cover opening component to ascend towards the moving driving mechanism, and the adhesive tape takes away the upper cover.
Drawings
The invention will be described in further detail with reference to examples of embodiments shown in the drawings, which should not be construed as limiting the invention in any way.
Fig. 1 is a schematic three-dimensional structure diagram of a device dedicated for intelligent SMD crystal oscillator product control detection according to a first embodiment.
Fig. 2 is a side view of the device dedicated for the intelligent SMD crystal oscillator quality control detection according to the first embodiment.
Fig. 3 is a schematic three-dimensional structure diagram of the intelligent SMD crystal oscillator product-control detection dedicated device according to the first embodiment from another view angle.
Fig. 4 is a front elevation view of the device dedicated for intelligent SMD crystal oscillator quality control detection according to the first embodiment.
The reference numerals in the accompanying figures 1-4 of the specification are as follows:
a Z-direction moving device 100, a vertical column 101 and a Z-direction moving driving mechanism 102;
an X-direction moving device 200, an upper bearing plate 201 and an X-direction moving driving mechanism 202;
a Y-direction moving device 300, a middle bearing plate 301, a Y-direction moving driving mechanism 302;
a first cover opening assembly 400, a grinding material holder 401, a Z-direction connecting and fixing mechanism 402;
the second cover opening assembly 500, the SMD crystal oscillator placing jig 502 and the jig fixing mechanism 501;
the lower carrier plate 600.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, however, the present disclosure may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. In the drawings, the shape and size of elements may be exaggerated for clarity, and the same reference numerals and signs will be used throughout to designate the same or similar elements.
< example one: intelligent SMD crystal oscillator product control detection special equipment
< first, mechanical Structure design >
The utility model provides an intelligent SMD crystal oscillator quality control detects professional equipment, includes: the device comprises a Z-direction moving device 100, an X-direction moving device 200, a Y-direction moving device 300, a first cover opening assembly 400, a second cover opening assembly 500 and a lower bearing plate 600;
the X direction, the Y direction and the Z direction are mutually vertical, the Z direction represents a vertical direction, and the X direction and the Y direction are both horizontal directions; the X direction indicates the sanding direction, and the Y direction indicates the rough grinding-finish grinding-tape direction;
the Z-direction moving device 100 comprises an upright post 101, a Z-direction moving driving mechanism 102 and a Z-direction track; the Z-direction track is arranged on the upright post 101, the Z-direction moving driving mechanism 102 is connected with the first uncovering assembly 400, and the first uncovering assembly 400 is controlled to move along the Z direction by the Z-direction moving driving mechanism 102;
the first uncovering assembly 400 comprises a grinding material fixer 401, a Z-direction connecting and fixing mechanism 402, a low-mesh grinding stone, a high-mesh grinding stone and an adhesive tape;
the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged below the polishing material holder 401 in parallel, specifically, the polishing material holder 401 is provided with L-shaped receiving steps at two ends in the X direction, and the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are placed between the lower surface of the polishing material holder 401 and the L-shaped receiving steps;
wherein, second uncap subassembly 500 includes: an SMD crystal oscillator placing jig 502 and a jig fixing mechanism 501;
the jig fixing mechanism 501 includes: the flange plate and the vertical cylinder body; the vertical cylinder is matched with the SMD crystal oscillator placing jig 502 in shape and size;
The X-direction moving device 200 includes: the device comprises an upper bearing plate 201, an X-direction movement driving mechanism 202 and an X-direction track, wherein the X-direction movement driving mechanism 202 is connected with the upper bearing plate 201, and the X-direction movement driving mechanism 202 drives the upper bearing plate 201 to move along the X direction; a groove matched with the X-direction track is formed in the upper bearing plate 201;
the Y-direction moving device 300 includes: the device comprises a middle bearing plate 301, a Y-direction moving driving mechanism 302 and a Y-direction track, wherein the Y-direction moving driving mechanism 302 is connected with the middle bearing plate 301, and the Y-direction moving driving mechanism 302 drives the middle bearing plate 301 to move along the Y direction; a groove matched with the Y-direction track is formed in the middle bearing plate 301;
the matching design of the second door-opening assembly 500, the X-direction moving device 200, the Y-direction moving device 300, the Z-direction moving device 100 and the lower bearing plate 600 is as follows:
the second door-opening assembly 500 is fixed on the upper surface of the upper bearing plate of the X-direction moving device 200 through a flange;
the X-direction track and the X-direction movement driving mechanism 202 are fixedly arranged on the upper surface of the middle bearing plate 301;
the Y-direction track, the Y-direction movement driving mechanism 302 and the Z-direction movement device 100 are all fixed on the lower bearing plate 600;
the upper loading plate is above the middle loading plate 301, and the middle loading plate 301 is above the lower loading plate 600.
It should be noted that:
for the driving mechanism 102 for the Z-direction movement, the driving mechanism 202 for the X-direction movement, and the driving mechanism 302 for the Y-direction movement, the scheme shown in FIG. 1 is adopted: screw-nut design, which is known in the art.
It should be noted that the Z-direction movement driving mechanism 102, the x-direction movement driving mechanism 202, and the y-direction movement driving mechanism 302 may also be implemented by other moving mechanisms, such as: a telescoping rod structure, etc.
Second, control design
The control design of the application mainly relates to two problems:
1. inputting information: and inputting information by adopting a touch screen.
2. Which components need to control: motors for controlling the Z-direction movement driving mechanism 102, the X-direction movement driving mechanism 202, and the Y-direction movement driving mechanism 302.
Therefore, the following design is made:
the method comprises the following steps: a touch screen and a controller; the touch screen is used for inputting the mesh numbers of the low-mesh grindstone and the high-mesh grindstone; the touch screen is electrically connected with the controller, the controller is electrically connected with the Z-direction movement driving mechanism 102, the X-direction movement driving mechanism 202 and the Y-direction movement driving mechanism 302, and the operation of the Z-direction movement driving mechanism 102, the X-direction movement driving mechanism 202 and the Y-direction movement driving mechanism 302 is controlled through the controller.
< III, working procedure >
The working method of the special intelligent SMD crystal oscillator quality control detection equipment comprises the following steps:
first, place the crystal oscillator on SMD crystal oscillator places tool 502:
firstly, the touch screen controller controls the X-direction movement driving mechanism 202 and/or the Y-direction movement driving mechanism 302 to move the SMD crystal oscillator placing jig 502 to a preset mounting position;
secondly, the product fixing piece is installed on the SMD crystal oscillator placing jig 502, and the product fixing piece and the SMD crystal oscillator placing jig 502 are installed and fixed together (it is feasible to apply for an improved SMD crystal oscillator reverse analysis and quality detection dedicated jig or other jigs in the past);
thirdly, placing the SMD crystal oscillator into the groove of the product fixing sheet;
secondly, the mesh numbers of a low-mesh grindstone and a high-mesh grindstone are input into the touch screen, wherein the mesh number of the low-mesh grindstone is expressed as a, and the mesh number of the high-mesh grindstone is expressed as b;
thirdly, clicking the touch screen to start working:
firstly, controlling the X-direction movement driving mechanism 202 and/or the Y-direction movement driving mechanism 302 through a touch screen controller, so that the SMD crystal oscillator placement jig 502 moves to a low-mesh grinding stone polishing starting position, wherein the low-mesh grinding stone polishing starting position of the SMD crystal oscillator placement jig 502 is below the low-mesh grinding stone;
secondly, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the low-mesh grindstone of the first uncapping assembly 400 contacts with the SMD crystal oscillator:
thirdly, the driving mechanism 202 for X-direction movement drives the SMD crystal oscillator placing jig 502 to move back and forth along X-direction, and rough grinding is started:
number of rough grinding: int (a.0.055) + int (a/400) × 1+ int (b/800) × 1 (int function represents integer); the speed of the X-direction movement is: 11.1-14.2 cm/s; the single friction distance of rough grinding is 10cm;
finally, after the rough grinding is finished, the Z-direction moving driving mechanism 202 drives the first uncapping assembly 400 to ascend, and the low-mesh grindstone of the first uncapping assembly 400 is not in contact with the SMD crystal oscillator any more:
fourthly, after the coarse grinding and polishing are finished, the fine grinding and polishing work is started again:
firstly, controlling an X-direction movement driving mechanism 202 and a Y-direction movement driving mechanism 302 through a touch screen controller, so that an SMD crystal oscillator placing jig 502 is moved to a high-mesh grinding stone polishing initial position, wherein the high-mesh grinding stone polishing initial position of the SMD crystal oscillator placing jig 502 is below the high-mesh grinding stone;
secondly, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the high-mesh grindstone of the first uncapping assembly 400 contacts with the SMD crystal oscillator:
thirdly, the driving mechanism 202 for moving in the X direction drives the SMD crystal oscillator placing jig 502 to reciprocate in the X direction, and then fine grinding is started:
the number of fine grinding: 8-int (a/360) x 2+ int [ (0.0525 x b-25) x (280/b) 0.2] (int function represents integer); the speed of the X-direction movement is: 18.18-22.2 cm/s; the single friction distance of fine grinding is 10cm;
finally, after the finish grinding is finished, the Z-direction moving driving mechanism 202 drives the first uncovering assembly 400 to ascend, and the high-mesh grindstone of the first uncovering assembly 400 is not contacted with the SMD crystal oscillator any more:
fifthly, after finish grinding and polishing, opening the cover again:
firstly, controlling the X-direction movement driving mechanism 202 and the Y-direction movement driving mechanism 302 by the touch screen controller, so that the SMD crystal oscillator placement jig 502 is moved to an uncovering position, where the uncovering position of the SMD crystal oscillator placement jig 502 is below an adhesive tape (i.e., an adhesive tape);
next, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the adhesive tape of the first uncapping assembly 400 contacts and adheres to the SMD crystal oscillator:
and thirdly, the Z-direction moving driving mechanism 202 drives the first cover opening assembly 400 to ascend, and the adhesive tape takes away the upper cover.
Specifically, the controller is programmed to use "prior application: the results of a standardized SMD quartz crystal oscillator test method ", namely the aforementioned number of rough grinding, number of finish grinding, single distance of grinding, speed of grinding.
< example two: intelligent SMD crystal oscillator product control detection special equipment
The second embodiment aims to increase: 2 pressure sensors: 1 pressure sensor is arranged between the low-mesh grinding stone and the grinding material fixer 401 and is called as a first pressure sensor, and 1 pressure sensor is arranged between the high-mesh grinding stone and the grinding material fixer 401 and is called as a second pressure sensor. The pressure sensor is connected with the controller.
One control point during grinding is that the pressure is kept in a certain pressure range during coarse grinding and fine grinding:
during coarse grinding, the pressure of a single crystal oscillator-low-mesh grinding stone is 5.9-6.2N.
During fine grinding, the pressure of a single crystal oscillator-high-mesh grinding stone is 2.2-2.6N.
And inputting the number of crystal oscillators of the product fixing sheet in the touch screen so as to determine the pressure between the low-mesh grindstone/high-mesh grindstone-SMD crystal oscillators.
The test method of the second embodiment is as follows:
first, place the crystal oscillator on SMD crystal oscillator places tool 502:
firstly, the touch screen controller controls the X-direction movement driving mechanism 202 and/or the Y-direction movement driving mechanism 302 to move the SMD crystal oscillator placing jig 502 to a preset mounting position;
secondly, mounting the product fixing sheet on the SMD crystal oscillator placing jig 502, and mounting and fixing the product fixing sheet and the SMD crystal oscillator placing jig 502 together;
thirdly, placing the SMD crystal oscillator into the groove of the product fixing sheet;
secondly, the mesh numbers of a low-mesh grindstone and a high-mesh grindstone are input into the touch screen, wherein the mesh number of the low-mesh grindstone is expressed as a, and the mesh number of the high-mesh grindstone is expressed as b;
inputting the number c of crystal oscillators of a product fixing sheet in a touch screen;
thirdly, clicking the touch screen to start working:
firstly, controlling the X-direction movement driving mechanism 202 and/or the Y-direction movement driving mechanism 302 through a touch screen controller, so that the SMD crystal oscillator placement jig 502 moves to a low-mesh grinding stone polishing starting position, wherein the low-mesh grinding stone polishing starting position of the SMD crystal oscillator placement jig 502 is below the low-mesh grinding stone;
next, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the first pressure sensor detects that the pressure between the low-mesh grinding stone and all crystal oscillators on the product fixing sheet is kept at (5.9-6.2N) × c:
thirdly, the driving mechanism 202 drives the SMD crystal oscillator placing jig 502 to move back and forth along the X direction, and rough grinding is started:
number of rough grinding: int (a.0.055) + int (a/400). Times.1 + int (b/800). Times.1 (int function represents integer); the speed of the X-direction movement is: 11.1-14.2 cm/s; the single friction distance of rough grinding is 10cm;
finally, after the rough grinding is finished, the Z-direction moving driving mechanism 202 drives the first uncapping assembly 400 to ascend, and the low-mesh grindstone of the first uncapping assembly 400 is not in contact with the SMD crystal oscillator any more:
fourthly, after the coarse grinding and polishing are finished, the fine grinding and polishing work is started again:
firstly, controlling an X-direction movement driving mechanism 202 and a Y-direction movement driving mechanism 302 through a touch screen controller, so that an SMD crystal oscillator placing jig 502 is moved to a high-mesh grinding stone polishing initial position, wherein the high-mesh grinding stone polishing initial position of the SMD crystal oscillator placing jig 502 is below the high-mesh grinding stone;
next, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the second pressure sensor detects that the pressure between the high-order grindstone and all crystal oscillators on the product fixing piece is kept at (2.2-2.6N) × c:
thirdly, the driving mechanism 202 for moving in the X direction drives the SMD crystal oscillator placing jig 502 to reciprocate in the X direction, and then fine grinding is started:
the number of fine grinding: 8-int (a/360) multiplied by 2+ int [ (0.0525 x b-25) x (280/b) 0.2] (int function represents integer); the speed of the X-direction movement is: 18.18-22.2 cm/s; the single friction distance of fine grinding is 10cm;
finally, after the finish grinding is finished, the Z-direction moving driving mechanism 202 drives the first uncovering assembly 400 to ascend, and the high-mesh grindstone of the first uncovering assembly 400 is not contacted with the SMD crystal oscillator any more:
fifthly, after finish grinding and polishing, opening the cover again:
firstly, controlling the X-direction movement driving mechanism 202 and the Y-direction movement driving mechanism 302 by the touch screen controller, so that the SMD crystal oscillator placement jig 502 is moved to an uncapping position, where the uncapping position of the SMD crystal oscillator placement jig 502 is below an adhesive tape (i.e., an adhesive tape);
next, the Z-direction movement driving mechanism 202 drives the first uncapping assembly 400 to descend until the adhesive tape of the first uncapping assembly 400 contacts and adheres to the SMD crystal oscillator:
and thirdly, the Z-direction moving driving mechanism 202 drives the first cover opening assembly 400 to ascend, and the adhesive tape takes away the upper cover.
The above-mentioned embodiments are only for convenience of description, and are not intended to limit the present invention in any way, and those skilled in the art will understand that the technical features of the present invention can be modified or changed by other equivalent embodiments without departing from the scope of the present invention.
Claims (9)
1. The utility model provides an intelligent SMD crystal oscillator quality control detects professional equipment which characterized in that includes: the device comprises a Z-direction moving device, an X-direction moving device, a Y-direction moving device, a first cover opening assembly and a second cover opening assembly;
the X direction, the Y direction and the Z direction are mutually vertical, the Z direction represents a vertical direction, and the X direction and the Y direction are both horizontal directions; the X direction indicates the sanding direction, and the Y direction indicates the rough grinding-finish grinding-tape direction;
the Z-direction moving device is used for driving the first uncovering assembly to move up and down;
the X-direction moving device is used for driving the second uncovering assembly to move along the X direction;
the Y-direction moving device is used for driving the second cover opening assembly and the X-direction moving device to move along the Y direction;
the first cover opening assembly comprises a polishing material fixer, a Z-direction connecting and fixing mechanism, a low-mesh grinding stone, a high-mesh grinding stone and an adhesive tape; the low-mesh grindstone, the high-mesh grindstone and the adhesive tape are arranged below the polishing material fixer;
a second door assembly comprising: an SMD crystal oscillator placing jig;
the second cover opening assembly is arranged below the first cover opening assembly;
the second door assembly further comprises: a jig fixing mechanism; tool fixed establishment includes: the flange plate and the vertical cylinder body; the vertical cylinder is matched with the SMD crystal oscillator placement jig in shape and size;
SMD crystal oscillator places the tool with tool fixed establishment adopts and to dismantle the connection design: the internal surface of the vertical cylinder of the jig fixing mechanism is provided with threads, the external surface of the SMD crystal oscillator placing jig is provided with threads, and the SMD crystal oscillator placing jig is fixedly connected with the jig fixing mechanism through threads.
2. The special intelligent SMD crystal oscillator quality control detection device according to claim 1, wherein said low-mesh grindstone, high-mesh grindstone and adhesive tape are arranged in parallel below the polishing material holder, the polishing material holder is provided with L-shaped receiving steps at both ends in X direction, and the low-mesh grindstone, high-mesh grindstone and adhesive tape are placed between the lower surface of the polishing material holder and the L-shaped receiving steps.
3. The special device for the intelligent SMD crystal oscillator quality control detection according to claim 1, wherein said second lid-opening assembly further comprises: the product fixing piece is provided with a groove for placing an SMD crystal oscillator; the product fixing piece and the SMD crystal oscillator placing jig are detachably connected and fixed together; the product fixing piece is placed and fixed above the SMD crystal oscillator placing jig.
4. The special device for the intelligent SMD crystal oscillator quality control detection as claimed in claim 1, wherein the Z-direction moving means comprises a column, a Z-direction moving driving mechanism, and a Z-direction track; the Z-direction track is arranged on the upright post, the Z-direction moving driving mechanism is connected with the first uncovering assembly, and the first uncovering assembly is controlled to move along the Z direction through the Z-direction moving driving mechanism.
5. The device as claimed in claim 4, wherein the X-direction moving means comprises: the device comprises an upper bearing plate, an X-direction movement driving mechanism and an X-direction track, wherein the X-direction movement driving mechanism is connected with the upper bearing plate and drives the upper bearing plate to move along the X direction; and a groove matched with the X-direction track is arranged on the upper bearing plate.
6. The device as claimed in claim 5, wherein the Y-direction moving means comprises: the bearing plate moving mechanism is connected with the bearing plate, and the Y-direction moving driving mechanism drives the bearing plate to move along the Y direction; and a groove matched with the Y-direction track is arranged on the middle bearing plate.
7. The device as claimed in claim 6, wherein the device further comprises: a lower bearing plate;
the second subassembly of uncapping, X lie in to mobile device, Y to mobile device, Z to the cooperation design of mobile device, lower loading board:
the second cover opening assembly is fixed on the upper surface of an upper bearing plate of the X-direction moving device through a flange plate;
the X-direction track and the X-direction movement driving mechanism are fixedly arranged on the upper surface of the middle bearing plate;
the Y-direction track, the Y-direction movement driving mechanism and the Z-direction movement device are all fixed on the lower bearing plate;
the upper bearing plate is arranged above the middle bearing plate, and the middle bearing plate is arranged above the lower bearing plate.
8. The device special for the intelligent SMD crystal oscillator quality control detection according to claim 7, further comprising: a touch screen and a controller; the touch screen is used for inputting the mesh numbers of the low-mesh grindstone and the high-mesh grindstone; the touch screen is electrically connected with the controller, the controller is electrically connected with the Z-direction movement driving mechanism, the X-direction movement driving mechanism and the Y-direction movement driving mechanism, and the operation of the Z-direction movement driving mechanism, the X-direction movement driving mechanism and the Y-direction movement driving mechanism is controlled by the controller;
further comprising: 2 pressure sensors: 1 pressure sensor is arranged between the low-mesh grindstone and the grinding material holder and is called as a first pressure sensor, and 1 pressure sensor is arranged between the high-mesh grindstone and the grinding material holder and is called as a second pressure sensor;
the pressure sensor is connected with the controller;
and inputting the number of crystal oscillators of a product fixing sheet in the touch screen.
9. An operating method of an intelligent SMD crystal oscillator product-control detection dedicated device, wherein said intelligent SMD crystal oscillator product-control detection dedicated device is the intelligent SMD crystal oscillator product-control detection dedicated device of claim 8;
the method comprises the following steps:
s1, placing a crystal oscillator on an SMD crystal oscillator placing jig:
s1-1, controlling an X-direction movement driving mechanism and/or a Y-direction movement driving mechanism through a touch screen controller, and moving an SMD crystal oscillator placement jig to a preset mounting position;
s1-2, mounting a product fixing piece on a crystal oscillator placing jig, and mounting and fixing the product fixing piece and an SMD crystal oscillator placing jig together;
s1-3, placing an SMD crystal oscillator into a groove of a product fixing sheet;
s2, inputting the mesh numbers of a low-mesh grindstone and a high-mesh grindstone in the touch screen, wherein the mesh number of the low-mesh grindstone is expressed as a, and the mesh number of the high-mesh grindstone is expressed as b; inputting the number c of crystal oscillators of a product fixing sheet in a touch screen;
s3, clicking the touch screen, and starting work:
s3-1, controlling an X-direction movement driving mechanism and/or a Y-direction movement driving mechanism through a touch screen controller, so that an SMD crystal oscillator placement jig moves to a low-mesh grinding stone polishing initial position, wherein the low-mesh grinding stone polishing initial position of the SMD crystal oscillator placement jig is below the low-mesh grinding stone;
S3-2,Z drives the first uncovering component to descend to the moving driving mechanism until the first pressure sensor monitors that the pressure between the low-mesh grindstone and all crystal oscillators on the product fixing piece is kept at (5.9-6.2N) x c:
S3-3,X driving the SMD crystal oscillator placing jig to move back and forth along the X direction by the movement driving mechanism, and starting coarse grinding:
number of rough grinding: int (a.0.055) + int (a/400). Times.1 + int (b/800). Times.1;
the speed of the X-direction movement is: 11.1-14.2 cm/s;
the single friction distance of rough grinding is 10cm;
s3-4, after coarse grinding is finished, the Z-direction moving driving mechanism drives the first uncovering component to ascend, and a low-mesh grinding stone of the first uncovering component is not in contact with the SMD crystal oscillator any more:
s4, after the coarse grinding and polishing are finished, the fine grinding and polishing work is started again:
s4-1, controlling the X-direction movement driving mechanism and the Y-direction movement driving mechanism through a touch screen controller, so that the SMD crystal oscillator placement jig is moved to a high-mesh grinding stone polishing initial position, and the high-mesh grinding stone polishing initial position of the SMD crystal oscillator placement jig is below the high-mesh grinding stone;
S4-2,Z drives the first uncovering component to descend towards the moving driving mechanism until the second pressure sensor monitors that the pressure between the high-mesh grindstone and all crystal oscillators on the product fixing sheet is kept at (2.2-2.6N) x c:
S4-3,X drives the SMD crystal oscillator placing jig to reciprocate along the X direction by the movement driving mechanism, and then fine grinding is started:
the number of fine grinding: 8-int (a/360). Times.2 + int [ (0.0525 x b-25). Times.280/b ^0.2]; the speed of the X-direction movement is: 18.18-22.2 cm/s; the single friction distance of fine grinding is 10cm;
s4-4, after fine grinding is finished, the Z-direction moving driving mechanism drives the first cover opening assembly to ascend, and a high-mesh grinding stone of the first cover opening assembly is not in contact with the SMD crystal oscillator any more:
s5, after finish grinding and polishing are finished, opening the cover again:
s5-1, controlling the X-direction movement driving mechanism and the Y-direction movement driving mechanism through a touch screen controller to enable the SMD crystal oscillator placement jig to move to an uncovering position, wherein the uncovering position of the SMD crystal oscillator placement jig is below the adhesive tape;
S5-2,Z drives the first uncovering component to descend to the moving driving mechanism until the adhesive tape of the first uncovering component is contacted with the SMD crystal oscillator and bonded together:
S5-3,Z drives the first uncovering component to ascend towards the moving driving mechanism, and the adhesive tape takes away the upper cover.
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| CN114310592A (en) | 2022-04-12 |
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